TI SN74ABT843NT

SN54ABT843, SN74ABT843
9-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS197D – FEBRUARY 1991 – REVISED MAY 1997
D
D
D
D
State-of-the-Art EPIC-ΙΙB  BiCMOS Design
Significantly Reduces Power Dissipation
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK), Ceramic Flat (W) Package,
and Plastic (NT) and Ceramic (JT) DIPs
SN54ABT843 . . . JT OR W PACKAGE
SN74ABT843 . . . DB, DW, OR NT PACKAGE
(TOP VIEW)
OE
1D
2D
3D
4D
5D
6D
7D
8D
9D
CLR
GND
description
The ’ABT843 9-bit latches are designed
specifically for driving highly capacitive or
relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
A buffered output-enable (OE) input can be used
to place the nine outputs in either a normal logic
state (high or low logic levels) or a
high-impedance state. The outputs are also in the
high-impedance state during power-up and
power-down conditions. The outputs remain in the
high-impedance state while the device is powered
down. In the high-impedance state, the outputs
neither load nor drive the bus lines significantly.
The high-impedance state and increased drive
provide the capability to drive bus lines without
need for interface or pullup components.
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
9Q
PRE
LE
2D
1D
SN54ABT843 . . . FK PACKAGE
(TOP VIEW)
4
3D
4D
5D
NC
6D
7D
8D
5
3 2 1 28 27 26
25
6
24
7
23
8
22
9
21
10
20
11
19
12 13 14 15 16 17 18
3Q
4Q
5Q
NC
6Q
7Q
8Q
9D
CLR
GND
NC
LE
PRE
9Q
The nine transparent D-type latches provide true
data at the outputs.
1
OE
NC
VCC
1Q
2Q
D
NC – No internal connection
OE does not affect the internal operations of the latch. Previously stored data can be retained or new data can
be entered while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT843 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74ABT843 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
Copyright  1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ABT843, SN74ABT843
9-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS197D – FEBRUARY 1991 – REVISED MAY 1997
FUNCTION TABLE
INPUTS
PRE
CLR
OE
LE
D
OUTPUT
Q
L
X
L
X
X
H
H
L
L
X
X
L
H
H
L
H
L
L
H
H
L
H
H
H
H
H
L
L
X
Q0
X
X
H
X
X
Z
logic symbol†
OE
1
14
PRE
11
CLR
LE
1D
2D
3D
4D
5D
6D
7D
8D
9D
13
2
EN
S2
R
C1
1D
2
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the DB, DW, JT, NT, and W packages.
2
23
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
9Q
SN54ABT843, SN74ABT843
9-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS197D – FEBRUARY 1991 – REVISED MAY 1997
logic diagram (positive logic)
OE
PRE
CLR
LE
1
14
11
13
S2
C1
1D
2
23
1Q
1D
R
To Eight Other Channels
Pin numbers shown are for the DB, DW, JT, NT, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range , VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT843 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT843 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W
NT package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only, and
functional operation of the device at these or any other conditions beyond those indicated in the “recommended operating conditions” section of
this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54ABT843, SN74ABT843
9-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS197D – FEBRUARY 1991 – REVISED MAY 1997
recommended operating conditions (see Note 3)
SN54ABT843
SN74ABT843
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
VCC
–24
Low-level output current
48
64
mA
∆t/∆v
Input transition rise or fall rate
5
5
ns/V
85
°C
High-level input voltage
2
2
V
0.8
Input voltage
0
TA
Operating free-air temperature
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
–55
125
0.8
0
V
VCC
–32
–40
V
V
mA
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = –18 mA
IOH = –3 mA
VCC = 5 V,
VCC = 4
4.5
5V
VOL
Vhys
II
IOZH‡
IOZL‡
Ioff
ICEX
IO§
VCC = 4
4.5
5V
TA = 25°C
TYP†
MAX
SN54ABT843
MIN
–1.2
MAX
SN74ABT843
MIN
–1.2
2.5
2.5
IOH = –3 mA
IOH = –24 mA
3
3
3
IOH = –32 mA
IOL = 48 mA
2*
0.55*
0.55
100
VI = VCC or GND
VO = 2.7 V
VCC = 5.5 V,
VCC = 0,
VO = 0.5 V
VI or VO ≤ 4.5 V
VCC = 5.5 V,
VCC = 5.5 V,
VO = 5.5 V
VO = 2.5 V
5 5 V,
V IO = Open,
O
VCC = 5.5
VI = VCC or GND
∆ICC¶
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
Ci
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
V
mV
±1
±1
±1
µA
10
10
10
µA
–10
–10
–10
µA
±100
Outputs high
50
–50
V
2
0.55
IOL = 64 mA
VCC = 5.5 V,
VCC = 5.5 V,
UNIT
V
2
50
–50
–180
–50
±100
µA
50
µA
–140
–180
Outputs high
1
250
250
250
µA
Outputs low
24
34
34
34
mA
Outputs disabled
0.5
250
250
250
µA
1.5
1.5
1.5
mA
POST OFFICE BOX 655303
–180
mA
4
pF
7
pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ The parameters IOZH and IOZL include the input leakage current.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
4
MAX
–1.2
2.5
ICC
Co
MIN
• DALLAS, TEXAS 75265
SN54ABT843, SN74ABT843
9-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS197D – FEBRUARY 1991 – REVISED MAY 1997
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figures 1 and 2)
VCC = 5 V,
TA = 25°C
MIN
tw
Pulse duration
th
Hold time,
time data after LE↓
MAX
MIN
5.5
5.5
5.5
PRE low
4.5
4.5
4.5
3.3
3.3
3.4
2.5
2.5
2.5
Data before LE↓
Setup time
MIN
SN74ABT843
CLR low
LE low
tsu
MAX
SN54ABT843
Low
3
3
3
PRE inactive
High
1.6
1.6
1.6
CLR inactive
2
2
2
1
1.5†
1
2.3†
1
1.5†
High
Low
UNIT
MAX
ns
ns
ns
† This data sheet limit may vary among suppliers.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figures 1 and 2)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
Q
tPLH
tPHL
LE
Q
tPLH
tPHL
PRE
Q
tPLH
tPHL
CLR
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
PARAMETER
VCC = 5 V,
TA = 25°C
SN54ABT843
MIN
1.2†
TYP
MAX
MIN
1.2†
MAX
3.8
5.2
1.5†
1.7†
3.4
6.3
7.3
5.6
1.5†
1.7†
4.4
SN74ABT843
MIN
1.2†
MAX
6.7†
8.3
1.5†
1.7†
7.2
7.2†
7.2
1.9†
6.9
7.4
8
5.7†
7.8
1.9†
4.1
6.3
1.3†
2.2
2.1†
2†
5
6.2
6.5
4.4
6.3
2.2
2.1†
2†
8.3
4.1
7.6
2.2
2.1†
2†
1.9†
4.5
1.9†
8.1
1.9†
1
3.4
6.8
4.5†
1
6.4
1
2
2.4†
4.3
5.7†
6.6
4.9
6.2
2
2.4†
7.3
2
2.4†
6.3
1.5†
7
1.5†
1.5†
4.2
7.5
7.2
7.1
6.5
6.8
5.9†
UNIT
ns
ns
ns
ns
ns
ns
† This data sheet limit may vary among suppliers.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54ABT843, SN74ABT843
9-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS197D – FEBRUARY 1991 – REVISED MAY 1997
recovery-time waveform
3V
PRE, CLR
1.5 V
1.5 V
0V
tw(L)
tREC
3V
LE
1.5 V
0V
tPLH
3V
Q
1.5 V
0V
3V
Q
1.5 V
0V
tPHL
Figure 1. CLR and PRE Pulse Duration, CLR and PRE to Output Delay,
and CLR and PRE to Latch-Enable Recovery Time
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ABT843, SN74ABT843
9-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS197D – FEBRUARY 1991 – REVISED MAY 1997
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
1.5 V
Input
1.5 V
Data Input
0V
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
3V
3V
1.5 V
Input
Output
Control
1.5 V
0V
1.5 V
1.5 V
VOL
tPLH
tPHL
VOH
Output
1.5 V
1.5 V
VOL
1.5 V
0V
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
VOH
Output
1.5 V
tPZL
tPHL
tPLH
1.5 V
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
1.5 V
VOH – 0.3 V
VOH
≈0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 2. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9571201Q3A
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
5962-9571201QKA
ACTIVE
CFP
W
24
1
TBD
Call TI
Level-NC-NC-NC
1
TBD
Call TI
Level-NC-NC-NC
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
5962-9571201QLA
ACTIVE
CDIP
JT
24
SN74ABT843DBLE
OBSOLETE
SSOP
DB
24
SN74ABT843DBR
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPD
Level-1-260C-UNLIM
SN74ABT843DBRE4
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPD
Level-1-260C-UNLIM
SN74ABT843DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT843DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT843DWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT843DWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT843NSR
ACTIVE
SO
NS
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT843NSRE4
ACTIVE
SO
NS
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT843NT
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74ABT843NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SNJ54ABT843FK
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
SNJ54ABT843JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54ABT843W
ACTIVE
CFP
W
24
1
TBD
Call TI
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2005
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
13
24
B
1
24
28
A MAX
1.280
(32,51)
1.460
(37,08)
A MIN
1.240
(31,50)
1.440
(36,58)
B MAX
0.300
(7,62)
0.291
(7,39)
B MIN
0.245
(6,22)
0.285
(7,24)
DIM
12
0.070 (1,78)
0.030 (0,76)
0.100 (2,54) MAX
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
PINS **
A
24
28
A MAX
1.260
(32,04)
1.425
(36,20)
A MIN
1.230
(31,24)
1.385
(35,18)
B MAX
0.310
(7,87)
0.315
(8,00)
B MIN
0.290
(7,37)
0.295
(7,49)
DIM
24
13
0.280 (7,11)
0.250 (6,35)
1
12
0.070 (1,78) MAX
B
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0°– 15°
0.010 (0,25) M
0.010 (0,25) NOM
4040050 / B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated