HITACHI 2SC4046

2SC4046
Silicon NPN Epitaxial
Application
High voltage amplifier
Outline
TO-126 MOD
1
1. Emitter
2. Collector
3. Base
2
3
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
120
V
Collector to emitter voltage
VCEO
120
V
Emitter to base voltage
VEBO
5
V
Collector current
IC
0.2
A
8
W
1
Collector power dissipation
PC *
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Note:
1. Value at TC = 25°C
2SC4046
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V(BR)CBO
120
—
—
V
I C = 10 µA, IE = 0
Collector to emitter breakdown V(BR)CEO
voltage
120
—
—
V
I C = 1 mA, RBE = ∞
Emitter to base breakdown
voltage
V(BR)EBO
5
—
—
V
I E = 10 µA, IC = 0
Collector cutoff current
I CBO
—
—
10
µA
VCB = 80 V, IE = 0
250
—
800
1
DC current transfer ratio
hFE*
Base to emitter voltage
VBE
—
—
1.0
V
Collector to emitter saturation
voltage
VCE(sat)
—
—
1.0
V
I C = 200 mA, IB = 20 mA
Gain bandwidth product
fT
—
350
—
MHz
VCE = 10 V, IC = 50 mA
Collector output capacitance
Cob
—
3.5
—
pF
VCB = 30 V, f = 1 MHz, IE = 0
Note:
VCE = 5 V, IC = 10 mA
1. The 2SC4046 is grouped by h FE as follows.
Grade
D
E
hFE
250 to 500
400 to 800
Area of Safe Operation
Maximum Collector Dissipation Curve
1.0
Collector Current IC (A)
6
4
(25 V, 0.4 A)
ms
8
=1
Single Pulse
Ta = 25°C
10
PW
Collector power dissipation Pc (W)
12
(80 V, 0.125 A)
DC Operation
TC = 25°C
0.1
(80 V, 0.1 A)
(120 V, 0.055 A)
(120 V, 0.05 A)
2
0.01
0
2
50
100
Case Temperature TC (°C)
150
1
10
100
1,000
Collector to emitter Voltage VCE (V)
2SC4046
DC Current Transfer Ratio vs.
Collector Current
Typical Output Characteristics
1,000
100
DC current transfer ratio hFE
Collector Current IC (mA)
120
80
100
60
80
60
40
40
20 µA
20
Ta = 75°C
VCE = 10 V
Pulse Test
4
8
12
18
20
Collector to emitter Voltage VCE (V)
1
10
100
Collector current IC (mA)
Ta = –25°C
75
25
Collector to emitter saturation voltage
VCE (sat) (V)
Base to emitter voltage
VBE (V)
VCE = 10 V
Pulse Test
1.0
1,000
Collector to Emitter Saturation
Voltage vs. Collector Current
Base to Emitter Voltage
vs. Collector Current
10
25
10
IB = 0
0
–25
100
10
IC/IB = 10
Pulse Test
1.0
Ta = 75°C
25
0.1
–25
0.01
0.1
1
10
100
Collector current IC (mA)
1,000
1
10
100
Collector current IC (mA)
1,000
3
2SC4046
Collector Output Capacitance vs.
Collector to Base Voltage
Gain bandwidth product fT (MHz)
1,000
VCE = 20 V
5
100
10
Pulse Test
10
1
1
4
2
5
10 20
50
Collector current IC (mA)
100
Collector output capacitance Cob (pF)
Gain Bandwidth Product vs.
Collector Current
100
f = 1 MHz
IE = 0
50
20
10
5
2
1
1
2
5
10 20
50 100
Collector to base voltage VCB (V)
Unit: mm
2.7 ± 0.4
120°
3.7 ± 0.7
11.0 ± 0.5
12
0°
2.3 ± 0.3
φ 3.1 +0.15
–0.1
12
0°
8.0 ± 0.5
15.6 ± 0.5
1.1
0.8
2.29 ± 0.5
2.29 ± 0.5
0.55
1.2
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-126 Mod
—
—
0.67 g
Cautions
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intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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products.
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