HITACHI 2SJ248

2SJ248
Silicon P-Channel MOS FET
Application
High speed power switching
Features
•
•
•
•
•
Low on-resistance
High speed switching
Low drive current
4 V gate drive device can be driven from 5 V source
Suitable for switching regulator, DC-DC converter
Outline
TO-220FM
D
1
2 3
1. Gate
2. Drain
3. Source
G
S
2SJ248
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDSS
–100
V
Gate to source voltage
VGSS
±20
V
Drain current
ID
–8
A
–32
A
–8
A
Drain peak current
I D(pulse)*
Body to drain diode reverse drain current
I DR
2
1
Channel dissipation
Pch*
25
W
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at TC = 25°C
2
2SJ248
Electrical Characteristics (Ta = 25°C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DSS
–100
—
—
V
I D = –10 mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GSS
±20
—
—
V
I G = ±100 µA, VDS = 0
Gate to source leak current
I GSS
—
—
±10
µA
VGS = ±16 V, VDS = 0
Zero gate voltage drain current I DSS
—
—
–250
µA
VDS = –80 V, VGS = 0
Gate to source cutoff voltage
VGS(off)
–1.0
—
–2.0
V
I D = –1 mA, VDS = –10 V
Static drain to source on state
RDS(on)
—
0.25
0.3
Ω
I D = –4 A, VGS = –10 V*1
—
0.3
0.45
Ω
I D = –4 A, VGS = –4 V*1
resistance
Forward transfer admittance
|yfs|
3.0
5.5
—
S
I D = –4 A, VDS = –10 V*1
Input capacitance
Ciss
—
880
—
pF
VDS = –10 V, VGS = 0,
Output capacitance
Coss
—
325
—
pF
f = 1 MHz
Reverse transfer capacitance
Crss
—
80
—
pF
Turn-on delay time
t d(on)
—
12
—
ns
I D = –4 A, VGS = –10 V,
Rise time
tr
—
47
—
ns
RL = 2 Ω
Turn-off delay time
t d(off)
—
150
—
ns
Fall time
tf
—
75
—
ns
Body to drain diode forward
voltage
VDF
—
–1.0
—
V
I F = –8 A, VGS = 0
Body to drain diode reverse
recovery time
t rr
—
170
—
ns
I F = –8 A, VGS = 0,
diF/dt = 50 A/µs
Note:
1. Pulse test
See characteristic curves of 2SJ247
3
2SJ248
Power vs. Temperature Derating
Maximum Safe Operation Area
–50
–30
10 µ s
10
Drain Current I D (A)
50
100
150
s
0
–0.05
–1
pe
ra
tio
n
(T
Operation
c
=
in this area
25
is limited by
°C
)
R DS (on)
)
ot
sh
(1
–0.1
s
–0.3
O
s
m
–1
10
C
m
D
–3
1
10
0µ
–10
=
20
PW
Channel Dissipation Pch (W)
30
Ta = 25°C
–3
–10 –30 –100 –300 –1000
Drain to Source Voltage VDS (V)
Case Temperature Tc (°C)
Normalized Transient Thermal Impedance γ s (t)
Noremalized Transient Thermal Impedance vs. Pulse Width
3
D=1
Tc = 25°C
1.0
0.5
0.3
0.2
0.1
0.1
θ ch – c(t) = γ s(t) . θ ch – c
θ ch – c = 5.0°C / W. Tc = 25°C
PW
D= T
P DM
0.05
0.02
0.03
T
0.01
0.01
10 µ
1 shot Pulse
100 µ
1m
10 m
Pulse Width PW (S)
4
PW
100 m
1
10
10.0 ± 0.3
2.8 ± 0.2
7.0 ± 0.3
φ 3.2 ± 0.2
Unit: mm
0.7 ± 0.1
2.54 ± 0.5
2.54 ± 0.5
4.45 ± 0.3
2.5
14.0 ± 1.0
5.0 ± 0.3
1.2 ± 0.2
1.4 ± 0.2
2.0 ± 0.3
12.0 ± 0.3
17.0 ± 0.3
0.6
2.5 ± 0.2
0.5 ± 0.1
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-220FM
—
Conforms
1.8 g
Cautions
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copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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products.
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