HITACHI 2SK2117

2SK2116, 2SK2117
Silicon N-Channel MOS FET
Application
High speed power switching
Features
•
•
•
•
•
Low on-resistance
High speed switching
Low drive current
No secondary breakdown
Suitable for Switching regulator
Outline
TO-220CFM
D
12
3
1. Gate
2. Drain
3. Source
G
S
2SK2116, 2SK2117
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
2SK2116
VDSS
450
V
2SK2117
VDSS
500
Gate to source voltage
VGSS
±30
V
Drain current
ID
7
A
28
A
7
A
Drain to source voltage
Drain peak current
I D(pulse)*
Body to drain diode reverse drain current
I DR
2
1
Channel dissipation
Pch*
35
W
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 %
2. Value at Tc = 25 °C
2
2SK2116, 2SK2117
Electrical Characteristics (Ta = 25°C)
Item
Drain to source
2SK2116
breakdown
voltage
2SK2117
Symbol
Min
Typ
Max
Unit
Test conditions
V(BR)DSS
450
—
—
V
I D = 10 mA, VGS = 0
500
Gate to source breakdown
voltage
V(BR)GSS
±30
—
—
V
I G = ±100 µA, VDS = 0
Gate to source leak current
I GSS
—
—
±10
µA
VGS = ±25 V, VDS = 0
Zero gate
2SK2116
I DSS
—
—
250
µA
VDS = 360 V, VGS = 0
voltage drain
current
2SK2117
VDS = 400 V, VGS = 0
Gate to source cutoff voltage
VGS(off)
2.0
—
3.0
V
I D = 1 mA, VDS = 10 V
Static drain to
2SK2116
RDS(on)
—
0.6
0.8
Ω
I D = 4 A, VGS = 10 V*1
source on state
resistance
2SK2117
—
0.7
0.9
Forward transfer admittance
|yfs|
4.0
6.5
—
S
ID = 4 A
VDS = 10 V*1
Input capacitance
Ciss
—
1050
—
pF
VDS = 10 V
Output capacitance
Coss
—
280
—
pF
VGS = 0
Reverse transfer capacitance
Crss
—
40
—
pF
f = 1 MHz
Turn-on delay time
t d(on)
—
15
—
ns
ID = 4 A
Rise time
tr
—
55
—
ns
VGS = 10 V
Turn-off delay time
t d(off)
—
95
—
ns
RL = 7.5 Ω
Fall time
tf
—
40
—
ns
Body to drain diode forward
voltage
VDF
—
0.95
—
V
I F = 7 A, VGS = 0
Body to drain diode reverse
recovery time
t rr
—
320
—
ns
I F = 7 A, VGS = 0,
diF / dt = 100 A / µs
Note
1. Pulse Test
See characteristic curve of 2SK1157, 2SK1158.
3
2SK2116, 2SK2117
Power vs. Temperature Derating
Maximum Safe Operation Area
50
40
20
50
100
Case Temperature
Normalized Transient Thermal Impedance γS (t)
10
10
150
Tc (°C)
PW
D
5
C
0
=
O
pe
1
10
tio
n
1
m
=
Sh
ot
)
25
°C
)
2SK2117
2SK2116
Ta = 25°C
0.05
1
(1
(T
Operation in this Area
is Limited by RDS (on)
0.2
µs
s
C
0.5
µs
m
s
ra
2
0.1
0
4
10
20
Drain Current ID (A)
Channel Dissipation
Pch (W)
60
3
30
10
100 300 1,000
Drain to Source Voltage VDS (V)
Normalized Transient Thermal Impedance vs. Pulse Width
3
1.0
TC = 25°C
D=1
0.5
0.3
0.2
θch–c (t) = γ S (t) · θch–c
θch–c = 3.57°C/W, TC = 25°C
0.1
0.1
0.03
0.05
PDM
0.02
0.01
lse
t Pu
ho
0.01
10 µ
1S
100 µ
T
1m
10 m
100 m
Pulse Width PW (s)
D = PW
T
PW
1
10
Unit: mm
2.54
2.54
15.0 ± 0.3
4.5 ± 0.3
2.7 ± 0.2
2.5 ± 0.2
13.60 ± 1.0
0.6 ± 0.1
4.1 ± 0.3
1.0 ± 0.2
1.15 ± 0.2
φ 3.2 ± 0.2
12.0 ± 0.3
10.0 ± 0.3
0.7 ± 0.1
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-220CFM
—
—
1.9 g
Cautions
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contact Hitachi’s sales office before using the product in an application that demands especially high
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
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