TI DAC5670IGDJ

DAC5670
www.ti.com
SGLS394 – MARCH 2010
14-BIT 2.4-GSPS DIGITAL-TO-ANALOG CONVERTER
Check for Samples: DAC5670
FEATURES
1
•
•
2
•
•
14-Bit Resolution
2.4-GSPS Maximum Update Rate Digital to
Analog Converter
Dual Differential Input Ports
– Even/Odd Demultiplexed Data
– Maximum 1.2 GSPS Each Port, 2.4 GSPS
Total
– Dual 14-Bit Inputs + 1 Reference Bit
– DDR Output Clock
– DLL Optimized Clock Timing Synchronized
to Reference Bit
– LVDS and HyperTransport™ Voltage Level
Compatible
– Internal 100-Ω Terminations for Data and
Reference Bit Inputs
Selectable 2 Times Interpolation With Fs/2
Mixing
•
•
•
•
•
Differential Scalable Current Outputs:
5 mA to 30 mA
On-Chip 1.2-V Reference
3.3-V Analog Supply Operation
Power Dissipation: 2 W
252-Ball GDJ Package
APPLICATIONS
•
•
•
•
•
Cable Modem Termination System Direct
Synthesis
Cellular Base Transceiver Station Transmit
Channels
– CDMA: W-CDMA, CDMA2000, TD-SCDMA
– 800 to 900-MHz Direct Synthesis
Point-to-Point Microwave
Radar
Satellite Communications
DESCRIPTION
The DAC5670 is a 14-bit 2.4-GSPS digital-to-analog converter (DAC) with dual demultiplexed differential input
ports. The DAC5670 is clocked at the DAC sample rate and the two input ports run at a maximum of 1.2 GSPS.
An additional reference bit input sequence is used to adjust the output clock delay to the data source, optimizing
the internal data latching clock relative to this reference bit with a delay lock loop (DLL).
The DAC5670 also can accept data up to 1.2 GSPS on one input port the same clock configuration. In the single
port mode, repeating the input sample (A_ONLY mode), 2 times interpolation by zero stuff (A_ONLY_ZS mode),
or 2 times interpolation by repeating and inverting the input sample (A_ONLY_INV) are used to double the input
sample rate up to 2.4 GSPS.
The DAC5670 operates with a single 3-V to 3.6-V supply voltage. Power dissipation is 2 W at maximum
operating conditions. The DAC5670 provides a nominal full-scale differential current-output of 20 mA, supporting
both single-ended and differential applications. An on-chip 1.2-V temperature-compensated bandgap reference
and control amplifier allows the user to adjust the full-scale output current from the nominal 20 mA to as low as 5
mA or as high as 30 mA. The output current can be directly fed to the load with no additional external output
buffer required. The device has been specifically designed for a differential transformer coupled output with a
50-Ω doubly-terminated load.
The DAC5670 is available in a 252-ball GDKJ package. The device is characterized for operation over the
temperature range –40°C to 85°C .
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
DAC5670
SGLS394 – MARCH 2010
www.ti.com
AVAILABLE OPTIONS (1)
TOP SIDE SYMBOL
–40°C to 85°C
252-GDJ
DAC5670I
A_ONLY_ZS
A_ONLY_INV
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
NORMAL
(2)
PACKAGE (2)
A_ONLY
(1)
TEMPERATURE
SLEEP
Mode Controls
CSBIAS
CSBIAS_IN
100
DA_P[13:0]
DA_N[13:0]
Input
Registers
100
DB_P[13:0]
IOUT_P
14 bit
2.4Gsps
DAC
Demux
and
Format
IOUT_N
DB_N[13:0]
RBIASOUT
RBIASIN
100
DTCLK_P
DTCLK_N
Phase
Detector
Loop
Filter
REFIO_IN
Bandgap
Ref
LOCK
REFIO
RESTART
÷2
÷2
INV_CLK
DLYCLK_P
DACCLK_P
LVDS_HTB
DACCLK_N
Variable
Delay
DLYCLK_N
Figure 1. Functional Block Diagram DAC5670
2
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A
SGLS394 – MARCH 2010
1
2
GND
LOCK
B
3
4
5
13
6
7
8
9
10
11
GND
IOUT_P
GND
GND
IOUT_N
GND
RBIASOUT
GND
REFIO
12
14
NORMAL
AVDD
GND
IOUT_P
AVDD
AVDD
IOUT_N
GND
RBIASIN
A_ONLY_ZS
GND
GND
GND
GND
GND
GND
GND
SLEEP
LVDS_HTB
A_ONLY
GND
AVDD
AVDD
AVDD
AVDD
AVDD
AVDD
GND
15
16
REFIO_IN
C
AVDD
RESTART
D
N/C
INV_CLK
E
GND
GND
GND
F
DACCLK_P
DACCLK_N
GND
GND
AVDD
GND
GND
AVDD
AVDD
GND
GND
AVDD
G
GND
GND
GND
GND
AVDD
GND
GND
GND
GND
GND
GND
AVDD
H
GND
AVDD
AVDD
GND
/
/
GND
AVDD
AVDD
AVDD
DB_N(0)
GND
J
GND
DA_P(13)
AVDD
AVDD
GND
/
/
GND
AVDD
AVDD
AVDD
DB_N(1)
GND
K
DA_P(12)
DA_N(12)
AVDD
GND
GND
GND
GND
GND
GND
AVDD
DB_N(2)
DB_P(2)
DB_P(1)
L
DA_P(11)
DA_N(11)
DA_P(10)
DA_N(10)
AVDD
GND
GND
AVDD
AVDD
GND
GND
AVDD
DB_N(6)
DB_N(3)
DB_P(3)
M
DA_P(9)
DA_N(9)
DA_P(8)
DA_N(8)
GND
AVDD
AVDD
AVDD
AVDD
AVDD
AVDD
GND
DB_P(6)
DB_N(4)
DB_P(4)
N
DA_P(7)
DA_N(7)
DA_P(6)
DA_N(6)
DTCLK_P
DTCLK_N
DB_N(5)
DB_P(5)
DA_N(5)
GND
DLYCLK_P
DLYCLK_N
DB_N(13)
DB_P(13)
P
R
DA_P(5)
T
GND
DA_P(4)
A_ONLY_INV
DA_N(13)
DA_N(4)
DA_N(3)
DA_P(3)
DA_P(2)
DA_N(2)
CSCAP
DA_N(1)
DA_N(0)
AVDD
AVDD
DA_P(1)
DA_P(0)
GND
GND
DB_N(12)
CSCAP_IN
DB_N(9)
GND
DB_N(7)
DB_P(7)
DB_N(11)
DB_N(10)
DB_P(9)
DB_N(8)
DB_P(8)
DB_P(12)
DB_P(11)
DB_P(10)
GND
Figure 2. Ball Grid Array of the DAC5670
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TERMINAL FUNCTIONS
TERMINAL
NAME
DACCLK_P
NO.
F1
I/O
DESCRIPTION
I
External clock input; sample clock for the DAC
DACCLK_N
F2
I
Complementary external clock input; sample clock for the DAC
DLYCLK_P
P8
O
DDR type data clock output to data source
DLYCLK_N
P9
O
DDR type data clock output to data source complementary signal
DTCLK_P
N8
I
Input data toggling reference bit
DTCLK_N
N9
I
Input data toggling reference bit complementary signal
J2
I
Port A data bit 13 (MSB)
DA_N[13]
J3
I
Port A data bit 13 complement (MSB)
DA_P[12]
K1
I
Port A data bit 12
DA_N[12]
K2
I
Port A data bit 12 complement
DA_P[11]
L1
I
Port A data bit 11
DA_N[11]
L2
I
Port A data bit 11 complement
DA_P[10]
L3
I
Port A data bit 10
DA_N[10]
L4
I
Port A data bit 10 complement
DA_P[9]
M1
I
Port A data bit 9
DA_N[9]
M2
I
Port A data bit 9 complement
DA_P[8]
M3
I
Port A data bit 8
DA_N[8]
M4
I
Port A data bit 8 complement
DA_P[7]
N1
I
Port A data bit 7
DA_N[7]
N2
I
Port A data bit 7 complement
DA_P[6]
N3
I
Port A data bit 6
DA_N[6]
N4
I
Port A data bit 6 complement
DA_P[5]
R1
I
Port A data bit 5
DA_N[5]
P2
I
Port A data bit 5 complement
DA_P[4]
T2
I
Port A data bit 4
DA_N[4]
R3
I
Port A data bit 4 complement
DA_P[3]
T3
I
Port A data bit 3
DA_N[3]
R4
I
Port A data bit 3 complement
DA_P[2]
T4
I
Port A data bit 2
DA_N[2]
T5
I
Port A data bit 2 complement
DA_P[1]
T6
I
Port A data bit 1
DA_N[1]
R6
I
Port A data bit 1 complement
DA_P[0]
T7
I
Port A data bit 0 (LSB)
DA_N[0]
R7
I
Port A data bit 0 complement (LSB)
xxx
DA_P[13]
xxx
DB_P[13]
R10
DB_N[13]
P10
I
Port B data bit 13 complement (MSB)
DB_P[12]
T12
I
Port B data bit 12
DB_N[12]
R11
I
Port B data bit 12 complement
DB_P[11]
T13
I
Port B data bit 11
DB_N[11]
R12
I
Port B data bit 11 complement
DB_P[10]
T14
I
Port B data bit 10
DB_N[10]
R13
I
Port B data bit 10 complement
DB_P[9]
R14
I
Port B data bit 9
DB_N[9]
P13
I
Port B data bit 9 complement
4
Port B data bit 13 (MSB)
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SGLS394 – MARCH 2010
TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
DB_P[8]
R16
I
Port B data bit 8
DB_N[8]
R15
I
Port B data bit 8 complement
DB_P[7]
P16
I
Port B data bit 7
DB_N[7]
P15
I
Port B data bit 7 complement
DB_P[6]
M13
I
Port B data bit 6
DB_N[6]
L13
I
Port B data bit 6 complement
DB_P[5]
N16
I
Port B data bit 5
DB_N[5]
N15
I
Port B data bit 5 complement
DB_P[4]
M16
I
Port B data bit 4
DB_N[4]
M15
I
Port B data bit 4 complement
DB_P[3]
L16
I
Port B data bit 3
DB_N[3]
L15
I
Port B data bit 3 complement
DB_P[2]
K15
I
Port B data bit 2
DB_N[2]
K14
I
Port B data bit 2 complement
DB_P[1]
K16
I
Port B data bit 1
DB_N[1]
J15
I
Port B data bit 1 complement
DB_P[0]
J14
I
Port B data bit 0 (LSB)
DB_N[0]
H15
I
Port B data bit 0 complement (LSB)
IOUT_P
A7, B7
O
DAC current output. Full scale when all input bits are set 1.
IOUT_N
A10, B10
O
DAC complementary current output. Full scale when all input bits are 0.
RBIASOUT
A14
O
Rbias resistor current output
RBIASIN
B14
I
Rbias resistor sense input
CSCAP
D16
O
Current source bias voltage output
CSCAP_IN
E16
I
Current source bias voltage sense input
REFIO
B16
O
Bandgap reference output
REFIO_IN
C16
I
Bandgap reference sense input
RESTART
C2
I
Resets DLL when high. Low for normal DLL operation.
LVDS_HTB
D6
I
DLYCLK_P/N control; lvds mode when high, ht mode when low.
INV_CLK
D2
I
Inverts the DLL target clocking relationship when high. Low for normal DLL operation.
LOCK
A2
O
DLL lock indicator, constant high when locked. (1)
D5
I
Active high sleep.
NORMAL
B2
I
High for {a0,b0,a1,b1,a2,b2, …} normal mode
A_ONLY
D7
I
High for {a0,a0,a1,a1,a2,a2, …} A_only mode
A_ONLY_INV
D4
I
High for {a0,-a0, a1,-a1,a2,-a2, ...} A_only_inv mode
A_ONLY_ZS
C3
I
High for {a0,0,a1,0,a2,0, …} A_only_zs mode
xxx
xxx
xxx
xxx
SLEEP
xxx
(1)
The DLL LOCK indicator on the current version of the DAC5670 is only partially functional - the lock signal may indicate a DLL lock
condition when no DACCLK signal or DTCLK signal is present.
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TERMINAL
NAME
DESCRIPTION
NO.
GND
A1, A6, A8, A9, A11, A16, B6, B11, C6, C7, C8,
C9, C10, C11, C14, E1, E2, E3, E5, E12, F3, F4,
F6, F7, F10, F11, G1, G2, G3, G4, G6, G7, G8,
Ground
G9, G10, G11, H1, H7,H10, H16, J1, J7, J10, J16,
K6, K7, K8, K9, K10, K11, L6, L7, L10, L11, M5,
M12, P3, P14, T1, T8, T9, T16
AVDD
B3, B8, B9, C1, E6, E7, E8, E9, E10, E11, F5, F8,
F9, F12, G5, G12, H5, H6, H11, H12, H14, J5, J6,
3.3 V Analog power supply
J11, J12, K5, K12, L5, L8, L9, L12, M6, M7, M8,
M9, M10, M11, R8, R9
No connect
A3, A4, A13, A15, B1, B4, B13, B15, C4, C12,
C13, C15, D3, D8, D9, D10, D11, D12, D13, D14,
D15, E4, E13, E14, E15, F13, F14, F15, F16,
No internal connection. These balls can be connected to GND (if
G13, G14, G15, G16, H2, H3, H4, H13, J4, J13,
desired), or left open.
K3, K4, K13, L14, M14, N5, N6, N7, N10, N11,
N12, N13, N14, P1, P4, P5, P6, P7,P11, P12, R2,
R5, T10, T11, T15
No connect
D1
Factory use only, must be left unconnected.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage
AVDD to GND
DA_P[13..0], DA_N[13..0],
DB_P[13..0], DB_N[13..0]
Measured with respect to GND
NORMAL, A_ONLY,
A_ONLY_INV, A_ONLY_ZS
MAX
UNIT
5.0
V
-0.3
AVDD + 0.3
V
Measured with respect to GND
-0.3
AVDD + 0.3
V
DTCLK_P, DTCLK_N,
DACCLK_P, DACCLK_N
Measured with respect to GND
-0.3
AVDD + 0.3
V
LVDS_HTB, INV_CLK,
RESTART
Measured with respect to GND
-0.3
AVDD + 0.3
V
IOUT_P, IOUT_N
Measured with respect to GND
AVDD – 0.5
AVDD + 1.5
V
CSCAP_IN, REFIO_IN,
RBIAS_IN
Measured with respect to GND
-0.3
AVDD + 0.3
V
20
mA
–65
150
°C
Maximum Junction Temperature
150
°C
Lead temperature 1,6 mm (1/16 in) from the case for 10 s
260
°C
Peak input current (any input)
Storage temperature range
(1)
6
Stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
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DC Electrical Characteristics
TC,MIN = –40°C to TC,MAX = 85°C, typical values at 25°C, AVDD = 3 V to 3.6 V, IoutFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP (1)
MAX
14
UNIT
Bits
DC Accuracy
INL
Integral nonlinearity
DNL
Differential nonlinearity
TC,MIN to TC,MAX , fDAC = 640 MHz,
fOUT = 10 MHz
Monotonocity
–7.5
±1.5
7.5
–0.98
±0.8
1.75
14
LSB
Bits
Analog Output
Offset error
Mid code offset
–0.45
±0.09
0.45
%FSR
Gain error
With external reference
–6.0
±1.6
6.0
%FSR
Gain error
With internal reference
–6.0
±1.6
6.0
%FSR
30
mA
Full-scale output current
Output compliance range
IO(FS) = 20 mA,
AVDD = 3.15 V to 3.45 V
AVDD – 0.5
Output resistance
Output capacitance
IOUT_P and IOUT_N single ended
AVDD + 0.5
V
300 (2)
kΩ
(2)
pF
13.7
Reference Output
Reference voltage
1.14
Reference output current
1.2
1.26
V
100
nA
Reference Input
VREFIO
Input voltage range
1.14
Input resistance
Small-signal bandwidth
1.2
1.26
V
1 (2)
MΩ
1.4
MHz
3.2 (2)
Input capacitance
pF
Temperature Coefficients
Offset drift
75
ppm of FSR/°C
Gain drift
With external reference
75
ppm of FSR/°C
Gain drift
With internal reference
75
ppm of FSR/°C
35
ppm/°C
Reference voltage drift
Power Supply
AVDD
Analog supply voltage
3
IAVDD
Analog supply current
fDAC = 2.4 GHz, NORMAL input
mode
IAVDD
Sleep mode, AVDD supply
current
Sleep mode (SLEEP pin high)
P
Power dissipation
fDAC = 2.4 GHz, NORMAL input
mode
PSRR
Power-supply rejection ratio
AVDD = 3.15 V to 3.45 V
(1)
(2)
3.3
3.6
V
560
650
mA
150
180
mA
1800
2350
mW
0.4
1.3
%FSR/V
Typicals are characterization values at 25C and AVDD = 3.3V. These parameters are characterized but not production tested.
Specified by design
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AC Electrical Characteristics
TC,MIN = –40°C to TC,MAX = 85°C, typical values at 25°C, AVDD = 3 V to 3.6 V, IoutFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP (1)
MIN
MAX
UNIT
Analog Output
fDAC
Maximum output update
rate
ts(DAC)
Output setting time to
0.1%
tpd
Output propagation delay
tr(IOUT)
Output rise time, 10% to
90%
280
ps
tf(IOUT)
Output fall time, 90% to
10%
280
ps
2.4
Mid-scale transition
GSPS
3.5
ns
7 DACCLK
+ 1.5 ns
AC Performance
SFDR
Spurious-free dynamic
range
fDAC = 2.4 GSPS, fOUT = 100 MHz, Dual-port
mode, 0 dBFS
47
55
fDAC = 2.4 GSPS, fOUT = 200 MHz, Dual-port
mode, 0 dBFS
38
51
fDAC = 2.4 GSPS, fOUT = 300 MHz, Dual-port
mode, 0 dBFS
37
41
fDAC = 2.4 GSPS, fOUT = 500 MHz, Dual-port
mode, 0 dBFS
44
50
fDAC = 2.4 GSPS, fOUT = 500 MHz, Dual-port
mode, –6 dBFS
SNR
Signal-to-noise ratio
47
fDAC = 2.4 GSPS, fOUT = 100 MHz, Dual-port
mode, 0 dBFS
63
70
fDAC = 2.4 GSPS, fOUT = 200 MHz, Dual-port
mode, 0 dBFS
62
70
fDAC = 2.4 GSPS, fOUT = 300 MHz, Dual-port
mode, 0 dBFS
57
62
fDAC = 2.4 GSPS, fOUT = 500 MHz, Dual-port
mode, 0 dBFS
53
60
fDAC = 2.4 GSPS, fOUT = 500 MHz, Dual-port
mode, –6 dBFS
THD
Total harmonic distortion
IMD3
IMD
(1)
8
dBc
52
fDAC = 2.4 GSPS, fOUT = 100 MHz, Dual-port
mode, 0 dBFS
50
55
fDAC = 2.4 GSPS, fOUT = 200 MHz, Dual-port
mode, 0 dBFS
41
50
fDAC = 2.4 GSPS, fOUT = 300 MHz, Dual-port
mode, 0 dBFS
38
48
fDAC = 2.4 GSPS, fOUT = 500 MHz, Dual-port
mode, 0 dBFS
47
53
fDAC = 2.4 GSPS, fOUT = 500 MHz, Dual-port
mode, –6 dBFS
Third-order two-tone
intermodulation
dBc
dBc
44
fDAC = 2.4 GSPS, fOUT = 99 MHz and 102 MHz,
Each tone at –6 dBFS, Dual-port mode.
65
70
dBc
fDAC = 2.4 GSPS, fOUT = 200 MHz and 202 MHz,
Each tone at –6 dBFS, Dual-port mode.
51
68
dBc
fDAC = 2.4 GSPS, fOUT = 253 Mhz and 257 MHz,
Each tone at –6 dBFS, Dual-port mode.
47
57
dBc
fDAC = 2.4 GSPS, fOUT = 299 Mhz and 302 MHz,
Each tone at –6 dBFS, Dual-port mode.
51
55
dBc
51
62.5
dBc
fDAC = 2.4 GSPS, fOUT = 298 MHz, 299 MHz,
Four-tone intermodulation 300 MHz, and 301 MHz, Each tone at –12
dBFS, Dual-port mode.
Typicals are characterization values at 25C and AVDD = 3.3V. These parameters are characterized but not production tested
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SGLS394 – MARCH 2010
Digital Electrical Characteristics
TC,MIN = –40°C to TC,MAX = 85°C, typical values at 25°C, AVDD = 3 V to 3.6 V, IoutFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1) MAX
UNIT
CMOS Interface (SLEEP, RESTART, INV_CLK, NORMAL, A_ONLY, A_ONLY_INV, A_ONLY_ZS)
VIH
High-level input voltage
2
3
VIL
Low-level input voltage
0
0
0.8
V
IIH
High-level input current
0.2
10
mA
IIL
Low-level input current
-10
-0.2
mA
2.5 (2)
pF
Input capacitance
V
Differential Data Interface (DA_P[13:0], DA_N[13:0], DB_P[13:0], DB_N[13:0], DTCLK_P, DTCLK_N)
VITH
Differential input threshold
ZT
Internal termination impedance
–100
80
VICOM
Input common mode
0.6
Ci
Input capacitance
100
100
mV
125
Ω
1.4
V
2.6 (2)
pF
Clock Inputs (DACCLK_P, DACCLK_N)
|DACCLK_P DACCLK_N|
VCLKCM
(1)
(2)
Clock differential input voltage
200
1000
mV
Clock duty cycle
40
60
%
Clock common mode
1.0
1.4
V
Typicals are characterization values at 25C and AVDD = 3.3V. These parameters are characterized but not production tested
Specified by design
Table 1. Thermal Information
Parameter
TEST CONDITIONS
TYPICAL
41.3
°C/W
3.8
°C/W
RqJA
Junction-to-free-air thermal resistance
Non-thermally enhanced JEDEC standard
PCB, per JESD-51, 51-3
RqJC
Junction-to-case thermal resistance
MIL-STD-883 test method 1012
UNIT
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TYPICAL CHARACTERISTICS
Single-Tone Spectrum Power
vs
Frequency
Figure 3.
Two-Tone IMD (Power)
vs
Frequency
Figure 4.
10
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TYPICAL CHARACTERISTICS (continued)
W-CDMA TM1 Single Carrier Power
vs
Frequency
Figure 5.
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TYPICAL CHARACTERISTICS (continued)
W-CDMA TM1 Single Carrier Power
vs
Frequency
Figure 6.
12
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TYPICAL CHARACTERISTICS (continued)
W-CDMA TM1 Dual Carrier Power
vs
Frequency
Figure 7.
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TYPICAL CHARACTERISTICS (continued)
W-CDMA TM1 Three Carrier Power
vs
Frequency
Figure 8.
14
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TYPICAL CHARACTERISTICS (continued)
W-CDMA TM1 Four Carrier Power
vs
Frequency
Figure 9.
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APPLICATION INFORMATION
Detailed Description
Figure 10 shows a simplified block diagram of the current steering DAC5670. The DAC5670 consists of a
segmented array of NPN-transistor current sinks, capable of delivering a full-scale output current up to 30mA.
Differential current switches direct the current of each current sink to either one of the complementary output
nodes IOUT_P or IOUT_N. The complementary current output enables differential operation, canceling out
common-mode noise sources (digital feed-through, on-chip and PCB noise), dc offsets, and even-order distortion
components, and doubling signal output power.
The full-scale output current is set using an external resistor (RBIAS) in combination with an on-chip bandgap
voltage reference source (1.2V) and control amplifier. The current (IBIAS) through resistor RBIAS is mirrored
internally to provide a full-scale output current equal to 32 times IBIAS. The full-scale current is adjustable from
30mA down to 5mA by using the appropriate bias resistor value.
Figure 10. Current Steering DAC5670
16
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Digital Inputs
The DAC5670 differential digital inputs are compatible with LVDS and HyperTransport voltage levels.
Figure 11. Digital Input Voltage Options
The DAC5670 uses low voltage differential signaling (LVDS and Hyper-Transport) for the bus input interface. The
LVDS and Hyper-Transport input modes feature a low differential voltage swing. The differential characteristic of
LVDS and Hyper-Transport modes allow for high-speed data transmission with low electromagnetic interference
(EMI) levels. Figure 12 shows the equivalent complementary digital input interface for the DAC5670, valid for
pins DA_P[13:0], DA_N[13:0], DB_P[13:0], and DB_N[13:0].
Figure 12.
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Figure 13 shows a schematic of the equivalent CMOS/TTL-compatible digital inputs of the DAC5670, valid for the
following pins: RESTART, LVDS_HTB, INV_CLK, SLEEP, NORMAL, A_ONLY, A_ONLY_INV, and A_ONLY_ZS.
Figure 13.
The DAC5670 is clocked at the DAC sample rate. Each input port runs at a maximum of 1.2 GSPS. The
DAC5670 provides an output clock at one-half the input port data rate (DACCLK/4), monitors an additional
reference bit input sequence, and adjusts the output clock delay to optimize the data latch relative to the
reference bit with a DLL. The DLL delay automatically adjusts for drift over temperature and time.
Data Source
DAC5670
DA_P[13:0]
DA_N[13:0]
Input
Registers
DB_P[13:0]
DB_N[13:0]
DTCLK_P
DTCLK_N
Delay
Locked
Loop
(DLL)
÷2
÷2
DLYCLK_P
DLYCLK_N
DACCLK_P
DACCLK_N
Figure 14. DLL Input Loop Simplified Block Diagram
18
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Figure 15. DLL Input Loop Functional Timing
Input Format
The DAC5670 has four input modes selected by the four mutually exclusive configuration pins: NORMAL,
A_ONLY, A_ONLY_INV, and A_ONLY_ZS. Table 2 lists the input modes, the input sample rates, the maximum
DAC sample rate (CLK input) and resulting DAC output sequence for each configuration. For all configurations,
the DLYCLK_P/N outputs and DTCLK_P/N inputs are DACCLK_P/N frequency divided by four.
Table 2. DAC5670 Input Formats
DLYCLK_P/N
AND
DTCLK_P/N
FREQ
(MHz)
NORMAL
A_ONLY
A_ONLY_INV
A_ONLY_ZS
FinA/Fdac
FinB/Fdac
fDAC MAX
(MHz)
DAC OUTPUT
SEQUENCE
1
0
0
0
1/2
1/2
2400
Fdac/4
A0, B0, A1, B1,
A2, B2, . . .
0
1
0
0
1/2
Off
2400
Fdac/4
A0, A0, A1, A1,
A2, A2, . . .
0
0
1
0
1/2
Off
2400
Fdac/4
A0, –A0, A1, –A1,
A2, –A2, . .
0
0
0
1
1/2
Off
2400
Fdac/4
A0, 0, A1, 0,
A2, 0, . . .
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Clock Input
The DAC5670 features differential, LVPECL compatible clock inputs (DACCLK_P, DACCLK_N). Figure 16shows
the equivalent schematic of the clock input buffer. The internal biasing resistors set the input common-mode
voltage to AVDD/2, while the input resistance is typically 1 kΩ. A variety of clock sources can be ac-coupled to
the device, including a sine wave source (see Figure 17).
Figure 16. Clock Equivalent Input
Figure 17. Driving the DAC5670 with a Single-Ended Clock Source Using a Transformer
To obtain best ac performance the DAC5670 clock input should be driven with a differential LVPECL or sine
wave source as shown in Figure 18and Figure 19. Here, the potential of VTT should be set to the termination
voltage required by the driver along with the proper termination resistors (RT). The DAC5670 clock input can also
be driven single-ended for slower clock rates using TTL/CMOS levels; this is shown in Figure 20.
20
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Figure 18. Driving the DAC5670 with a Single-Ended ECL/PECL Clock Source
Figure 19. Driving the DAC5670 with a Differential ECL/PECL Clock Source
Figure 20. Driving the DAC5670 with a Single-Ended TTL/CMOS Clock Source
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DAC Transfer Function
The DAC5670 has a current sink output. The current flow through IOUT_P and IOUT_N is controlled by
Dx_P[13:0] and Dx_N[13:0]. For ease of use, we denote D[13:0] as the logical bit equivalent of Dx_P[13:0] and
its complement Dx_N[13:0]. The DAC5670 supports straight binary coding with D13 being the MSB and D0 the
LSB. Full-scale current flows through IOUTP when all D[13:0] inputs are set high and through IOUTN when all
D[13:0] inputs are set low. The relationship between IOUT_P and IOUT_N can be expressed as Equation 1:
IOUT_N = IO(FS) - IOUT_P
(1)
(1)
IO(FS) is the full-scale output current sink (5 mA to 30 mA). Since the output stage is a current sink, the current
can only flow from AVDD through the load resistors RL into the IOUT_N and IOUT_P pins.
The output current flow in each pin driving a resistive load can be expressed as shown in Figure 21, as well as in
Equation 2 and Equation 3.
Figure 21. Relationship between D[13:0], IOUT_N and IOUT_P
IOUT_N = (IOUT(FS) x (16383 - CODE)) / 16384
IOUT_P = (IOUT(FS) x CODE) / 16384
(2)
(3)
(2)
(3)
where CODE is the decimal representation of the DAC input word. This would translate into single-ended
voltages at IOUT_N and IOUT_P, as shown in Equation 4 and Equation 5:
VOUTN = AVDD - IOUT_N x RL
(4)
(4)
VOUTP = AVDD - IOUT_P x RL
(5)
(5)
For example, assuming that D[13:0] = 1 and that RL is 50 Ω, the differential voltage between pins IOUT_N and
IOUT_P can be expressed as shown in Equation 6 through Equation 8 where IO(FS) = 20 mA:
VOUTN = 3.3 V - 0 mA x 50 Ω = 3.3 V
(6)
(6)
VOUTP = 3.3 V - 20 mA x 50 Ω = 2.3 V
(7)
(7)
VDIFF = VOUTN - VOUTP = 1 V
(8)
(8)
If D[13:0] = 0, then IOUT_P = 0 mA and IOUT_N = 20 mA and the differential voltage VDIFF = –1 V.
The output currents and voltages in IOUT_N and IOUT_P are complementary. The voltage, when measured
differentially, will be doubled compared to measuring each output individually. Care must be taken not to exceed
the compliance voltages at the IOUT_N and IOUT_P pins in order to keep signal distortion low.
22
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Reference Operation
Bandgap
Reference
1.2 V Reference
REFIO
External
REFIO
Filter
Capacitor
REFIO_IN
+
RBIASOUT
RBIASIN
External
RBIAS
Resistor
Figure 22. Reference Circuit
The DAC5670 comprises a bandgap reference and control amplifier for biasing the full-scale output current. The
full-scale output current is set by applying an external resistor RBIAS to pins RBIASOUT and RBIASIN. The bias
current IBIAS through resistor RBIAS is defined by the on-chip bandgap reference voltage and control amplifier. The
full-scale output current equals 32 times this bias current. The full-scale output current IOUTFS can thus be
expressed as:
IOUTFS = 32 × IBIAS = 32 × VREFIO/RBIAS
(9)
(9)
Where:
VREFIO Voltage at terminals REFIO and REFIO_IN
The bandgap reference voltage delivers an accurate voltage of 1.2 V. An external REFIO filter capacitor of 0.1
mF should be connected externally to the terminals REFIO and REFIO_IN for compensation.
The full-scale output current can be adjusted from 30 mA down to 5 mA by varying external resistor RBIAS .
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Analog Current Outputs
Figure 23 is a simplified schematic of the current sink array output with corresponding switches. Differential NPN
switches direct the current of each individual NPN current sink to either the positive output node IOUT_P or its
complementary negative output node IOUT_N. The input data presented at the DA_P[13:0], DA_N[13:0],
DB_P[13:0] and DB_N[13:0] is decoded to control the sw_p(N) and sw_n(N) current switches.
AVDD (3.3 V)
RLOAD
RLOAD
IOUT_N
sw_p(0)
IOUT_P
sw_n(0)
sw_p(1)
sw_n(1)
sw_p(N)
sw_n(N)
Current Sink Array
CSBIAS
CSBIAS_IN
External
CSBIAS
Filter
Capacitor
Figure 23. Current Sink Array
The external output resistors RLOAD are connected to the positive supply, AVDD.
The DAC5670 can easily be configured to drive a doubly-terminated 50 Ω cable using a properly selected
transformer. Figure 24 and Figure 25 show the 1:1 and 4:1 impedance ratio configuration, respectively. These
configurations provide maximum rejection of common-mode noise sources and even-order distortion
components, thereby doubling the power of the DAC to the output. The center tap on the primary side of the
transformer is terminated to AVDD, enabling a dc current flow for both IOUT_N and IOUT_P.
24
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Figure 24.
Figure 25.
Sleep Mode
When the SLEEP pin is asserted (high), the DAC5670 enters a lower-power mode.
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Definitions of Specifications and Terminology
Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1 LSB
change in the digital input code.
Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the
value at 25°C to values over the full operating temperature range.
Gain Error: Defined as the percentage error in the ratio between the measured full-scale output current and the
value of the ideal full-scale output (32 x VREFIO/RBIAS). A VREFIO of 1.2V is used to measure the gain error with an
external reference voltage applied. With an internal reference, this error includes the deviation of VREFIO (internal
bandgap reference voltage) from the typical value of 1.2V.
Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output,
determined by a straight line drawn from zero scale to full scale.
Intermodulation Distortion (IMD3, IMD): The two-tone IMD3 or four-tone IMD is defined as the ratio (in dBc) of
the worst 3rd-order (or higher) intermodulation distortion product to either fundamental output tone.
Offset Drift: Defined as the maximum change in DC offset, in terms of ppm of full-scale range (FSR) per °C,
from the value at 25°C to values over the full operating temperature range.
Offset Error: Defined as the percentage error in the ratio of the differential output current (IOUT_P – IOUT_N) to
half of the full-scale output current for input code 8192.
Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the
current-output DAC. Exceeding this limit may result in reduced reliability of the device or adversely affecting
distortion performance.
Power Supply Rejection Ratio (PSSR): Defined as the percentage error in the ratio of the delta IOUT and delta
supply voltage normalized with respect to the ideal IOUT current.
Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius
from value at ambient (25°C) to values over the full operating temperature range.
Spurious Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the
output signal and the peak spurious signal.
Signal to Noise Ratio (SNR): Defined as the ratio of the RMS value of the fundamental output signal to the
RMS sum of all other spectral components below the Nyquist frequency, including noise, but excluding the first
six harmonics and dc.
Total Harmonic Distortion (THD): Defined as the ratio of the rms sum of the first six harmonic components to
the rms value of the fundamental output signal.
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PACKAGE OPTION ADDENDUM
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2-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
DAC5670IGDJ
ACTIVE
BGA
GDJ
Pins Package Eco Plan (2)
Qty
252
90
Lead/Ball Finish
Green (RoHS &
no Sb/Br)
Call TI
MSL Peak Temp (3)
Level-4-260C-72 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DAC5670 :
• Space: DAC5670-SP
NOTE: Qualified Version Definitions:
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 1
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