TI TMP400AIDBQR

 TMP400
TM
P4
00
SBOS404 – DECEMBER 2007
±1°C Remote and Local TEMPERATURE SENSOR
with N-Factor and Series Resistance Correction
FEATURES
1
•
•
•
•
234
•
•
•
•
•
•
•
•
±1°C REMOTE DIODE SENSOR
±1°C LOCAL TEMPERATURE SENSOR
PROGRAMMABLE NON-IDEALITY FACTOR
PROGRAMMABLE SERIES RESISTANCE
CANCELLATION
ALERT FUNCTION
PROGRAMMABLE RESOLUTION: 9 to 12 Bits
PROGRAMMABLE THRESHOLD LIMITS
TWO-WIRE/SMBus™ SERIAL INTERFACE
MINIMUM AND MAXIMUM TEMPERATURE
MONITORS
MULTIPLE INTERFACE ADDRESSES
ALERT PIN CONFIGURATION
DIODE FAULT DETECTION
APPLICATIONS
•
•
•
•
•
•
•
•
LCD/DLP®/LCOS PROJECTORS
SERVERS
INDUSTRIAL CONTROLLERS
CENTRAL OFFICE TELECOM EQUIPMENT
DESKTOP AND NOTEBOOK COMPUTERS
STORAGE AREA NETWORKS (SAN)
INDUSTRIAL AND MEDICAL EQUIPMENT
PROCESSOR/FPGA TEMPERATURE
MONITORING
DESCRIPTION
The TMP400 is a remote temperature sensor monitor
with a built-in local temperature sensor. The remote
temperature sensor diode-connected transistors are
typically low-cost, NPN- or PNP-type transistors or
diodes that are an integral part of microcontrollers,
microprocessors, or FPGAs.
Remote accuracy is ±1°C for multiple IC
manufacturers, with no calibration needed. The
Two-Wire serial interface accepts SMBus write byte,
read byte, send byte, and receive byte commands to
program the alarm thresholds and to read
temperature data.
The TMP400 is customizable with programmable:
series resistance cancellation, non-ideality factor,
resolution, and threshold limits. Other features are:
minimum and maximum temperature monitors, wide
remote temperature measurement range (up to
+127.9375°C), diode fault detection, and temperature
alert function.
The TMP400 is available in a QSSOP-16 package.
STBY
15
V+
11
2
V+
GND
7, 8
TMP400
Interrupt
Configuration
ALERT
Consecutive Alert
Configuration Register
Status Register
N-Factor
Correction
Local
Temperature
Register
TL
Remote Temp High Limit
Remote Temp Low Limit
Temperature
Comparators
Conversion Rate
Register
Local Temp Low Limit
Local Temperature Min/Max Register
D+ 3
4
Local Temp High Limit
TR
Remote
Temperature
Register
Remote Temperature Min/Max Register
Manufacturer ID Register
D-
Device ID Register
Configuration Register
Resolution Register
SCL
SDA
14
Bus Interface
12
6
Pointer Register
10
A1
A0
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DLP is a registered trademark of Texas Instruments.
SMBus is a trademark of Intel Corp.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP400
QSSOP-16
DBQ
TMP400
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Power Supply, VS
Input Voltage, pins 3, 4, 6, 10, and 15 only
Input Voltage, pins 11, 12, and 14 only
TMP400
UNIT
7
V
–0.5 to VS + 0.5
V
–0.5 to +7
V
10
mA
Operating Temperature Range
–55 to +127
°C
Storage Temperature Range
–60 to +130
°C
+150
°C
Human Body Model (HBM)
3000
V
Charged Device Model (CDM)
1000
V
Machine Model (MM)
200
V
Input Current
Junction Temperature (TJ max)
ESD Rating
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
TERMINAL FUNCTIONS
PIN CONFIGURATION
PIN
QSSOP-16
Top View
NC
No internal connection
NC
1
16 NC
2
V+
Positive supply (2.7V to 5.5V)
V+
2
15 STBY
3
D+
Positive connection to remote temperature
sensor
D+
3
14 SCL
4
D–
D-
4
Negative connection to remote temperature
sensor
6
A1
Address pin
13 NC
TMP400
2
NAME DESCRIPTION
1, 5, 9,
13, 16
NC
5
12 SDA
7, 8
GND
A1
6
11 ALERT
10
A0
GND
7
10 A0
11
ALERT
GND
8
9
12
SDA
Serial data line for SMBus, open-drain;
requires pull-up resistor to V+
14
SCL
Serial clock line for SMBus, open-drain;
requires pull-up resistor to V+
15
STBY
NC
Submit Documentation Feedback
Ground
Address pin
Alert, active low, open-drain; requires pull-up
resistor to V+
Standby pin
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +125°C and VS = 2.7V to 5.5V, unless otherwise noted.
TMP400
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE ERROR
Local Temperature Sensor
Remote Temperature Sensor (1) (2)
TELOCAL
TEREMOTE
TA = –40°C to +125°C
±1.25
±2.5
°C
VS = 3.3V, TA = +15°C to +85°C
±0.0625
±1
°C
VS = 3.3V, TA = +15°C to +75°C, TD = –40°C to +125°C (3)
±0.0625
±1
°C
VS = 3.3V, TA = –40°C to +100°C, TD = –40°C to +125°C (3)
±1
±3
°C
TA = –40°C to +125°C, TD = –40°C to +125°C (3)
±3
±10
°C
VS = 2.7V to 5.5V
±0.2
±0.5
°C/V
115
125
ms
12
Bits
vs Supply
Local/Remote
TEMPERATURE MEASUREMENT
Conversion Time (per channel) (4)
105
Resolution
Local Temperature Sensor (programmable)
9
Remote Temperature Sensor
12
Bits
Remote Sensor Source Currents
120
µA
Medium High
60
µA
Medium Low
12
µA
6
µA
High
Series Resistance 3kΩ Maximum
Low
Remote Transistor Ideality Factor
η
TMP400 Optimized Ideality Factor
1.008
SMBus INTERFACE
Logic Input High Voltage (SCL, SDA)
VIH
Logic Input Low Voltage (SCL, SDA)
VIL
2.1
V
0.8
Hysteresis
500
SMBus Output Low Sink Current
6
Logic Input Current
–1
SMBus Input Capacitance (SCL, SDA)
mA
+1
µA
3.4
MHz
35
ms
1
µs
3
SMBus Clock Frequency
SMBus Timeout
25
V
mV
30
SCL Falling Edge to SDA Valid Time
pF
DIGITAL OUTPUTS
Output Low Voltage
VOL
IOUT = 6mA
0.15
0.4
V
High-Level Output Leakage Current
IOH
VOUT = VS
0.1
1
µA
ALERT Output Low Sink Current
ALERT Forced to 0.4V
6
mA
POWER SUPPLY
Specified Voltage Range
VS
Quiescent Current
IQ
5.5
V
0.0625 Conversions per Second
2.7
30
38
µA
Eight Conversions per Second
420
525
µA
10
µA
Serial Bus Inactive, Shutdown Mode
3
Serial Bus Active, fS = 400kHz, Shutdown Mode
90
Serial Bus Active, fS = 3.4MHz, Shutdown Mode
350
Undervoltage Lock Out
Power-On Reset Threshold
2.3
POR
µA
µA
2.4
2.6
V
1.6
2.3
V
°C
TEMPERATURE RANGE
Specified Range
–40
+125
Storage Range
–60
+130
Thermal Resistance, QSSOP
(1)
(2)
(3)
(4)
70
°C
°C/W
Tested with less than 5Ω effective series resistance and 100pF differential input capacitance.
RC = '1'.
TD is the remote temperature measured at the diode.
RES1 = '1' and RES0 = '1' for 12-bit resolution.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
3
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
TYPICAL CHARACTERISTICS
At TA = +25°C and VS = 5.0V, unless otherwise noted.
REMOTE TEMPERATURE ERROR
vs TEMPERATURE
3.0
VS = 3.3V
TREMOTE = +25°C
2
30 Typical Units Shown
h = 1.008
RC = 1
1
0
-1
-2
2.0
1.0
0
-1.0
-2.0
-3
-3.0
-50
0
-25
25
50
75
100
125
-50
25
50
75
100
125
Figure 1.
Figure 2.
REMOTE TEMPERATURE ERROR
vs LEAKAGE RESISTANCE
REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE
(Diode-Connected Transistor, 2N3906 PNP)
2.0
RC = 1
Remote Temperature Error (°C)
Remote Temperature Error (°C)
0
Ambient Temperature, TA (°C)
40
20
R - GND
0
R - VS
-20
-40
1.5
VS = 2.7V
1.0
0.5
0
VS = 5.5V
-0.5
-1.0
-1.5
-2.0
-60
0
5
10
15
20
25
0
500
1000
1500
2000
2500
Leakage Resistance (MW )
RS ( W )
Figure 3.
Figure 4.
REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE
(GND Collector-Connected Transistor, 2N3906 PNP)
REMOTE TEMPERATURE ERROR
vs DIFFERENTIAL CAPACITANCE
2.0
3000
3
1.5
VS = 2.7V
1.0
0.5
VS = 5.5V
0
-0.5
-1.0
-1.5
-2.0
Remote Temperature Error (°C)
RC = 1
Remote Temperature Error (°C)
-25
Ambient Temperature, TA (°C)
60
2
1
0
-1
-2
-3
0
4
50 Units Shown
VS = 3.3V
Local Temperature Error (°C)
Remote Temperature Error (°C)
3
LOCAL TEMPERATURE ERROR
vs TEMPERATURE
500
1000
1500
2000
2500
3000
0
0.5
1.0
1.5
2.0
RS (W)
Capacitance (nF)
Figure 5.
Figure 6.
Submit Documentation Feedback
2.5
3.0
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and VS = 5.0V, unless otherwise noted.
TEMPERATURE ERROR
vs POWER-SUPPLY NOISE FREQUENCY
25
500
Local 100mVPP Noise
Remote 100mVPP Noise
Local 250mVPP Noise
Remote 250mVPP Noise
20
15
10
450
400
350
5
IQ (mA)
Temperature Error (°C)
QUIESCENT CURRENT
vs CONVERSION RATE
0
300
-5
200
-10
150
-15
100
-20
50
0
0.0625
-25
0
5
10
15
VS = 2.7V
0.125
0.25
0.5
1
2
4
Frequency (MHz)
Conversion Rate (conversions/sec)
Figure 7.
Figure 8.
SHUTDOWN QUIESCENT CURRENT
vs SCL CLOCK FREQUENCY
SHUTDOWN QUIESCENT CURRENT
vs SUPPLY VOLTAGE
500
8
450
7
400
8
6
350
5
300
250
IQ (mA)
IQ (mA)
VS = 5.5V
250
VS = 5.5V
200
4
3
150
2
100
1
50
VS = 3.3V
0
1k
10k
100k
1M
10M
0
2.5
SCL Clock Frequency (Hz)
3.0
3.5
4.0
4.5
5.0
5.5
VS (V)
Figure 9.
Figure 10.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
5
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
APPLICATION INFORMATION
other devices if desired for a wired-OR
implementation. A 0.1µF power-supply bypass
capacitor is recommended for good local bypassing.
Figure 11 shows a typical configuration for the
TMP400.
The TMP400 is a dual-channel digital temperature
sensor that combines a local die temperature
measurement channel and a remote junction
temperature measurement channel in a QSSOP-16
package. The TMP400 is Two-Wire and SMBus
interface-compatible, and is specified over a
temperature range of –40°C to +125°C. The TMP400
contains multiple registers for holding configuration
information, temperature measurement results,
temperature comparator maximum/minimum limits,
and status information.
SERIES RESISTANCE CANCELLATION
Series resistance in an application circuit that typically
results from printed circuit board (PCB) trace
resistance and remote line length (see Figure 11) can
be automatically programmed to be cancelled by the
TMP400 by setting the RC bit to '1' in the Resolution
Register, preventing what would otherwise result in a
temperature offset.
User-programmed high and low temperature limits
stored in the TMP400 can be used to monitor local
and remote temperatures to trigger an over/under
temperature alarm (ALERT).
A total of up to 3kΩ of series line resistance is
cancelled by the TMP400 if the RC bit is enabled,
eliminating the need for additional characterization
and temperature offset correction. Upon power-up,
the RC bit is disabled (RC = 0).
The TMP400 requires only a transistor connected
between D+ and D– for proper remote temperature
sensing operation. The SCL and SDA interface pins
require pull-up resistors as part of the communication
bus, while ALERT is an open-drain output that also
needs a pull−up resistor. ALERT may be shared with
See the two Remote Temperature Error vs Series
Resistance typical characteristics curves (Figure 4
and Figure 5) for details on the effect of series
resistance and power-supply voltage on sensed
remote temperature error.
+5V
0.1mF
(1)
Transistor-connected configuration :
Series Resistance
RS
RS
(2)
3
15
2
STBY
V+
10kW
(typ)
SCL
D+
10kW
(typ)
10kW
(typ)
14
(3)
(2)
CDIFF
4
DTMP400
10
6
SDA
12
Two-Wire Bus/
SMBus Controller
A0
A1
ALERT
11
GND
(1)
7, 8
Diode-connected configuration :
RS
RS
(2)
(2)
(3)
CDIFF
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
(2) RS should be less than 1.5kΩ in most applications.
(3) CDIFF should be less than 1000pF in most applications.
Figure 11. Basic Connections
6
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
DIFFERENTIAL INPUT CAPACITANCE
The TMP400 tolerates differential input capacitance
of up to 1000pF if RC = 1 (if RC = 0, input
capacitance can be as high as 2200pF) with minimal
change in temperature error. The effect of
capacitance on sensed remote temperature error is
illustrated in the typical characteristic curve, Remote
Temperature Error vs Differential Capacitance
(Figure 6).
byte stores the decimal fraction value of the
temperature and allows a higher measurement
resolution. The measurement resolution for the
remote channel is 0.0625°C, and is not adjustable.
The measurement resolution for the local channel is
adjustable; it can be set for 0.5°C, 0.25°C, 0.125°C,
or 0.0625°C by setting the RES1 and RES0 bits of
the Resolution Register; see the Resolution Register
section (Table 5).
REGISTER INFORMATION
TEMPERATURE MEASUREMENT DATA
Temperature measurement data are taken over a
default range of –55°C to +127.9375°C for both local
and remote locations.
Temperature data resulting from conversions within
the default measurement range are represented in
binary form, as shown in Table 1, Binary column.
Note that any temperature above +127.9375°C
results in a value of 127.9375 (7Fh/F0h).
Temperatures below –65°C results in a value of –65
(BF/00h). The TMP400 is specified only for ambient
temperatures ranging from –40°C to +125°C.
Parameters in the Absolute Maximum Ratings table
must be observed.
Table 1. Temperature Data Format
REMOTE TEMPERATURE REGISTER
DIGITAL OUTPUT
(BINARY)
The TMP400 contains multiple registers for holding
configuration information, temperature measurement
results, temperature comparator maximum/minimum,
limits, and status information. These registers are
described in Figure 12 and Table 2.
POINTER REGISTER
Figure 12 shows the internal register structure of the
TMP400. The 8-bit Pointer Register is used to
address a given data register. The Pointer Register
identifies which of the data registers should respond
to a read or write command on the Two-Wire bus.
This register is set with every write command. A write
command must be issued to set the proper value in
the Pointer Register before executing a read
command. Table 2 describes the pointer address of
the registers available in the TMP400. The power-on
reset (POR) value of the Pointer Register is 00h
(0000 0000b).
TEMPERATURE
(°C)
HIGH BYTE
LOW BYTE
HEX
128
0111 1111
1111 0000
7F/F0
Pointer Register
127.9375
0111 1111
1111 0000
7F/F0
Local and Remote Temperature Registers
100
0110 0100
0000 0000
64/00
80
0101 0000
0000 0000
50/00
75
0100 1011
0000 0000
4B/00
Status Register
50
0011 0010
0000 0000
32/00
Configuration Register
Resolution Register
Local and Remote Limit Registers
SDA
25
0001 1001
0000 0000
19/00
0.25
0000 0000
0100 0000
00/40
0
0000 0000
0000 0000
00/00
–0.25
1111 1111
1100 0000
FF/C0
–25
1110 0111
0000 0000
E7/00
Identification Registers
–55
1100 1001
0000 0000
C9/00
Local Temperature Min/Max
–65
1011 1111
0000 0000
BF/00
Remote Temperature Min/Max
Both local and remote temperature data use two
bytes for data storage. The high byte stores the
temperature with 1°C resolution. The second (or low)
Conversion Rate Register
I/O
Control
Interface
SCL
Consecutive Alert Register
Figure 12. Internal Register Structure
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
7
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
Table 2. Register Map
POINTER
ADDRESS (HEX)
READ
00
(1)
(2)
8
WRITE
NA
(1)
BIT DESCRIPTIONS
POWER-ON
RESET (HEX)
D7
D6
D5
D4
D3
D2
D1
D0
REGISTER DESCRIPTIONS
00
LT11
LT10
LT9
LT8
LT7
LT6
LT5
LT4
Local Temperature
(High Byte)
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
Remote Temperature
(High Byte)
01
NA
00
02
NA
00
BUSY
LHIGH
LLOW
RHIGH
RLOW
OPEN
0
0
Status Register
03
09
00
MASK1
SD
0
0
0
0
0
0
Configuration Register
04
0A
02
0
0
0
0
R3
R2
R1
R0
Conversion Rate Register
05
0B
7F
LTH11
LTH10
LTH9
LTH8
LTH7
LTH6
LTH5
LTH4
Local Temperature High
Limit (High Byte)
06
0C
C9
LTL11
LTL10
LTL9
LTL8
LTL7
LTL6
LTL5
LTL4
Local Temperature Low Limit
(High Byte)
07
0D
7F
RTH11
RTH10
RTH9
RTH8
RTH7
RTH6
RTH5
RTH4
Remote Temperature High
Limit (High Byte)
08
0E
C9
RTL11
RTL10
RTL9
RTL8
RTL7
RTL6
RTL5
RTL4
Remote Temperature Low
Limit (High Byte)
NA
0F
XX
X (2)
X
X
X
X
X
X
X
One-Shot Start
10
NA
00
RT3
RT2
RT1
RT0
0
0
0
0
Remote Temperature
(Low Byte)
13
13
00
RTH3
RTH2
RTH1
RTH0
0
0
0
0
Remote Temperature High
Limit (Low Byte)
14
14
00
RTL3
RTL2
RTL1
RTL0
0
0
0
0
Remote Temperature Low
Limit (Low Byte)
15
NA
00
LT3
LT2
LT1
LT0
0
0
0
0
Local Temperature
(Low Byte)
16
16
00
LTH3
LTH2
LTH1
LTH0
0
0
0
0
Local Temperature High
Limit (Low Byte)
17
17
00
LTL3
LTL2
LTL1
LTL0
0
0
0
0
Local Temperature Low Limit
(Low Byte)
18
18
00
NC7
NC6
NC5
NC4
NC3
NC2
NC1
NC0
N-factor Correction
1A
1A
18
0
0
0
1
1
RC
RES1
RES0
Resolution Register
22
22
01
TO_EN
0
0
0
C2
C1
C0
0
Consecutive Alert Register
30
30
7F
LMT11
LMT10
LMT9
LMT8
LMT7
LMT6
LMT5
LMT4
Local Temperature Minimum
(High Byte)
31
31
F0
LMT3
LMT2
LMT1
LMT0
0
0
0
0
Local Temperature Minimum
(Low Byte)
32
32
80
LXT11
LXT10
LXT9
LXT8
LXT7
LXT6
LXT5
LXT4
Local Temperature Maximum
(High Byte)
33
33
00
LXT3
LXT2
LXT1
LXT0
0
0
0
0
Local Temperature Maximum
(Low Byte)
34
34
7F
RMT11
RMT10
RMT9
RMT8
RMT7
RMT6
RMT5
RMT4
Remote Temperature
Minimum (High Byte)
35
35
F0
RMT3
RMT2
RMT1
RMT0
0
0
0
0
Remote Temperature
Minimum (Low Byte)
36
36
80
RXT11
RXT10
RXT9
RXT8
RXT7
RXT6
RXT5
RXT4
Remote Temperature
Maximum (High Byte)
37
37
00
RXT3
RXT2
RXT1
RXT0
0
0
0
0
Remote Temperature
Maximum (Low Byte)
NA
FC
FF
X (2)
X
X
X
X
X
X
X
Software Reset
FE
NA
55
0
1
0
1
0
1
0
1
Manufacturer ID
FF
NA
01
0
0
0
0
0
0
0
1
Device ID
NA = not applicable; register is write- or read-only.
X = indeterminate state. Writing any value to this register indicates a software reset; see the Software Reset section.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
TEMPERATURE REGISTERS
The TMP400 has four 8-bit registers that hold
temperature measurement results. Both the local
channel and the remote channel have a high byte
register that contains the most significant bits (MSBs)
of the temperature analog-to-digital converter (ADC)
result, and a low byte register that contains the least
significant bits (LSBs) of the temperature ADC result.
The local channel high byte address is 00h; the local
channel low byte address is 15h. The remote channel
high byte is at address 01h; the remote channel low
byte address is 10h. These read-only registers are
updated by the ADC each time a temperature
measurement is completed.
The TMP400 contains circuitry to assure that a low
byte register read command returns data from the
same ADC conversion as the immediately preceding
high byte read command. This assurance remains
valid only until another register is read. For proper
operation, the high byte of a temperature register
should be read first. The low byte register should be
read in the next read command. The low byte register
may be left unread if the LSBs are not needed.
Alternatively, the temperature registers may be read
as a 16-bit register by using a single two-byte read
command from address 00h for the local channel
result or from address 01h for the remote channel
result. The high byte is output first, followed by the
low byte. Both bytes of this read operation are from
the same ADC conversion. The power-on reset value
of both temperature registers is 00h.
LIMIT REGISTERS
The TMP400 has eight registers for setting
comparator limits for both the local and remote
measurement channels. These registers have read
and write capability. The High and Low Limit
Registers for both channels span two registers, as do
the temperature registers. The local temperature high
limit is set by writing the high byte to pointer address
0Bh and writing the low byte to pointer address 16h,
or by using a single two-byte write command (high
byte first) to pointer address 0Bh. The local
temperature high limit is obtained by reading the high
byte from pointer address 05h and the low byte from
pointer address 16h. The power-on reset value of the
local temperature high limit is 7Fh/00h (+127°C).
Similarly, the local temperature low limit is set by
writing the high byte to pointer address 0Ch and
writing the low byte to pointer address 17h, or by
using a single two-byte write command to pointer
address 0Ch. The local temperature low limit is read
by reading the high byte from pointer address 06h
and the low byte from pointer address 17h, or by
using a two-byte read from pointer address 06h. The
power-on reset value of the local temperature low
limit register is C9h/00h (–55°C).
The remote temperature high limit is set by writing the
high byte to pointer address 0Dh and writing the low
byte to pointer address 13h, or by using a two-byte
write command to pointer address 0Dh. The remote
temperature high limit is obtained by reading the high
byte from pointer address 07h and the low byte from
pointer address 13h, or by using a two-byte read
command from pointer address 07h. The power-on
reset value of the Remote Temperature High Limit
Register is 7Fh/00h (+127°C).
The remote temperature low limit is set by writing the
high byte to pointer address 0Eh and writing the low
byte to pointer address 14h, or by using a two-byte
write to pointer address 0Eh. The remote temperature
low limit is read by reading the high byte from pointer
address 08h and the low byte from pointer address
14h, or by using a two-byte read from pointer address
08h. The power-on reset value of the Remote
Temperature Low Limit Register is C9h/00h (–55°C).
STATUS REGISTER
The TMP400 has a Status Register to report the state
of the temperature comparators. Table 3 shows the
Status Register bits. The Status Register is read-only
and is read by reading from pointer address 02h.
Table 3. Status Register Format
STATUS REGISTER (Read = 02h, Write = NA)
BIT #
BIT NAME
POR VALUE
(1)
D7
D6
D5
D4
D3
D2
D1
D0
BUSY
LHIGH
LLOW
RHIGH
RLOW
OPEN
—
—
0 (1)
0
0
0
0
0
0
0
The BUSY bit will change to ‘1’ almost immediately (<< 100µs) following power-up, as the TMP400 begins the first temperature
conversion. It is high whenever the TMP400 converts a temperature reading.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
9
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
The BUSY bit is ‘1’ if the ADC makes a conversion. It
is ‘0’ if the ADC is not converting.
The OPEN bit is ‘1’ if the remote transistor was
detected as open since the last read of the Status
Register. The OPEN status is only detected when the
ADC attempts to convert a remote temperature.
The LHIGH bit is ‘1’ if the local high limit was
exceeded since the last clearing of the Status
Register. The RHIGH bit is ‘1’ if the remote high limit
was exceeded since the last clearing of the Status
Register.
The LLOW bit is ‘1’ if the local low limit was exceeded
since the last clearing of the Status Register. The
RLOW bit is ‘1’ if the remote low limit was exceeded
since the last clearing of the Status Register.
The values of the LLOW, RLOW, and OPEN bits are
latched and read as ‘1’ until the Status Register is
read or a device reset occurs. These bits are cleared
by reading the Status Register, provided that the
condition causing the flag to be set no longer exists.
The BUSY bit is not latched and is not cleared by
reading the Status Register. The BUSY bit always
indicates the current state and updates appropriately
at the end of the corresponding ADC conversion.
Clearing the Status Register bits does not clear the
state of the ALERT pin; an SMBus alert response
address command must be used to clear the ALERT
pin.
The TMP400 NORs LHIGH, LLOW, RHIGH, RLOW,
and OPEN, so a status change for any of these flags
from ‘0’ to ‘1’ automatically causes the ALERT pin to
go low.
CONFIGURATION REGISTER
The Configuration Register controls shutdown mode
and disables the ALERT pin. The Configuration
Register is set by writing to pointer address 09h and
read by reading from pointer address 03h.
The MASK bit (bit 7) enables or disables the ALERT
pin output. If MASK is set to ‘0’, the ALERT pin goes
low when one of the temperature measurement
channels exceeds its high or low limits for the chosen
number of consecutive conversions. If the MASK bit
is set to ‘1’, the TMP400 retains the ALERT pin
status, but the ALERT pin does not go low.
The shutdown (SD) bit (bit 6) enables or disables the
temperature measurement circuitry. If SD = 0, the
TMP400 converts continuously at the rate set in the
conversion rate register. When SD is set to ‘1’, the
TMP400 immediately stops converting and enters a
shutdown mode. When SD is set to ‘0’ again, the
TMP400 resumes continuous conversions.
The remaining bits of the Configuration Register are
reserved and must always be set to ‘0’. The power-on
reset value for this register is 00h. Table 4
summarizes the bits of the Configuration Register.
Table 4. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (Read = 03h, Write = 09h, POR = 00h)
BIT
10
NAME
FUNCTION
POWER-ON RESET VALUE
7
MASK
0 = ALERT Enabled
1 = ALERT Masked
0
6
SD
0 = Run
1 = Shut Down
0
5, 4, 3, 2, 1, 0
Reserved
—
0
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
RESOLUTION REGISTER
The RES1 and RES0 bits (resolution bits 1 and 0,
respectively) of the Resolution Register set the
resolution of the local temperature measurement
channel. Remote temperature measurement channel
resolution is not affected. Changing the local channel
resolution also affects the conversion time and rate of
the TMP400. The Resolution Register is set by
writing to pointer address 1Ah and is read by reading
from pointer address 1Ah. Table 5 shows the
resolution bits for the Resolution Register.
Table 5. Resolution Register: Local Channel
Programmable Resolution
RESOLUTION REGISTER
(Read = 1Ah, Write = 1Ah, POR = 18h)
RESOLUTION
CONVERSION
TIME (Typical)
0
9 Bits (0.5°C)
12.5ms
1
10 Bits (0.25°C)
25ms
RES1
RES0
0
0
1
0
11 Bits (0.125°C)
50ms
1
1
12 Bits (0.0625°C)
100ms
Bits 3 and 4 of the Resolution Register must always
be set to ‘1’. Bits 5 through 7 of the Resolution
Register must always be set to ‘0’. The power-on
reset value of this register is 18h. Resistance
correction (RC) is not automatically enabled on
power-on; see the Series Resistance Cancellation
section for information on RC.
ONE-SHOT (OS)
The TMP400 features a One-Shot Temperature
Measurement Mode. When the device is in Shutdown
Mode, writing a ‘1’ to the OS bit starts a single
temperature conversion. The device returns to the
shutdown state at the completion of the single
conversion. This mode is useful to reduce power
consumption in the TMP400 when continuous
temperature monitoring is not required. When the
configuration register is read, the OS bit always reads
'0'
CONVERSION RATE REGISTER
The Conversion Rate Register controls the rate at
which temperature conversions are performed. This
register adjusts the idle time between conversions but
not the conversion timing itself, thereby allowing the
TMP400 power dissipation to be balanced with the
temperature register update rate. Table 6 shows the
conversion rate options and corresponding current
consumption. By default, the TMP400 converts every
four seconds.
N-FACTOR CORRECTION REGISTER
The TMP400 allows for a different n-factor value to
be
used
for
converting
remote
channel
measurements to temperature. The remote channel
uses sequential current excitation to extract a
differential VBE voltage measurement to determine
the temperature of the remote transistor. Equation 1
relates this voltage and temperature.
VBE2 - VBE1 =
nkT
ln
q
l2
l1
(1)
The value n in Equation 1 is a characteristic of the
particular transistor used for the remote channel. The
default value for the TMP400 is n = 1.008. The value
in the N-Factor Correction Register may be used to
adjust the effective n-factor according to Equation 2
and Equation 3.
1.008 ´ 300
neff =
(300 - NADJUST)
(2)
NADJUST = 300 -
300 ´ 1.008
neff
(3)
Table 6. Conversion Rate Register
CONVERSION RATE REGISTER (Read = 04h, Write = 0Ah, POR = 02h)
AVERAGE IQ (TYP)
(µA)
R7
R6
R5
R4
R3
R2
R1
R0
CONVERSION/SEC
0
0
0
0
0
0
0
0
0.0625
11
32
0
0
0
0
0
0
0
1
0.125
17
38
0
0
0
0
0
0
1
0
0.25
28
49
0
0
0
0
0
0
1
1
0.5
47
69
0
0
0
0
0
1
0
0
1
80
103
0
0
0
0
0
1
0
1
2
128
155
0
0
0
0
0
1
1
0
4
190
220
8
373
413
07h to 0Fh
VS = 2.7V VS = 5.5V
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
11
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
The n-correction value must be stored in
two’s-complement format, yielding an effective data
range from –128 to +127. The n-correction value may
be written to and read from pointer address 18h. The
register power-on reset value is 00h; thus, the
register has no effect unless written to. The n-factor
range is shown in Table 7.
Table 7. N-Factor Range
NADJUST
BINARY
HEX
DECIMAL
N
01111111
7F
127
1.747977
00001010
0A
10
1.042759
00001000
08
8
1.035616
00000110
06
6
1.028571
00000100
04
4
1.021622
00000010
02
2
1.014765
00000001
01
1
1.011371
00000000
00
0
1.008
11111111
FF
–1
1.004651
11111110
FE
–2
1.001325
11111100
FC
–4
0.994737
11111010
FA
–6
0.988235
11111000
F8
–8
0.981818
11110110
F6
–10
0.975484
10000000
80
–128
0.706542
The Local Temperature Maximum Register may be
read by reading the high byte from pointer address
32h and the low byte from pointer address 33h. The
Local Temperature Maximum Register may also be
read by using a two-byte read command from pointer
address 32h. The Local Temperature Maximum
Register is reset at power-on by executing the chip
reset command, or by writing any value to any of
pointer addresses 30h through 37h. The reset value
for these registers is 80h/00h.
The Remote Temperature Minimum Register may be
read by reading the high byte from pointer address
34h and the low byte from pointer address 35h. The
Remote Temperature Minimum Register may also be
read by using a two-byte read command from pointer
address 34h. The Remote Temperature Minimum
Register is reset at power-on by executing the chip
reset command, or by writing any value to any of
pointer addresses 30h through 37h. The reset value
for these registers is 7Fh/F0h.
The Remote Temperature Maximum Register may be
read by reading the high byte from pointer address
36h and the low byte from pointer address 37h. The
Remote Temperature Maximum Register may also be
read by using a two-byte read command from pointer
address 36h. The Remote Temperature Maximum
Register is reset at power-on by executing the chip
reset command, or by writing any value to any of
pointer addresses 30h through 37h. The reset value
for these registers is 80h/00h.
MINIMUM AND MAXIMUM REGISTERS
The TMP400 stores the minimum and maximum
temperatures measured since power-on, chip-reset,
or minimum and maximum register reset for both the
local and remote channels. The Local Temperature
Minimum Register may be read by reading the high
byte from pointer address 30h and the low byte from
pointer address 31h. The Local Temperature
Minimum Register may also be read by using a
two-byte read command from pointer address 30h.
The Local Temperature Minimum Register is reset at
power-on, by executing the chip-reset command, or
by writing any value to any of pointer addresses 30h
through 37h. The reset value for these registers is
7Fh/F0h.
12
SOFTWARE RESET
The TMP400 may be reset by writing any value to
Pointer Register FCh. A reset restores the power-on
reset state to all of the TMP400 registers as well as
aborts any conversion in process and clears the
ALERT pin.
The TMP400 also supports reset via the Two-Wire
general call address (00000000). The TMP400
acknowledges the general call address and responds
to the second byte. If the second byte is 00000110,
the TMP400 latches the status of the address pins
and executes a software reset. A 500µs time delay
must be observed after a general-call command. The
TMP400 takes no action in response to other values
in the second byte.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
CONSECUTIVE ALERT REGISTER
SERIAL INTERFACE
The value in the Consecutive Alert Register (address
22h) determines how many consecutive out-of-limit
measurements must occur on a measurement
channel before the ALERT signal is activated. The
value in this register does not affect bits in the Status
Register. Values of one, two, three, or four
consecutive conversions can be selected; one
conversion is the default. This function allows
additional filtering for the ALERT pin. The consecutive
alert bits are shown in Table 8.
The TMP400 operates only as a slave device on
either the Two-Wire bus or the SMBus. Connections
to either bus are made via the open-drain I/O lines,
SDA, and SCL. The SDA and SCL pins feature
integrated spike suppression filters and Schmitt
triggers to minimize the effects of input spikes and
bus noise. The TMP400 supports the transmission
protocol for fast (1kHz to 400kHz) and high-speed
(1kHz to 3.4MHz) modes. All data bytes are
transmitted MSB first.
Table 8. Consecutive Alert Register
CONSECUTIVE ALERT REGISTER
(READ = 22h, WRITE = 22h, POR = 01h)
C2
C1
C0
NUMBER OF CONSECUTIVE
OUT-OF-LIMIT
MEASUREMENTS
0
0
0
1
0
0
1
2
0
1
1
3
1
1
1
4
(1) Note that bit 7 of the Consecutive Alert Register controls the
enable/disable of the timeout function. See the Timeout
Function section for a description of this feature.
BUS OVERVIEW
The TMP400 is SMBus interface-compatible. In
SMBus protocol, the device that initiates the transfer
is called a master, and the devices controlled by the
master are slaves. The bus must be controlled by a
master device that generates the serial clock (SCL),
controls the bus access, and generates the START
and STOP conditions.
To address a specific device, a START condition is
initiated. START is indicated by pulling the data line
(SDA) from a high to low logic level while SCL is
high. All slaves on the bus shift in the slave address
byte, with the last bit indicating whether a read or
write operation is intended. During the ninth clock
pulse, the slave being addressed responds to the
master by generating an Acknowledge and pulling
SDA low.
Data transfer is then initiated and sent over eight
clock pulses followed by an Acknowledge bit. During
data transfer, SDA must remain stable while SCL is
high, because any change in SDA while SCL is high
is interpreted as a control signal.
Once all data have been transferred, the master
generates a STOP condition. STOP is indicated by
pulling SDA from low to high, while SCL is high.
SERIAL BUS ADDRESS
To communicate with the TMP400, the master must
first address slave devices via a slave address byte.
The slave address byte consists of seven address
bits, and a direction bit indicating the intent of
executing a read or write operation. The address of
the TMP400 is set by the A0 and A1 pins. TMP400
addresses and corresponding A0 and A1
configurations are shown in Table 9.
Table 9. Device Addresses
A0
A1
ADDRESS
GND
GND
0011 000
GND
High-Z
0011 001
GND
VCC
0011 010
High-Z
GND
0101 001
High-Z
High-Z
0101 010
High-Z
VCC
0101 011
VCC
GND
1001 100
VCC
High-Z
1001 101
VCC
VCC
1001 110
READ/WRITE OPERATIONS
Accessing a particular register on the TMP400 is
accomplished by writing the appropriate value to the
Pointer Register. The value for the Pointer Register is
the first byte transferred after the slave address byte
with the R/W bit low. Every write operation to the
TMP400 requires a value for the Pointer Register
(see Figure 14).
When reading from the TMP400, the last value stored
in the Pointer Register by a write operation is used to
determine which register is read by a read operation.
To change the register pointer for a read operation, a
new value must be written to the Pointer Register.
This transaction is accomplished by issuing a slave
address byte with the R/W bit low, followed by the
Pointer Register byte. No additional data are
required. The master can then generate a START
condition and send the slave address byte with the
R/W bit high to initiate the read command. See
Figure 16 for details of this sequence. If repeated
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
13
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
reads from the same register are desired, it is not
necessary to continually send the Pointer Register
bytes, because the TMP400 retains the Pointer
Register value until it is changed by the next write
operation. Note that register bytes are sent MSB first,
followed by the LSB.
Stop Data Transfer: A change in the state of the
SDA line from low to high while the SCL line is high
defines a STOP condition. Each data transfer
terminates with a repeated START or STOP
condition.
Data Transfer: The number of data bytes transferred
between a START and a STOP condition is not
limited and is determined by the master device. The
receiver acknowledges the transfer of data.
TIMING DIAGRAMS
Figure 13 to Figure 16 describe various operations on
the TMP400. Bus definitions are given below.
Parameters for Figure 13 are defined in Table 10.
Acknowledge: Each receiving device, when
addressed, is obliged to generate an Acknowledge
bit. A device that acknowledges must pull down the
SDA line during the Acknowledge clock pulse in such
a way that the SDA line is stable low during the high
period of the Acknowledge clock pulse. Setup and
hold times must be taken into account. On a master
receive, data transfer termination can be signaled by
the master generating a Not-Acknowledge on the last
byte that has been transmitted by the slave.
Bus Idle: Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the
SDA line, from high to low, while the SCL line is high,
defines a START condition. Each data transfer
initiates with a START condition.
t(LOW)
tF
tR
t(HDSTA)
SCL
t(HDSTA)
t(HIGH)
t(SUSTO)
t(SUSTA)
t(HDDAT)
t(SUDAT)
SDA
t(BUF)
P
S
S
P
Figure 13. Two-Wire Timing Diagram
Table 10. Timing Diagram Definitions for Figure 13
FAST MODE
PARAMETER
HIGH-SPEED MODE
MIN
MAX
MIN
MAX
UNIT
0.4
0.001
3.4
MHz
SCL Operating Frequency
f(SCL)
0.001
Bus Free Time Between STOP and START Condition
t(BUF)
600
160
ns
t(HDSTA)
100
100
ns
Repeated START Condition Setup Time
t(SUSTA)
100
100
ns
STOP Condition Setup Time
t(SUSTO)
100
100
ns
Data Hold Time
t(HDDAT)
0 (1)
0 (2)
ns
Data Setup Time
Hold time after repeated START condition.
After this period, the first clock is generated.
t(SUDAT)
100
10
ns
SCL Clock LOW Period
t(LOW)
1300
160
ns
SCL Clock HIGH Period
t(HIGH)
600
60
ns
Clock/Data Fall Time
tF
300
Clock/Data Rise Time
tR
300
160
for SCL ≤ 100kHz
tR
1000
160
(1)
(2)
14
ns
ns
For cases with fall time of SCL less than 20ns and/or the rise time or fall time of SDA less than 20ns, the hold time should be greater
than 20ns.
For cases with fall time of SCL less than 10ns and/or the rise or fall time of SDA less than 10ns, the hold time should be greater than
10ns.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
1
9
9
1
SCL
¼
1
SDA
0
0
1
1
0
0
R/W
Start By
Master
P7
P6
P5
P4
P3
P2
P1
P0
ACK By
TMP400
Frame 1 Two- Wire Slave Address Byte
¼
ACK By
TMP400
(1)
Frame 2 Pointer Register Byte
9
1
1
9
SCL
(Continued)
SDA
(Continued)
D6
D7
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
ACK By
TMP400
ACK By
TMP400
Frame 3 Data Byte 1
Stop By
Master
Frame 4 Data Byte 2
(1) See Table 9 for all available addresses. A0 = 1 and A1 = 0 in this example.
Figure 14. Two-Wire Timing Diagram for Write Word Format
1
9
1
9
SCL
SDA
1
0
0
1
1
0
R/W
0
Start By
Master
P7
P6
P5
P4
P3
P2
P1
P0
ACK By
TMP400
Frame 1 Two-Wire Slave Address Byte
ACK By
TMP400
(1)
1
Frame 2 Pointer Register Byte
9
1
9
SCL
(Continued)
SDA
(Continued)
1
0
0
1
1
0
0
R/W
Start By
Master
D7
D6
ACK By
TMP400
Frame 3 Two-Wire Slave Address Byte
(1)
D5
D4
D3
D2
D1
D0
From
TMP400
NACK By
Master
(2)
Frame 4 Data Byte 1 Read Register
(1) See Table 9 for all available addresses. A0 = 1 and A1 = 0 in this example.
(2) Master should leave SDA high to terminate a single-byte read operation.
Figure 15. Two-Wire Timing Diagram for Single-Byte Read Format
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
15
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
1
9
1
9
SCL
¼
1
SDA
0
0
1
1
0
R/W
0
Start By
Master
P7
P6
P5
P4
P3
P2
P1
P0
ACK By
TMP400
ACK By
TMP400
Frame 1 Two-Wire Slave Address Byte
¼
(1)
Frame 2 Pointer Register Byte
1
9
1
9
SCL
(Continued)
¼
SDA
(Continued)
1
0
0
1
1
0
0
D7
R/W
Start By
Master
D6
D5
D4
D3
D2
ACK By
TMP400
Frame 3 Two-Wire Slave Address Byte
1
D1
D0
¼
From
TMP400
(1)
ACK By
Master
Frame 4 Data Byte 1 Read Register
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
From
TMP400
ACK By
Master
Stop By
Master
Frame 5 Data Byte 2 Read Register
(1) See Table 9 for all available addresses. A0 = 1 and A1 = 0 in this example.
Figure 16. Two-Wire Timing Diagram for Two-Byte Read Format
ALERT
1
9
1
9
SCL
SDA
0
0
0
1
Start By
Master
1
0
0
1
R/W
0
0
1
1
ACK By
TMP400
Frame 1 SMBus ALERT Response Address Byte
0
0
From
TMP400
Status
NACK By
Master
Frame 2 Two-Wire Slave Address Byte
Stop By
Master
(1)
(1) See Table 9 for all available addresses. A0 = 1 and A1 = 0 in this example.
Figure 17. Timing Diagram for SMBus ALERT
16
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
HIGH-SPEED MODE
ALERT (PIN 11)
In order for the Two-Wire bus to operate at
frequencies above 400kHz, the master device must
issue a High-speed mode (Hs-mode) master code
(00001XXX) as the first byte after a START condition
to switch the bus to high-speed operation. The
TMP400 does not acknowledge this byte, but
switches the input filters on SDA and SCL and the
output filter on SDA to operate in Hs-mode, allowing
transfers at up to 3.4MHz. After the Hs-mode master
code has been issued, the master transmits a
Two-Wire slave address to initiate a data transfer
operation. The bus continues to operate in Hs-mode
until a STOP condition occurs on the bus. Upon
receiving the STOP condition, the TMP400 switches
the input and output filter back to fast-mode
operation.
The ALERT pin of the TMP400 is dedicated to alarm
functions. This pin has an open-drain output that
requires a pull-up resistor to V+. It can be wire-ORed
together with other alarm pins for system monitoring
of multiple sensors. The ALERT pin is intended for
use as an earlier warning interrupt, and can be
software disabled, or masked.
The ALERT pin (pin 11) asserts low when either the
measured local or remote temperature violates the
range limit set by the corresponding Local/Remote
Temperature High/Low Limit Registers. This alert
function can be configured to assert only if the range
is violated a specified number of consecutive times
(1, 2, 3, or 4). The consecutive violation limit is set in
the Consecutive Alert Register. False alerts that
occur as a result of environmental noise can be
prevented by requiring consecutive faults. ALERT
also asserts low if the remote temperature sensor is
open-circuit. When the MASK function is enabled
(Configuration Register: bit 7 = 1), ALERT is disabled
(that is, masked). ALERT resets when the master
reads the device address, as long as the condition
that caused the alert no longer persists, and the
Status Register has been reset.
TIMEOUT FUNCTION
When bit 7 of the Consecutive Alert Register is set
high, the TMP400 timeout function is enabled. The
TMP400 resets the serial interface if either SCL or
SDA are held low for 30ms (typical) between a
START and STOP condition. If the TMP400 is
holding the bus low, it releases the bus and waits for
a START condition. To avoid activating the timeout
function, it is necessary to maintain a communication
speed of at least 1kHz for the SCL operating
frequency. The default state of the timeout function is
enabled (bit 7 = high).
STBY (PIN 15)
The TMP400 features a standby pin (STBY) that,
when pulled low, disables the device. During normal
operation STBY should be tied high (V+). When
STBY is pulled low, the TMP400 is immediately
disabled. If the TMP400 receives a One-Shot
command when STBY is pulled low, the command is
ignored and the TMP400 continues to be disabled
until STBY is pulled high.
ALERT High Limit
Measured
Temperature
ALERT Low Limit Hysteresis
ALERT
SMBus ALERT
Read
Read
Read
Time
Figure 18. SMBus Alert Timing Diagram
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
17
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
SMBUS ALERT FUNCTION
UNDERVOLTAGE LOCKOUT
The TMP400 supports the SMBus Alert function. The
ALERT pin of the TMP400 may be connected as an
SMBus Alert signal. When a master detects an alert
condition on the ALERT line, the master sends an
SMBus Alert command (00011001) on the bus. If the
ALERT pin of the TMP400 is active, the device
acknowledges the SMBus Alert command and
respond by returning its slave address on the SDA
line. The eighth bit (LSB) of the slave address byte
indicates whether the temperature exceeding one of
the temperature high limit settings or falling below
one of the temperature low limit settings caused the
alert condition. This bit is high if the temperature is
greater than or equal to one of the temperature high
limit settings; this bit is low if the temperature is less
than one of the temperature low limit settings. See
Figure 17 for details of this sequence.
The TMP400 senses when the power-supply voltage
has reached a minimum voltage level for the ADC
converter to function. The detection circuitry consists
of a voltage comparator that enables the ADC
converter after the power supply (V+) exceeds 2.45V
(typical). The comparator output is continuously
checked during a conversion. The TMP400 does not
perform a temperature conversion if the power supply
is not valid. The last valid measured temperature is
used for the temperature measurement result.
If multiple devices on the bus respond to the SMBus
Alert command, arbitration during the slave address
portion of the SMBus Alert command determines
which device will clear its alert status. If the TMP400
wins the arbitration, its ALERT pin becomes inactive
at the completion of the SMBus Alert command. If the
TMP400 loses the arbitration, the ALERT pin remains
active.
GENERAL CALL RESET
The TMP400 supports reset via the Two-Wire
General Call address 00h (0000 0000b). The
TMP400 acknowledges the General Call address and
responds to the second byte. If the second byte is
06h (0000 0110b), the TMP400 executes a software
reset, while latching the status of the address pins.
This software reset restores the power-on reset state
to all TMP400 registers, aborts any conversion in
progress, and clears the ALERT pin. If the second
byte is 04h (0000 0100b), the TMP400 latches the
status of the address pins, but does not reset. The
TMP400 takes no action in response to other values
in the second byte. A 500µs time delay must be taken
after a general call command.
SHUTDOWN MODE (SD)
The TMP400 Shutdown Mode allows the user to save
maximum power by shutting down all device circuitry
other than the serial interface, reducing current
consumption to typically less than 3µA; see typical
characteristic curve Shutdown Quiescent Current vs
Supply Voltage (Figure 10). Shutdown Mode is
enabled when the SD bit of the Configuration
Register is high; the device shuts down once the
current conversion is completed. When SD is low, the
device maintains a continuous conversion state.
IDENTIFICATION REGISTERS
The TMP400 allows for the Two-Wire bus controller
to query the device for manufacturer and device IDs
to allow for software identification of the device at the
particular Two-Wire bus address. The manufacturer
ID is obtained by reading from pointer address FEh.
The device ID is obtained by reading from pointer
address FFh. The TMP400 returns 55h for the
manufacturer code and 01h for the device ID. These
registers are read-only.
SENSOR FAULT
FILTERING
The TMP400 senses a fault at the D+ input resulting
from incorrect diode connection or an open circuit.
The detection circuitry consists of a voltage
comparator that trips when the voltage at D+ exceeds
(V+) – 0.6V (typical). The comparator output is
continuously checked during a conversion. If a fault is
detected, the result reads 7FFh (0111 1111 1111b)
and is used for the temperature measurement result;
the OPEN bit (Status Register, bit 2) is set high, and,
if the alert function is enabled, ALERT asserts low.
Remote junction temperature sensors are usually
implemented in a noisy environment. Noise is most
often created by fast digital signals, and it can corrupt
measurements. The TMP400 has a built-in 65kHz
filter on the inputs of D+ and D– to minimize the
effects of noise. However, a bypass capacitor placed
differentially across the inputs of the remote
temperature sensor is recommended to make the
application more robust against unwanted coupled
signals. The value of the capacitor should be
between 100pF and 1nF. Some applications attain
better overall accuracy with additional series
resistance; however, this increased accuracy is
setup-specific. When series resistance is added, the
value should not be greater than 3kΩ and resistance
correction must be enabled (RC = 1).
When not using the remote sensor with the TMP400,
the D+ and D– inputs must be connected together to
prevent meaningless fault warnings.
18
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
If filtering is needed, the suggested component
values are 100pF and 50Ω on each input. Exact
values are application specific. Resistance correction
must be enabled to avoid offset correction.
REMOTE SENSING
The TMP400 is designed to be used with either
discrete transistors or substrate transistors built into
processor chips and ASICs. Either NPN or PNP
transistors can be used, as long as the base-emitter
junction is used as the remote temperature sense.
Either a transistor or diode connection can also be
used; see Figure 11.
Errors in remote temperature sensor readings are
generally the consequence of the ideality factor and
current excitation used by the TMP400 versus the
manufacturer-specified operating current for a given
transistor. Some manufacturers specify a high-level
and low-level current for the temperature-sensing
substrate transistors. The TMP400 uses 6µA for ILOW
and 120µA for IHIGH. The TMP400 allows for different
n-factor values; see the N-Factor Correction Register
section.
The ideality factor (n) is a measured characteristic of
a remote temperature sensor diode as compared to
an ideal diode. The ideality factor for the TMP400 is
trimmed to be 1.008. For transistors whose ideality
factor does not match the TMP400, Equation 4 can
be used to calculate the temperature error. Note that
for the equation to be used correctly, actual
temperature (°C) must be converted to Kelvin (°K).
n - 1.008
TERR =
´ [273.15 + T(°C)]
1.008
(4)
Where:
n = Ideality factor of remote temperature sensor
T(°C) = actual temperature
TERR = Error in TMP400 reading due to n ≠ 1.008
Degree delta is the same for °C and °K
For n = 1.004 and T(°C) = 100°C:
1.004 - 1.008
TERR =
´ (273.15 + 100°C)
1.008
TERR = -1.48°C
(5)
If a discrete transistor is used as the remote
temperature sensor with the TMP400, the best
accuracy can be achieved by selecting the transistor
according to the following criteria:
1. Base-emitter voltage > 0.25V at 6µA, at the
highest sensed temperature.
2. Base-emitter voltage < 0.95V at 120µA, at the
lowest sensed temperature.
3. Base resistance < 100Ω.
4. Tight control of VBE characteristics indicated by
small variations in hFE (that is, 50 to 150).
Based on these criteria, two recommended
small-signal transistors are the 2N3904 (NPN) or
2N3906 (PNP).
MEASUREMENT ACCURACY AND THERMAL
CONSIDERATIONS
The temperature measurement accuracy of the
TMP400 depends on the remote and/or local
temperature sensor being at the same temperature
as the system point being monitored. Clearly, if the
temperature sensor is not in good thermal contact
with the part of the system being monitored, then
there will be a delay in the response of the sensor to
a temperature change in the system. For remote
temperature sensing applications using a substrate
transistor (or a small, SOT23 transistor) placed close
to the device being monitored, this delay is usually
not a concern.
The local temperature sensor inside the TMP400
monitors the ambient air around the device. The
thermal time constant for the TMP400 is
approximately two seconds. This constant implies
that if the ambient air changes quickly by 100°C, it
would take the TMP400 about 10 seconds (that is,
five thermal time constants) to settle to within 1°C of
the final value. In most applications, the TMP400
package is in electrical (and therefore, thermal)
contact with the printed circuit board (PCB), as well
as subjected to forced airflow. The accuracy of the
measured temperature directly depends on how
accurately the PCB and forced airflow temperatures
represent the temperature that the TMP400 is
measuring. Additionally, the internal power dissipation
of the TMP400 can cause the temperature to rise
above the ambient or PCB temperature. The internal
power dissipated as a result of exciting the remote
temperature sensor is negligible because of the small
currents used. For a 5.5V supply and maximum
conversion rate of eight conversions per second, the
TMP400 dissipates 1.82mW (PDIQ = 5.5V × 420µA).
If the ALERT pin is sinking 1mA, an additional power
of 0.4mW is dissipated (PDOUT = 1mA × 0.4V =
0.4mW). Total power dissipation is then 2.22mW
(PDIQ + PDOUT) and, with an θJA of 150°C/W, causes
the junction temperature to rise approximately
0.333°C above the ambient.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
19
TMP400
www.ti.com
SBOS404 – DECEMBER 2007
LAYOUT CONSIDERATIONS
Remote temperature sensing on the TMP400
measures very small voltages using very low
currents; therefore, noise at the IC inputs must be
minimized. Most applications using the TMP400 will
have high digital content, with several clocks and
logic level transitions creating a noisy environment.
Layout should adhere to the following guidelines:
1. Place the TMP400 as close to the remote
junction sensor as possible.
2. Route the D+ and D– traces next to each other
and shield them from adjacent signals through
the use of ground guard traces, as shown in
Figure 19. If a multilayer PCB is used, bury these
traces between ground or VDD planes to shield
them from extrinsic noise sources. 5 mil
(0.127mm) PCB traces are recommended.
3. Minimize additional thermocouple junctions
caused by copper-to-solder connections. If these
junctions are used, make the same number and
approximate
locations
of
copper-to-solder
connections in both the D+ and D– connections
to cancel any thermocouple effects.
4. Use a 0.1µF local bypass capacitor directly
between the V+ and GND of the TMP400, as
shown in Figure 20. Minimize filter capacitance
between D+ and D– to 1000pF or less for
optimum measurement performance. This
capacitance includes any cable capacitance
between the remote temperature sensor and
TMP400.
5. If the connection between the remote
temperature sensor and the TMP400 is less than
8 inches (203.2mm), use a twisted-wire pair
connection. Beyond 8 inches, use a twisted,
shielded pair with the shield grounded as close to
the TMP400 as possible. Leave the remote
sensor connection end of the shield wire open to
avoid ground loops and 60Hz pickup.
20
GND(1)
D+
(1)
Ground or V+ layer
on bottom and/or
top, if possible.
D-(1)
GND
(1)
(1) 5mil traces with 5mil spacing.
Figure 19. Example Signal Traces
0.1mF Capacitor
V+
PCB Via
GND
1
16
2
15
3
14
4
PCB Via
13
TMP400
5
12
6
11
7
10
8
9
Figure 20. Suggested Bypass Capacitor
Placement
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TMP400
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TMP400AIDBQR
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TMP400AIDBQT
ACTIVE
SSOP/
QSOP
DBQ
16
250
CU NIPDAU
Level-2-260C-1 YEAR
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Dec-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TMP400AIDBQR
DBQ
16
SITE 41
330
12
6.4
5.2
2.1
8
12
Q1
TMP400AIDBQT
DBQ
16
SITE 41
180
12
6.9
5.4
2.0
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Dec-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TMP400AIDBQR
DBQ
16
SITE 41
346.0
346.0
29.0
TMP400AIDBQT
DBQ
16
SITE 41
184.0
184.0
50.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated