HOLTEK HT49C30-1

HT49R30A-1/HT49C30-1/HT49C30L
8-Bit LCD Type MCU
Features
· Operating voltage:
· On-chip crystal, RC and 32768Hz crystal oscillator
2.2V~5.5V for HT49R30A-1/HT49C30-1
1.2V~2.2V for HT49C30L
· HALT function and wake-up feature reduce power
consumption
· 6 input lines
· 4-level subroutine nesting
· 8 bidirectional I/O lines
· Bit manipulation instruction
· Two external interrupt input
· 14-bit table read instruction
· One 8-bit programmable timer/event counter with
· Up to 0.5ms instruction cycle with 8MHz system clock
PFD (programmable frequency divider) function
for HT49R30A-1/HT49C30-1
· LCD driver with 19´2, 19´3 or 18´4 segments
· Up to 8ms instruction cycle with 500kHz system clock
· 2K´14 program memory ROM
for HT49C30L
· 96´8 data memory RAM
· 63 powerful instructions
· Real Time Clock (RTC)
· All instructions in 1 or 2 machine cycles
· 8-bit prescaler for RTC
· Low voltage reset/detector for
HT49R30A-1/HT49C30-1
· Watchdog Timer
· 48-pin SSOP package
· Buzzer output
General Description
devices are also suitable for use in multiple LCD low
power applications such as scales, leisure products,
high-level household appliances, hand held LCD products and batteries operated systems in particular.
The HT49C30-1 and the HT49C30L are 8-bit high perf o rm a n c e s i n g l e c hi p m i c r o c ont r o l l e r s. T h e
HT49R30A-1 is the OTP version of the HT49C30-1. Its
single cycle instruction and two-stage pipeline architecture make it suitable for high speed applications. The
Rev. 1.10
1
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Block Diagram
In te rru p t
C ir c u it
P ro g ra m
M e m o ry
P ro g ra m
C o u n te r
IN T C
In s tr u c tio n
R e g is te r
M
M P
M
T M R C
T M R
S T A C K
X
fS
U
R T C
X
D A T A
M e m o ry
M
W D T
U
Y S
/4
R T C
X
O S C
O S C 3
O S C 4
W D T O S C
M U X
In s tr u c tio n
D e c o d e r
T im in g
G e n e r a tio n
P O R T B
S T A T U S
A L U
S
S
P O R T A
A C C
C 1
D
P A
P A
P A
P A
P A
P A
L C D
M e m o ry
C 3
P B 0 /IN T 0
P B 1 /IN T 1
P B 2 /T M R
P B 3 ~ P B 5
P B
S h ifte r
B P
O S
R E
V D
V S
O S
fS Y S /4
fS Y S
R T C O u t
P B 2 /T M R
P F D
T im e B a s e
O S C 2
O S C 4
U
L C D D R IV E R
H A L T
0 /B Z
1 /B Z
2
3 /P F D
4 ~ P A 7
E N /D IS
L V D /L V R
C O M 0 ~
C O M 2
Rev. 1.10
C O M 3 /
S E G 1 8
S E G 0 ~
S E G 1 7
2
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Pin Assignment
R E S
P A 0 /B Z
1
4 8
P A 1 /B Z
2
4 7
O S C 1
P A 2
3
4 6
O S C 2
P A 3 /P F D
4
4 5
V D D
P A 4
5
4 4
O S C 3
P A 5
6
4 3
O S C 4
P A 6
7
4 2
S E G 0
P A 7
8
4 1
S E G 1
P B 0 /IN T 0
9
4 0
S E G 2
P B 1 /IN T 1
1 0
3 9
S E G 3
P B 2 /T M R
1 1
3 8
S E G 4
P B 3
1 2
3 7
S E G 5
P B 4
1 3
3 6
S E G 6
P B 5
1 4
3 5
S E G 7
V S S
1 5
3 4
S E G 8
V L C D
1 6
3 3
S E G 9
V 1
1 7
3 2
S E G 1 0
V 2
1 8
3 1
S E G 1 1
C 1
1 9
3 0
S E G 1 2
C 2
2 0
2 9
S E G 1 3
C O M 0
2 1
2 8
S E G 1 4
C O M 1
2 2
2 7
S E G 1 5
C O M 2
2 3
2 6
S E G 1 6
S E G 1 8 /C O M 3
2 4
2 5
S E G 1 7
H T 4 9 R 3 0 A -1 /H T 4 9 C 3 0 -1 /H T 4 9 C 3 0 L
4 8 S S O P -A
Pad Assignment
HT49C30-1
R E S
4 5
4 4
4
5
4 3
4 2
4 1
4 0
3 9
(0 , 0 )
6
IN T 1 /P B 1
T M R /P B 2
7
P B 3
8
P B 4
9
P B 5
1 0
3 8
S E G 0
3 7
S E G 1
3 6
S E G 2
3 5
S E G 3
3 4
S E G 4
3 3
S E G 5
3 2
S E G 6
3 1
S E G 7
3 0
S E G 8
2 9
S E G 9
S E G 1 0
S E G 1 1
V S S
1 1
2 8
V L C D
1 2
2 7
C 2
C O M 0
C O M 1
2 1
2 2
2 3
2 4
2 5
2 6
S E G 1 2
C 1
2 0
S E G 1 3
V 2
1 9
S E G 1 4
1 8
S E G 1 5
1 7
S E G 1 6
1 6
S E G 1 7
1 5
S E G 1 8 /C O M 3
1 4
C O M 2
1 3
V 1
Rev. 1.10
T E S T 3
P A 7
IN T 0 /P B 0
4 8
T E S T 2
3
5 0
T E S T 1
P A 6
2
O S C 4
B Z /P A 0
4 6
O S C 3
B Z /P A 1
4 7
V D D
P A 2
4 9
O S C 2
P F D /P A 3
5 1
O S C 1
P A 5
P A 4
1
3
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
HT49C30L
4 4
4 3
4 2
4 1
O S C 4
R E S
4 5
V D D
B Z /P A 0
4 6
O S C 3
B Z /P A 1
4 7
O S C 2
P A 2
4 8
O S C 1
P A 4
P F D /P A 3
P A 5
1
4 0
3 9
3 8
2
P A 6
P A 7
3
IN T 0 /P B 0
4
(0 ,0 )
3 7
S E G 0
3 6
S E G 1
3 5
S E G 2
3 4
S E G 3
3 3
S E G 4
3 2
S E G 5
IN T 1 /P B 1
5
T M R /P B 2
6
P B 3
7
3 1
S E G 6
P B 4
8
3 0
S E G 7
P B 5
9
2 9
S E G 8
V S S
1 0
2 8
S E G 9
V L C D
1 1
2 7
S E G 1 0
2 6
S E G 1 1
2 2
2 3
2 4
2 5
S E G 1 2
2 1
S E G 1 4
2 0
S E G 1 3
C 2
1 9
S E G 1 6
C 1
1 8
S E G 1 5
V 2
1 7
C O M 3 /S E G 1 8
V 1
1 6
S E G 1 7
1 5
C O M 2
1 4
C O M 1
1 3
C O M 0
1 2
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pad Description
Pad Name
I/O
Options
Description
I/O
Wake-up
Pull-high
or None
CMOS or
NMOS
PA0~PA7 constitute an 8-bit bidirectional input/output port with Schmitt trigger input capability. Each bit on port can be configured as a wake-up input by
options. PA0~PA3 can be configured as a CMOS output or NMOS input/output with or without pull-high resistor by options. PA4~PA7 are always
pull-high NMOS input/output. Of the eight bits, PA0~PA1 can be set as I/O
pins or buzzer outputs by options. PA3 can be set as an I/O pin or as a PFD
output also by options.
I
¾
PB0~PB5 constitute a 6-bit Schmitt trigger input port. Each bit on port are
with pull-high resistor. Of the six bits, PB0 and PB1 can be set as input pins or
as external interrupt control pins (INT0) and (INT1) respectively, by software
application. PB2 can be set as an input pin or as a timer/event counter input
pin TMR also by software application.
¾
¾
Negative power supply, ground
VLCD
I
¾
LCD power supply for HT49R30A-1/HT49C30-1.
Voltage pump for HT49C30L.
V2
I
¾
Voltage pump for HT49R30A-1/HT49C30-1.
LCD power supply for HT49C30L.
V1,C1,C2
I
¾
Voltage pump
SEG18/COM3
COM2~COM0
1/2 or 1/3 or 1/4 SEG18 can be set as a segment or as a common output driver for LCD panel
O
Duty
by options. COM2~COM0 are outputs for LCD panel plate.
SEG17~SEG0
O
PA0/BZ
PA1/BZ
PA2
PA3/PFD
PA4~PA7
PB0/INT0
PB1/INT1
PB2/TMR
PB3~PB5
VSS
Rev. 1.10
¾
LCD driver outputs for LCD panel segments
4
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Pad Name
I/O
OSC4
OSC3
O
I
VDD
¾
OSC2
OSC1
O
I
RES
I
Options
Description
Real time clock oscillators. OSC3 and OSC4 are connected to a 32768Hz
RTC or
crystal oscillator for timing purposes or to a system clock source (depending
System Clock
on the options).
¾
Positive power supply
OSC1 and OSC2 are connected to an RC network or a crystal (by options)
for the internal system clock. In the case of RC operation, OSC2 is the output
Crystal or RC terminal for 1/4 system clock.
The system clock may come from the RTC oscillator. If the system clock comes from RTCOSC, these two pins can be floating.
¾
Schmitt trigger reset input, active low
Absolute Maximum Ratings
Supply Voltage..................................VSS-0.3V to 5.5V*
Supply Voltage ................................VSS-0.3V to 2.2V**
Storage Temperature ............................-50°C to 125°C
Input Voltage..............................VSS-0.3V to VDD+0.3V
Operating Temperature ...........................-40°C to 85°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
²*² For HT49R30A-1/HT49C30-1
²**² For HT49C30L
D.C. Characteristics
VDD=1.5V for HT49C30L, VDD=3V & VDD=5V for HT49R30A-1 and HT49C30-1
Symbol
VDD
Parameter
Operating Voltage
Test Conditions
Min.
Typ.
Max.
Unit
for HT49C30L
1.2
¾
2.2
V
LVR disable
(for HT49R30A-1/HT49C30-1)
2.2
¾
5.5
V
¾
60
100
mA
¾
1
2
mA
¾
3
5
mA
¾
50
100
mA
¾
1
2
mA
5V
¾
3
5
mA
1.5V
¾
2.5
4
mA
¾
0.3
0.6
mA
¾
2
4
mA
¾
0.1
0.5
mA
¾
¾
1
mA
¾
¾
2
mA
Conditions
VDD
¾
1.5V No load, fSYS=455kHz
IDD1
Operating Current
(Crystal OSC)
3V
No load, fSYS=4MHz
5V
1.5V No load, fSYS=400kHz
IDD2
IDD3
Operating Current
(RC OSC)
Operating Current
(fSYS=32768Hz)
3V
3V
No load, fSYS=4MHz
No load
5V
1.5V
ISTB1
Standby Current
(*fS=T1)
3V
No load, system HALT,
LCD off at HALT
5V
Rev. 1.10
Ta=25°C
5
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
¾
1
2
mA
¾
2.5
5
mA
¾
6
10
mA
¾
0.5
1
mA
¾
2
5
mA
¾
6
10
mA
¾
17
30
mA
¾
34
60
mA
¾
13
25
mA
¾
28
50
mA
¾
14
25
mA
¾
26
50
mA
¾
10
20
mA
¾
19
40
mA
0
¾
0.3VDD
V
0
¾
0.3VDD
V
5V
0
¾
0.3VDD
V
1.5V
0.7VDD
¾
VDD
V
0.7VDD
¾
VDD
V
5V
0.7VDD
¾
VDD
V
1.5V
0
¾
0.4VDD
V
0
¾
0.4VDD
V
5V
0
¾
0.4VDD
V
3V
0.9VDD
¾
VDD
V
0.9VDD
¾
VDD
V
5V
0.9VDD
¾
VDD
V
1.5V
0.4
0.8
¾
mA
6
12
¾
mA
5V
10
25
¾
mA
1.5V
-0.3
-0.6
¾
mA
-2
-4
¾
mA
-5
-8
¾
mA
210
420
¾
mA
350
700
¾
mA
-80
-160
¾
mA
-180
-360
¾
mA
Conditions
VDD
1.5V
ISTB2
Standby Current
(*fS=32.768kHz OSC)
3V
No load, system HALT,
LCD on at HALT, C type
5V
1.5V
ISTB3
Standby Current
(*fS=WDT RC OSC)
3V
No load, system HALT
LCD on at HALT, C type
5V
ISTB4
ISTB5
ISTB6
ISTB7
Standby Current
(*fS=32.768kHz OSC)
3V
Standby Current
(*fS=32.768kHz OSC)
3V
Standby Current
(*fS=WDT RC OSC)
3V
Standby Current
(*fS=WDT RC OSC)
3V
5V
5V
5V
5V
No load, system HALT,
LCD on at HALT, R type, 1/2 bias
No load, system HALT,
LCD on at HALT, R type, 1/3 bias
No load, system HALT,
LCD on at HALT, R type, 1/2 bias
No load, system HALT,
LCD on at HALT, R type, 1/3 bias
1.5V
VIL1
VIH1
VIL2
VIH2
IOL1
IOH1
Input Low Voltage for I/O
Ports, TMR and INT
Input High Voltage for I/O
Ports, TMR and INT
Input Low Voltage (RES)
Input High Voltage (RES)
I/O Port Sink Current
I/O Port Source Current
¾
3V
¾
3V
¾
3V
¾
1.5V
3V
3V
VOL=0.1VDD
VOH=0.9VDD
5V
IOL2
IOH2
Rev. 1.10
LCD Comment and Segment
Current
LCD Comment and Segment
Current
3V
VOL=0.1VDD
5V
3V
VOH=0.9VDD
5V
6
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Symbol
Parameter
Test Conditions
1.5V
Pull-high Resistance of I/O
3V
Ports and INT0, INT1
5V
RPH
VLVR
Low Voltage Reset Voltage
¾
VLVD
Low Voltage Detector Voltage
¾
Note:
Conditions
VDD
¾
¾
Min.
Typ.
Max.
Unit
75
150
300
kW
40
60
80
kW
10
30
50
kW
2.7
3.2
3.6
V
3.0
3.3
3.6
V
tSYS=1/fSYS
²*fS² please refer to the clock option of WDT
A.C. Characteristics
Symbol
Parameter
Ta=25°C
Test Conditions
VDD
Conditions
1.5V
fSYS1
fSYS2
System Clock (Crystal OSC)
System Clock (RC OSC)
¾
3V
Min.
Typ.
Max.
Unit
400
¾
500
kHz
4000
kHz
400
5V
400
¾
8000
kHz
1.5V
400
¾
500
kHz
400
¾
4000
kHz
400
¾
8000
kHz
¾
3V
5V
fSYS3
System Clock
(32768Hz Crystal OSC)
¾
¾
¾
32768
¾
Hz
fRTCOSC
RTC Frequency
¾
¾
¾
32768
¾
Hz
0
¾
500
kHz
0
¾
4000
kHz
5V
0
¾
8000
kHz
1.5V
35
70
140
ms
45
90
180
ms
35
65
130
ms
For HT49C30L
10
¾
¾
ms
For HT49R30A-1/HT49C30-1
1
¾
¾
ms
Wake-up from HALT
¾
1024
¾
tSYS
35
70
140
ms
45
90
180
ms
35
70
140
ms
For HT49C30L
10
¾
¾
ms
For HT49R30A-1/HT49C30-1
1
¾
¾
ms
1.5V
fTIMER
Timer I/P Frequency
tWDTOSC Watchdog Oscillator
¾
3V
¾
3V
5V
tRES
tSST
External Reset Low Pulse Width
System Start-up Timer Period
¾
¾
1.5V
tOPD
Option Load Time During Reset
¾
3V
5V
tINT
Interrupt Pulse Width
¾
Note: tSYS=1/fSYS
Rev. 1.10
7
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Functional Description
Execution flow
After accessing a program memory word to fetch an instruction code, the value of the PC is incremented by
one. The PC then points to the memory word containing
the next instruction code.
The system clock is derived from either a crystal or an
RC oscillator or a 32768Hz crystal oscillator. It is internally divided into four non-overlapping clocks. One instruction cycle consists of four system clock cycles.
When executing a jump instruction, conditional skip execution, loading a PCL register, a subroutine call, an initial reset, an internal interrupt, an external interrupt, or
returning from a subroutine, the PC manipulates the
program transfer by loading the address corresponding
to each instruction.
Instruction fetching and execution are pipelined in such
a way that a fetch takes one instruction cycle while decoding and execution takes the next instruction cycle.
The pipelining scheme causes each instruction to effectively execute in a cycle. If an instruction changes the
value of the program counter, two cycles are required to
complete the instruction.
The conditional skip is activated by instructions. Once
the condition is met, the next instruction, fetched during
the current instruction execution, is discarded and a
dummy cycle replaces it to get a proper instruction; otherwise proceed with the next instruction.
Program counter - PC
The program counter (PC) is of 11 bits wide and controls
the sequence in which the instructions stored in the program ROM are executed. The contents of the PC can
specify a maximum of 2048 addresses.
S y s te m
C lo c k
T 1
T 2
T 3
T 4
The lower byte of the PC (PCL) is a readable and
writeable register (06H). Moving data into the PCL performs a short jump. The destination is within 256 locations.
T 1
T 2
T 3
T 4
T 1
T 2
T 3
T 4
O S C 2 ( R C o n ly )
P C
P C
P C + 1
F e tc h IN S T (P C )
E x e c u te IN S T (P C -1 )
P C + 2
F e tc h IN S T (P C + 1 )
E x e c u te IN S T (P C )
F e tc h IN S T (P C + 2 )
E x e c u te IN S T (P C + 1 )
Execution flow
Mode
Program Counter
*10
*9
*8
*7
*6
*5
*4
*3
*2
*1
*0
Initial Reset
0
0
0
0
0
0
0
0
0
0
0
External Interrupt 0
0
0
0
0
0
0
0
0
1
0
0
External Interrupt 1
0
0
0
0
0
0
0
1
0
0
0
Timer/Event Counter Overflow
0
0
0
0
0
0
0
1
1
0
0
Time Base Interrupt
0
0
0
0
0
0
1
0
0
0
0
RTC Interrupt
0
0
0
0
0
0
1
0
1
0
0
Skip
PC+2
Loading PCL
*10
*9
*8
@7
@6
@5
@4
@3
@2
@1
@0
Jump, Call Branch
#10
#9
#8
#7
#6
#5
#4
#3
#2
#1
#0
Return From Subroutine
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
Program counter
Note: *10~*0: Program counter bits
S10~S0: Stack register bits
#10~#0: Instruction code bits
Rev. 1.10
@7~@0: PCL bits
8
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
· Location 00CH
When a control transfer takes place, an additional
dummy cycle is required.
Location 00CH is reserved for the timer/event counter
interrupt service program. If a timer interrupt results
from a timer/event counter overflow, and if the interrupt is enabled and the stack is not full, the program
begins execution at location 00CH.
Program memory - ROM
The program memory is used to store the program instructions which are to be executed. It also contains
data, table, and interrupt entries, and is organized into
2048´14 bits which are addressed by the PC and table
pointer.
· Location 010H
Location 010H is reserved for the Time Base interrupt
service program. If a Time Base interrupt occurs, and
the interrupt is enabled, and the stack is not full, the
program begins execution at location 010H.
Certain locations in the ROM are reserved for special
usage:
· Location 014H
· Location 000H
Location 014H is reserved for the real time clock interrupt service program. If a real time clock interrupt occurs, and the interrupt is enabled, and the stack is not
full, the program begins execution at location 014H.
Location 000H is reserved for program initialization.
After chip reset, the program always begins execution
at this location.
· Location 004H
· Table location
Location 004H is reserved for the external interrupt
service program. If the INT0 input pin is activated, and
the interrupt is enabled, and the stack is not full, the
program begins execution at location 004H.
Any location in the ROM can be used as a look-up table. The instructions ²TABRDC [m]² (the current page,
1 page=256 words) and ²TABRDL [m]² (the last page)
transfer the contents of the lower-order byte to the
specified data memory, and the contents of the
higher-order byte to TBLH (Table Higher-order byte
register) (08H). Only the destination of the lower-order
byte in the table is well-defined; the other bits of the table word are all transferred to the lower portion of
TBLH, and the remaining 2 bit is read as ²0². The
TBLH is read only, and the table pointer (TBLP) is a
read/write register (07H), indicating the table location.
Before accessing the table, the location should be
placed in TBLP. All the table related instructions require 2 cycles to complete the operation. These areas
may function as a normal ROM depending upon the
user¢s requirements.
· Location 008H
Location 008H is reserved for the external interrupt
service program also. If the INT1 input pin is activated,
and the interrupt is enabled, and the stack is not full,
the program begins execution at location 008H.
0 0 0 H
D e v ic e in itia liz a tio n p r o g r a m
0 0 4 H
E x te r n a l in te r r u p t 0 s u b r o u tin e
0 0 8 H
0 0 C H
E x te r n a l in te r r u p t 1 s u b r o u tin e
T im e r /e v e n t c o u n te r in te r r u p t s u b r o u tin e
0 1 0 H
T im e B a s e In te r r u p t
0 1 4 H
P ro g ra m
R O M
R T C In te rru p t
Stack register - STACK
n 0 0 H
The stack register is a special part of the memory used
to save the contents of the PC. The stack is organized
into 4 levels and is neither part of the data nor part of the
program, and is neither readable nor writeable. Its activated level is indexed by a stack pointer (SP) and is neither readable nor writeable. At a commencement of a
subroutine call or an interrupt acknowledgment, the
contents of the PC is pushed onto the stack. At the end
of the subroutine or interrupt routine, signaled by a return instruction (RET or RETI), the contents of the PC is
L o o k - u p ta b le ( 2 5 6 w o r d s )
n F F H
L o o k - u p ta b le ( 2 5 6 w o r d s )
7 F F H
1 4 b its
N o te : n ra n g e s fro m
0 to 7
Program memory
Instruction(s)
Table Location
*10
*9
*8
*7
*6
*5
*4
*3
*2
*1
*0
TABRDC [m]
P10
P9
P8
@7
@6
@5
@4
@3
@2
@1
@0
TABRDL [m]
1
1
1
@7
@6
@5
@4
@3
@2
@1
@0
Table location
Note: *10~*0: Table location bits
P10~P8: Current program counter bits
@7~@0: Table pointer bits
Rev. 1.10
9
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
restored to its previous value from the stack. After chip
reset, the SP will point to the top of the stack.
If the stack is full and a non-masked interrupt takes
place, the interrupt request flag is recorded but the acknowledgment is still inhibited. Once the SP is decremented (by RET or RETI), the interrupt is serviced. This
feature prevents stack overflow, allowing the programmer to use the structure easily. Likewise, if the stack is
full, and a ²CALL² is subsequently executed, a stack
overflow occurs and the first entry is lost (only the most
recent four return addresses are stored).
In d ir e c t A d d r e s s in g R e g is te r 0
0 2 H
M P 0
In d ir e c t A d d r e s s in g R e g is te r 1
0 3 H
M P 1
0 4 H
B P
A C C
P C L
0 5 H
0 6 H
0 7 H
0 8 H
T B L P
T B L H
0 9 H
R T C C
0 A H
S T A T U S
0 B H
IN T C 0
S p e c ia l P u r p o s e
D A T A M E M O R Y
0 C H
Data memory - RAM
0 D H
The data memory (RAM) is designed with 113´8 bits,
and is divided into two functional groups, namely special
function registers and general purpose data memory,
most of which are readable/writeable, although some
are read only.
0 E H
T M R
T M R C
0 F H
1 0 H
1 1 H
1 2 H
P A
1 3 H
Of the two types of functional groups, the special function registers consist of an Indirect addressing register 0
(00H), a Memory pointer register 0 (MP0;01H), an Indirect addressing register 1 (02H), a Memory pointer register 1 (MP1;03H), a Bank pointer (BP;04H), an
A c c u m ul a t o r ( A C C ; 05H ) , a P r o g r am co u n t e r
lower-order byte register (PCL;06H), a Table pointer
(TBLP;07H), a Table higher-order byte register
(TBLH;08H), a Real time clock control register
(RTCC;09H), a Status register (STATUS;0AH), an Interrupt control register 0 (INTC0;0BH), a timer/event counter (TMR;0DH), a timer/event counter control register
(TMRC;0EH), I/O registers (PA;12H, PB;14H), and Interrupt control register 1 (INTC1;1EH). On the other
hand, the general purpose data memory, addressed
from 20H to 7FH, is used for data and control information under instruction commands.
1 4 H
P B
1 5 H
1 6 H
1 7 H
1 8 H
: U n u s e d .
1 9 H
1 A H
R e a d a s "0 "
1 B H
1 C H
1 D H
1 E H
1 F H
2 0 H
IN T C 1
G e n e ra l P u rp o s e
D A T A M E M O R Y
(9 6 B y te s )
7 F H
The areas in the RAM can directly handle arithmetic,
logic, increment, decrement, and rotate operations. Except some dedicated bits, each bit in the RAM can be
set and reset by ²SET [m].i² and ²CLR [m].i² They are
also indirectly accessible through the Memory pointer
register 0 (MP0;01H) or the Memory pointer register 1
(MP1;03H).
RAM mapping
while MP1 can be applied to data memory and LCD display memory.
Accumulator - ACC
The accumulator (ACC) is related to the ALU operations. It is also mapped to location 05H of the RAM and
is capable of operating with immediate data. The data
movement between two data memory locations must
pass through the ACC.
Indirect addressing register
Location 00H and 02H are indirect addressing registers
that are not physically implemented. Any read/write operation of [00H] and [02H] accesses the RAM pointed to
by MP0 (01H) and MP1(03H) respectively. Reading location 00H or 02H indirectly returns the result 00H.
While, writing it indirectly leads to no operation.
Arithmetic and logic unit - ALU
This circuit performs 8-bit arithmetic and logic operations and provides the following functions:
The function of data movement between two indirect addressing registers is not supported. The memory pointer
registers, MP0 (7-bit) and MP1 (7-bit), used to access
the RAM by combining corresponding indirect addressing registers. MP0 can only be applied to data memory,
Rev. 1.10
0 0 H
0 1 H
· Arithmetic operations (ADD, ADC, SUB, SBC, DAA)
· Logic operations (AND, OR, XOR, CPL)
· Rotation (RL, RR, RLC, RRC)
· Increment and Decrement (INC, DEC)
· Branch decision (SZ, SNZ, SIZ, SDZ etc.)
10
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Once an interrupt subroutine is serviced, other interrupts are all blocked (by clearing the EMI bit). This
scheme may prevent any further interrupt nesting. Other
interrupt requests may take place during this interval,
but only the interrupt request flag will be recorded. If a
certain interrupt requires servicing within the service
routine, the EMI bit and the corresponding bit of the
INTC0 or of INTC1 may be set in order to allow interrupt
nesting. Once the stack is full, the interrupt request will
not be acknowledged, even if the related interrupt is enabled, until the SP is decremented. If immediate service
is desired, the stack should be prevented from becoming full.
The ALU not only saves the results of a data operation
but also changes the status register.
Status register - STATUS
The status register (0AH) is of 8 bits wide and contains,
a carry flag (C), an auxiliary carry flag (AC), a zero flag
(Z), an overflow flag (OV), a power down flag (PD), and
a watchdog time-out flag (TO). It also records the status
information and controls the operation sequence.
Except the TO and PD flags, bits in the status register
can be altered by instructions similar to other registers.
Data written into the status register does not alter the TO
or PD flags. Operations related to the status register,
however, may yield different results from those intended. The TO and PD flags can only be changed by a
Watchdog Timer overflow, chip power-up, or clearing
the Watchdog Timer and executing the ²HALT² instruction. The Z, OV, AC, and C flags reflect the status of the
latest operations.
All these interrupts can support a wake-up function. As
an interrupt is serviced, a control transfer occurs by
pushing the contents of the PC onto the stack followed
by a branch to a subroutine at the specified location in
the ROM. Only the contents of the PC is pushed onto
the stack. If the contents of the register or of the status
register (STATUS) is altered by the interrupt service program which corrupts the desired control sequence, the
contents should be saved in advance.
On entering the interrupt sequence or executing the
subroutine call, the status register will not be automatically pushed onto the stack. If the contents of the status
is important, and if the subroutine is likely to corrupt the
status register, the programmer should take precautions
and save it properly.
External interrupts are triggered by a high to low transition of INT0 or INT1, and the related interrupt request
flag (EIF0; bit 4 of INTC0, EIF1; bit 5 of INTC0) is set as
well. After the interrupt is enabled, the stack is not full,
and the external interrupt is active, a subroutine call to
location 04H or 08H occurs. The interrupt request flag
(EIF0 or EIF1) and EMI bits are all cleared to disable
other interrupts.
Interrupts
The device provides two external interrupts, an internal
timer/event counter interrupt, an internal time base interrupt, and an internal real time clock interrupt. The interrupt control register 0 (INTC0;0BH) and interrupt
control register 1 (INTC1;1EH) both contain the interrupt
control bits that are used to set the enable/disable status
and interrupt request flags.
Labels
The internal timer/event counter interrupt is initialized by
setting the timer/event counter interrupt request flag
(TF; bit 6 of INTC0), which is normally caused by a timer
overflow. After the interrupt is enabled, and the stack is
Bits
Function
C
0
C is set if the operation results in a carry during an addition operation or if a borrow does not take
place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate
through carry instruction.
AC
1
AC is set if the operation results in a carry out of the low nibbles in addition or no borrow from the
high nibble into the low nibble in subtraction; otherwise AC is cleared.
Z
2
Z is set if the result of an arithmetic or logic operation is zero; otherwise Z is cleared.
OV
3
OV is set if the operation results in a carry into the highest-order bit but not a carry out of the
highest-order bit, or vice versa; otherwise OV is cleared.
PD
4
PD is cleared by either a system power-up or executing the ²CLR WDT² instruction. PD is set by
executing the ²HALT² instruction.
TO
5
TO is cleared by a system power-up or executing the ²CLR WDT² or ²HALT² instruction. TO is
set by a WDT time-out.
¾
6
Unused bit, read as ²0²
¾
7
Unused bit, read as ²0²
Status register
Rev. 1.10
11
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Register
INTC0
(0BH)
INTC1
(1EH)
Bit No.
Label
Function
0
EMI
Control the master (global) interrupt (1=enabled; 0=disabled)
1
EEI0
Control the external interrupt 0 (1=enabled; 0=disabled)
2
EEI1
Control the external interrupt 1 (1=enabled; 0=disabled)
3
ETI
Control the timer/event counter interrupt (1=enabled; 0=disabled)
4
EIF0
External interrupt 0 request flag (1=active; 0=inactive)
5
EIF1
External interrupt 1 request flag (1=active; 0=inactive)
6
TF
Internal timer/event counter request flag (1=active; 0=inactive)
7
¾
Unused bit, read as ²0²
0
ETBI
Control the time base interrupt (1=enabled; 0:disabled)
Control the real time clock interrupt (1=enabled; 0:disabled)
1
ERTI
2, 3
¾
4
TBF
5
RTF
6, 7
¾
Unused bit, read as ²0²
Time base request flag (1=active; 0=inactive)
Real time clock request flag (1=active; 0=inactive)
Unused bit, read as ²0²
INTC register
priorities in the following table apply. These can be
masked by resetting the EMI bit.
not full, and the TF bit is set, a subroutine call to location
0CH occurs. The related interrupt request flag (TF) is reset, and the EMI bit is cleared to disable further interrupts.
No.
The time base interrupt is initialized by setting the time
base interrupt request flag (TBF; bit 4 of INTC1), that is
caused by a regular time base signal. After the interrupt
is enabled, and the stack is not full, and the TBF bit is
set, a subroutine call to location 10H occurs. The related
interrupt request flag (TBF) is reset and the EMI bit is
cleared to disable further interrupts.
Priority Vector
a
External interrupt 0
1
04H
b
External interrupt 1
2
08H
c
Timer/event counter overflow
3
0CH
d
Time base interrupt
4
10H
e
Real time clock interrupt
5
14H
The timer/event counter interrupt request flag (TF), external interrupt 1 request flag (EIF1), external interrupt 0
request flag (EIF0), enable timer/event counter interrupt
bit (ETI), enable external interrupt 1 bit (EEI1), enable
external interrupt 0 bit (EEI0), and enable master interrupt bit (EMI) make up of the Interrupt Control register 0
(INTC0) which is located at 0BH in the RAM. The real
time clock interrupt request flag (RTF), time base interrupt request flag (TBF), enable real time clock interrupt
bit (ERTI), and enable time base interrupt bit (ETBI),
constitute the Interrupt Control register 1 (INTC1) which
is located at 1EH in the RAM. EMI, EEI0, EEI1, ETI,
ETBI, and ERTI are all used to control the enable/disable status of interrupts. These bits prevent the requested interrupt from being serviced. Once the
interrupt request flags (RTF, TBF, TF, EIF1, EIF0) are all
set, they remain in the INTC1 or INTC0 respectively until
the interrupts are serviced or cleared by a software instruction.
The real time clock interrupt is initialized by setting the
real time clock interrupt request flag (RTF; bit 5 of
INTC1), that is caused by a regular real time clock signal. After the interrupt is enabled, and the stack is not
full, and the RTF bit is set, a subroutine call to location
14H occurs. The related interrupt request flag (RTF) is
reset and the EMI bit is cleared to disable further interrupts.
During the execution of an interrupt subroutine, other interrupt acknowledgments are all held until the ²RETI² instruction is executed or the EMI bit and the related
interrupt control bit are set both to 1 (if the stack is not
full). To return from the interrupt subroutine, ²RET² or
²RETI² may be invoked. RETI sets the EMI bit and enables an interrupt service, but RET does not.
Interrupts occurring in the interval between the rising
edges of two consecutive T2 pulses are serviced on the
latter of the two T2 pulses if the corresponding interrupts
are enabled. In the case of simultaneous requests, the
Rev. 1.10
Interrupt Source
12
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
It is recommended that a program not use the ²CALL
subroutine² within the interrupt subroutine. It¢s because
interrupts often occur in an unpredictable manner or require to be serviced immediately in some applications.
At this time, if only one stack is left, and enabling the interrupt is not well controlled, operation of the ²call² in the
interrupt subroutine may damage the original control sequence.
ternal capacitors in OSC1 and OSC2 are required.
There is another oscillator circuit designed for the real
time clock. In this case, only the 32.768kHz crystal oscillator can be applied. The crystal should be connected
between OSC3 and OSC4.
The RTC oscillator circuit can be controlled to oscillate
quickly by setting the ²QOSC² bit (bit 4 of RTCC). It is
recommended to turn on the quick oscillating function
upon power on, and then turn it off after 2 seconds.
Oscillator configuration
The WDT oscillator is a free running on-chip RC oscillator, and no external components are required. Although
the system enters the power down mode, the system
clock stops, and the WDT oscillator still works with a period of approximately 78ms. The WDT oscillator can be
disabled by options to conserve power.
The device provides three oscillator circuits for system
clocks, i.e., RC oscillator, crystal oscillator and 32768Hz
crystal oscillator, determined by options. No matter what
type of oscillator is selected, the signal is used for the
system clock. The HALT mode stops the system oscillator (RC and crystal oscillator only) and ignores external
signal to conserve power. The 32768Hz crystal oscillator (system oscillator) still runs at HALT mode. If the
32768Hz crystal oscillator is selected as the system oscillator, the system oscillator is not stopped; but the instruction execution is stopped. Since the (used as
system oscillator or oscillator) is also designed for timing purposes, the internal timing (RTC, time base, WDT)
operation still runs even if the system enters the HALT
mode.
Watchdog Timer - WDT
The WDT clock source is implemented by a dedicated
RC oscillator (WDT oscillator) or an instruction clock
(system clock/4) or a real time clock oscillator (RTC oscillator). The timer is designed to prevent a software
malfunction or sequence from jumping to an unknown
location with unpredictable results. The WDT can be
disabled by options. But if the WDT is disabled, all executions related to the WDT lead to no operation.
Of the three oscillators, if the RC oscillator is used, an
external resistor between OSC1 and VSS is required,
and the range of the resistance should be from 24kW to
1MW for HT49R30A-1/HT49C30-1 and from 560kW to
1MW for HT49C30L. The system clock, divided by 4, is
available on OSC2 with pull-high resistor, which can be
used to synchronize external logic. The RC oscillator
provides the most cost effective solution. However, the
frequency of the oscillation may vary with VDD, temperature, and the chip itself due to process variations. It is
therefore, not suitable for timing sensitive operations
where accurate oscillator frequency is desired.
The WDT time-out period is fS/215 ~ fS/216.
If the WDT clock source chooses the internal WDT oscillator, the time-out period may vary with temperature,
VDD, and process variations. On the other hand, if the
clock source selects the instruction clock and the
²HALT² instruction is executed, WDT may stop counting
and lose its protecting purpose, and the logic can only
be restarted by an external logic.
When the device operates in a noisy environment, using
the on-chip RC oscillator (WDT OSC) is strongly recommended, since the HALT can stop the system clock.
On the other hand, if the crystal oscillator is selected, a
crystal across OSC1 and OSC2 is needed to provide the
feedback and phase shift required for the oscillator, and
no other external components are required. A resonator
may be connected between OSC1 and OSC2 to replace
the crystal and to get a frequency reference, but two ex-
The WDT overflow under normal operation initializes a
²chip reset² and sets the status bit ²TO². In the HALT
mode, the overflow initializes a ²warm reset², and only
the PC and SP are reset to zero. To clear the contents of
the WDT, there are three methods to be adopted, i.e.,
V
O S C 3
O S C 4
3 2 7 6 8 H z C r y s ta l/
R T C O s c illa to r
D D
4 7 0 p F
O S C 1
V
O S C 2
C r y s ta l O s c illa to r
fS
Y S
/4
O S C 1
D D
O S C 2
R C O s c illa to r
System oscillator
Rev. 1.10
13
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Time base
external reset (a low level to RES), software instruction,
and a ²HALT² instruction. There are two types of software instructions; ²CLR WDT² and the other set - ²CLR
WDT1² and ²CLR WDT2². Of these two types of instruction, only one type of instruction can be active at a time
depending on the options - ²CLR WDT² times selection
option . If the ²CLR WDT² is selected (i.e., CLR WDT
times equal one), any execution of the ²CLR WDT² instruction clears the WDT. In the case that ²CLR WDT1²
and ²CLR WDT2² are chosen (i.e., CLR WDT times
equal two), these two instructions have to be executed
to clear the WDT; otherwise, the WDT may reset the
chip due to time-out.
The time base offers a periodic time-out period to generate a regular internal interrupt. Its time-out period
ranges from /212 to fS/215 selected by options. If time
base time-out occurs, the related interrupt request flag
(TBF; bit 4 of INTC1) is set. But if the interrupt is enabled, and the stack is not full, a subroutine call to location 10H occurs.
Real time clock - RTC
The real time clock (RTC) is operated in the same manner as the time base that is used to supply a regular internal interrupt. Its time-out period ranges from fS/28 to
fS/215 by software programming . Writing data to RT2,
RT1 and RT0 (bit2, 1, 0 of RTCC;09H) yields various
time-out periods. If the RTC time-out occurs, the related
interrupt request flag (RTF; bit 5 of INTC1) is set. But if
the interrupt is enabled, and the stack is not full, a subroutine call to location 14H occurs. The real time clock
time-out signal also can be applied to be a clock source
of timer/event counter for getting a longer time-out period.
Multi-function timer
The device provides a multi-function timer for the WDT,
time base and RTC but with different time-out periods.
The multi-function timer consists of a 8-stage divider
and an 7-bit prescaler, with the clock source coming
from the WDT OSC or RTC OSC or the instruction clock
(i.e.., system clock divided by 4). The multi-function
timer also provides a selectable frequency signal
(ranges from fS/22 to fS/28) for LCD driver circuits, and a
selectable frequency signal (ranges from fS/22 to fS/29)
for the buzzer output by options. It is recommended to
select a near 4kHz signal to LCD driver circuits for
proper display.
S y s te m
C lo c k /4
R T C
O S C 3 2 7 6 8 H z
O p tio n
S e le c t
fS
D iv id e r
D iv id e r
C K
W D T
1 2 k H z
O S C
T
R
C K
T
R
T im e - o u t R e s e t fS /2
1 5
~ fS /2
1 6
W D T C le a r
Watchdog Timer
fs
D iv id e r
P r e s c a le r
O p tio n
O p tio n
T im e B a s e In te r r u p t
fS /2 12~ fS /2 15
L C D D r iv e r ( fS /2 2 ~ fS /2 8 )
B u z z e r (fS /2 2~ fS /2 9)
Time base
fS
D iv id e r
P r e s c a le r
R T 2
R T 1
R T 0
8 to 1
M u x .
fS /2 8~ fS /2 15
R T C In te rru p t
Real time clock
Rev. 1.10
14
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
RT2
RT1
RT0
RTC Clock Divided Factor
0
0
0
28*
0
0
1
29*
0
1
0
210*
0
1
1
211*
1
0
0
212
1
0
1
213
1
1
0
214
1
1
1
215
If wake-up events occur, it takes 1024 tSYS (system
clock period) to resume normal operation. In other
words, a dummy period is inserted after the wake-up. If
the wake-up results from an interrupt acknowledgment,
the actual interrupt subroutine execution is delayed by
more than one cycle. However, if the Wake-up results in
the next instruction execution, the execution will be performed immediately after the dummy period is finished.
To minimize power consumption, all the I/O pins should
be carefully managed before entering the HALT status.
Note: ²*² not recommended for use
Reset
Power down operation - HALT
There are three ways in which reset may occur.
· RES is reset during normal operation
The HALT mode is initialized by the ²HALT² instruction
and results in the following.
· RES is reset during HALT
· WDT time-out is reset during normal operation
· The system oscillator turns off but the WDT or RTC
The WDT time-out during HALT differs from other chip
reset conditions, for it can perform a ²warm reset² that
resets only the PC and SP and leaves the other circuits
at their original state. Some registers remain unaffected
during any other reset conditions. Most registers are reset to the ²initial condition² once the reset conditions are
met. Examining the PD and TO flags, the program can
distinguish between different ²chip resets².
oscillator keeps running (if the WDT oscillator or the
real time clock is selected).
· The contents of the on-chip RAM and of the registers
remain unchanged.
· The WDT is cleared and start recounting (if the WDT
clock source is from the WDT oscillator or the real time
clock oscillator).
· All I/O ports maintain their original status.
V
· The PD flag is set but the TO flag is cleared.
D D
· LCD driver is still running (if the WDT OSC or RTC
OSC is selected).
The system quits the HALT mode by an external reset,
an interrupt, an external falling edge signal on port A, or
a WDT overflow. An external reset causes device initialization, and the WDT overflow performs a ²warm reset².
After examining the TO and PD flags, the reason for chip
reset can be determined. The PD flag is cleared by system power-up or by executing the ²CLR WDT²
instruction, and is set by executing the ²HALT²
instruction. On the other hand, the TO flag is set if WDT
time-out occurs, and causes a wake-up that only resets
the PC (Program Counter) and SP, and leaves the others at their original state.
R E S
Reset circuit
TO
PD
RESET Conditions
0
0
RES reset during power-up
u
u
RES reset during normal operation
0
1
RES Wake-up HALT
1
u
WDT time-out during normal operation
1
1
WDT Wake-up HALT
The port A wake-up and interrupt methods can be considered as a continuation of normal execution. Each bit
in port A can be independently selected to wake up the
device by options. Awakening from an I/O port stimulus,
the program resumes execution of the next instruction.
On the other hand, awakening from an interrupt, two sequences may occur. If the related interrupt is disabled or
the interrupt is enabled but the stack is full, the program
resumes execution at the next instruction. But if the interrupt is enabled, and the stack is not full, the regular interrupt response takes place.
Note: ²u² stands for ²unchanged²
When an interrupt request flag is set before entering the
²HALT² status, the system cannot be awaken using that
interrupt.
An extra option load time delay is added during reset
and power on.
Rev. 1.10
To guarantee that the system oscillator is started and
stabilized, the SST (System Start-up Timer) provides an
extra-delay of 1024 system clock pulses when the system awakes from the HALT state. Awaking from the
HALT state, the SST delay is added.
15
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
The functional unit chip reset status is shown below.
PC
000H
Interrupt
Disabled
Prescaler, Divider
Cleared
V D D
R E S
tO
P D
+ tS
S T
S S T T im e - o u t
C h ip
R e s e t
Cleared. After master reset,
WDT, RTC, Time Base
WDT starts counting
Timer/Event Counter
Off
Input/output Ports
Input mode
SP
Points to the top of the stack
Reset timing chart
H A L T
W D T
R e s e t
T im e - o u t
R e s e t
E x te rn a l
R E S
O S C 1
W a rm
W D T
C o ld
R e s e t
S S T
1 0 - b it R ip p le
C o u n te r
P o w e r - o n D e te c tio n
Reset configuration
The states of the registers are summarized below:
Register
Reset (Power On)
WDT Time-out
RES Reset
(Norma Operation) (Normal Operation)
RES Reset
(HALT)
WDT Time-out
(HALT)*
TMR
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
uuuu uuuu
TMRC
0000 1---
0000 1---
0000 1---
0000 1---
uuuu u---
Program Counter
0000H
0000H
0000H
0000H
0000H
MP0
-xxx xxxx
-uuu uuuu
-uuu uuuu
-uuu uuuu
-uuu uuuu
MP1
-xxx xxxx
-uuu uuuu
-uuu uuuu
-uuu uuuu
-uuu uuuu
---- ---0
---- ---0
---- ---0
---- ---0
---- ---u
ACC
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
uuuu uuuu
TBLP
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
uuuu uuuu
TBLH
--xx xxxx
--uu uuuu
--uu uuuu
--uu uuuu
--uu uuuu
STATUS
--00 xxxx
--1u uuuu
--uu uuuu
--01 uuuu
--11 uuuu
INTC0
-000 0000
-000 0000
-000 0000
-000 0000
-uuu uuuu
INTC1
--00 --00
--00 --00
--00 --00
--00 --00
--uu --uu
BP
RTCC
--00 0111
--00 0111
--00 0111
--00 0111
--uu uuuu
PA
1111 1111
1111 1111
1111 1111
1111 1111
uuuu uuuu
Note:
²*² stands for warm reset
²u² stands for unchanged
²x² stands for unknown
Rev. 1.10
16
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
low if the TE bit is ²0²), it will start counting until the
TMR returns to the original level and resets the TON.
The measured result remains in the timer/event counter
even if the activated transient occurs again. In other
words, only one cycle measurement can be made until
the TON is set. The cycle measurement will re-function
as long as it receives further transient pulse. In this operation mode, the timer/event counter begins counting according not to the logic level but to the transient edges.
In the case of counter overflows, the counter is reloaded
from the timer/event counter preload register and issues
an interrupt request, as in the other two modes, i.e.,
event and timer modes.
Timer/Event Counter
One timer/event counters is implemented in the device.
It contains an 8-bit programmable count-up counter.
The timer/event counter clock source may come from
the system clock or system clock/4 or RTC time-out signal or external source. System clock source or system
clock/4 is selected by options. Using external clock input
allows the user to count external events, measure time
internals or pulse widths, or generate an accurate time
base. While using the internal clock allows the user to
generate an accurate time base.
There are two registers related to the timer/event counter, i.e., TMR ([0DH]) and TMRC ([0EH]). There are also
two physical registers which are mapped to TMR location; writing TMR places the starting value in the
timer/event counter preload register, while reading it
yields the contents of the timer/event counter. TMRC is
a timer/event counter control register used to define
some options.
To enable the counting operation, the Timer ON bit
(TON; bit 4 of TMRC) should be set to 1. In the pulse
width measurement mode, the TON is automatically
cleared after the measurement cycle is completed. But
in the other two modes, the TON can only be reset by instructions. The overflow of the Timer/Event Counter is
one of the wake-up sources and can also be applied to a
PFD (Programmable Frequency Divider) output at PA3
by options. No matter what the operation mode is, writing
a 0 to ETI disables the related interrupt service. When the
PFD function is selected, executing ²CLR [PA].3² instruction to enable PFD output and executing ²SET [PA].3² instruction to disable PFD output.
The TN0 and TN1 bits define the operation mode. The
event count mode is used to count external events,
which means that the clock source is from an external
TMR pin. The timer mode functions as a normal timer
with the clock source coming from the internal selected
clock source. Finally, the pulse width measurement
mode can be used to count the high or low level duration
of the external signal TMR, and the counting is based on
the internal selected clock source.
In the case of timer/event counter OFF condition, writing
data to the timer/event counter preload register also reloads that data to the timer/event counter. But if the
timer/event counter is turn on, data written to the
timer/event counter is kept only in the timer/event counter preload register. The timer/event counter still continues its operation until an overflow occurs.
In the event count or timer mode, the timer/event counter starts counting at the current contents in the
timer/event counter and ends at FFH. Once an overflow
occurs, the counter is reloaded from the timer/event
counter preload register, and generates an interrupt request flag (TF; bit 6 of INTC0).
When the timer/event counter (reading TMR) is read,
the clock is blocked to avoid errors. As this may results
in a counting error, blocking of the clock should be taken
into account by the programmer.
In the pulse width measurement mode with the values
of the TON and TE bits equal to one, after the TMR
has received a transient from low to high (or high to
S y s te m
S y s te m
C lo c k
M
O p tio n
C lo c k /4
f IN
U
T
X
D a ta B u s
R T C O u t
T N 1
T N 0
T N 2
T M R
T im e r /E v e n t C o u n te r
P r e lo a d R e g is te r
R e lo a d
T E
T N 1
T N 0
T O N
P u ls e W id th
M e a s u re m e n t
M o d e C o n tro l
O v e r flo w
to In te rru p t
T im e r /E v e n t
C o u n te r
T
Q
P F D
P A 3 D a ta C T R L
Timer/Event Counter
Rev. 1.10
17
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Label
(TMR0C)
Bits
¾
0~2
Function
Unused bit, read as ²0²
TE
3
To define the TMR0 active edge of timer/event counter
(0=active on low to high; 1=active on high to low)
TON
4
To enable/disable timer counting
(0=disabled; 1=enabled)
TN2
5
2 to 1 multiplexer control inputs to select the timer/event counter clock source
(0=RTC outputs; 1= system clock or system clock/4)
6
7
To define the operating mode (TN1, TN0)
01= Event count mode (External clock)
10= Timer mode (Internal clock)
11= Pulse Width measurement mode (External clock)
00= Unused
TN0
TN1
TMRC register
Some instructions first input data and then follow the
output operations. For example, ²SET [m].i², ²CLR
[m].i², ²CPL [m]², ²CPLA [m]² read the entire port states
into the CPU, execute the defined operations
(bit-operation), and then write the results back to the
latches or to the accumulator. When a PA line is used as
an I/O line, the related PA line options should be configured as NMOS with or without pull-high resistor. Once a
PA line is selected as a CMOS output, the I/O function
cannot be used.
It is strongly recommended to load a desired value into
the TMR register first, then turn on the related
timer/event counter for proper operation, because the
initial value of TMR is unknown.
Due to the timer/event scheme, the programmer should
pay special attention on the instruction to enable then
disable the timer for the first time, whenever there is a
need to use the timer/event function, to avoid unpredictable result. After this procedure, the timer/event function
can be operated normally.
The input state of a PA line is read from the related PA
pad. When the PA is configured as NMOS with or without pull-high resistor, one should be careful when applying a read-modify-write instruction to PA. Since the
read-modify-write will read the entire port state (pads
state) firstly, execute the specified instruction and then
write the result to the port data register. When the read
operation is executed, a fault pad state (caused by the
load effect or floating state) may be read. Errors will then
occur.
Input/output ports
There are a 8-bit bidirectional input/output port, an 6-bit
input port in the device, labeled PA, PB which are
mapped to [12H], [14H] of the RAM, respectively.
PA0~PA3 can be configured as CMOS (output) or
NMOS (input/output) with or without pull-high resistor by
options. PA4~PA7 are always pull-high and NMOS (input/output).
If you choose NMOS (input), each bit on the port
(PA0~PA7) can be configured as a wake-up input. PB
can only be used for input operation. All the ports for the
input operation (PA, PB), are non-latched, that is, the inputs should be ready at the T2 rising edge of the instruction ²MOV A, [m]² (m=12H or 14H).
There are three function pins that share with the PA port:
PA0/BZ, PA1/BZ and PA3/PFD.
The BZ and BZ are buzzer driving output pair and the
PFD is a programmable frequency divider output. If the
user wants to use the BZ/BZ or PFD function, the related
PA port should be set as a CMOS output. The buzzer
output signals are controlled by PA0 and PA1 data registers and defined in the following table.
For PA output operation, all data are latched and remain
unchanged until the output latch is rewritten.
When the PA structures are open drain NMOS type, it
should be noted that, before reading data from the pads,
a ²1² should be written to the related bits to disable the
NMOS device. That is executing first the instruction
²SET [m].i² (i=0~7 for PA) to disable related NMOS device, and then ²MOV A, [m]² to get stable data.
After chip reset, these input lines remain at the high level
or are left floating (by options). Each bit of these output
latches can be set or cleared by the ²MOV [m], A²
(m=12H) instruction.
Rev. 1.10
PA1 Data
Register
PA0 Data
Register
0
0
PA0=BZ, PA1=BZ
1
0
PA0=BZ, PA1=0
X
1
PA0=0, PA1=0
PA0/PA1 Pad State
Note: ²X² stands for ²unused²
18
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
The PFD output signal function is controlled by the PA3 data register and the timer/event counter state. The PFD output
signal frequency is also dependent on the timer/event counter overflow period. The definitions of PFD control signal
and PFD output frequency are listed in the following table.
Timer
Timer Preload Value
PA3 Data Register
PA3 Pad State
PFD Frequency
OFF
X
0
U
X
OFF
X
1
0
X
ON
N
0
PFD
fINT/[2´(256-N)]
ON
N
1
0
X
Note:
²X² stands for unused
²U² stands for unknown
V
V
D a ta B u s
W r ite
D
D D
W e a k
P u ll- u p
C /N M O S
O p tio n
(P A 0 ~ P A 3 )
Q
C K
D D
O p tio n
(P A 0 ~ P A 3 )
V
P A 0 ~ P A 7
Q
S
D D
W e a k
P u ll- u p
C h ip R e s e t
D a ta b u s
P B 0 ~ P B 5
R e a d I/O
R e a
S y
W a k
(P A
d I/O
s te m
e -u p
o n ly )
O p tio n
PA Input/output ports
PB Input ports
memory. The LCD display memory can be read and
written to only by indirect addressing mode using MP1.
When data is written into the display data area, it is automatically read by the LCD driver which then generates
the corresponding LCD driving signals. To turn the display on or off, a ²1² or a ²0² is written to the corresponding bit of the display memory, respectively. The figure
illustrates the mapping between the display memory
and LCD pattern for the device.
LCD display memory
The device provides an area of embedded data memory
for LCD display. This area is located from 40H to 52H of
the RAM at Bank 1. Bank pointer (BP; located at 04H of
the RAM) is the switch between the RAM and the LCD
display memory. When the BP is set as ²01H², any data
written into 40H~52H will effect the LCD display. When
the BP is cleared to ²00H², any data written into
40H~52H means to access the general purpose data
C O M
4 0 H
4 1 H
4 2 H
4 3 H
5 0
5 1
5 2
B it
0
0
1
1
2
2
3
3
S E G M E N T
0
1
2
3
1 6
1 7
1 8
Display memory
Rev. 1.10
19
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
is selected, no external capacitor is required. If the ²C²
bias type is selected, a capacitor mounted between C1
and C2 pins is needed. The bias voltage of LCD driver
can be 1/2 bias or 1/3 bias by options.
LCD driver output
The output number of the device LCD driver can be 19´2
or 19´3 or 18´4 by options (i.e., 1/2 duty, 1/3 duty or 1/4
duty). The bias type of LCD driver can be ²R² type (for
HT49R30A-1/HT49C30-1) or ²C² type. If the ²R² bias type
D u r in g a r e s e t p u ls e
V A
C O M 0 ,C O M 1 ,C O M 2
A ll L C D
V B
V S S
V A
V B
V S S
d r iv e r o u tp u ts
N o r m a l o p e r a tio n m o d e
*
*
*
C O M 0
C O M 1
C O M 2 *
L C D s e g m e n ts O N
C O M 0 ,1 ,2 s id e s a r e u n lig h te d
O n ly L C D s e g m e n ts O N
C O M 0 s id e a r e lig h te d
O n ly L C D s e g m e n ts O N
C O M 1 s id e a r e lig h te d
O n ly L C D s e g m e n ts O N
C O M 2 s id e a r e lig h te d
L C D s e g m e n ts O N
C O M 0 ,1 s id e s a r e lig h te d
L C D
s e g m e n ts O N
C O M 0 , 2 s id e s a r e lig h te d
L C D s e g m e n ts O N
C O M 1 ,2 s id e s a r e lig h te d
L C D s e g m e n ts O N
C O M 0 ,1 ,2 s id e s a r e lig h te d
H A L T M o d e
S
S
S
S
S
S
S
S
S
S
S
V A
C O M 0 ,C O M 1 ,C O M 2 *
V B
V S S
V A
V B
V S S
A ll L C D d r iv e r o u tp u ts
N o te :
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
V A
V B
V S
" * " O m it th e C O M 2 s ig n a l, if th e 1 /2 d u ty L C D is u s e d .
V A = V L C D , V B = 1 /2 V L C D fo r H T 4 9 R 3 0 A -1 /H T 4 9 C 3 0 -1
V A = 2 V 2 , V B = V 2 , C ty p e fo r H T 4 9 C 3 0 L
LCD driver output (1/3 duty, 1/2 bias, R/C type)
Rev. 1.10
20
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
V A
V B
C O M 0
V C
V S S
V A
V B
C O M 1
V C
V S S
V A
V B
C O M 2
V C
V S S
V A
V B
C O M 3
V C
V S S
V A
V B
L C D s e g m e n ts O N
C O M 2 s id e lig h te d
V C
V S S
N o te : 1 /4 d u ty , 1 /3 b ia s , C ty p e : " V A " 3 /2 V L C D , " V B " V L C D , " V C " 1 /2 V L C D
1 /4 d u ty , 1 /3 b ia s , R ty p e : " V A " V L C D , " V B " 2 /3 V L C D , " V C " 1 /3 V L C D
1 /3 b ia s o n ly fo r H T 4 9 R 3 0 A - 1 /H T 4 9 C 3 0 - 1
LCD driver output
The LVR has the same effect or function with the external RES signal which performs chip reset. During HALT
state, LVR is disabled.
Low voltage reset/detector functions for
HT49R30A-1/HT49C30-1
There is a low voltage detector (LVD) and a low voltage
reset circuit (LVR) implemented in the microcontroller.
These two functions can be enabled/disabled by options. Once the options of LVD is enabled, the user can
use the RTCC.3 to enable/disable (1/0) the LVD circuit
and read the LVD detector status (0/1) from RTCC.5;
otherwise, the LVD function is disabled.
Register
RTCC
(09H)
Bit No.
Label
Read/Write
The definitions of RTCC register are listed in the following table.
Reset
Function
8 to 1 multiplexer control inputs to select the real
clock prescaler output
0~2
RT0~RT2
R/W
111B
3
LVDC*
R/W
0
LVD enable/disable (1/0)
4
QOSC
R/W
0
32768Hz OSC quick start-up oscillating
0/1: quickly/slowly start
5
LVDO*
R
0
LVD detection output (1/0)
1: low voltage detected
6~7
¾
¾
¾
Unused bit, read as ²0²
Note: ²*² For HT49R30A-1/HT49C30-1
Rev. 1.10
21
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Options
The following shows the options in the device. All these options should be defined in order to ensure proper functioning
system.
Options
OSC type selection.
This option is to determine whether an RC or crystal or 32768Hz crystal oscillator is chosen as system clock.
WDT Clock source selection.
RTC and Time Base. There are three types of selection: system clock/4 or RTC OSC or WDT OSC.
WDT enable/disable selection.
WDT can be enabled or disabled by options.
CLR WDT times selection.
This option defines how to clear the WDT by instruction. ²One time² means that the ²CLR WDT² can clear the WDT.
²Two times² means that if both of the ²CLR WDT1² and ²CLR WDT2² have been executed, only then will the WDT be
cleared.
Time Base time-out period selection.
The Time Base time-out period ranges from clock/212 to clock/215 ²Clock² means the clock source selected by options.
Buzzer output frequency selection.
There are eight types of frequency signals for buzzer output: Clock/22~Clock/29. ²Clock² means the clock source selected by options.
Wake-up selection.
This option defines the wake-up capability. External I/O pins (PA only) all have the capability to wake-up the chip
from a HALT by a falling edge.
Pull-high selection.
This option is to decide whether the pull-high resistance is visible or not on the PA0~PA3. (PB and PA4~PA7 are always pull-high)
PA0~PA3 CMOS or NMOS selection.
The structure of PA0~PA3 4 bits can be selected as CMOS or NMOS individually. When the CMOS is selected, the
related pins only can be used for output operations. When the NMOS is selected, the related pins can be used for input or output operations. (PA4~PA7 are always NMOS)
Clock source selection of timer/event counter.
There are two types of selection: system clock or system clock/4.
I/O pins share with other functions selection.
PA0/BZ, PA1/BZ: PA0 and PA1 can be set as I/O pins or buzzer outputs.
PA3/PFD: PA3 can be set as I/O pins or PFD output.
LCD common selection.
There are three types of selection: 2 common (1/2 duty) or 3 common (1/3 duty) or 4 common (1/4 duty). If the 4 common is selected, the segment output pin ²SEG18² will be set as a common output.
LCD bias power supply selection.
There are two types of selection: 1/2 bias or 1/3 bias for HT49R30A-1/HT49C30-1.
LCD bias type selection.
This option is to determine what kind of bias is selected, R type or C type for HT49R30A-1/HT49C30-1, C type for
HT49C30L.
LCD driver clock selection.
There are seven types of frequency signals for the LCD driver circuits: fS/22~fS/28.
²fS² means the clock source selection by options.
LCD ON/OFF at HALT selection
LVR selection.
LVR has enable or disable options for HT49R30A-1/HT49C30-1
LVD selection.
LVD has enable or disable options for HT49R30A-1/HT49C30-1
Rev. 1.10
22
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Application Circuits
RC oscillator application
V
Crystal oscillator application
D D
C 1
4 7 0 p F
O S C 1
O S C 1
2 4 k W
~ 1 M W
fS
Y S
V
S E G 0 ~ 1 7
C O M 0 ~ 3
D D
L C D
P A N E L
S E G 0 ~ 1 7
C O M 0 ~ 3
C 2
L C D
P A N E L
O S C 2
/4
V L C D
O S C 2
V
L C D P o w e r
S u p p ly
V L C D
V
D D
C 1
1 0 0 k W
0 .1 m F
0 .1 m F
C 2
R E S
R E S
H T 4 9 R 3 0 A -1 /
H T 4 9 C 3 0 -1
0 .1 m F
C 1
1 0 0 k W
C 2
1 0 k W
D D
L C D P o w e r
S u p p ly
V 1
H T 4 9 R 3 0 A -1 /
H T 4 9 C 3 0 -1
1 0 k W
0 .1 m F
0 .1 m F
V 2
V 2
0 .1 m F
O S C 4
P A 0 ~ P A 7
IN T 0
IN T 0
P B 0 ~ P B 5
IN T 1
0 .1 m F
0 .1 m F
O S C 3
O S C 3
O S C 4
V 1
P A 0 ~ P A 7
P B 0 ~ P B 5
IN T 1
T M R
T M R
32768Hz crystal oscillator application
O S C 1
O S C 2
V
D D
S E G 0 ~ 1 7
C O M 0 ~ 3
V L C D
1 0 0 k W
C 1
R E S
1 0 k W
L C D
P A N E L
L C D P o w e r
S u p p ly
0 .1 m F
C 2
H T 4 9 R 3 0 A -1 /
H T 4 9 C 3 0 -1
0 .1 m F
O S C 3
V 1
V 2
0 .1 m F
0 .1 m F
O S C 4
IN T 0
P A 0 ~ P A 7
IN T 1
T M R
Note:
P B 0 ~ P B 5
C1=C2=300pF if fSYS < 1MHz, Otherwise, C1=C2=0
The resistance and capacitance for reset circuit should be designed in such a way as to ensure that the VDD is
stable and remains within a valid operating voltage range before bringing RES to high.
Rev. 1.10
23
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
RC oscillator application
V
Crystal oscillator application
D D
2 0 0 p F
4 7 0 p F
O S C 1
O S C 1
5 6 0 k W
~ 1 M W
V
S E G 0 ~ 1 7
C O M 0 ~ 3
D D
L C D
P A N E L
S E G 0 ~ 1 7
C O M 0 ~ 3
2 0 0 p F
O S C 2
V L C D
V L C D
fS
Y S
L C D
P A N E L
/4
V
0 .1 m F
0 .1 m F
O S C 2
V
D D
C 1
1 0 0 k W
0 .1 m F
C 1
1 0 0 k W
C 2
0 .1 m F
C 2
R E S
R E S
H T 4 9 C 3 0 L
0 .1 m F
D D
V 1
O S C 4
IN T 0
IN T 1
0 .1 m F
V 2
O S C 3
V
H T 4 9 C 3 0 L
0 .1 m F
D D
P A 0 ~ P A 7
O S C 3
V 2
O S C 4
P A 0 ~ P A 7
IN T 0
P B 0 ~ P B 5
V 1
V
0 .1 m F
D D
P B 0 ~ P B 5
IN T 1
T M R
T M R
32768Hz crystal oscillator application
O S C 1
O S C 2
V
S E G 0 ~ 1 7
C O M 0 ~ 3
L C D
P A N E L
V L C D
D D
0 .1 m F
1 0 0 k W
C 1
R E S
1 0 k W
0 .1 m F
C 2
H T 4 9 C 3 0 L
0 .1 m F
V 1
0 .1 m F
O S C 3
O S C 4
IN T 0
V 2
V
D D
P A 0 ~ P A 7
IN T 1
T M R
Note:
P B 0 ~ P B 5
The resistance and capacitance for reset circuit should be designed in such a way as to ensure that the VDD is
stable and remains within a valid operating voltage range before bringing RES to high.
Rev. 1.10
24
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Instruction Set Summary
Description
Instruction
Cycle
Flag
Affected
Add data memory to ACC
Add ACC to data memory
Add immediate data to ACC
Add data memory to ACC with carry
Add ACC to data memory with carry
Subtract immediate data from ACC
Subtract data memory from ACC
Subtract data memory from ACC with result in data memory
Subtract data memory from ACC with carry
Subtract data memory from ACC with carry and result in data memory
Decimal adjust ACC for addition with result in data memory
1
1(1)
1
1
1(1)
1
1
1(1)
1
1(1)
1(1)
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
Z,C,AC,OV
C
1
1
1
1(1)
1(1)
1(1)
1
1
1
1(1)
1
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Increment data memory with result in ACC
Increment data memory
Decrement data memory with result in ACC
Decrement data memory
1
1(1)
1
1(1)
Z
Z
Z
Z
Rotate data memory right with result in ACC
Rotate data memory right
Rotate data memory right through carry with result in ACC
Rotate data memory right through carry
Rotate data memory left with result in ACC
Rotate data memory left
Rotate data memory left through carry with result in ACC
Rotate data memory left through carry
1
1(1)
1
1(1)
1
1(1)
1
1(1)
None
None
C
C
None
None
C
C
Move data memory to ACC
Move ACC to data memory
Move immediate data to ACC
1
1(1)
1
None
None
None
Clear bit of data memory
Set bit of data memory
1(1)
1(1)
None
None
Mnemonic
Arithmetic
ADD A,[m]
ADDM A,[m]
ADD A,x
ADC A,[m]
ADCM A,[m]
SUB A,x
SUB A,[m]
SUBM A,[m]
SBC A,[m]
SBCM A,[m]
DAA [m]
Logic Operation
AND A,[m]
OR A,[m]
XOR A,[m]
ANDM A,[m]
ORM A,[m]
XORM A,[m]
AND A,x
OR A,x
XOR A,x
CPL [m]
CPLA [m]
AND data memory to ACC
OR data memory to ACC
Exclusive-OR data memory to ACC
AND ACC to data memory
OR ACC to data memory
Exclusive-OR ACC to data memory
AND immediate data to ACC
OR immediate data to ACC
Exclusive-OR immediate data to ACC
Complement data memory
Complement data memory with result in ACC
Increment & Decrement
INCA [m]
INC [m]
DECA [m]
DEC [m]
Rotate
RRA [m]
RR [m]
RRCA [m]
RRC [m]
RLA [m]
RL [m]
RLCA [m]
RLC [m]
Data Move
MOV A,[m]
MOV [m],A
MOV A,x
Bit Operation
CLR [m].i
SET [m].i
Rev. 1.10
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HT49R30A-1/HT49C30-1/HT49C30L
Instruction
Cycle
Flag
Affected
Jump unconditionally
Skip if data memory is zero
Skip if data memory is zero with data movement to ACC
Skip if bit i of data memory is zero
Skip if bit i of data memory is not zero
Skip if increment data memory is zero
Skip if decrement data memory is zero
Skip if increment data memory is zero with result in ACC
Skip if decrement data memory is zero with result in ACC
Subroutine call
Return from subroutine
Return from subroutine and load immediate data to ACC
Return from interrupt
2
1(2)
1(2)
1(2)
1(2)
1(3)
1(3)
1(2)
1(2)
2
2
2
2
None
None
None
None
None
None
None
None
None
None
None
None
None
Read ROM code (current page) to data memory and TBLH
Read ROM code (last page) to data memory and TBLH
2(1)
2(1)
None
None
No operation
Clear data memory
Set data memory
Clear Watchdog Timer
Pre-clear Watchdog Timer
Pre-clear Watchdog Timer
Swap nibbles of data memory
Swap nibbles of data memory with result in ACC
Enter power down mode
1
1(1)
1(1)
1
1
1
1(1)
1
1
None
None
None
TO,PD
TO(4),PD(4)
TO(4),PD(4)
None
None
TO,PD
Mnemonic
Description
Branch
JMP addr
SZ [m]
SZA [m]
SZ [m].i
SNZ [m].i
SIZ [m]
SDZ [m]
SIZA [m]
SDZA [m]
CALL addr
RET
RET A,x
RETI
Table Read
TABRDC [m]
TABRDL [m]
Miscellaneous
NOP
CLR [m]
SET [m]
CLR WDT
CLR WDT1
CLR WDT2
SWAP [m]
SWAPA [m]
HALT
Note:
x: Immediate data
m: Data memory address
A: Accumulator
i: 0~7 number of bits
addr: Program memory address
Ö: Flag is affected
-: Flag is not affected
(1)
: If a loading to the PCL register occurs, the execution cycle of instructions will be delayed for one more cycle
(four system clocks).
(2)
: If a skipping to the next instruction occurs, the execution cycle of instructions will be delayed for one more
cycle (four system clocks). Otherwise the original instruction cycle is unchanged.
(3) (1)
:
(4)
Rev. 1.10
and (2)
: The flags may be affected by the execution status. If the Watchdog Timer is cleared by executing the
CLR WDT1 or CLR WDT2 instruction, the TO and PD are cleared.
Otherwise the TO and PD flags remain unchanged.
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HT49R30A-1/HT49C30-1/HT49C30L
Instruction Definition
ADC A,[m]
Add data memory and carry to the accumulator
Description
The contents of the specified data memory, accumulator and the carry flag are added simultaneously, leaving the result in the accumulator.
Operation
ACC ¬ ACC+[m]+C
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
ADCM A,[m]
Add the accumulator and carry to data memory
Description
The contents of the specified data memory, accumulator and the carry flag are added simultaneously, leaving the result in the specified data memory.
Operation
[m] ¬ ACC+[m]+C
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
ADD A,[m]
Add data memory to the accumulator
Description
The contents of the specified data memory and the accumulator are added. The result is
stored in the accumulator.
Operation
ACC ¬ ACC+[m]
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
ADD A,x
Add immediate data to the accumulator
Description
The contents of the accumulator and the specified data are added, leaving the result in the
accumulator.
Operation
ACC ¬ ACC+x
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
ADDM A,[m]
Add the accumulator to the data memory
Description
The contents of the specified data memory and the accumulator are added. The result is
stored in the data memory.
Operation
[m] ¬ ACC+[m]
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
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HT49R30A-1/HT49C30-1/HT49C30L
AND A,[m]
Logical AND accumulator with data memory
Description
Data in the accumulator and the specified data memory perform a bitwise logical_AND operation. The result is stored in the accumulator.
Operation
ACC ¬ ACC ²AND² [m]
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
AND A,x
Logical AND immediate data to the accumulator
Description
Data in the accumulator and the specified data perform a bitwise logical_AND operation.
The result is stored in the accumulator.
Operation
ACC ¬ ACC ²AND² x
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
ANDM A,[m]
Logical AND data memory with the accumulator
Description
Data in the specified data memory and the accumulator perform a bitwise logical_AND operation. The result is stored in the data memory.
Operation
[m] ¬ ACC ²AND² [m]
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
CALL addr
Subroutine call
Description
The instruction unconditionally calls a subroutine located at the indicated address. The
program counter increments once to obtain the address of the next instruction, and pushes
this onto the stack. The indicated address is then loaded. Program execution continues
with the instruction at this address.
Operation
Stack ¬ PC+1
PC ¬ addr
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
CLR [m]
Clear data memory
Description
The contents of the specified data memory are cleared to 0.
Operation
[m] ¬ 00H
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
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HT49R30A-1/HT49C30-1/HT49C30L
CLR [m].i
Clear bit of data memory
Description
The bit i of the specified data memory is cleared to 0.
Operation
[m].i ¬ 0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
CLR WDT
Clear Watchdog Timer
Description
The WDT is cleared (clears the WDT). The power down bit (PD) and time-out bit (TO) are
cleared.
Operation
WDT ¬ 00H
PD and TO ¬ 0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
0
0
¾
¾
¾
¾
CLR WDT1
Preclear Watchdog Timer
Description
Together with CLR WDT2, clears the WDT. PD and TO are also cleared. Only execution of
this instruction without the other preclear instruction just sets the indicated flag which implies this instruction has been executed and the TO and PD flags remain unchanged.
Operation
WDT ¬ 00H*
PD and TO ¬ 0*
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
0*
0*
¾
¾
¾
¾
CLR WDT2
Preclear Watchdog Timer
Description
Together with CLR WDT1, clears the WDT. PD and TO are also cleared. Only execution of
this instruction without the other preclear instruction, sets the indicated flag which implies
this instruction has been executed and the TO and PD flags remain unchanged.
Operation
WDT ¬ 00H*
PD and TO ¬ 0*
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
0*
0*
¾
¾
¾
¾
CPL [m]
Complement data memory
Description
Each bit of the specified data memory is logically complemented (1¢s complement). Bits
which previously contained a 1 are changed to 0 and vice-versa.
Operation
[m] ¬ [m]
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
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HT49R30A-1/HT49C30-1/HT49C30L
CPLA [m]
Complement data memory and place result in the accumulator
Description
Each bit of the specified data memory is logically complemented (1¢s complement). Bits
which previously contained a 1 are changed to 0 and vice-versa. The complemented result
is stored in the accumulator and the contents of the data memory remain unchanged.
Operation
ACC ¬ [m]
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
DAA [m]
Decimal-Adjust accumulator for addition
Description
The accumulator value is adjusted to the BCD (Binary Coded Decimal) code. The accumulator is divided into two nibbles. Each nibble is adjusted to the BCD code and an internal
carry (AC1) will be done if the low nibble of the accumulator is greater than 9. The BCD adjustment is done by adding 6 to the original value if the original value is greater than 9 or a
carry (AC or C) is set; otherwise the original value remains unchanged. The result is stored
in the data memory and only the carry flag (C) may be affected.
Operation
If ACC.3~ACC.0 >9 or AC=1
then [m].3~[m].0 ¬ (ACC.3~ACC.0)+6, AC1=AC
else [m].3~[m].0 ¬ (ACC.3~ACC.0), AC1=0
and
If ACC.7~ACC.4+AC1 >9 or C=1
then [m].7~[m].4 ¬ ACC.7~ACC.4+6+AC1,C=1
else [m].7~[m].4 ¬ ACC.7~ACC.4+AC1,C=C
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
Ö
DEC [m]
Decrement data memory
Description
Data in the specified data memory is decremented by 1.
Operation
[m] ¬ [m]-1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
DECA [m]
Decrement data memory and place result in the accumulator
Description
Data in the specified data memory is decremented by 1, leaving the result in the accumulator. The contents of the data memory remain unchanged.
Operation
ACC ¬ [m]-1
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
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HT49R30A-1/HT49C30-1/HT49C30L
HALT
Enter power down mode
Description
This instruction stops program execution and turns off the system clock. The contents of
the RAM and registers are retained. The WDT and prescaler are cleared. The power down
bit (PD) is set and the WDT time-out bit (TO) is cleared.
Operation
PC ¬ PC+1
PD ¬ 1
TO ¬ 0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
0
1
¾
¾
¾
¾
INC [m]
Increment data memory
Description
Data in the specified data memory is incremented by 1
Operation
[m] ¬ [m]+1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
INCA [m]
Increment data memory and place result in the accumulator
Description
Data in the specified data memory is incremented by 1, leaving the result in the accumulator. The contents of the data memory remain unchanged.
Operation
ACC ¬ [m]+1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
JMP addr
Directly jump
Description
The program counter are replaced with the directly-specified address unconditionally, and
control is passed to this destination.
Operation
PC ¬addr
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
MOV A,[m]
Move data memory to the accumulator
Description
The contents of the specified data memory are copied to the accumulator.
Operation
ACC ¬ [m]
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
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HT49R30A-1/HT49C30-1/HT49C30L
MOV A,x
Move immediate data to the accumulator
Description
The 8-bit data specified by the code is loaded into the accumulator.
Operation
ACC ¬ x
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
MOV [m],A
Move the accumulator to data memory
Description
The contents of the accumulator are copied to the specified data memory (one of the data
memories).
Operation
[m] ¬ACC
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
NOP
No operation
Description
No operation is performed. Execution continues with the next instruction.
Operation
PC ¬ PC+1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
OR A,[m]
Logical OR accumulator with data memory
Description
Data in the accumulator and the specified data memory (one of the data memories) perform a bitwise logical_OR operation. The result is stored in the accumulator.
Operation
ACC ¬ ACC ²OR² [m]
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
OR A,x
Logical OR immediate data to the accumulator
Description
Data in the accumulator and the specified data perform a bitwise logical_OR operation.
The result is stored in the accumulator.
Operation
ACC ¬ ACC ²OR² x
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
ORM A,[m]
Logical OR data memory with the accumulator
Description
Data in the data memory (one of the data memories) and the accumulator perform a
bitwise logical_OR operation. The result is stored in the data memory.
Operation
[m] ¬ACC ²OR² [m]
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
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HT49R30A-1/HT49C30-1/HT49C30L
RET
Return from subroutine
Description
The program counter is restored from the stack. This is a 2-cycle instruction.
Operation
PC ¬ Stack
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
RET A,x
Return and place immediate data in the accumulator
Description
The program counter is restored from the stack and the accumulator loaded with the specified 8-bit immediate data.
Operation
PC ¬ Stack
ACC ¬ x
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
RETI
Return from interrupt
Description
The program counter is restored from the stack, and interrupts are enabled by setting the
EMI bit. EMI is the enable master (global) interrupt bit.
Operation
PC ¬ Stack
EMI ¬ 1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
RL [m]
Rotate data memory left
Description
The contents of the specified data memory are rotated 1 bit left with bit 7 rotated into bit 0.
Operation
[m].(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6)
[m].0 ¬ [m].7
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
RLA [m]
Rotate data memory left and place result in the accumulator
Description
Data in the specified data memory is rotated 1 bit left with bit 7 rotated into bit 0, leaving the
rotated result in the accumulator. The contents of the data memory remain unchanged.
Operation
ACC.(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6)
ACC.0 ¬ [m].7
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
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HT49R30A-1/HT49C30-1/HT49C30L
RLC [m]
Rotate data memory left through carry
Description
The contents of the specified data memory and the carry flag are rotated 1 bit left. Bit 7 replaces the carry bit; the original carry flag is rotated into the bit 0 position.
Operation
[m].(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6)
[m].0 ¬ C
C ¬ [m].7
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
Ö
RLCA [m]
Rotate left through carry and place result in the accumulator
Description
Data in the specified data memory and the carry flag are rotated 1 bit left. Bit 7 replaces the
carry bit and the original carry flag is rotated into bit 0 position. The rotated result is stored
in the accumulator but the contents of the data memory remain unchanged.
Operation
ACC.(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6)
ACC.0 ¬ C
C ¬ [m].7
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
Ö
RR [m]
Rotate data memory right
Description
The contents of the specified data memory are rotated 1 bit right with bit 0 rotated to bit 7.
Operation
[m].i ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6)
[m].7 ¬ [m].0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
RRA [m]
Rotate right and place result in the accumulator
Description
Data in the specified data memory is rotated 1 bit right with bit 0 rotated into bit 7, leaving
the rotated result in the accumulator. The contents of the data memory remain unchanged.
Operation
ACC.(i) ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6)
ACC.7 ¬ [m].0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
RRC [m]
Rotate data memory right through carry
Description
The contents of the specified data memory and the carry flag are together rotated 1 bit
right. Bit 0 replaces the carry bit; the original carry flag is rotated into the bit 7 position.
Operation
[m].i ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6)
[m].7 ¬ C
C ¬ [m].0
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
Ö
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HT49R30A-1/HT49C30-1/HT49C30L
RRCA [m]
Rotate right through carry and place result in the accumulator
Description
Data of the specified data memory and the carry flag are rotated 1 bit right. Bit 0 replaces
the carry bit and the original carry flag is rotated into the bit 7 position. The rotated result is
stored in the accumulator. The contents of the data memory remain unchanged.
Operation
ACC.i ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6)
ACC.7 ¬ C
C ¬ [m].0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
Ö
SBC A,[m]
Subtract data memory and carry from the accumulator
Description
The contents of the specified data memory and the complement of the carry flag are subtracted from the accumulator, leaving the result in the accumulator.
Operation
ACC ¬ ACC+[m]+C
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
SBCM A,[m]
Subtract data memory and carry from the accumulator
Description
The contents of the specified data memory and the complement of the carry flag are subtracted from the accumulator, leaving the result in the data memory.
Operation
[m] ¬ ACC+[m]+C
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
SDZ [m]
Skip if decrement data memory is 0
Description
The contents of the specified data memory are decremented by 1. If the result is 0, the next
instruction is skipped. If the result is 0, the following instruction, fetched during the current
instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle).
Operation
Skip if ([m]-1)=0, [m] ¬ ([m]-1)
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SDZA [m]
Decrement data memory and place result in ACC, skip if 0
Description
The contents of the specified data memory are decremented by 1. If the result is 0, the next
instruction is skipped. The result is stored in the accumulator but the data memory remains
unchanged. If the result is 0, the following instruction, fetched during the current instruction
execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle).
Operation
Skip if ([m]-1)=0, ACC ¬ ([m]-1)
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
35
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
SET [m]
Set data memory
Description
Each bit of the specified data memory is set to 1.
Operation
[m] ¬ FFH
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SET [m]. i
Set bit of data memory
Description
Bit i of the specified data memory is set to 1.
Operation
[m].i ¬ 1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SIZ [m]
Skip if increment data memory is 0
Description
The contents of the specified data memory are incremented by 1. If the result is 0, the following instruction, fetched during the current instruction execution, is discarded and a
dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with
the next instruction (1 cycle).
Operation
Skip if ([m]+1)=0, [m] ¬ ([m]+1)
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SIZA [m]
Increment data memory and place result in ACC, skip if 0
Description
The contents of the specified data memory are incremented by 1. If the result is 0, the next
instruction is skipped and the result is stored in the accumulator. The data memory remains unchanged. If the result is 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper
instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle).
Operation
Skip if ([m]+1)=0, ACC ¬ ([m]+1)
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SNZ [m].i
Skip if bit i of the data memory is not 0
Description
If bit i of the specified data memory is not 0, the next instruction is skipped. If bit i of the data
memory is not 0, the following instruction, fetched during the current instruction execution,
is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle).
Operation
Skip if [m].i¹0
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
36
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
SUB A,[m]
Subtract data memory from the accumulator
Description
The specified data memory is subtracted from the contents of the accumulator, leaving the
result in the accumulator.
Operation
ACC ¬ ACC+[m]+1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
SUBM A,[m]
Subtract data memory from the accumulator
Description
The specified data memory is subtracted from the contents of the accumulator, leaving the
result in the data memory.
Operation
[m] ¬ ACC+[m]+1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
SUB A,x
Subtract immediate data from the accumulator
Description
The immediate data specified by the code is subtracted from the contents of the accumulator, leaving the result in the accumulator.
Operation
ACC ¬ ACC+x+1
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
Ö
Ö
Ö
Ö
SWAP [m]
Swap nibbles within the data memory
Description
The low-order and high-order nibbles of the specified data memory (1 of the data memories) are interchanged.
Operation
[m].3~[m].0 « [m].7~[m].4
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SWAPA [m]
Swap data memory and place result in the accumulator
Description
The low-order and high-order nibbles of the specified data memory are interchanged, writing the result to the accumulator. The contents of the data memory remain unchanged.
Operation
ACC.3~ACC.0 ¬ [m].7~[m].4
ACC.7~ACC.4 ¬ [m].3~[m].0
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
37
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
SZ [m]
Skip if data memory is 0
Description
If the contents of the specified data memory are 0, the following instruction, fetched during
the current instruction execution, is discarded and a dummy cycle is replaced to get the
proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle).
Operation
Skip if [m]=0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SZA [m]
Move data memory to ACC, skip if 0
Description
The contents of the specified data memory are copied to the accumulator. If the contents is
0, the following instruction, fetched during the current instruction execution, is discarded
and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed
with the next instruction (1 cycle).
Operation
Skip if [m]=0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
SZ [m].i
Skip if bit i of the data memory is 0
Description
If bit i of the specified data memory is 0, the following instruction, fetched during the current
instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle).
Operation
Skip if [m].i=0
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
TABRDC [m]
Move the ROM code (current page) to TBLH and data memory
Description
The low byte of ROM code (current page) addressed by the table pointer (TBLP) is moved
to the specified data memory and the high byte transferred to TBLH directly.
Operation
[m] ¬ ROM code (low byte)
TBLH ¬ ROM code (high byte)
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
TABRDL [m]
Move the ROM code (last page) to TBLH and data memory
Description
The low byte of ROM code (last page) addressed by the table pointer (TBLP) is moved to
the data memory and the high byte transferred to TBLH directly.
Operation
[m] ¬ ROM code (low byte)
TBLH ¬ ROM code (high byte)
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
¾
¾
¾
38
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
XOR A,[m]
Logical XOR accumulator with data memory
Description
Data in the accumulator and the indicated data memory perform a bitwise logical Exclusive_OR operation and the result is stored in the accumulator.
Operation
ACC ¬ ACC ²XOR² [m]
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
XORM A,[m]
Logical XOR data memory with the accumulator
Description
Data in the indicated data memory and the accumulator perform a bitwise logical Exclusive_OR operation. The result is stored in the data memory. The 0 flag is affected.
Operation
[m] ¬ ACC ²XOR² [m]
Affected flag(s)
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
XOR A,x
Logical XOR immediate data to the accumulator
Description
Data in the accumulator and the specified data perform a bitwise logical Exclusive_OR operation. The result is stored in the accumulator. The 0 flag is affected.
Operation
ACC ¬ ACC ²XOR² x
Affected flag(s)
Rev. 1.10
TC2
TC1
TO
PD
OV
Z
AC
C
¾
¾
¾
¾
¾
Ö
¾
¾
39
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Package Information
48-pin SSOP (300mil) outline dimensions
4 8
2 5
A
B
2 4
1
C
C '
G
H
D
E
Symbol
Rev. 1.10
a
F
Dimensions in mil
Min.
Nom.
Max.
A
395
¾
420
B
291
¾
299
C
8
¾
12
C¢
613
¾
637
D
85
¾
99
E
¾
25
¾
F
4
¾
10
G
25
¾
35
H
4
¾
12
a
0°
¾
8°
40
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Product Tape and Reel Specifications
Reel dimensions
,
6
)
+
*
6 SSOP 48W
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330±1.0
B
Reel Inner Diameter
100±0.1
C
Spindle Hole Diameter
13.0+0.5
-0.2
D
Key Slit Width
2.0±0.5
T1
Space Between Flange
32.2+0.3
-0.2
T2
Reel Thickness
38.2±0.2
Rev. 1.10
41
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Carrier tape dimensions
P 0
D
P 1
t
E
F
W
D 1
C
B 0
K 1
P
K 2
A 0
SSOP 48W
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
32.0±0.3
P
Cavity Pitch
16.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
14.2±0.1
D
Perforation Diameter
2.0 Min.
D1
Cavity Hole Diameter
1.5+0.25
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
12.0±0.1
B0
Cavity Width
16.20±0.1
K1
Cavity Depth
2.4±0.1
K2
Cavity Depth
3.2±0.1
t
Carrier Tape Thickness
C
Cover Tape Width
Rev. 1.10
0.35±0.05
25.5
42
September 25, 2002
HT49R30A-1/HT49C30-1/HT49C30L
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science-based Industrial Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Sales Office)
11F, No.576, Sec.7 Chung Hsiao E. Rd., Taipei, Taiwan
Tel: 886-2-2782-9635
Fax: 886-2-2782-9636
Fax: 886-2-2782-7128 (International sales hotline)
Holtek Semiconductor (Shanghai) Inc.
7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China
Tel: 021-6485-5560
Fax: 021-6485-0313
http://www.holtek.com.cn
Holtek Semiconductor (Hong Kong) Ltd.
RM.711, Tower 2, Cheung Sha Wan Plaza, 833 Cheung Sha Wan Rd., Kowloon, Hong Kong
Tel: 852-2-745-8288
Fax: 852-2-742-8657
Holmate Semiconductor, Inc.
48531 Warm Springs Boulevard, Suite 413, Fremont, CA 94539
Tel: 510-252-9880
Fax: 510-252-9885
http://www.holmate.com
Copyright Ó 2002 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek reserves the right to alter its products without prior notification. For the most
up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.10
43
September 25, 2002