GMT G771

G771
Global Mixed-mode Technology Inc.
Two Remote Temperature Sensors with SMBus
Serial Interface and System Reset Circuit
Features
General Description
„Measures Two Remote Temperatures
„No Calibration Required
„SMBus 2-Wire Serial Interface
„Programmable Under/Over-temperature Alarms
„Programmable Thermal Shutdown Signal
„Supports SMBus Alert Response
„Accuracy: ±5°C (-40°C to + 125°C, remote)
The G771 contains a precise digital thermometer, a
system-reset circuit, and a programmable thermal
shutdown signal.
The thermometer reports the temperature of 2 remote
sensors. The remote sensors are diode-connected
transistors typically a low-cost, easily mounted
2N3904 NPN type that replace conventional thermistors or thermocouples. Remote accuracy is ±5°C for
multiple transistor manufacturers, with no calibration
needed. The remote channel can also measure the die
temperature of other ICs, such as microprocessors,
that contain an on-chip, diode-connected transistor.
±3°C (+60°C to + 100°C, remote)
„4.5V to 5.5V Supply Range
„Precision Monitoring of 5V Power-Supply
Voltage
„140ms Min Power-On Reset Pulse Width
RESET Output
The 2-wire serial interface accepts standard System
Management Bus (SMBusTM) Write Byte, Read Byte,
Send Byte, and Receive Byte commands to program
the alarm thresholds and to read temperature data.
The data format is 7 bits plus sign, with each bit corresponding to 1°C, in two’s-complement format.
Measurements can be done automatically and
autonomously, with the conversion rate programmed
by the user or programmed to operate in a single-shot
mode. The adjustable rate allows the user to control
the supply-current drain.
„Guaranteed RESET Valid to VCC=1V
„Power Supply Transient Immunity
„No External Components needed for reset
function
„Small, 16-Pin SSOP Package
Applications
„Desktop and Notebook
„Central Office Computers
„Telecom Equipment
„Smart Battery Packs
„Test and Measurement
„LAN Servers
„Multi-Chip Modules
„Industrial Controls
Ordering Information
PART*
TEMP. RANGE
PIN-PACKAGE
G771
-55°C to +125°C
16SSOP
Pin Configuration
G771
NC
1
16
TH_SHUT(push-pull)
Vcc
2
15
NC
DXP1
3
14
SMBCLK
DXN
4
13
NC
DXP2
5
12
SMBDATA
NC
6
11
ALERT
DGND
7
10
NC
AGND
8
9
RESET
16Pin SSOP
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G771
Global Mixed-mode Technology Inc.
the Tcrit1 (SMBus 35h) threshold consecutively for
the times equal to the number of faults of the
FQ_TH_SHUT registers, TH_SHUT pin becomes
logic high. The same mechanism is duplicated for
DX2. Therefore, either one of DX1, DX2 continuously over their respective Tcrit, the TH_SHUT will
assert logic high to indicate a thermal shutdown
event.
The G771 also contains a microprocessor (µP) supervisory circuit used to monitor the power supplies in µP
and digital systems. They provide excellent circuit reliability and low cost by eliminating external components and adjustments when used with 5V-powered
circuits. This circuit asserts a reset signal whenever
the VCC supply voltage declines below a preset
threshold, keeping it asserted for at least 140ms after
VCC has risen above the reset threshold. The G771
has an active-low RESET output. The reset comparator is designed to ignore fast transients on VCC.
Reset threshold of this circuit is set to 4.38V.
The G771’s SMBus device address is fixed to be 7Ah
for write and 7Bh for read.
The G771 is available in a small, 16-pin SSOP surface-mount package.
When the temperature of DX1 reaches or exceeds
Typical Operating Circuit
TH_SHUT
Vcc
Vcc
0.1µF
0.1µF
10k EACH
G771
DXP1
DXN
2N3904
SMBCLK
SMBDATA
SMBCLK
SMBDATA
2200pF
ALERT
INTERRUPT TO µC
DXP2
2N3904
RESET
2200pF
RESET
µP
GND
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Global Mixed-mode Technology Inc.
ESD Protection (human body model)……………..2000V
Continuous Power Dissipation (T A= +70°C) SSOP
(de-rate 8.30mW/°C above +70°C)………….…667mW
Operating Temperature Range………-55°C to +125°C
Junction Temperature……………………....+150°C
Storage temperature Range…………..-65°C to +165°C
Lead Temperature (soldering,10sec)………….+300°C
Absolute Maximum Ratings
Vcc to GND……………….………….…….-0.3V to +6V
DXP1, DXP2 to GND……………0.3V to (Vcc + 0.3V)
DXN to GND……………………………...-0.3V to +0.8V
SMBCLK, SMBDATA, ALERT to GND...-0.3V to +6V
SMBDATA, ALERT Current…………...-1mA to +50mA
DXN Current………………………………………±1mA
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Electrical Characteristics
(Vcc = + 5V, TA = 60°C, unless otherwise noted.)
PARAMETER
Temperature Sensor
Temperature Resolution (Note 1)
Temperature Error, Remote Diode
(Notes 2 and 3)
CONDITIONS
Monotonicity guaranteed
TR = 0°C to +125°C
TR = 60°C to +100°C
Temperature Error, On-chip Diode
(Notes 1 and 2)
Supply-Voltage Range
Under-voltage Lockout Threshold
Under-voltage Lockout Hysteresis
Power-On Reset Threshold
POR Threshold Hysteresis
MIN TYP MAX UNITS
8
-5
-3
±3
TA = +60℃ to +100°C
Vcc input, disables A/D conversion, rising edge
4.5
2.6
Vcc , falling edge
1.0
Conversion Time
SMBus static
Logic inputs forced to Vcc or
Hardware or software
GND
standby, SMBCLK at 10kHz
Auto-convert mode, average 0.25 conv/sec
measured over 4sec. Logic
2.0 conv/sec
inputs forced to Vcc or GND
From stop bit to conversion complete (all channels)
94
Conversion Rate Timing Error
Auto-convert mode
Remote-Diode Source Current
DXP forced to 1.5V
Standby Supply Current
Average Operating Supply Current
Bits
5
3
5
2.8
50
1.7
50
3
°C
°C
5.5
2.95
2.5
V
V
mV
V
mV
10
µA
200
250
300
300
350
125
156
ms
25
%
-25
High level
120
160
200
Low level
15
20
25
µA
µA
SMBus Interface
Logic Input High Voltage
SMBCLK, SMBDATA; Vcc = 4.5V to 5.5V
2.4
Logic Input Low Voltage
SMBCLK, SMBDATA; Vcc = 4.5V to 5.5V
Logic Output Low Sink Current
, SMBDATA forced to 0.4V
Output High Leakage Current
forced to 5.5V
Logic Input Current
Logic inputs forced to Vcc or GND
SMBus Input Capacitance
SMBCLK, SMBDATA
SMBus Clock Frequency
(Note 4)
DC
SMBCLK Clock Low Time
tLOW , 10% to 10% points
4.7
SMBCLK Clock High Time
tHIGH , 90% to 90% points
SMBus Start-Condition Setup Time
SMBus Repeated Start-Condition Setup Time tSU : STA , 90% to 90% points
V
0.8
6
V
mA
-2
1
µA
2
µA
5
pF
100
KHz
µs
4
µs
4.7
µs
500
ns
SMBus Start-Condition Hold Time
tHD: STA , 10% of SMBDATA to 90% of SMBCLK
4
µs
SMBus Start-Condition Setup Time
tSD: STO , 90% of SMBDATA to 10% of SMBDATA
4
µs
800
ns
0
µs
SMBus Data Valid to SMBCLK Rising-Edge tSU: DAT , 10% or 90% of SMBDATA to 10% of SMBCLK
Time
SMBus Data-Hold Time
tHD : DAT(Note 5)
SMBCLK Falling Edge to SMBus Data-Valid
Master clocking in data
Time
1
µs
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Global Mixed-mode Technology Inc.
Electrical Characteristics (continued)
(VCC =full range, TA= 60°C, unless otherwise noted.)
PARAMETER
SYMBOL
Reset Threshold
CONDITIONS
VTH
Reset Active Timeout Period
Output Voltage Low
VOL
RESET Output Voltage High
VOH
MIN
TYP
4.2
4.4
MAX UNITS
4.5
V
0.4
ms
V
340
VCC=VTH min ISINK =3.2mA
VCC>VTH max, ISOURCE =5.0mA VCC-1.5
V
Note 1: Guaranteed but not 100% tested.
Note 2: Quantization error is not included in specifications for temperature accuracy. For example, if the G771
device temperature is exactly +66.7°C, or +68°C (due to the quantization error plus the +1/2°C offset
used for rounding up) and still be within the guaranteed ±3°C error limits for the +60°C to +100°C temperature range. See Table3.
Note 3: A remote diode is any diode-connected transistor from Table1. TR is the junction temperature of the remote diode. See Remote Diode Selection for remote diode forward voltage requirements.
Note 4: The SMBus logic block is a static design that works with clock frequencies down to DC. While slow operation is possible, it violates the 10kHz minimum clock frequency and SMBus specifications, and may
monopolize the bus.
Note 5: Note that a transition must internally provide at least a hold time in order to bridge the undefined region
(300ns max) of SMBCLK's falling edge.
Pin Description
PIN
NAME
FUNCTION
1,6,10,13,15
2
NC
Vcc
3
DXP1
4
DXN
5
DXP2
7
8
DGND
AGND
Not connected.
Supply Voltage Input, 4.5V to 5.5V. Bypass to GND with a 0.1µF capacitor.
Combined Current Source and A/D Positive Input for remote-diode channel 1. Do not leave DXP1
floating; tie DXP1 to DXN if no remote diode on channel 1 is used. Place a 2200pF capacitor between DXP1 and DXN for noise filtering.
Combined Current Sink and A/D Negative Input. DXN is common negative node of both remote diodes on channel 1 and 2. The traces of DXP1-DXN and DXP2-DXN pairs should be routed independently. The common DXN should be connected together as close as possible to the IC. DXN is
internally connected to the GND pin for signal ground use.
Combined Current Source and A/D Positive Input for remote-diode channel 2. Do not leave DXP2
floating; tie DXP2 to DXN if no remote diode on channel 2 is used. Place a 2200pF capacitor between DXP2 and DXN for noise filtering.
Digital Ground.
Analog Ground.
9
RESET
11
ALERT
SMBDATA
SMBCLK
TH_SHUT
12
14
16
RESET Output remains low while VCC is below the reset threshold, and for 240ms after VCC rises
above the reset threshold.
SMBus Alert (interrupt) Output, open drain.
SMBus Serial-Data Input / Output, open drain.
SMBus Serial-Clock Input.
Thermal Shutdown Output, push-pull output.
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G771
Global Mixed-mode Technology Inc.
ADC and Multiplexer
The ADC is an averaging type that integrates over a
60ms period (each channel, typical).
Detailed Description
The G771 (patents pending) consists of two temperature sensors, one on-chip temperature sensor and
provides system-reset function.
The multiplexer automatically steers bias currents
through two remote diodes, measures their forward
voltages, and computes their temperatures. All channels are converted automatically once the conversion
process has started, either in free-running or single-shot mode. If one of the two channels is not used,
the device still performs all measurements, and the
user can simply ignore the results of the unused channel. If the remote diode channel is unused, tie DXPx to
DXN rather than leaving the pins open.
The temperature sensor is designed to work in conjunction with an external micro-controller (µC) or other
intelligence in thermostatic, process-control, or monitoring applications. The µC is typically a powermanagement or keyboard controller, generating SMBus serial commands by "bit-banging" general-purpose input-output (GPIO) pins or via a dedicated SMBus interface block.
Essentially a 12-bit serial analog-to-digital converter
(ADC) with a sophisticated front end, the G771 contains a switched current source, a multiplexer, an ADC,
an SMBus interface, a reset circuit and associated
control logic (Figure 1).
The DXN input is internally connected to the ground
node inside the chip to set up the analog to digital
(A/D) inputs for a differential measurement. The
worst-case DXP-DXN differential input voltage range
is 0.25V to 0.95V.
Temperature data from the ADC is loaded into two
data registers, where it is automatically compared with
data previously stored in four over/under-temperature
alarm registers.
Excess resistance in series with the remote diode causes
about +1/2°C error per ohm. Likewise, 200µV of offset
voltage forced on DXP-DXN causes about 1°C error.
THERMAL SHUTDOWN
LOGIC
VCC
VCC
TH_SHUT
SMBCLK
SMBUS
REGISTERS
CONTROL
LOGIC
SMBDATA
ALERT
DXP1
+
DXP2
+
+
MUX
ADC
DXN
RESET
CIRCUIT
RESET
INTERNAL GROUND
Fig 1. Functional Diagram
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A/D Conversion Sequence
If a Start command is written (or generated automatically in the free-running auto-convert mode), both two
channels are converted, and the results of both measurements are available after the end of conversion. A
BUSY status bit in the status byte shows that the device is actually performing a new conversion; however,
even if the ADC is busy, the results of the previous
conversion are always available.
proper external noise filtering are required for highaccuracy remote measurements in electrically noisy
environments.
High-frequency EMI is best filtered at DXP and DXN
with an external 2200pF capacitor. This value can be
increased to about 3300pF(max), including cable capacitance. Higher capacitance than 3300pF introduces
errors due to the rise time of the switched current
source.
Remote-Diode Selection
Temperature accuracy depends on having a
good-quality, diode-connected small-signal transistor.
Accuracy has been experimentally verified for all of
the devices listed in Table 1. The G771 can also directly measure the die temperature of CPUs and other
integrated circuits having on-board temperaturesensing diodes. The transistor must be a small-signal
type with a relatively high forward voltage; otherwise,
the A/D input voltage range can be violated. The forward voltage must be greater than 0.25V at 10µA;
check to ensure this is true at the highest expected
temperature. The forward voltage must be less than
0.95V at 200A; check to ensure this is true at the lowest expected temperature. Large power transistors
don't work at all. Also, ensure that the base resistance
is less than 100Ω. Tight specifications for forward
current gain (+50 to +150, for example) indicate that
the manufacturer has good process controls and that
the devices have consistent VBE characteristics.
Nearly all noise sources tested cause the ADC measurements to be higher than the actual temperature,
typically by +1°C to 10°C, depending on the frequency
and amplitude (see Typical Operating Characteristics).
PC Board Layout
Place the G771 as close as practical to the remote
diode. In a noisy environment, such as a computer
motherboard, this distance can be 4 in. to 8 in. (typical)
or more as long as the worst noise sources (such as
CRTs, clock generators, memory buses, and ISA/PCI
buses) are avoided.
Do not route the DXP-DXN lines next to the deflection
coils of a CRT. Also, do not route the traces across a
fast memory bus, which can easily introduce +30°C
error, even with good filtering, Otherwise, most noise
sources are fairly benign.
Route the DXP and DXN traces in parallel and in close
proximity to each other, away from any high-voltage
traces such as +12VDC. Leakage currents from PC
board contamination must be dealt with carefully,
since a 20MΩ leakage path from DXP to ground
causes about +1°C error.
Thermal Mass and Self-Heating
Thermal mass can seriously degrade the G771's effective accuracy. The thermal time constant of the
SSOP-16 package is about 140sec in still air. For the
G771 junction temperature to settle to within +1°C
after a sudden +100°C change requires about five
time constants or 12 minutes. The use of smaller
packages for remote sensors, such as SOT23s, improves the situation. Take care to account for thermal
gradients between the heat source and the sensor ,and ensure that stray air current across the sensor package do not interfere with measurement accuracy.
Route the 2 pairs of DXP1-DXN and DXP2-DXN
traces independently (Figure 2a). Connect the common DXN as close as possible to the DXN pin on IC
(Figure 2a).
Connect guard traces to GND on either side of the
DXP-DXN traces (Figure 2b). With guard traces in place,
routing near high-voltage traces is no longer an issue.
Route through as few vias and crossunders as possible to minimize copper/solder thermocouple effects.
Table 1. Remote-Sensor Transistor Manufacturers
MANUFACTURER
Philips
Motorola (USA)
National Semiconductor (USA)
G771
When introducing a thermocouple, make sure that
both the DXP and the DXN paths have matching
thermocouples. In general, PC board- induced thermocouples are not a serious problem, A copper-solder
thermocouple exhibits 3µV/°C, and it takes about
200µV of voltage error at DXP-DXN to cause a +1°C
measurement error. So, most parasitic thermocouple
errors are swamped out.
MODEL NUMBER
PMBS 3904
MMBT3904
MMBT3904
Note:Transistors must be diode-connected (base short
-ed to collector).
ADC Noise Filtering
The ADC is an integrating type with inherently good
noise rejection, especially of low-frequency signals
such as 60Hz/120Hz power-supply hum. Micro-power
operation places constraints on high-frequency noise
rejection; therefore, careful PC board layout and
Use wide traces. Narrow ones are more inductive and
tend to pick up radiated noise. The 10 mil widths and
spacing recommended on Figure 2 aren't absolutely
necessary (as they offer only a minor improvement in
leakage and noise), but try to use them where practical.
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Excess capacitance at DX_limits practical remote
sensor distances (see Typical Operating Characteristics), For very long cable runs, the cable's parasitic
capacitance often provides noise filtering, so the
2200pF capacitor can often be removed or reduced in
value. Cable resistance also affects remote-sensor
accuracy; 1Ω series resistance introduces about + 1°C
error.
Keep in mind that copper can't be used as an EMI
shield, and only ferrous materials such as steelwork
will. Placing a copper ground plane between the DXPDXN traces and traces carrying high-frequency noise
signals do not help reduce EMI.
PC Board Layout Checklist
„Place the G771 close to a remote diode.
„Keep traces away from high voltages (+12V bus).
„Keep traces away from fast data buses and CRTs.
„Use recommended trace widths and spacing.
„Place a ground plane under the traces
„Use guard traces flanking DXP and DXN and connecting to GND.
„Route two DXPx-DXN pairs independently
„Connect the common DXN as close as possible to
the DXN pin on IC.
„Place the noise filter and the 0.1µF Vcc bypass
capacitors close to the G771.
Low-Power Standby Mode
Standby mode disables the ADC and reduces the supply-current drain to less than 10µA. Enter standby
mode via the RUN/STOP bit in the configuration byte
register. In standby mode, all data is retained in memory, and the SMB interface is alive and listening for
reads and writes. This is valid for temperature sensor
only.
Standby mode is not a shutdown mode. With activity
on the SMBus, extra supply current is drawn (see
Typical Operating Characteristics). In software
standby mode, the G771 can be forced to perform
temperature measurement via the one-shot command,
despite the RUN/STOP bit being high.
GND
DXP1
DXN
DXP1
DXN
G771
DXN
DXP2
G771
Supply-current drain during the 125ms conversion
period is always about 500µA. Slowing down the conversion rate reduces the average supply current (see
Typical Operating Characteristics). In between conversions, the instantaneous supply current is about
200µA due to the current consumed by the system
resetting circuit.
DXP2
GND
Chip Boundary
„Fig 2(a) Connect the common DXN as close as
possible to the DXN pin on IC.
Reset Immunity Negative-Going VCC Transients
In addition to issuing a reset to the microprocessor (µP)
during power-up, power-down, and brownout conditions, the G771 is relatively immune to short duration
negative-going VCC transients (glitches).
Typically, for the G771, a VCC transient that goes
100mV below the reset threshold and lasts 20µs or
less will not cause a reset pulse. A 0.1µF bypass capacitor mounted as close as possible to the VCC pin
provides additional transient immunity.
GND
10 MILS
10 MILS
DXP
MINIMUM
DXN
10 MILS
10 MILS
GND
Ensuring a Valid Reset Output Down to VCC = 0V
When VCC falls below 1V, the G771 RESET output
no longer sinks current-it becomes an open circuit.
Therefore, high-impedance CMOS logic inputs connected to RESET can drift to undetermined voltages.
This presents no problem in most applications, since
most µP and other circuitry is inoperative with VCC below 1V. However, in applications where RESET
must be valid down to 0V, adding a pull-down resistor
to RESET causes any stray leakage currents to flow
Fig 2 (b) Recommended DXP/DXN PC
Twisted Pair and Shielded Cables
For remote-sensor distances longer than 8 in., or in
particularly noisy environments, a twisted pair is recommended. Its practical length is 6 feet to 12feet (typical) before noise becomes a problem, as tested in a
noisy electronics laboratory. For longer distances, the
best solution is a shielded twisted pair like that used
for audio microphones. Connect the twisted pair to
DXP and DXN and the shield to GND, and leave the
shield's remote end unterminated.
to ground, holding RESET low (Figure 3). R1's value
is not critical; 100kΩ is large enough not to load
RESET and small enough to pull RESET to ground.
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SMBus Digital Interface
From a software perspective, the G771 appears as a
set of byte-wide registers that contain temperature
data, alarm threshold values, fan speed data, or control bits, A standard SMBus 2-wire serial interface is
used to read temperature data and write control bits
and alarm threshold data. Each A/D and fan control
channel within the device responds to the same
SMBus slave address for normal reads and writes.
Interfacing to µPs with Bi-directional Reset Pins
A µP with bi-directional reset pins (such as the Motorola 68HC11 series) can connect to the G771 reset
output. If, for example, the G771 RESET output is
asserted high and the µP wants to pull it low,
indeterminate logic levels may result. To correct this,
connect a 4.7kΩ resistor between the G771 RESET
output and the µP reset I/O (Figure 4). Buffer the
G771 RESET output to other system components.
The G771 employs four standard SMBus protocols:
Write Byte, Read Byte, Send Byte, and Receive Byte
(Figure 5). The shorter Receive Byte protocol allows
quicker transfers, provided that the correct data register was previously selected by a Read Byte instruction.
Use caution with the shorter protocols in multi-master
systems, since a second master could over-write the
command byte without informing the first master.
The temperature data format is 7bits plus sign in
twos-complement form for each channel, with each
data bit representing 1°C (Table3), transmitted MSB
first. Measurements are offset by +1/2°C to minimize
internal rounding errors; for example, +99.6°C is reported as +100°C.
Benefits of Highly Accurate Reset Threshold
Most µP supervisor Ics have reset threshold voltages
between 5% and 10% below the value of nominal supply voltages. This ensures a reset will not occur within
5% of the nominal supply, but will occur when the supply is 10% below nominal.
When using Ics rated at only the nominal supply ±5%
this leaves a zone of uncertainty where the supply is
between 5% and 10% low, and where the reset may or
may not be asserted.
The G771 use highly accurate circuitry to ensure that
reset is asserted close to the 5% limit, and long before
the supply has declined to 10% below nominal.
BUFFER
BUFFERED RESET
TO OTHER SYSTEM
COMPONENTS
V CC
VCC
G771
G771
RESET
RESET
VCC
4.7k
µP
RESET
R1
100k
GND
GND
GND
Fig 4. Interfacing to µPs with Bi-directional Reset I/O
Fig 3. RESET Valid to VCC = Ground Circuit
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Write Byte Format
S
Address
ACK
WR
Command
7 bits
ACK
DATA
8 bits
ACK
P
8 bits
1
Slave Address: equivalent to chip-select line of a 3-wire interface
Command Byte: selects, which register you, are writing to
Data Byte: data goes into the register set by the command byte (to set thresholds, configuration masks, and
sampling rate)
Read Byte Format
S Address WR
ACK
7 bits
Command
ACK
S
Address
8 bits
RD
ACK
DATA
7 bits
///
P
8 bits
Slave Address: equivalent to chip- select line
Command Byte: selects, which register you, are reading from
Slave Address: repeated due to change in data-flow direction
Data byte: reads from the register set by the command byte
Send Byte Format
S
Address
ACK
WR
Command
7 bits
ACK
P
///
P
8 bits
Command Byte: sends command with no data usually used for one-shot command
Receive Byte Format
S
Address
ACK
RD
Data
7 bits
8 bits
Data Byte: reads data from the register commanded by the last Read Byte or Write
Byte transmission; also used for SMBus Alert Response return address
S = Start condition
Shaded = Slave transmission
P = Stop condition
/// = Not acknowledged
Fig 5. SMBus Protocols
Alarm Threshold Registers
Four registers store alarm threshold data, with
high-temperature (THIGH) and low-temperature
(TLOW) registers for each A/D channel. If either
measured temperature equals or exceeds the corresponding alarm threshold value, an ALERT interrupt
is asserted.
Table 3. Data Format (Twos-Complement)
ROUND
DIGITAL OUTPUT
TEMP.
TEMP.
DATA BITS
(°°C)
(°°C)
SIGN
MSB
LSB
+130.00
+127.00
+126.50
+126.00
+25.25
+0.50
+0.25
+0.00
-0.25
-0.50
-0.75
-1.00
-25.00
-25.50
-54.75
-55.00
-65.00
-70.00
+127
+127
+127
+126
+25
+1
+0
+0
+0
+0
-1
-1
-25
-25
-55
-55
-65
-65
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
111
111
111
111
001
000
000
000
000
000
111
111
110
110
100
100
011
011
1111
1111
1111
1110
1001
0001
0000
0000
0000
0000
1111
1111
0111
0110
1001
1001
1111
1111
The power-on-reset (POR) state of both THIGH registers is full scale (0111 1111, or +127°C). The POR
state of both TLOW registers is 1100 1001 or -55°C.
Diode Fault Alarm
There is a continuity fault detector at DXP that detects
whether the remote diode has an open-circuit condition. At the beginning of each conversion, the diode
fault is checked, and the status byte is updated. This
fault detector is a simple voltage detector; if DXP rises
above VCC - 1V (typical) due to the diode current
source, a fault is detected. Note that the diode fault
isn't checked until a conversion is initiated, so immediately after power-on reset the status byte indicates
no fault is present, even if the diode path is broken.
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rupt output pin is open-drain so that device can share
a common interrupt line. The interrupt rate can never
exceed the conversion rate.
If the remote channel is shorted (DXP to DXN or DXP
to GND), the ADC reads 0000 0000 so as not to trip
either the THIGH or TLOW alarms at their POR settings. In applications that are never subjected to 0°C in
normal operation, a 0000 0000 result can be checked
to indicate a fault condition in which DXP is accidentally short circuited. Similarly, if DXP is short circuited
to VCC, the ADC reads +127°C for both channels, and
the device alarms.
The interface responds to the SMBus Alert Response
address, an interrupt pointer return-address feature
(see Alert Response Address section). Prior to taking
corrective action, always check to ensure that an interrupt is valid by reading the current temperature.
Alert Response Address
The SMBus Alert Response interrupt pointer provides
quick fault identification for simple slave devices that
lack the complex, expensive logic needed to be a bus
master. Upon receiving an ALERT interrupt signal, the
host master can broadcast a Receive Byte transmission
to the Alert Response slave address (0001 100). Then
any slave device that generated an interrupt attempts to
identify itself by putting its own address on the bus.
ALERT Interrupts
The ALERT interrupt output signal is latched and can
only be cleared by reading the Alert Response address. Interrupts are generated in response to THIGH
and TLOW comparisons and when the remote diode is
disconnected (for continuity fault detection). The interrupt does not halt automatic conversions; new temperature data continues to be available over the SMBus
interface after ALERT is asserted. The interrupt output
Table 4. Command-Byte Bit Assignments
REGISTER
RRTE2
RRTE1
RSL
RCL
RCRA
RRHI2
RRLS2
RRHI1
RRLS1
WCA
WCRW
WRHA2
WRLN2
WRHA1
WRLN1
OSHT
TCRIT1
TCRIT2
COMMAND
POR STATE
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
35h
36h
0000 0000b
0000 0000b
N/A
0000 0000b
0000 0010b
0111 1111b (127)
1100 1001b(-55)
0111 1111b (127)
1100 1001b (-55)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
0110 1100b (108)
0101 1000b (88)
FUNCTION
Read 2nd remote temperature: returns latest temperature
Read 1st remote temperature: returns latest temperature
Read status byte (flags, busy signal)
Read configuration byte
Read conversion rate byte
Read 2nd remote THIGH limit
Read 2nd remote TLOW limit
Read 1st remote THIGH limit
Read 1st remote TLOW limit
Write configuration byte
Write conversion rate byte
Write 2nd remote THIGH limit
Write 2nd remote TLOW limit
Write 1st remote THIGH limit
Write 1st remote TLOW limit
One-shot command (use send-byte format)
Critical temperature for 1st remote temperaure sensor
Critical temperature for 2nd remote temperaure sensor
0000, so that a Receive Byte transmission (a protocol
that lacks the command byte) that occurs immediately
after POR returns the current local temperature data.
The one-shot command immediately forces a new
conversion cycle to begin. In software standby mode
( RUN /STOP bit = high), a new conversion is begun,
after which the device returns to standby mode. If a
conversion is in progress when a one-shot command
is received in auto-convert mode (RUN/STOP bit = low)
between conversions, a new conversion begins, the
conversion rate timer is reset, and the next automatic
conversion takes place after a full delay elapses.
The Alert Response can activate several different slave
devices simultaneously, similar to the SMBus General
Call. If more than one slave attempts to respond, bus
arbitration rules apply, and the device with the lower
address code wins. The losing device does
not generate an acknowledge and continues to hold the
ALERT line low until serviced (implies that the host
interrupt input is level sensitive). Successful reading of
the alert response address clears the interrupt latch.
Command Byte Functions
The 8-bit command byte register (Table 4) is the master index that points to the various other registers
within the G771. The register's POR state is 0000
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Configuration Byte Functions
The configuration byte register contents are listed in
in the remote diode DXPx-DXN path. After POR, the
normal state of all the flag bits is zero, assuming none
of the alarm conditions are present. The status byte is
cleared by any successful read of the status, unless
the fault persists. Note that the ALERT interrupt latch
is not automatically cleared when the status flag bit is
cleared.
table 5. Bit 7 (MASK) is used to mask ALERT interrupt. Bit 6 ( RUN /STOP) is to put the device in software
standby mode. Setting bit 5 (DET_FAN) with logic 1
can activate the detection of fan failure. Logic 1 in bit 4
(EN_TH_SHUT) makes thermal shutdown function
valid and logic 0 disables this function and keep
TH_SHUT pin low. Bit 3~0 forms thermal shutdown
fault queue. The number of faults these bits decided
are listed in table 6.
When reading the status byte, you must check for internal bus collisions caused by asynchronous ADC
timing, or else disable the ADC prior to reading the
status byte (via the RUN /STOP bit in the configuration byte). In one-shot mode, read the status byte only
after the conversion is complete, which is 150ms max
after the one-shot conversion is commanded.
Thermal Status Byte Functions
The thermal status byte register (02h) (Table 6) indicates which (if any) temperature thresholds have been
exceeded. This byte also indicates whether or not the
ADC is converting and whether there is an open circuit
Table 5. Configuration-Byte Bit Assignments
BIT
NAME
POR STATE
7 (MSB)
MASK
0
Masks all ALERT interrupts when high.
FUNCTION
6
RUN / STOP
0
Standby mode control bit. If high, the device immediately stops converting and enters standby mode. If low, the device converts in either one-shot or timer mode.
5
DET_FAN
0
Should be 0. Changing this to 1 will cause ALERT function abnormal.
4
EN_TH_SHUT
1
3-0
FQ_TH_SHUT
0010b
Validation of the fault queue function of thermal shutdown.
Fault Queue. Number of faults necessary to detect before setting TH_SHUT output
to avoid false tripping due to noise.
Table 6. Number of Faults assigned by FQ_TH_SHUT
FQ_TH_SHUT
Number of Faults
FQ_TH_SHUT
Number of Faults
0000b
0001b
0010b
0011b
0100b
0101b
0110b
0111b
1
2
3(Power-up default)
4
5
6
7
8
1000b
1001b
1010b
1011b
1100b
1101b
1110b
1111b
9
10
11
12
13
14
15
16
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Table 7. Status-Byte Bit Assignments
BIT
NAME
7(MSB)
6
5
4
3
2
1
0(LSB)
BUSY
RHIGH2*
RLOW2*
RHIGH1*
RLOW1*
OPEN*
RFU
RFU
FUNCTION
A high indicates that the ADC is busy converting.
A high indicates that the 2nd diode high-temperature alarm has activated.
A high indicates that the 2nd diode low-temperature alarm has activated.
A high indicates that the 1st diode high-temperature alarm has activated.
A high indicates that the 1st diode low-temperature alarm has activated.
A high indicates a remote-diode continuity (open-circuit) fault.
Reserved for future use (returns 0)
Reserved for future use (returns 0)
*These flags stay high until cleared by POR, or until the status byte register is read.
Table 8. Conversion-Rate Control Byte
DATA
CONVERSION
RATE (Hz)
Temperature Sensor Average
Supply Current (µA TYP, at Vcc = 5V)
00h
01h
02h
03h
04h
05h
06h
07h
08h to FFh
0.0625
0.125
0.25
0.5
1
2
4
8
RFU
30
33
35
48
70
128
225
425
-
Table 9. RLTS and RRTE Temp Register Update Timing Chart
OPERATING
MODE
CONVERSION
INITIATED BY:
NEW CONVERSION RATE
(CHANGED VIA WRITE TO CRW)
TIME UNTIL RLTS AND
RRTE ARE UPDATED
Auto-Convert
Power-on reset
N/A (0.25Hz)
156ms max
Auto-Convert
1-shot command, while idling
between automatic conversions
N/A
156ms max
Auto-Convert
1-shot command that occurs
during a conversion
N/A
When current conversion is
complete (1-shot is ignored)
Auto-Convert
Rate timer
0.0625Hz
20sec
Auto-Convert
Rate timer
0.125Hz
10sec
Auto-Convert
Rate timer
0.25Hz
5sec
Auto-Convert
Rate timer
0.5Hz
2.5sec
Auto-Convert
Rate timer
1Hz
1.25sec
Auto-Convert
Rate timer
2Hz
625ms
Auto-Convert
Rate timer
4Hz
312.5ms
Auto-Convert
Rate timer
8Hz
237.5ms
Software Standby RUN/STOP bit
N/A
156ms
Software Standby 1-shot command
N/A
156ms
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156ms maximum) after initiating a conversion, whether
conversion is initiated via the RUN/STOP bit, one-shot
command, or initial power-up. Changing the conversion rate can also affect the delay until new results are
available. See Table 8.
To check for internal bus collisions, read the status
byte. If the least significant seven bits are ones, discard the data and read the status byte again. The
status bits LHIGH, LLOW, RHIGH, and RLOW are
refreshed on the SMBus clock edge immediately following the stop condition, so there is no danger of
losing temperature-related status data as a result of
an internal bus collision. The OPEN status bit (diode
continuity fault) is only refreshed at the beginning of a
conversion, so OPEN data is lost. The ALERT interrupt latch is independent of the status byte register, so
no false alerts are generated by an internal bus collision.
Slave Addresses
The G771 appears to the SMBus as one device having a common address for all the ADC and fan control
channels. The device address is fixed to be 7Ah for
write and 7Bh for read.
The G771 also responds to the SMBus Alert Response slave address (see the Alert Response Address section).
When auto-converting, if the THIGH and TLOW limits
are close together, it's possible for both high-temp and
low-temp status bits to be set, depending on the
amount of time between status read operations (especially when converting at the fastest rate). In these
circumstances, it's best not to rely on the status bits to
indicate reversals in long-term temperature changes
and instead use a current temperature reading to establish the trend direction.
POR and UVLO
The G771 has a volatile memory. To prevent ambiguous power-supply conditions from corrupting the data
in memory and causing erratic behavior, a POR voltage detector monitors Vcc and clears the memory if
Vcc falls below 1.7V (typical, see Electrical Characteristics table). When power is first applied and Vcc
rises above 1.75V (typical), the logic blocks begin operating, although reads and writes at VCC levels below
3V are not recommended. A second Vcc comparator,
the ADC UVLO comparator, prevents the ADC from
converting until there is sufficient headroom (Vcc =
2.8V typical).
Temperature Conversion Rate Byte
The conversion rate register (Table 7) programs the
time interval between conversions in free running
auto-convert mode. This variable rate control reduces
the supply current in portable-equipment applications.
The conversion rate byte's POR state is 02h (0.25Hz).
The G771 looks only at the 3 LSB bits of this register,
so the upper 5 bits are "don't care" bits, which should
be set to zero. The conversion rate tolerance is ±25%
at any rate setting.
Valid A/D conversion results for all channels are available one total conversion time (125ms nominal, 156ms
Power-Up Defaults:
„Interrupt latch is cleared.
„ADC begins auto /converting at a 0.25Hz rate.
„Command byte is set to 00h to facilitate quick re-
mote Receive Byte queries.
„THIGH
and TLOW registers are set to max and
min limits, respectively
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same mechanism is duplicated for DX2. There fore,
either one of DX1, DX2 continuously over their respective Tcrit, the TH_SHUT will assert logic high to
indicate a thermal shutdown event.
Thermal Shutdown Signal
When the temperature of DX1 reaches or exceeds
the Tcrit1 threshold consecutively for the times
equal to the number of faults of the FQ_TH_SHUT
registers, TH_SHUT pin becomes logic high. The
A
B
tLOW tHIGH
C
D
G
E F
H
I
J
K
M
L
SMBCLK
SMBDATA
tSU:STA tHD:STA
tHD:DAT
tSU:DAT
tSU:STO
tBUF
Figure 6. SMBus Write Timing Diagram
A = start condition
B = MSB of address clocked into slave
C = LSB of address clocked into slave
D = R / W bit clocked into slave
E = slave pulls SMB Data line low
F = acknowledge bit clocked into master
G = MSB of data clocked into slave
A
B
tLOW tHIGH
H = LSB of data clocked into slave
I = slave pulls SMBDATA line low
J = acknowledge clocked into master
K = acknowledge clocked pulse
L = stop condition data executed by slave
M = new start condition
C
D
E F
G
H
J
I
K
SMBCLK
SMBDATA
t SU:STA t HD:STA
t SU:STO
tSU:DAT
t BUF
Figure 7. SMBus Read Timing Diagram
A = start condition
B = MSB of address clocked into slave
C = LSB of address clocked into slave
D = R / W bit clocked into slave
E = slave pulls SMBDATA line low
F =acknowledge bit clocked into master
G = MSB of data clocked into master
H = LSB of data clocked into master
I = acknowledge clocked pulse
J = stop condition
K= new start condition
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Package Information
C
E1
E
L
D
θ
7°
(4X)
A2
e
y
A
A1
b
Note:
1. Package body sizes exclude mold flash and gate burrs
2. Dimension L is measured in gage plane
3. Tolerance 0.10mm unless other wise specified
4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact.
SYMBOLS
A
A1
A2
b
C
D
E
E1
e
L
y
θ
MIN
DIMENSION IN MM
NOM
MAX
MIN
DIMENSION IN INCH
NOM
MAX
1.35
0.10
----0.20
0.19
4.80
5.80
3.80
----0.40
----0º
1.60
----1.45
0.25
----------------0.64
-------------
1.75
0.25
----0.30
0.25
5.00
6.20
4.00
----1.27
0.10
8º
0.053
0.004
----0.008
0.007
0.189
0.228
0.150
----0.016
----0º
0.064
----0.057
0.010
----------------0.25
-------------
0.069
0.010
----0.012
0.010
0.197
0.244
0.157
----0.050
0.004
8º
Taping Specification
Feed Direction
Typical SSOP Package Orientation
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