HITACHI 3SK300

3SK300
Silicon N Channel Dual Gate MOS FET
UHF / VHF RF Amplifier
ADE-208-449
1st. Edition
Features
• Low noise figure
NF = 1.0 dB typ. at f = 200 MHz
• High gain
PG = 27.6 dB typ. at f = 200 MHz
Outline
MPAK-4
2
3
1
4
1. Source
2. Gate1
3. Gate2
4. Drain
3SK300
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDS
14
V
Gate 1 to source voltage
VG1S
±8
V
Gate 2 to source voltage
VG2S
±8
V
Drain current
ID
25
mA
Channel power dissipation
Pch
150
mW
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
2
3SK300
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DSX
14
—
—
V
I D = 200 µA, VG1S = –3 V,
VG2S = –3 V
Gate 1 to source breakdown
voltage
V(BR)G1SS
±8
—
—
V
I G1 = ±10 µA,
VDS = VG2S = 0
Gate 2 to source breakdown
voltage
V(BR)G2SS
±8
—
—
V
I G2 = ±10 µA,
VDS = VG1S = 0
Gate 1 cutoff current
I G1SS
—
—
±100
nA
VG1S = ±6 V,
VDS = VG2S = 0
Gate 2 cutoff current
I G2SS
—
—
±100
nA
VG2S = ±6 V,
VDS = VG1S = 0
Drain current
I DS(op)
4
8
14
mA
VDS = 6 V, VG1S = 0.75 V,
VG2S = 3 V
Gate 1 to source cutoff voltage VG1S(off)
0
+0.2
+1.0
V
VDS = 10 V, VG2S = 3 V,
I D = 100 µA
Gate 2 to source cutoff voltage VG2S(off)
0
+0.3
+1.0
V
VDS = 10 V, VG1S = 3 V,
I D = 100 µA
Forward transfer admittance
|yfs|
20
25
—
ms
VDS = 6 V, VG2S = 3 V,
I D = 10 mA, f = 1 kHz
Input capacitance
Ciss
2.4
3.1
3.5
pF
VDS = 6 V,
Output capacitance
Coss
0.8
1.1
1.4
pF
VG2S = 3 V, ID = 10 mA
Reverse transfer capacitance
Crss
—
0.021
0.04
pF
f = 1 MHz
Power gain
PG
24
27.6
—
dB
VDS = 6 V, VG2S = 3 V,
Noise figure
NF
—
1.0
1.5
dB
I D = 10 mA, f = 200 MHz
Power gain
PG
12
15.6
—
dB
VDS = 6 V, VG2S = 3 V,
Noise figure
NF
—
3.0
4.0
dB
I D = 10 mA, f = 900 MHz
Noise figure
NF
—
2.7
3.5
dB
VDS = 6 V, VG2S = 3 V,
I D = 10 mA, f = 60 MHz
Note: Marking is “ZR–”
3
3SK300
Main Characteristics
20
200
Typical Output Characteristics
1.2 V
VG2S = 3 V
Pulse test
16
Drain current ID (mA)
Channel power dissipation Pch (mW)
Maximum Channel Power
Dissipation Curve
150
100
50
1.0 V
12
0.8 V
8
4
VG1S = 0.4 V
0
50
100
150
200
0
Drain Current vs. Gate1 to Source Voltage
20
3.0 V
VDS = 6 V
2.5 V
Pulse test
2.0 V
16
1.5 V
12
8
1.0 V
4
Drain current ID (mA)
Ambient Temperature Ta (°C)
Drain current ID (mA)
0.6 V
2
4
6
8
Drain to source voltage VDS (V)
10
Drain Current vs. Gate2 to Source Voltage
20
3.0 V
2.0 V VDS = 6 V
Pulse test
2.5 V
16
1.5 V
12
1.0 V
8
4
VG1S = 0.5 V
0
1
2
3
4
5
Gate2 to source voltage VG2S (V)
VG2S = 0.5 V
0
4
1
2
3
4
5
Gate1 to source voltage VG1S (V)
3SK300
VDS = 6 V
f = 1kHz
3V
2.5 V
18
2V
12
1.5 V
6
VDS = 6 V
VG2S = 3V
f = 200MHz
40
24
30
20
10
1V
VG2S = 0.5 V
0
0.4
0.8
1.2
1.6
2
Gate1 to source voltage VG1S (V)
0
Noise Figure vs. Drain Current
VDS = 6 V
VG2S = 3V
f = 200MHz
3
2
1
0
4
8
12
16
Drain current ID (mA)
8
12
16
Drain current ID (mA)
20
20
VG2S = 3V
ID = 10mA
f = 200MHz
40
Power gain PG (dB)
4
4
Power Gain vs. Drain to Source Voltage
50
5
Noise figure NF (dB)
Power Gain vs. Drain Current
50
30
Power gain PG (dB)
Forward transfer admittance |yfs| (ms)
Forward Transfer Admittance vs.
Gate1 to Source Voltage
30
20
10
0
2
4
6
8
10
Drain to source voltage VDS (V)
5
3SK300
20
VG2S = 3V
ID = 10mA
f = 200MHz
4
Noise figure NF (dB)
Power Gain vs. Drain Current
Noise Figure vs. Drain to Source Voltage
16
Power gain PG (dB)
5
3
2
1
0
12
8
4
2
4
6
8
0
10
Drain to source voltage VDS (V)
5
8
12
16
20
Power Gain vs. Drain to Source Voltage
Noise Figure vs. Drain Current
20
16
Power gain PG (dB)
Noise figure NF (dB)
6
4
Drain current ID (mA)
4
3
2
VDS = 6V
VG2S = 3V
f = 900MHz
1
0
VDS = 6V
VG2S = 3V
f = 900MHz
4
8
12
16
Drain current ID (mA)
12
8
VG2S = 3V
ID = 10mA
f = 900MHz
4
20
0
2
4
6
8
Drain to source voltage VDS (V)
10
3SK300
5
VG2S = 3V
I D = 10mA
f = 900MHz
8
4
2
0
VDS = 6V
VG2S = 3V
f = 60MHz
4
6
3
2
1
2
4
6
8
Drain to source voltage VDS (V)
5
4
Noise figure NF (dB)
Noise figure NF (dB)
Noise Figure vs. Drain Current
Noise Figure vs. Drain to Source Voltage
Noise figure NF (dB)
10
10
0
4
8
12
16
20
Drain current ID (mA)
Noise Figure vs. Drain to Source Voltage
VG2S = 3V
ID = 10mA
f = 60MHz
3
2
1
0
2
4
6
8
10
Drain to source voltage VDS (V)
7
3SK300
Package Dimentions
Unit: mm
+ 0.3
2.8 – 0.1
+ 0.1
0.4 – 0.05
0.4 – 0.05
3
0.65 – 0.3
+ 0.1
+ 0.1
1.9
0.95 0.95
+ 0.1
0.16 – 0.06
+ 0.2
2.8 – 0.6
1.5
2
0 ~ 0.1
0.95
0.85
0.65– 0.3
+ 0.1
0.6 – 0.05
+ 0.1
1
4
+ 0.1
0.4 – 0.05
+ 0.2
1.1– 0.1
0.3
1.8
8
Hitachi Code
EIAJ
JEDEC
MPAK–4
SC–61AA
—
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
: http:semiconductor.hitachi.com/
Europe
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan)
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.