TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 D Wide Bandwidth (BW = 500 MHz Typ) D Low Crosstalk (XTALK = −30 dB Typ) D Bidirectional Data Flow, With Near-Zero D D 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC E ID0 ID1 YD IC0 IC1 YC IA0 IA1 YA IB0 IB1 YB 1 16 15 E 14 ID0 2 3 13 ID1 12 YD 4 5 11 IC0 10 IC1 6 7 8 9 YC S IA0 IA1 YA IB0 IB1 YB GND VCC RGY PACKAGE (TOP VIEW) D, DBQ, DGV, OR PW PACKAGE (TOP VIEW) S D D D D Propagation Delay Low and Flat ON-State Resistance (ron = 4 W Typ, ron(flat) = 1 W) Switching on Data I/O Ports (0 to 5 V) VCC Operating Range From 3 V to 3.6 V Ioff Supports Partial-Power-Down Mode Operation Clamp Diodes Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 − 2000-V Human-Body Model (A114-B, Class II) − 1000-V Charged-Device Model (C101) Suitable for Both 10 Base-T/100 Base-T Signaling GND D D Data and Control Inputs Have Undershoot description/ordering information The TI TS3L110 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled, and the I port is connected to the Y port. When E is high, the switch is disabled, and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer. ORDERING INFORMATION QFN − RGY SOIC − D −40°C 40 C to 85°C 85 C SSOP (QSOP) − DBQ TSSOP − PW TVSOP − DGV † ORDERABLE PART NUMBER PACKAGE† TA Tape and reel TS3L110RGYR Tube TS3L110D Tape and reel TS3L110DR Tape and reel TS3L110DBQR Tube TS3L110PW Tape and reel TS3L110PWR Tape and reel TS3L110DGVR TOP-SIDE MARKING TK110 TS3L110 TK110 TK110 TK110 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 description/ordering information (continued) This device can be used to replace mechanical relays in LAN applications. This device has low and flat ron, wide bandwidth, and low crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications. The device can be used to route signals from a 10/100 Base-T ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations. The device is designed for low channel-to-channel skew and low crosstalk. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS S INPUT/OUTPUT YX FUNCTION L L IX0 YX = IX0 L H IX1 YX = IX1 H X Z Disconnect E PIN DESCRIPTIONS PIN NAME IAn−IDn Data I/Os S Select input E Enable input YA−YD 2 DESCRIPTION Data I/Os POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 logic diagram (positive logic) 2 4 IA0 YA 3 IA1 YB 7 5 IB0 6 IB1 11 9 YC 10 YD 12 14 13 S IC0 IC1 ID0 ID1 1 15 Control Logic E POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W (see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W (see Note 5): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W (see Note 5): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W (see Note 6): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground, unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. VI and VO are used to denote specific conditions for VI/O. 4. II and IO are used to denote specific conditions for II/O. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 7) MIN MAX UNIT VCC Supply voltage 3 3.6 V VIH High-level control input voltage (E, S) 2 5.5 V VIL Low-level control input voltage (E, S) 0 0.8 V VI/O Input/output voltage 0 5.5 V TA Operating free-air temperature −40 85 °C NOTE 7: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 electrical characteristics over recommended VCC = 3.3 V + 0.3 V (unless otherwise noted) PARAMETER operating free-air TEST CONDITIONS temperature range, TYP† MAX UNIT −1.8 V MIN VIK E, S VCC = 3.6 V, IIN = −18 mA IIH E, S VCC = 3.6 V, VIN = 5.5 V ±1 μA IIL E, S VCC = 3.6 V, VIN = GND ±1 μA VCC = 0, VO = 0 to 5.5 V , VI = 0 1 μA Switch ON or OFF 0.7 1.5 mA 2.5 3.5 pF Ioff ICC Cin VCC = 3.6 V, II/O = 0, E, S f = 1 MHz, VIN = 0 I port VI = 0, f = 1 MHz, Outputs open, Switch OFF 3.5 5 Y port VI = 0, f = 1 MHz, Outputs open, Switch OFF 5.5 7 I or Y port VI = 0, f = 1 MHz, Outputs open, Switch ON 10.5 13 pF 8 Ω Cio(OFF) Cio(ON) pF VCC = 3 V 1.25 V ≤ VI ≤ VCC, II = −10 mA to −30 mA 4 ron(flat)‡ VCC = 3 V VI = 1.25 V and VCC, II = −10 mA to −30 mA 1 Δron VCC = 3 V, 1.25 V ≤ VI ≤ VCC, II = −10 mA to −30 mA 0.9 ron § Ω 2 Ω VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. † All typical values are at V CC = 3.3 V (unless otherwise noted), TA = 25°C. ‡r on(flat) is the difference of ron in a given channel at specified voltages. § Δr is the difference of r in a given device. on on switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V + 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figures 5 and 6) FROM (INPUT) TO (OUTPUT) tpd¶ I or Y Y or I tPZH, tPZL E or S I or Y 0.5 tPHZ, tPLZ E or S I or Y 0.5 tsk(p)# I or Y Y or I PARAMETER MIN TYP† MAX 0.25 0.1 UNIT ns 7 ns 5 ns 0.2 ns † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). # Skew between opposite transitions of the same output |t PHL − tPLH|. This parameter is not production tested. ¶ dynamic characteristics over recommended VCC = 3.3 V + 0.3 V (unless otherwise noted) PARAMETER † operating TEST CONDITIONS free-air temperature range, TYP† UNIT MIN MAX XTALK RL = 100 Ω, f = 250 MHz, see Figure 7 −26 OIRR RL = 100 Ω, f = 250 MHz, see Figure 8 −28 dB BW RL = 100 Ω, see Figure 6 500 MHz dB All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 OPERATING CHARACTERISTICS 0 0 Phase −10 −1 −20 Gain −30 −3 J −40 −4 −5 Y Phase (Deg) Gain (dB) −2 −50 −60 −6 −70 −7 1 10 100 700 Frequency (MHz) J Y Phase at 627 MHz, −36 Degrees Gain −3 dB at 627 MHz Figure 1. Gain/Phase vs Frequency 20 120 0 Phase 100 J 80 Y −40 60 Gain −60 40 −80 20 −100 1 J Y 10 Frequency (MHz) 100 Phase at 250 MHz, 88.2 Degrees Gain −28.5 dB at 250 MHz Figure 2. OFF Isolation vs Frequency 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 0 700 Phase (Deg) Gain (dB) −20 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 OPERATING CHARACTERISTICS 0 180 −10 160 −20 140 J Y −40 100 Phase −50 80 −60 60 Phase (Deg) 120 Gain −70 40 −80 20 −90 1 10 0 700 100 Frequency (MHz) Phase at 250 MHz, 137.92 Degrees Gain −26 dB at 250 MHz Figure 3. Crosstalk vs Frequency 5 20 4 16 VO 3 12 2 8 rON 1 ON-State Resistance (Ω) J Y Output Voltage (V) Gain (dB) −30 4 0 0 0 1 2 3 4 5 Input Voltage (V) Figure 4. Output Voltage/ON-State Resistance vs Input Voltage POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION FOR ENABLE AND DISABLE TIMES VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VCC Input Generator VI S1 RL VO Open GND 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VCC S1 RL VI CL VΔ tPLZ/tPZL 3.3 V ± 0.3 V 2 × VCC 200 Ω GND 10 pF 0.3 V tPHZ/tPZH 3.3 V ± 0.3 V GND 200 Ω VCC 10 pF 0.3 V Output Control (VIN) 2.5 V 1.25 V 1.25 V Output Waveform 1 S1 at 2 y VCC tPZL (see Note B) 0V tPLZ VOH VCC/2 tPZH Output Waveform 2 S1 at GND (see Note B) VOL +0.3 V VOL tPHZ VCC/2 VOH −0.3 V VOH VOL VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. Figure 5. Test Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION FOR SKEW VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VCC Input Generator VI RL VO S1 Open GND 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VCC S1 RL VIN (see Note B) CL tsk(p) 3.3 V ± 0.3 V GND 200 Ω VCC or GND 10 pF 3.5 V Data Input 2.5 V 1.5 V tPLH tPHL VOH 0.5 V (VOH − VOL) VOL Data Output tsk(p) = |tPHL − tPLH| VOLTAGE WAVEFORMS PULSE SKEW (tsk(p)) NOTES: A. CL includes probe and jig capacitance. B. Switch is ON during the measurement of tsk(p), i.e., voltage at E = 0 and S = VCC or GND Figure 6. Test Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC IA0 YA CL = 10 pF (see Note A) RL = 100 Ω S DUT VS E VE NOTE A: CL includes probe and jig capacitance. Figure 7. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VS = 0, VE = 0, and YA is the input, the output is measured at IA0. All unused analog I/O ports are left open. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBm 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC IA0 YA S RL = 100 Ω CL = 10 pF (see Note A) RL = 100 Ω CL = 10 pF (see Note A) 50 Ω (see Note B) VS E DUT VE YB IB0 NOTES: A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 8. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VS = 0, VE = 0, and YA is the input, the output is measured at IB0. All unused analog input (Y) ports are connected to GND, and output (I) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TS3L110 QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC IA0 YA S RL = 100 Ω CL = 10 pF (see Note A) RL = 100 Ω CL = 10 pF (see Note A) DUT VS IA1 E VE 50 Ω (see Note B) NOTES: A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 9. Test Circuit for OFF Isolation (OIRR) OFF isolation is measured at the output of the OFF channel. For example, when VS = VCC, VE = 0, and YA is the input, the output is measured at IA0. All unused analog input (Y) ports are left open, and output (I) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBm 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS3L110D ACTIVE SOIC D 16 TS3L110DBQR ACTIVE SSOP/ QSOP DBQ TS3L110DBQRE4 ACTIVE SSOP/ QSOP TS3L110DBQRG4 ACTIVE TS3L110DE4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L110RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3L110DGVR Package Package Pins Type Drawing TVSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 TS3L110DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TS3L110PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TS3L110RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3L110DGVR TVSOP DGV 16 2000 346.0 346.0 29.0 TS3L110DR SOIC D 16 2500 333.2 345.9 28.6 TS3L110PWR TSSOP PW 16 2000 346.0 346.0 29.0 TS3L110RGYR VQFN RGY 16 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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