HITACHI 2SK3390

2SK3390
Silicon N Channel MOS FET
UHF Power Amplifier
ADE-208-846 (Z)
1st. Edition
Aug.2001
Features
• High power output, High gain, High efficiency
PG = 17 dB, Pout = 6.31 W, ηadd= 60 % min. (f = 836 MHz)
• Compact package capable of surface mounting
Outline
RP8P
D
1
3
1
G
2
S
Note:
Marking is “IX”.
This Device is sensitive to Electro Static Discharge.
An Adequate handling procedure is requested.
2
3
1. Gate
2. Source
3. Drain
2SK3390
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDSS
17
V
Gate to source voltage
VGSS
±10
V
Drain current
ID
1
A
2.5
A
Drain peak current
ID(pulse)
Note1
Note2
Channel dissipation
Pch
20
W
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–45 to +150
°C
Note:
1. PW < 1sec, Tch < 150 °C
2. Value at Tc = 25°C
Electrical Characteristics
(Tc = 25°C)
Item
Symbol Min
Typ
Max
Unit
Test Conditions
Zero gate voltage drain current
IDSS
—
—
10
µA
VDS = 13.7 V, VGS = 0
Gate to source leak current
IGSS
—
—
±5
µA
VGS = ±10V, VDS = 0
Gate to source cutoff voltage
VGS(off)
2.2
—
3.0
V
ID = 1mA, VDS = 13.7V
Input capacitance
Ciss
—
27.5
—
pF
VGS = 5V, VDS = 0, f = 1MHz
Output capacitance
Coss
—
10.5
—
pF
VDS = 13.7V, VGS = 0, f = 1MHz
Output Power
Pout
6.31
—
—
W
VDS = 13.7V, IDO = 0.25A
f = 836 MHz, Pin = 126 mW
Added Efficiency
ηadd
60
—
—
%
VDS = 13.7V, IDO = 0.25A
f = 836 MHz, Pin = 126 mW
Rev.0, Aug. 2001, page 2 of 7
2SK3390
Maximum Channel Power
Dissipation Curve
Typical Output Characteristics
5
I D (A)
40
30
Drain Current
Channel Power Dissipation
Pch (W)
Main Characteristics
20
10
4
50
100
150
Case Temperature
7V
3
6V
2
5V
1
0
200
Tc (°C)
VGS = 4 V
Tc = 75°C
25°C
- 25°C
2
1.5
1
0.5
V DS = 13.7 V
Pulse Test
0
2
3
4
5
Gate to Source Voltage
6
7
V GS (V)
Forward Transfer Admittance |y fs | (S)
2.5
2
4
6
Drain to Source Voltage
8
10
V DS (V)
Forward Transfer Admittance vs.
Drain Current
Typical Transfer Characteristics
I D (A)
8V
9V
Pulse Test
0
Drain Current
10 V
10
3
25°C
Tc = - 25°C
1
0.3
75°C
0.1
0.03
V DS = 13.7 V
Pulse Test
0.01
0.01 0.03
0.1
0.3
1
3
10
Drain Current I D (A)
Rev.0, Aug. 2001, page 3 of 7
2SK3390
Drain to Source Saturatioin Voltage vs.
Drain Current
3
Gate to Source Cutoff Voltage
V GS(off) (V)
Drain to Source Saturation Voltage
V DS(sat) (V)
10
25°C
1
75°C
0.3
0.1
Tc = - 25°C
0.03
0.01
VGS = 10 V
Pulse Test
0.003
0.001
1
3
0.01 0.03 0.1 0.3
Drain Current I D (A)
Gate to Source Cutoff Voltage vs.
Ambient Temperature
10
3.6
3.2
2.8
ID = 0.1
mA
2.0
V DS = 13.7 V
1.6
- 25
0
25
50
75
Ambient Temperature
100
125
Ta (°C)
Output Capacitance vs.
Drain to Source Voltage
100
Output Capacitance Coss (pF)
29
Input Capacitance Ciss (pF)
1 mA
2.4
Input Capacitance vs.
Gate to Source Voltage
28
27
26
25
24
-10
10 mA
V DS = 0
f = 1 MHz
-6
-2
2
6
Gate to Source Voltage VGS (V)
Rev.0, Aug. 2001, page 4 of 7
10
30
10
3
V GS = 0
f = 1 MHz
1
0.1
0.3
1
3
10
Drain to Source Voltage V DS (V)
30
Pout
3
1
0.3
8
80
ηadd
6
4
0.3
1
3
10
Drain to Gate Voltege V DG (V)
30
V DS = 13.7 V
I DO = 0.25 A
f = 836 MHz
2
0
0
60
40
V GS = 0
f = 1 MHz
0.1
0.1
100
50
100
150
200
20
250
ηadd (%)
10
10
Output Power, Added Efficiency vs.
Input Power
Added Efficiency
Reverse Transfer Capacitance vs.
Drain to Gate Votage
Output Power Pout (W)
Reverse Transfer Capacitance Crss (pF)
2SK3390
0
Input power Pin (mW)
Rev.0, Aug. 2001, page 5 of 7
2SK3390
Package Dimensions
As of January, 2001
Unit: mm
5.2 ± 0.15
2.54 ± 0.2
1.0
3.4 ± 0.15
1.1
1.325 ± 0.15
0.2
0.16 +0.1
−0.06
0.6
0.5 +0.1
−0.05
2.0 Max
5.6
+0.7
−0.5
4.5 Max
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
Rev.0, Aug. 2001, page 6 of 7
RP8P


0.08 g
2SK3390
Disclaimer
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
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failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
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Copyright © Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.0, Aug. 2001, page 7 of 7