FUJI 2SK1663-S

2SK1663-L,S
N-channel MOS-FET
F-I Series
800V
> Features
-
4Ω
3A
80W
> Outline Drawing
High Speed Switching
Low On-Resistance
No Secondary Breakdown
Low Driving Power
High Voltage
> Applications
-
Switching Regulators
UPS
DC-DC Converters
General Purpose Power Amplifier
> Maximum Ratings and Characteristics
> Equivalent Circuit
- Absolute Maximum Ratings (TC=25°C), unless otherwise specified
Item
Drain-Source-Voltage
Continous Drain Current
Pulsed Drain Current
Continous Reverse Drain Current
Gate-Source-Voltage
Max. Power Dissipation
Operating and Storage Temperature Range
Symbol
V DS
ID
I D(puls)
I DR
V GS
PD
T ch
T stg
Rating
800
3
12
3
±20
80
150
-55 ~ +150
Unit
V
A
A
A
V
W
°C
°C
- Electrical Characteristics (TC=25°C), unless otherwise specified
Item
Drain-Source Breakdown-Voltage
Gate Threshhold Voltage
Zero Gate Voltage Drain Current
Gate Source Leakage Current
Symbol
V (BR)DSS
V GS(th)
I DSS
I
Drain Source On-State Resistance
Forward Transconductance
Input Capacitance
R
g
C
Output Capacitance
C
Reverse Transfer Capacitance
Turn-On-Time ton (ton=td(on)+tr)
C
t
t
Turn-Off-Time toff (ton=td(off)+tf)
Diode Forward On-Voltage
Reverse Recovery Time
t
t
V
t
GSS
DS(on)
fs
iss
Test conditions
ID=1mA
VGS=0V
ID=10mA
VDS=VGS
VDS=800V
Tch=25°C
VGS=0V
Tch=125°C
VGS=±20V
ID=1,5A
ID=1,5A
Min.
800
2,1
VDS=0V
VGS=10V
VDS=25V
VDS=25V
2
Typ.
Max.
3,0
0,01
0,2
4,0
0,5
1,0
Unit
V
V
mA
mA
10
100
nA
3
4
900
4
1400
Ω
S
pF
VGS=0V
90
140
pF
r
f=1MHz
VCC=30V
ID=2,1A
35
20
40
60
30
60
pF
ns
ns
d(off)
VGS=10V
150
60
250
90
ns
ns
1
400
1,35
V
ns
Max.
125
1,56
Unit
°C/W
°C/W
oss
rss
d(on)
f
SD
rr
RGS=50Ω
IF=2xIDR VGS=0V Tch=25°C
IF=IDR VGS=0V
-dIF/dt=100A/µs Tch=25°C
- Thermal Characteristics
Item
Thermal Resistance
Symbol
R th(ch-a)
R th(ch-c)
Test conditions
channel to air
channel to case
Min.
FUJI ELECTRIC GmbH; Lyoner Straße 26; D-60528 Frankfurt; Tel: 069-66 90 29-0; Fax: 069-66 90 29-56
Typ.
2SK1663-L,S
N-channel MOS-FET
800V
4Ω
3A
F-I Series
80W
> Characteristics
Typical Output Characteristics
↑
Drain-Source-On-State Resistance vs. Tch
↑
→
Tch [°C]
Typical Drain-Source-On-State-Resistance vs. ID
Gate Threshold Voltage vs. Tch
↑
ID [A]
→
Tch [°C]
VDS [V]
C [nF]
8
VDS [V]
→
Qg [nC]
Allowable Power Dissipation vs. TC
↑
↑
IF [A]
↑
→
Forward Characteristics of Reverse Diode
VGS [V]
Typical Input Charge
7
6
VGS(th) [V]
5
→
Typical Capacitance vs. VDS
→
VGS [V]
gfs [S]
RDS(ON) [Ω]
ID [A]
↑
→
Typical Forward Transconductance vs. ID
↑
4
3
ID [A]
ID [A]
VDS [V]
↑
↑
2
RDS(ON) [Ω]
1
Typical Transfer Characteristics
9
→
VSD [V]
→
Safe operation area
Zth(ch-c) [K/W]
↑
↑
12
11
ID [A]
10
PD [W]
↑
Transient Thermal impedance
Tc [°C]
→
VDS [V]
→
This specification is subject to change without notice!
t [s]
→