HITACHI 4AC12

4AC12
Silicon NPN Epitaxial
Application
Low frequency power amplifier
Outline
SP-10
3
2
5
4
ID
1
1
10
6
7
9
8
ID
1, 10
Emitter
2, 4, 6, 8 Base
3, 5, 7, 9 Collector
ID
ID
10
4AC12
Absolute Maximum Ratings (for each device, Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
27
V
Collector to emitter voltage
VCEO
27
V
Emitter to base voltage
VEBO
7
V
Collector current
IC
2
A
Collector peak current
I C(peak)
4
A
Diode current
ID
2
A
1
4
W
1
PC * (TC = 25°C)
28
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Collector power dissipation
Note:
PC *
1. 4 devices operation.
Electrical Characteristics (for each device, Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to emitter breakdown V(BR)CBO
voltage
27
—
—
V
I C = 1 mA, IE = 0
Collector to emitter sustain
voltage
VCEO(SUS)
28
—
36
V
I C = 1 A, L = 20 mH, RBE = ∞
Emitter to base breakdown
voltage
V(BR)EBO
7
—
—
V
I E = 5 mA, IC = 0
Collector cutoff current
I CBO
—
—
10
µA
VCB = 20 V, IE = 0
I CEO
—
—
10
VCE = 20 V, RBE = ∞
hFE
7000
—
30000
VCE = 2 V, IC = 0.5 A
hFE
2000
—
—
VCE = 2 V, IC = 2 A*1
Collector to emitter saturation
voltage
VCE(sat)
—
—
1.5
V
I C = 2 A, IB = 2 mA*1
Base to emitter saturation
voltage
VBE(sat)
—
—
2.0
V
I C = 2 A, IB = 2 mA*1
C to E diode forward current
VD
—
—
3.5
V
ID = 2 A
DC current transfer ratio
Note:
2
1. Pulse test.
4AC12
Maximum Collector Dissipation Curve
4 device operation
Maximum Collector Dissipation Curve
30
3 device operation
4
2 device operation
1 device operation
2
50
100
Ambient temperature Ta (°C)
150
4 device operation
3 device operation
20
2 device operation
10
1 device operation
0
Note: Collector power dissipation of each devices
is identical.
50
100
Case temperature TC (°C)
Area of Safe Operation
2.0
s
=
10
DC
(T Op
e
C =
25 ratio
°C n
)
ms
1.0
0.3
0.1
0.03
Collector current IC (A)
1m
IC(max)
PW
Collector current IC (A)
iC(peak)
3.0
1.6
1.0
2
5
10 20
50
Collector to emitter voltage VCE (V)
80
70
60
50
40
1.2
0.8
30 µA
0.4
Ta = 25°C
1 shot pulse
0.01
0.5
150
Typical Output Characteristics
10
90
0
Collector power dissipation PC (W)
Collector power dissipation PC (W)
6
IB = 0 TC = 25°C
0
1
2
3
4
5
Collector to emitter voltage VCE (V)
3
4AC12
Collector to emitter saturation voltage VCE(sat) (V)
DC Current Transfer Ratio
vs. Collector Current
DC current transfer ratio hFE
100,000
30,000
5°C
7
a=
10,000
T
3,000
1,000
25°C
–25°C
300
VCE = 2 V
100
0.03
0.3
0.1
1.0
Collector current IC (A)
3.0
4
3.0
10
3
Ta = –25°C
25°C
75°C
1.0
0.3
IC = 1000 IB
0.1
0.03
0.1
0.3
1.0
Collector current IC (A)
Typical Transfer Characteristics
10
2.0
Ta = –25°C
25°C
Collector current IC (A)
Base to emitter saturation voltage VBE(sat) (V)
Base to Emitter Saturatiion Voltage
vs. Collector Current
Collector to Emitter Saturatiion Voltage
vs. Collector Current
75°C
1.0
0.3
1.6
VCE = 2 V
Ta = 75°C
1.2
0.8
25°C
–25°C
0.4
IC = 1000 IB
0.1
0.03
0.3
0.1
1.0
Collector current IC (A)
3.0
0
1.2
1.6
2.0
0.4
0.8
Base to emitter voltage VBE (V)
3.0
4AC12
Transient Thermal Resistance
Zener Voltage vs. Case Temperature
Thermal resistance θj-c (°C/W)
50
40
30
20
10
25
50
75
100
Case temperature TC (°C)
0s
s
0m
to 1
1
1.0
10
0.1
s to
µ
10
ms
TC = 25°C
IC = 1 mA
0.02
0.01
0.1
0.01
0.1
125
1.0
10 (s)
1.0
10 (ms)
Time t
26.5 ± 0.3
10.0 ± 0.3
4.0 ± 0.2
1
1.82
2.54
1
2
3
4
1.4
5
6
10
0.55
1.2
7
8
9
1.5 ± 0.2
10.5 ± 0.5
0
10
2.5
Zener voltage VZ (V)
60
0.55 ± 0.1
10
Pin No.
1
2
3
4
5
6
7
8
9
10
Electrode
E
B
C
B
C
B
C
B
C
E
Note: B: Base
C: Collector
E: Emitter
5
Unit: mm
26.5 ± 0.3
1.82
2.54
1
2
3
4
0.55 ± 0.1
1.4
5
6
7
10.5 ± 0.5
2.5
10.0 ± 0.3
4.0 ± 0.2
8
9
1.5 ± 0.2
+0.1
0.55 –0.06
10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
SP-10
—
—
2.9 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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