HITACHI 2SC2853

2SC2853, 2SC2854
Silicon NPN Epitaxial
Application
• Low frequency amplifier
• Complementary pair with 2SA1188 and 2SA1189
Outline
TO-92 (1)
1. Emitter
2. Collector
3. Base
3
2
1
2SC2853, 2SC2854
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
2SC2853
2SC2854
Unit
Collector to base voltage
VCBO
90
120
V
Collector to emitter voltage
VCEO
90
120
V
Emitter to base voltage
VEBO
5
5
V
Collector current
IC
100
100
mA
Emitter current
IE
–100
–100
mA
Collector power dissipation
PC
400
400
mW
Junction temperature
Tj
150
150
°C
Storage temperature
Tstg
–55 to +150
–55 to +150
°C
Electrical Characteristics (Ta = 25°C)
2SC2853
2SC2854
Item
Symbol Min
Typ
Max Min
Typ
Max Unit Test conditions
Collector to base
breakdown voltage
V(BR)CBO
90
—
—
120
—
—
V
I C = 10 µA, IE = 0
Collector to emitter
breakdown voltage
V(BR)CEO
90
—
—
120
—
—
V
I C = 1 mA, RBE = ∞
Emitter to base breakdown
voltage
V(BR)EBO
5
—
—
5
—
—
V
I E = 10 µA, IC = 0
Collector cutoff current
I CBO
—
—
0.1
—
—
0.1
µA
VCB = 70 V, IE = 0
Emitter cutoff current
I EBO
—
—
0.1
—
—
0.1
µA
VEB = 2 V, IC = 0
250
—
800
250
—
800
1
VCE = 12 V, IC = 2 mA*2
DC current transfer ratio
hFE*
Collector to emitter
saturation voltage
VCE(sat)
—
0.05 0.10 —
0.05 0.10 V
Base to emitter saturation
voltage
VBE(sat)
—
0.7
1.0
—
0.7
1.0
V
Gain bandwidth product
fT
—
310
—
—
310
—
MHz VCE = 6 V, IC = 10 mA
—
3
—
—
3
—
pF
Collector output capacitance Cob
Notes: 1. The 2SC2853 and 2SC2854 are grouped by h FE as follows.
2. Pulse test
D
E
250 to 500
400 to 800
See characteristic curves of 2SC2855 and 2SC2856.
2
I C = 10 mA, IB = 1 mA*2
VCB = 10 V, IE = 0,
f = 1 MHz
2SC2853, 2SC2854
Collector Power Dissipation PC (mW)
Maximum Collector Dissipation Curve
600
400
200
0
50
100
150
Ambient Temperature Ta (°C)
3
Unit: mm
4.8 ± 0.3
0.7
0.60 Max
0.5 ± 0.1
12.7 Min
2.3 Max
5.0 ± 0.2
3.8 ± 0.3
0.5
1.27
2.54
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-92 (1)
Conforms
Conforms
0.25 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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