TI TRSF3232ECDWR

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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS825 – AUGUST 2007
FEATURES
•
•
•
•
•
•
•
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
Operates With 3-V to 5.5-V VCC Supply
Operates up to 1 Mbit/s
Low Supply Current . . . 300 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accept 5-V Logic Input With 3.3-V Supply
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection for RS-232 Pins
– ±15-kV Human-Body Model (HBM)
– ±15-kV IEC 61000-4-2 Air-Gap Discharge
– ±8-kV IEC 61000-4-2 Contact Discharge
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRSF3232E consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). This device provides the electrical
interface between an asynchronous communication controller and the serial-port connector. The charge pump
and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232E operates
at data signaling rates up to 1 Mbit/s and a driver output slew rate of 14 V/μs to 150 V/μs.
ORDERING INFORMATION
PACKAGE (1) (2)
TA
SOIC – D
0°C to 70°C
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – D
–40°C to 85°C
SOIC – DW
SSOP – DB
TSSOP – PW
(1)
(2)
ORDERABLE PART NUMBER
Tube of 40
TRSF3232ECD
Reel of 2500
TRSF3232ECDR
Tube of 40
TRSF3232ECDW
Reel of 2000
TRSF3232ECDWR
Reel of 2000
TRSF3232ECDBR
Tube of 90
TRSF3232ECPW
Reel of 2000
TRSF3232ECPWR
Tube of 40
TRSF3232EID
SOIC – DW
TRSF3232EIDR
Tube of 40
TRSF3232EIDW
TSSOP – PW
TRSF3232EIDWR
Reel of 2000
TRSF3232EIDBR
Tube of 90
TRSF3232EIPW
Reel of 2000
TRSF3232EIPWR
TOP-SIDE MARKING
TRSF3232EC
TRSF3232EC
RT32EC
RT32EC
TRSF3232EI
TRSF3232EI
RT32EI
RT32EI
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825 – AUGUST 2007
Table 1. 1-Mbit/s RS-232 Parts
TEMPERATURE
RANGE
0°C to 70°C
–40°C to 85°C
2
NO. OF
DRIVERS
NO. OF
RECEIVERS
ESD
SUPPLY
VCC
(V)
FEATURE
PIN/
PACKAGE
TRSF3221E
1
1
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
3.3 or 5
Auto-powerdown
16-pin
SOIC, SSOP,
TSSOP
TRSF3232E
2
2
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
3.3 or 5
Low pin count
16-pin
SOIC, SSOP,
TSSOP
TRS3227
1
1
±8-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
3.3 or 5
Auto-powerdown
plus, ready signal
16-pin
SSOP
TRSF3221
1
1
±15-kV HBM
3.3 or 5
Auto-powerdown
16-pin
SOIC, SSOP,
TSSOP
TRSF3222
2
2
±15-kV HBM
3.3 or 5
Enable,
powerdown
signal
20-pin
SOIC, SSOP,
TSSOP
TRSF3223
2
2
±15-kV HBM
3.5 or 5
TRSF3232
2
2
±15-kV HBM
3.3 or 5
Low pin count
16-pin
SOIC, SSOP,
TSSOP
TRSF3238
5
3
±15-kV HBM
3.3 or 5
Auto-powerdown
plus
28-pin
SOIC, SSOP,
TSSOP
TRSF3243
3
5
±15-kV HBM
3.3 or 5
Auto-powerdown
28-pin
SOIC, SSOP,
TSSOP
TRSF3221E
1
1
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
3.3 or 5
Auto-powerdown
16-pin
SOIC, SSOP,
TSSOP
TRSF3232E
2
2
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
3.3 or 5
Low pin count
16-pin
SOIC, SSOP,
TSSOP
TRS3227
1
1
±8-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
3.3 or 5
Auto-powerdown
plus, ready signal
16-pin
SSOP
TRSF3221
1
1
±15-kV HBM
3.3 or 5
Auto-powerdown
16-pin
SOIC, SSOP,
TSSOP
TRSF3222
2
2
±15-kV HBM
3.3 or 5
Enable,
powerdown
signal
20-pin
SOIC, SSOP,
TSSOP
TRSF3223
2
2
±15-kV HBM
3.3 or 5
TRSF3232
2
2
±15-kV HBM
3.3 or 5
Low pin count
16-pin
SOIC, SSOP,
TSSOP
TRSF3238
5
3
±15-kV HBM
3.3 or 5
Auto-powerdown
plus
28-pin
SOIC, SSOP,
TSSOP
TRSF3243
3
5
±15-kV HBM
3.3 or 5
Auto-powerdown
28-pin
SOIC, SSOP,
TSSOP
PART
NO.
Submit Documentation Feedback
20-pin
Auto-powerdown,
SOIC, SSOP,
enable signal
TSSOP
20-pin
Auto-powerdown,
SOIC, SSOP,
enable signal
TSSOP
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS825 – AUGUST 2007
FUNCTION TABLES
xxx
Each Driver (1)
(1)
INPUT
DIN
OUTPUT
DOUT
L
H
H
L
H = high level, L = low level
Each Receiver (1)
(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
14
DIN1
DOUT1
10
7
DIN2
DOUT2
12
13
ROUT1
RIN1
5 kW
9
8
ROUT2
RIN2
5 kW
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3
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825 – AUGUST 2007
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.3
6
V
V+
Positive-output supply voltage range (2)
–0.3
7
V
0.3
–7
V
13
V
V–
Negative-output supply voltage range
V+ – V–
Supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
(2)
Package thermal impedance (3) (4)
Operating virtual junction temperature
Storage temperature range
(4)
6
Receivers
–25
25
Receivers
Tstg
(2)
(3)
–0.3
Drivers
TJ
(1)
Drivers
–13.2
13.2
–0.3
VCC + 0.3
D package
82
DB package
46
DW package
57
PW package
108
–65
UNIT
V
V
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC = 3.3 V
Supply voltage
VCC = 5 V
Driver high-level input voltage
VIL
Driver low-level input voltage
DIN
Driver input voltage
DIN
VI
TA
(1)
DIN
VCC = 3.3 V
VIH
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
VCC = 5 V
V
2.4
0.8
Receiver input voltage
TRSF3232EI
Operating free-air temperature
MIN
TRSF3232EC
0
5.5
–25
25
–40
85
0
70
V
V
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
ICC
(1)
(2)
4
Supply current
TEST CONDITIONS
No load,
VCC = 3.3 V or 5 V
MIN
TYP (2)
MAX
0.3
1
UNIT
mA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825 – AUGUST 2007
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.5
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at GND
IOS (3) Short-circuit output current
ro
Output resistance
(1)
(2)
(3)
MAX
V
V
±0.01
±1
μA
μA
±0.01
±1
VCC = 3.6 V,
VO = 0 V
±35
±60
VCC = 5.5 V,
VO = 0 V
±35
±90
VCC, V+, and V– = 0 V,
VO = ±2 V
300
UNIT
mA
Ω
10M
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
MIN TYP (2) MAX UNIT
TEST CONDITIONS
CL = 250 pF,
VCC = 3 V to 4.5 V
1000
CL = 1000 pF,
VCC = 3.5 V to 5.5 V
1000
Maximum data rate
(see Figure 1)
RL = 3 kΩ,
One DOUT switching
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2
SR(tr)
Slew rate,
transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF, VCC = 3.3 V
(1)
(2)
(3)
kbit/s
300
14
ns
150 V/μs
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TERMINAL
NAME
NO.
DOUT
7, 14
TEST CONDITIONS
TYP
HBM
±15
IEC 61000-4-2 Air-Gap Discharge
±15
IEC 61000-4-2 Contact Discharge
±8
Submit Documentation Feedback
UNIT
kV
5
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825 – AUGUST 2007
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
ri
Input resistance
(1)
(2)
MIN
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
V
0.4
VCC = 3.3 V
1.5
2.4
VCC = 5 V
1.8
2.4
VCC = 3.3 V
0.6
1.2
VCC = 5 V
0.8
1.5
3
5
V
V
V
0.3
VI = ±3 V to ±25 V
UNIT
V
7
kΩ
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF
300
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF
300
ns
tsk(p)
Pulse skew (3)
300
ns
(1)
(2)
(3)
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TERMINAL
6
NAME
NO.
RIN
8, 13
TEST CONDITIONS
TYP
HBM
±15
IEC 61000-4-2 Air-Gap Discharge
±15
IEC 61000-4-2 Contact Discharge
±8
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UNIT
kV
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825 – AUGUST 2007
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
tTHL
CL
(see Note A)
Output
tTLH
3V
−3 V
TEST CIRCUIT
SR(tr) +
t
THL
6V
or t
VOH
3V
−3 V
VOL
VOLTAGE WAVEFORMS
TLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
Submit Documentation Feedback
7
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS825 – AUGUST 2007
APPLICATION INFORMATION
1
−
16
+ CBYPASS = 0.1 µF
−
+
C1
VCC
C1+
2
V+
+
C3
GND
15
−
14
3
DOUT1
C1−
13
4
C2+
+
C2
RIN1
5 kΩ
−
5 C2−
12
6
C4
DOUT2
RIN2
V−
−
11
ROUT1
DIN1
+
7
10
8
9
DIN2
ROUT2
5 kΩ
VCC vs CAPACITOR VALUES
A.
VCC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
C3 can be connected to VCC or GND.
Figure 4. Typical Operating Circuit and Capacitor Values
8
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TRSF3232ECD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDB
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDBRG4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDG4
ACTIVE
SOIC
D
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDWR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECDWRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232ECPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EID
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDB
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDBRG4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDG4
ACTIVE
SOIC
D
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIDW
ACTIVE
SOIC
DW
16
CU NIPDAU
Level-1-260C-UNLIM
40
40
40
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TRSF3232EIDWG4
ACTIVE
SOIC
DW
16
TRSF3232EIDWR
ACTIVE
SOIC
DW
TRSF3232EIDWRG4
ACTIVE
SOIC
TRSF3232EIPW
ACTIVE
TRSF3232EIPWG4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRSF3232EIPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TRSF3232ECDBR
SSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
DB
16
2000
330.0
16.4
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.2
6.6
2.5
12.0
16.0
Q1
TRSF3232ECDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
TRSF3232ECDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
TRSF3232ECPWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
TRSF3232EIDBR
SSOP
DB
16
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
TRSF3232EIDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
TRSF3232EIDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
TRSF3232EIPWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRSF3232ECDBR
SSOP
DB
16
2000
346.0
346.0
33.0
TRSF3232ECDR
SOIC
D
16
2500
346.0
346.0
33.0
TRSF3232ECDWR
SOIC
DW
16
2000
346.0
346.0
33.0
TRSF3232ECPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
TRSF3232EIDBR
SSOP
DB
16
2000
346.0
346.0
33.0
TRSF3232EIDR
SOIC
D
16
2500
346.0
346.0
33.0
TRSF3232EIDWR
SOIC
DW
16
2000
346.0
346.0
33.0
TRSF3232EIPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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