TI SN74LV373APWRE4

SCLS407J − APRIL 1998 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 8.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
19
3
18
4
17
5
6
16
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
LE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
20
1D
1Q
OE
VCC
8Q
1
SN54LV373A . . . FK PACKAGE
(TOP VIEW)
2D
2Q
3Q
3D
4D
19 8Q
18 8D
2
3
17 7D
16 7Q
4
5
15 6Q
14 6D
6
7
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
13 5D
12 5Q
8
9
10
11
8D
7D
7Q
6Q
6D
4Q
GND
LE
5Q
5D
2
20
LE
1
VCC
SN74LV373A . . . RGY PACKAGE
(TOP VIEW)
SN54LV373A . . . J OR W PACKAGE
SN74LV373A . . . DB, DGV, DW, NS,
OR PW PACKAGE
(TOP VIEW)
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
D
OE
D
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
GND
D
D Ioff Supports Partial-Power-Down Mode
description/ordering information
The ’LV373A devices are octal transparent D-type latches designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
QFN − RGY
TOP-SIDE
MARKING
Reel of 1000
SN74LV373ARGYR
Tube of 25
SN74LV373ADW
Reel of 2500
SN74LV373ADWR
SOP − NS
Reel of 2000
SN74LV373ANSR
74LV373A
SSOP − DB
Reel of 2000
SN74LV373ADBR
LV373A
Tube of 70
SN74LV373APW
Reel of 2000
SN74LV373APWR
Reel of 250
SN74LV373APWT
TVSOP − DGV
Reel of 2000
SN74LV373ADGVR
LV373A
VFBGA − GQN
Reel of 1000
SN74LV373AGQNR
LV373A
CDIP − J
Tube of 20
SNJ54LV373AJ
SNJ54LV373AJ
CFP − W
Tube of 85
SNJ54LV373AW
SNJ54LV373AW
SOIC − DW
−40°C to 85°C
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV373A
LV373A
LV373A
LCCC − FK
Tube of 55
SNJ54LV373AFK
SNJ54LV373AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
!"# #$# #%&!$# &&"# $ % '()$# $"* & #%&! '"%$# '"& " "&! % "+$ #&!"# $#$& ,$&&$#-*
&# '&"#. " # #""$&)- #)" "#. % $))
'$&$!""&*
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1
SCLS407J − APRIL 1998 − REVISED APRIL 2005
description/ordering information (continued)
While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the
Q outputs are latched at the logic levels set up at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly. The high-impedance state and increased drive provide the capability to drive bus lines without
need for interface or pullup components.
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
GQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
1Q
OE
B
2D
7D
VCC
1D
8Q
B
C
C
3Q
2Q
6Q
7Q
D
D
4D
5D
3D
6D
E
E
GND
4Q
LE
5Q
8D
FUNCTION TABLE
(each latch)
INPUTS
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
LE
1
11
C1
1D
3
2
1D
To Seven Other Channels
Pin numbers shown are for the DB, DGV, DW, FK, J, NS, PW, RGY, and W packages.
2
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1Q
SCLS407J − APRIL 1998 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance or
power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): GQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
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3
SCLS407J − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV373A
VCC
VIH
Supply voltage
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
IOL
∆t/∆v
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
MIN
MAX
2
5.5
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
High or low state
0
3-state
0
UNIT
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
Input transition rise or fall rate
MAX
1.5
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV373A
0
VCC
5.5
VCC × 0.3
5.5
0
0
V
V
VCC
5.5
V
µA
VCC = 2 V
VCC = 2.3 V to 2.7 V
−50
−50
−2
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
−8
−8
−16
−16
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV373A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
VI = VCC or GND,
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
IO = 0
MIN
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
±5
±5
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
2.9
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4
MAX
VCC−0.1
2
2 V to 5.5 V
IOL = 8 mA
IOL = 16 mA
ICC
Ioff
TYP
SN74LV373A
VCC−0.1
2
2.3 V
IOL = 50 µA
IOL = 2 mA
VI = 5.5 V or GND
VO = VCC or GND
MIN
2 V to 5.5 V
IOH = −8 mA
IOH = −16 mA
II
IOZ
VCC
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2.9
V
pF
SCLS407J − APRIL 1998 − REVISED APRIL 2005
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
SN54LV373A
MIN
MAX
SN74LV373A
MIN
MAX
UNIT
tw
Pulse duration, LE high
6
6.5
6.5
ns
tsu
Setup time, data before LE↓
High or low
4.5
5
5
ns
th
Hold time, data after LE↓
High or low
1.5
1.5
1.5
ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
Pulse duration, LE high
tsu
Setup time, data before LE↓
th
Hold time, data after LE↓
SN54LV373A
MIN
MAX
SN74LV373A
MIN
MAX
UNIT
5
5
5
ns
High or low
4
4
4
ns
High or low
1
1
1
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
tsu
th
Pulse duration, LE high
SN54LV373A
MIN
MAX
SN74LV373A
MIN
MAX
UNIT
5
5
5
ns
Setup time, data before LE↓
High or low
4
4
4
ns
Hold time, data after LE↓
High or low
1
1
1
ns
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV373A
range,
SN74LV373A
MIN
MAX
MIN
MAX
D
Q
8.3*
15.2*
1*
17*
1
17
tpd
LE
Q
9.1*
15.7*
1*
19*
1
19
ten
OE
Q
8.9*
15.8*
1*
19*
1
19
tdis
OE
Q
6.2*
12.6*
1*
15*
1
15
D
Q
10.4
18
1
21
1
21
tpd
LE
Q
11.1
18.6
1
22
1
22
ten
OE
Q
10.9
18.8
1
22
1
22
tdis
tsk(o)
OE
Q
8.3
17.4
1
19
1
19
CL = 15 pF
CL = 50 pF
2
UNIT
ns
ns
2
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
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SCLS407J − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV373A
range,
SN74LV373A
MIN
MAX
MIN
MAX
13.5
D
Q
5.8*
11.4*
1*
13.5*
1
LE
Q
6.4*
11*
1*
13*
1
13
ten
OE
Q
6.3*
11.4*
1*
13.5*
1
13.5
tdis
OE
Q
4.7*
10*
1*
12*
1
12
D
Q
7.3
14.9
1
17
1
17
tpd
LE
Q
7.8
14.5
1
16.5
1
16.5
ten
OE
Q
7.7
14.9
1
17
1
17
tdis
tsk(o)
OE
Q
6
13.2
1
15
1
15
tpd
CL = 15 pF
CL = 50 pF
1.5
UNIT
ns
ns
1.5
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
D
Q
tpd
LE
Q
ten
OE
Q
tdis
OE
D
tpd
ten
tdis
tsk(o)
OE
Q
LOAD
CAPACITANCE
free-air
TA = 25°C
MIN
TYP
MAX
temperature
SN54LV373A
range,
SN74LV373A
MIN
MAX
MIN
MAX
4.1*
7.2*
1*
8.5*
1
8.5
4.5*
7.2*
1*
8.5*
1
8.5
4.5*
8.1*
1*
9.5*
1
9.5
Q
3.3*
7.2*
1*
8.5*
1
8.5
Q
5.1
9.2
1
10.5
1
10.5
LE
Q
5.5
9.2
1
10.5
1
10.5
OE
Q
5.5
10.1
1
11.5
1
11.5
4
9.2
1
10.5
1
10.5
CL = 15 pF
CL = 50 pF
1
UNIT
ns
ns
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV373A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.6
0.8
V
Quiet output, minimum dynamic VOL
−0.6
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
VIL(D)
Low-level dynamic input voltage
2.9
High-level dynamic input voltage
V
2.31
V
0.99
V
VCC
3.3 V
TYP
UNIT
5V
19.5
NOTE 6: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
Outputs enabled
CL = 50 pF,
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6
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f = 10 MHz
17.4
pF
SCLS407J − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
50% VCC
Input
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPLZ
tPZL
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
50% VCC
VCC
Output
Control
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LV373ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADGVRG4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373AGQNR
NRND
GQN
20
1000
SNPB
Level-1-240C-UNLIM
SN74LV373ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Addendum-Page 1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LV373APWTG4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV373ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LV373ARGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LV373AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LV373ADBR
DB
20
MLA
330
16
8.2
7.5
2.5
12
16
Q1
SN74LV373ADGVR
DGV
20
MLA
330
12
7.0
5.6
1.6
8
12
Q1
SN74LV373ADWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74LV373AGQNR
GQN
20
HIJ
330
12
3.3
4.3
1.5
8
12
Q1
SN74LV373AGQNR
GQN
20
TAI
330
12
3.3
4.3
1.6
8
12
Q1
SN74LV373ANSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
SN74LV373APWR
PW
20
MLA
330
16
6.95
7.1
1.6
8
16
Q1
SN74LV373ARGYR
RGY
20
MLA
180
12
3.8
4.8
1.6
8
12
Q1
SN74LV373AZQNR
ZQN
20
HIJ
330
12
3.3
4.3
1.5
8
12
Q1
SN74LV373AZQNR
ZQN
20
TAI
330
12
3.3
4.3
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LV373ADBR
DB
20
MLA
342.9
336.6
28.58
SN74LV373ADGVR
DGV
20
MLA
338.1
340.5
20.64
31.75
SN74LV373ADWR
DW
20
MLA
333.2
333.2
SN74LV373AGQNR
GQN
20
HIJ
346.0
346.0
29.0
SN74LV373AGQNR
GQN
20
TAI
338.1
340.5
20.64
SN74LV373ANSR
NS
20
MLA
333.2
333.2
31.75
SN74LV373APWR
PW
20
MLA
342.9
336.6
28.58
SN74LV373ARGYR
RGY
20
MLA
190.0
212.7
31.75
SN74LV373AZQNR
ZQN
20
HIJ
346.0
346.0
29.0
SN74LV373AZQNR
ZQN
20
TAI
338.1
340.5
20.64
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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