HITACHI HD74AC74

HD74AC74
Dual D-Type Positive Edge-Triggered Flip-Flop
Description
The HD74AC74 is a dual D-type flip-flop with Asynchronous Clear and Set inputs and complementary (Q,
Q) outputs. Information at the input is transferred to the outputs on the positive edge of the clock pulse.
Clock triggering occurs at a voltage level of the clock pulse and is not directly related to the transition time
of the positive-going pulse. After the Clock Pulse input threshold voltage has been passed, the Data input
is locked out and information present will not be transferred to the outputs until the next rising edge of the
Clock Pulse input.
Features
Asynchronous Inputs:
Low input to SD (Set) sets Q to High level
Low input to CD (Clear) sets Q to Low level
Clear and Set are independent of clock
Simultaneous Low on CD and SD makes both Q and Q High
• Outputs Source/Sink 24 mA
HD74AC74
Pin Arrangement
CD1 1
14 VCC
CP1 D1
D1 2
SD1
CP1 3
13 CD2
CD1
12 D2
Q1 Q1
SD1 4
11 CP2
Q1 5
D2
CP2
Q1 6
CD2
SD2
10 SD2
9 Q2
Q2 Q2
8 Q2
GND 7
(Top view)
Logic Symbol
SD1
D1
SD2
Q1
CP1
CD1
Pin Names
D1, D2
CP1, CP2
C D1, CD2
S D1, SD2
Q1, Q1, Q2, Q 2
2
Data Inputs
Clock Pulse Inputs
Direct Clear Inputs
Direct Set Inputs
Outputs
D2
Q2
CP2
Q1
CD2
Q2
HD74AC74
Truth Table (Each Half)
Inputs
Outputs
SD
CD
CP
D
Q
Q
L
H
X
X
H
L
H
L
X
X
L
H
L
L
X
X
H
H
H
H
H
H
L
H
H
L
L
H
X
Q0
Q0
H
H
H
L
X
:
:
:
:
Q0 (Q0) :
L
High Voltage Level
Low Voltage Level
Immaterial
Low-to-High Clock Transition
Previous Q (Q) before Low-to-High Transition of Clock
Logic Diagram
SD
D
Q
CP
Q
CD
Please note that this diagram is provised only for the understanding of logic operations and should not be
used to estimate propagation delays.
DC Characteristics (unless otherwise specified)
Item
Symbol
Max
Unit
Condition
Maximum quiescent supply current
I CC
40
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = Worst case
Maximum quiescent supply current
I CC
4.0
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = 25°C
3
HD74AC74
AC Characteristics
Ta = +25°C
CL = 50 pF
Ta = –40°C to +85°C
CL = 50 pF
Item
Symbol
VCC (V)*1
Min
Typ
Max
Min
Max
Unit
Maximum clock
f max
3.3
100
125
—
95
—
MHz
5.0
140
160
—
125
—
3.3
1.0
8.0
12.0
1.0
13.0
5.0
1.0
6.0
9.0
1.0
10.0
3.3
1.0
10.5
12.0
1.0
13.5
5.0
1.0
8.0
9.5
1.0
10.5
3.3
1.0
8.0
13.5
1.0
16.0
5.0
1.0
6.0
10.0
1.0
10.5
3.3
1.0
8.0
14.0
1.0
14.5
5.0
1.0
6.0
10.0
1.0
10.5
frequency
Propagation delay
t PLH
CDn or SDn to Qn or Qn
Propagation delay
t PHL
CDn or SDn to Qn or Qn
Propagation delay
t PLH
CP n to Q n or Qn
Propagation delay
t PHL
CP n to Q n or Qn
Note:
ns
ns
ns
ns
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
AC Operating Requirements: HD74AC74
Ta = –40°C
to +85°C
CL = 50 pF
Ta = +25°C
CL = 50 pF
Item
Symbol
VCC (V)*1 Typ
Guaranteed Minimum
Unit
Set-up time, HIGH or LOW
t su
3.3
1.5
4.0
4.5
ns
5.0
1.0
3.0
3.0
3.3
–2.0
0
0
5.0
–1.5
0
0
3.3
3.0
5.5
7.0
5.0
2.5
4.5
5.0
3.3
–2.5
0
0
5.0
–2.0
0
0
Dn to CPn
Hold time, HIGH or LOW
th
Dn to CPn
CP n or CDn or SDn
tw
Pulse width
Recovery time
CDn or SDn to CP
Note:
4
t rec
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
ns
ns
ns
HD74AC74
Capacitance
Item
Symbol
Typ
Unit
Condition
Input capacitance
CIN
4.5
pF
VCC = 5.5 V
Power dissipation capacitance
CPD
35.0
pF
VCC = 5.0 V
5
Unit: mm
19.20
20.32 Max
8
6.30
7.40 Max
14
1.30
7
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
2.39 Max
2.54 Min 5.06 Max
1
7.62
+ 0.10
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-14
Conforms
Conforms
0.97 g
Unit: mm
10.06
10.5 Max
8
5.5
14
1
0.10 ± 0.10
1.42 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
7
+ 0.20
7.80 – 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-14DA
—
Conforms
0.23 g
Unit: mm
8.65
9.05 Max
8
1
7
*0.20 ± 0.05
0.635 Max
1.75 Max
3.95
14
+ 0.10
6.10 – 0.30
1.08
*0.40 ± 0.06
0.11
0.14 +– 0.04
0° – 8°
1.27
0.67
0.60 +– 0.20
0.15
0.25 M
*Pd plating
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-14DN
Conforms
Conforms
0.13 g
Unit: mm
4.40
5.00
5.30 Max
14
8
1
7
0.65
0.20 ± 0.06
1.0
0.13 M
6.40 ± 0.20
0.10
*Dimension including the plating thickness
Base material dimension
*0.17 ± 0.05
0.15 ± 0.04
1.10 Max
0.83 Max
0.07 +0.03
–0.04
*0.22+0.08
–0.07
0° – 8°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-14D
—
—
0.05 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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