TI SN74HC573APWR

SCLS147E − DECEMBER 1982 − REVISED SEPTEMBER 2003
D Wide Operating Voltage Range of 2 V to 6 V
D High-Current 3-State Outputs Drive Bus
D
D
D
D
Lines Directly or Up To 15 LSTTL Loads
D Low Power Consumption, 80-µA Max ICC
SN54HC573A . . . J OR W PACKAGE
SN74HC573A . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
LE
3D
4D
5D
6D
7D
OE
VCC
1Q
20
2D
1D
1
SN54HC573A . . . FK PACKAGE
(TOP VIEW)
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2Q
3Q
4Q
5Q
6Q
8D
GND
LE
8Q
7Q
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
Typical tpd = 21 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Bus-Structured Pinout
description/ordering information
These octal transparent D-type latches feature 3-state outputs designed specifically for driving highly capacitive
or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
While the latch-enable (LE) input is high, the Q outputs respond to the data (D) inputs. When LE is low, the
outputs are latched to retain the data that was set up.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
ORDERING INFORMATION
PDIP − N
SN74HC573AN
Tube of 40
SN74HC573ADW
Reel of 2500
SN74HC573ADWR
Reel of 2000
SN74HC573ADBR
Reel of 2000
SN74HC573APWR
Reel of 250
SN74HC573APWT
CDIP − J
Tube of 25
SNJ54HC573AJ
SNJ54HC573AJ
CFP − W
Tube of 150
SNJ54HC573AW
SNJ54HC573AW
LCCC − FK
Tube of 55
SNJ54HC573AFK
SSOP − DB
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 25
SOIC − DW
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74HC573AN
HC573A
HC573A
HC573A
SNJ54HC573AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
$'"! !$& ./0
&& $## # ##'
"&# )#+# #'( && )# $'"!
$'"!
$!#- '# #!#&, !&"'# #- && $##(
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS147E − DECEMBER 1982 − REVISED SEPTEMBER 2003
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
FUNCTION TABLE
(each latch)
INPUTS
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
LE
1
11
C1
1D
2
19
1Q
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS147E − DECEMBER 1982 − REVISED SEPTEMBER 2003
recommended operating conditions (see Note 3)
SN54HC573A
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VCC = 6 V
VCC = 2 V
VIL
VI
VO
tt
MIN
NOM
MAX
2
5
6
Input voltage
MAX
2
5
6
3.15
3.15
4.2
4.2
0
VCC = 6 V
UNIT
V
V
0.5
0.5
1.35
1.35
1.8
1.8
VCC
VCC
VCC = 2 V
VCC = 4.5 V
Input transition (rise and fall) time
NOM
1.5
0
Output voltage
MIN
1.5
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
SN74HC573A
0
VCC
VCC
0
1000
1000
500
500
400
400
V
V
V
ns
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
VI = VCC or 0,
MIN
MAX
SN74HC573A
MIN
MAX
UNIT
1.9
1.998
1.9
1.9
IOH = −20 µA
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = −6 mA
IOH = −7.8 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
6V
±0.01
±0.5
±10
±5
µA
8
160
80
µA
10
10
10
pF
IOL = 6 mA
IOL = 7.8 mA
ICC
Ci
SN54HC573A
2V
VI = VIH or VIL
VI = VCC or 0
VO = VCC or 0
TA = 25°C
MIN
TYP
MAX
4.5 V
VI = VIH or VIL
II
IOZ
VCC
IO = 0
6V
2 V to 6 V
POST OFFICE BOX 655303
3
• DALLAS, TEXAS 75265
V
V
3
SCLS147E − DECEMBER 1982 − REVISED SEPTEMBER 2003
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
tw
Pulse duration, LE high
tsu
Setup time, data before LE↓
th
Hold time, data after LE↓
TA = 25°C
MIN
MAX
SN54HC573A
MIN
MAX
SN74HC573A
MIN
2V
80
120
100
4.5 V
16
24
20
6V
14
20
17
2V
50
75
63
4.5 V
10
15
13
6V
9
13
11
2V
20
24
24
4.5 V
5
5
5
6V
5
5
5
MAX
UNIT
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
D
ten
tdis
tt
4
OE
OE
SN54HC573A
SN74HC573A
VCC
2V
77
175
265
220
Q
4.5 V
26
35
53
44
6V
23
30
45
38
2V
87
175
265
220
4.5 V
27
35
53
44
6V
23
30
45
38
2V
68
150
225
190
4.5 V
24
30
45
38
6V
21
26
38
32
2V
47
150
225
190
4.5 V
23
30
45
38
6V
21
26
38
32
2V
28
60
90
75
4.5 V
8
12
18
15
6V
6
10
15
13
tpd
LE
TA = 25°C
MIN
TYP
MAX
TO
(OUTPUT)
Any Q
Any Q
Any Q
Any Q
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
MAX
MIN
MAX
UNIT
ns
ns
ns
ns
SCLS147E − DECEMBER 1982 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
SN54HC573A
SN74HC573A
TO
(OUTPUT)
VCC
2V
95
200
300
250
D
Q
4.5 V
33
40
60
50
6V
21
34
51
43
2V
103
225
335
285
4.5 V
33
45
67
57
6V
29
38
57
48
tpd
LE
ten
TA = 25°C
TYP
MAX
FROM
(INPUT)
Any Q
OE
Any Q
tt
Any Q
MIN
MIN
MAX
MIN
MAX
2V
85
200
300
250
4.5 V
29
40
60
50
6V
26
34
51
43
2V
60
210
315
265
4.5 V
17
42
63
53
6V
14
36
53
45
UNIT
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per latch
No load
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TYP
50
UNIT
pF
5
SCLS147E − DECEMBER 1982 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
VCC
PARAMETER
S1
Test
Point
From Output
Under Test
ten
RL
tPZH
RL
CL
50 pF
or
150 pF
1 kΩ
tPZL
tdis
S2
tPLZ
1 kΩ
50 pF
−−
50 pF
or
150 pF
tpd or tt
LOAD CIRCUIT
50%
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
50%
0V
50%
tsu
0V
tw
Data
50%
Input 10%
VCC
Low-Level
Pulse
50%
50%
50%
0V
tPLH
50%
10%
tPHL
90%
90%
tr
tPHL
90%
tf
50%
10%
Output
Control
(Low-Level
Enabling)
50%
10% V
OL
tf
tPZL
Output
Waveform 1
(See Note B)
VOH
tPZH
VOH
tPLH
50%
10%
90%
90%
VCC
50%
10% 0 V
tf
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VCC
50%
th
tr
0V
VOLTAGE WAVEFORMS
PULSE DURATIONS
Out-ofPhase
Output
Open
VCC
Reference
Input
VCC
High-Level
Pulse
In-Phase
Output
S2
tPHZ
CL
(see Note A)
Input
S1
90%
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VCC
50%
Output
Waveform 2
(See Note B)
50%
0V
tPLZ
≈VCC
50%
10%
≈VCC
VOL
tPHZ
50%
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MCFP006B − JANUARY 1995 − REVISED JULY 2003
W (R-GDFP-F20)
CERAMIC DUAL FLATPACK
Base and Seating Plane
0.300 (7,62)
0.245 (6,22)
0.045 (1,14)
0.026 (0,66)
0.009 (0,23)
0.004 (0,10)
0.100 (2,54)
0.045 (1,14)
0.320 (8,13) MAX
1
0.022 (0,56)
0.015 (0,38)
20
0.050 (1,27)
0.540 (13,72)
MAX
0.005 (0,13) MIN
4 Places
10
11
0.370 (9,40)
0.250 (6,35)
0.370 (9,40)
0.250 (6,35)
4040180-4 /D 07/03
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification only.
Falls within Mil-Std 1835 GDFP2-F20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL
MPDI002C – JANUARY 1995 – REVISED DECEMBER 20002
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
16 PINS SHOWN
PINS **
14
16
18
20
A MAX
0.775
(19,69)
0.775
(19,69)
0.920
(23,37)
1.060
(26,92)
A MIN
0.745
(18,92)
0.745
(18,92)
0.850
(21,59)
0.940
(23,88)
MS-100
VARIATION
AA
BB
AC
DIM
A
16
9
0.260 (6,60)
0.240 (6,10)
1
C
AD
8
0.070 (1,78)
0.045 (1,14)
0.045 (1,14)
0.030 (0,76)
D
D
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gauge Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.430 (10,92) MAX
0.021 (0,53)
0.015 (0,38)
0.010 (0,25) M
14/18 PIN ONLY
20 pin vendor option
D
4040049/E 12/2002
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A).
D. The 20 pin end lead shoulder width is a vendor option, either half or full width.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MSOI003E – JANUARY 1995 – REVISED SEPTEMBER 2001
DW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
16 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
9
0.050 (1,27)
16
0.010 (0,25)
0.419 (10,65)
0.400 (10,15)
0.010 (0,25) NOM
0.299 (7,59)
0.291 (7,39)
Gage Plane
0.010 (0,25)
1
8
0°– 8°
0.050 (1,27)
0.016 (0,40)
A
Seating Plane
0.104 (2,65) MAX
0.012 (0,30)
0.004 (0,10)
PINS **
0.004 (0,10)
16
18
20
24
28
A MAX
0.410
(10,41)
0.462
(11,73)
0.510
(12,95)
0.610
(15,49)
0.710
(18,03)
A MIN
0.400
(10,16)
0.453
(11,51)
0.500
(12,70)
0.600
(15,24)
0.700
(17,78)
DIM
4040000/E 08/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MS-013
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Amplifiers
Applications
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2003, Texas Instruments Incorporated