www.ti.com FEATURES AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 1 • AM26LS32A Devices Meet or Exceed the Requirements of ANSI TIA/EIA-422-B, TIA/EIA-423-B, and ITU Recommendations V.10 and V.11 • AM26LS32A Devices Have ±7-V Common-Mode Range With ±200-mV Sensitivity • AM26LS33A Devices Have ±15-V Common-Mode Range With ±500-mV Sensitivity • Input Hysteresis . . . 50 mV Typical • Operate From a Single 5-V Supply • Low-Power Schottky Circuitry • 3-State Outputs • Complementary Output-Enable Inputs • Input Impedance . . . 12 kΩ Minimum • Designed to Be Interchangeable With Advanced Micro Devices AM26LS32™ and AM26LS33™ 2 AM26LS32AC . . . D, N, NS, OR PW PACKAGE AM26LS32AI, AM26LS33AC . . . D, OR N PACKAGE AM26LS32AM, AM26LS33AM . . .J PACKAGE (TOP VIEW) DESCRIPTION The AM26LS32A and AM26LS33A devices are quadruple differential line receivers for balanced and unbalanced digital data transmission. The enable function is common to all four receivers and offers a choice of active-high or active-low input. The 3-state outputs permit connection directly to a bus-organized system. Fail-safe design ensures that, if the inputs are open, the outputs always are high. Compared to the AM26LS32 and the AM26LS33, the AM26LS32A and AM26LS33A incorporate an additional stage of amplification to improve sensitivity. The input impedance has been increased, resulting in less loading of the bus line. The additional stage has increased propagation delay; however, this does not affect interchangeability in most applications. The AM26LS32AC and AM26LS33AC are characterized for operation from 0°C to 70°C. The AM26LS32AI is characterized for operation from –40°C to 85°C. The AM26LS32AM and AM26LS33AM are characterized for operation over the full military temperature range of –55°C to 125°C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. AM26LS32, AM26LS33 are trademarks of Advanced Micro Devices, Inc.. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1980–2007, Texas Instruments Incorporated AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 FUNCTION TABLE Each Receiver ENABLES DIFFERENTIAL A–B VID ≥ VIT+ VIT– ≤ VID ≤ VIT+ VID ≤ VIT– X Open G G OUTPUT Y H X H X L H H X ? X L ? H X L X L L L H Z H X H X L H LOGIC DIAGRAM (POSITIVE LOGIC) G G 1A 1B 2A 2B 3A 3B 4A 4B 4 12 2 3 1 1Y 6 5 7 2Y 10 11 9 3Y 14 13 15 4Y Pin numbers are for D, N, NS, or PW packages only. 2 Submit Documentation Feedback Copyright © 1980–2007, Texas Instruments Incorporated Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 SCHEMATICS OF INPUTS AND OUTPUTS 85 Ω 8.3 kΩ 100 kΩ 20 kΩ 960 Ω 960 Ω 100 kΩ ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VCC Supply voltage (2) VI Input voltage VID Differential input voltage (3) 7 Any differential input TC Tstg (1) (2) (3) (4) ±25 Other inputs 7 ±25 Continuous total power dissipation θJA MAX UNIT V V V See Dissipation Ratings Table D package 73 N package 67 NS package 64 PW package 108 Case temperature for 60 seconds FK package 260 °C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds D or N package 260 °C Lead temperature 1.6 mm (1/16 inch) from case for 60 seconds J package 300 °C 150 °C Package thermal impedance (4) Storage temperature range –65 °C/W Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the network ground terminal. Differential voltage values are at the noninverting (A) input terminals with respect to the inverting (B) input terminals. The package thermal impedance is calculated in accordance with JESD 51-7. Copyright © 1980–2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM 3 AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 DISSIPATION RATINGS PACKAGE TA ≤ 25°C POWER RATING DERATION FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 125°C POWER RATING FK 1375 mW 11.0 mW/°C 880 mW 275 mW J 1375 mW 11.0 mW/°C 880 mW 275 mW RECOMMENDED OPERATING CONDITIONS VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage MIN NOM MAX AM26LS32AC, AM26LS32AI, AM26LS33AC 4.75 5 5.25 AM26LS32AM, AM26LS33AM 4.5 5 5.5 UNIT 2 V V 0.8 AM26LS32A ±7 AM26LS33A ±15 V VIC Common-mode input voltage IOH High-level output current –440 μA IOL Low-level output current 8 mA TA Operating free-air temperature AM26LS32AC, AM26LS33AC 0 V 70 AM26LS32AI –40 85 AM26LS32AM, AM26LS33AM –55 125 °C ELECTRICAL CHARACTERISTICS over recommended ranges of VCC, VIC, and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ Positive-going input threshold voltage VO = VOHmin, IOH = –440 μA VIT– Negative-going input threshold voltage VO = 0.45 V , IOL = 8 mA Vhys Hysteresis voltage (VIT+ – VIT–) VIK Enable-input clamp voltage VOH High-level output voltage TYP (1) MAX AM26LS32A 0.2 AM26LS33A 0.5 AM26LS32A –0.2 (2) AM26LS33A –0.5 (2) VCC = MIN, VCC = MIN, VID = 1 V, VI(G) = 0.8 V, IOH = –440 μA II = –18 mA 2.7 AM26LS32AM, AM26LS32AI, AM26LS33AM 2.5 0.4 IOL= 8 mA 0.45 VO = 2.4 V 20 VO = 0.4 V –20 VI = 15 V, Other input at –10 V to 15 V 1.2 VI = –15 V, Other input at –15 V to 10 V –1.7 VCC = MIN, VID = –1 V, VI(G) = 0.8 V IOZ Off-state (high-impedance state) output current VCC = MAX Line input current V V IOL= 4 mA Low-level output voltage V mV –1.5 AM26LS32AC, AM26LS33AC UNIT V 50 VOL II MIN V μA mA II(EN) Enable input current VI = 5.5 V 100 μA IH High-level enable current VI = 2.7 V 20 μA (1) (2) 4 All typical values are at VCC = 5 V, TA = 25°C, and VIC = 0. The algebraic convention, in which the less positive (more negative) limit is designated as minimum, is used in this data sheet for threshold levels only. Submit Documentation Feedback Copyright © 1980–2007, Texas Instruments Incorporated Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 ELECTRICAL CHARACTERISTICS (continued) over recommended ranges of VCC, VIC, and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS IL Low-level enable current VI = 0.4 V ri Input resistance VIC = –15 V to 15 V, IOS Short-circuit output current (3) VCC = MAX ICC Supply current VCC = MAX, (3) MIN One input to ac ground 12 TYP (1) UNIT mA 15 –15 All outputs disabled MAX –0.36 52 kΩ –85 mA 70 mA Not more than one output should be shorted to ground at a time, and duration of the short circuit should not exceed one second. SWITCHING CHARACTERISTICS VCC = 5 V, TA = 25°C PARAMETER tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tPZH Output enable time to high level tPZL Output enable time to low level tPHZ Output disable time from high level tPLZ Output disable time from low level (1) TEST CONDITIONS CL = 15 pF, MIN TYP (1) MAX 20 35 22 35 17 22 20 25 21 30 30 40 See Figure 1 CL = 15 pF, See Figure 1 CL = 15 pF, See Figure 1 UNIT ns ns ns All typical values are at VCC = 5 V, TA = 25°C, and VIC = 0. Copyright © 1980–2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM 5 AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 PARAMETER MEASUREMENT INFORMATION VCC Test Point RL = 2 kΩ 2.5 V S1 From Output Under Test CL (see Note A) Input 00 –2.5 V 5 kΩ tPLH See Note B tPHL VOH Output S2 1.3 V 1.3 V VOL S1 and S2 Closed TEST CIRCUIT VOLTAGE WAVEFORMS FOR tPLH, tPHL ≤5 ns 90% Enable G ≤5 ns 3V 90% 10% See Note C 90% 90% 10% tPZH S1 Open S2 Closed 10% 3V 90% 90% 10% VOH 1.3 V Output ≈1.4 V S1 Closed S2 Closed VOLTAGE WAVEFORMS FOR tPHZ, tPZH 3V 1.3 V 1.3 V 10% S1 Closed S2 Closed tPZL 1.3 V tPHZ 0 See Note C 0 0.5 V 3V 90% 1.3 V1.3 V Enable G 10% ≤5 ns 10% 0 1.3 V 1.3 V Enable G 90% Enable G 1.3 V1.3 V 10% Output ≤5 ns ≈1.4 V tPLZ S1 Closed S2 Open 0 VOL 0.5 V VOLTAGE WAVEFORMS FOR tPLZ, tPZL NOTES: A. CL includes probe and jig capacitance. B. All diodes are 1N3064 or equivalent. C. Enable G is tested with G high; G is tested with G low. Figure 1. Test Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright © 1980–2007, Texas Instruments Incorporated Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS HIGH-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE High-Level Output Voltage, VOH (V) High-Level Output Voltage, VOH (V) HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT High-Level Output Current, IOH (mA) IOH = –440 μA Free-Air Temperature, TA (°C) Figure 3. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE Low-Level Output Voltage, VOL (V) Low-Level Output Votlage, VOL (V) Figure 2. Low-Level Output Current, IOL (mA) Figure 4. Copyright © 1980–2007, Texas Instruments Incorporated Free-Air Temperature, TA (°C) Figure 5. Submit Documentation Feedback Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM 7 AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (continued) OUTPUT VOLTAGE vs ENABLE G VOLTAGE OUTPUT VOLTAGE vs ENABLE G VOLTAGE Load = 8 kΩ to GND Output Voltage, VO (V) Output Voltage, VO (V) Load = 8 kΩ to GND Enable G Voltage (V) Figure 7. OUTPUT VOLTAGE vs ENABLE G VOLTAGE OUTPUT VOLTAGE vs ENABLE G VOLTAGE Output Voltage, VO (V) Output Voltage, VO (V) Enable G Voltage (V) Figure 6. Load = 1 kΩ to VCC Load = 1 kΩ to VCC Enable G Voltage (V) Figure 8. 8 Submit Documentation Feedback Enable G Voltage (V) Figure 9. Copyright © 1980–2007, Texas Instruments Incorporated Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (continued) AM26LS33A OUTPUT VOLTAGE vs DIFFERENTIAL INPUT VOLTAGE Output Voltage, VO (V) Output Voltage, VO (V) AM26LS32A OUTPUT VOLTAGE vs DIFFERENTIAL INPUT VOLTAGE Differential Input Voltage, VID (mV) Differential Input Voltage, VID (mV) Figure 10. Figure 11. Input Current, II (mA) INPUT CURRENT vs INPUT VOLTAGE Input Voltage, VI (V) The unshaded area shows requirements of paragraph 4.2.1 of ANSI Standards EIA/TIA-422-B and EIA/TIA-423-B. Figure 12. Copyright © 1980–2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM 9 AM26LS32AC,, AM26LS32AI,, AM26LS33AC AM26LS32AM, AM26LS33AM QUADRUPLE DIFFERENTIAL LINE RECEIVERS www.ti.com SLLS115E – OCTOBER 1980 – REVISED OCTOBER 2007 APPLICATION INFORMATION Figure 13. Circuit with Multiple Receivers 10 Submit Documentation Feedback Copyright © 1980–2007, Texas Instruments Incorporated Product Folder Link(s): AM26LS32AC AM26LS32AI AM26LS33AC AM26LS32AM AM26LS33AM PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-7802003M2A ACTIVE LCCC FK 20 1 TBD 5962-7802003MEA ACTIVE CDIP J 16 1 TBD 5962-7802003MFA ACTIVE CFP W 16 1 TBD 5962-7802004M2A ACTIVE LCCC FK 20 1 TBD 5962-7802004MEA ACTIVE CDIP J 16 1 TBD 5962-7802004MFA ACTIVE CFP W 16 1 AM26LS32ACD ACTIVE SOIC D 16 40 AM26LS32ACDE4 ACTIVE SOIC D 16 40 AM26LS32ACDG4 ACTIVE SOIC D 16 40 AM26LS32ACDR ACTIVE SOIC D AM26LS32ACDRE4 ACTIVE SOIC AM26LS32ACDRG4 ACTIVE AM26LS32ACN Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26LS32ACNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26LS32ACNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32ACNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32ACPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32ACPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32ACPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32ACPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32ACPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32ACPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32AID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32AIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32AIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32AIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS32AIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2010 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty AM26LS32AIDRG4 ACTIVE SOIC D 16 AM26LS32AIN ACTIVE PDIP N 16 25 AM26LS32AINE4 ACTIVE PDIP N 16 AM26LS32AMFKB ACTIVE LCCC FK AM26LS32AMJ ACTIVE CDIP J AM26LS32AMJB ACTIVE CDIP AM26LS32AMWB ACTIVE AM26LS33ACD ACTIVE AM26LS33ACDE4 ACTIVE AM26LS33ACDG4 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 20 1 TBD 16 1 TBD A42 N / A for Pkg Type J 16 1 TBD A42 N / A for Pkg Type CFP W 16 1 TBD A42 N / A for Pkg Type SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS33ACDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS33ACDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS33ACDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LS33ACN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26LS33ACNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26LS33AMFKB ACTIVE LCCC FK 20 1 TBD AM26LS33AMJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type AM26LS33AMJB ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type AM26LS33AMWB ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2010 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF AM26LS32A, AM26LS32AM, AM26LS33A, AM26LS33AM : • Enhanced Product: AM26LS32AM-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing AM26LS32ACDR SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) 8.0 16.0 Q1 D 16 2500 330.0 16.4 6.5 10.3 2.1 W Pin1 (mm) Quadrant AM26LS32ACDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26LS32ACNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 AM26LS32ACPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 AM26LS32AIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26LS33ACDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AM26LS32ACDR SOIC D 16 2500 333.2 345.9 28.6 AM26LS32ACDR SOIC D 16 2500 346.0 346.0 33.0 AM26LS32ACNSR SO NS 16 2000 346.0 346.0 33.0 AM26LS32ACPWR TSSOP PW 16 2000 346.0 346.0 29.0 AM26LS32AIDR SOIC D 16 2500 333.2 345.9 28.6 AM26LS33ACDR SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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