AG103 The Communications Edge TM High Dynamic Range Gain Block Product Features • • • • • • • • 50 – 870 MHz 13 dB Gain 3 dB Noise Figure >+36 dBm OIP3 +20 dBm P1dB Single +5 Bias Supply Internally matched to 50 Ω Lead-free/Green/RoHScompliant SOT-89 Package • MTTF > 1000 years Product Description Functional Diagram The AG103 is a general-purpose gain block that offers good dynamic range and low noise figure in a low-cost surfacemount package. The combination of high OIP3 and tight gain variation window makes it attractive for a multitude of applications. The device combines dependable performance with superb quality to maintain MTTF values exceeding 1000 years at mounting temperatures of +85°C and is available in both the standard SOT-89 package and the environmentally-friendly lead-free/green/RoHS-compliant and green SOT-89 package. All devices are 100% RF & DC tested. GND The AG103 uses a high reliability GaAs MMIC technology and only requires DC-blocking and bypass capacitors, and an inductive RF choke for operation. Internal matching provides a 50 ohm input / output impedance minimizing the number of required external components. Applications • • • • Product Information Mobile Infrastructure CATV / DBS Defense / Homeland Security NMT-450 Infrastructure 4 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 The AG103 GaAs MMIC amplifier is well suited for wireless infrastructure such as NMT-450, homeland security, and 2nd generation mobile infrastructure utilizing the cellular band. In addition, the amplifier can be used for applications in various IF frequency bands. Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 Noise Figure Operating Current Range Supply Voltage Units Min MHz MHz dB dB dB dBm dBm dB mA V 50 12 +33 120 Typ Max Comment 870 800 12.9 10 20 +20 >+36 2.9 150 +5 14 See note 2 Pout = +5 dBm/tone, 10 MHz spacing. See note 2 180 1. Test conditions unless otherwise noted: T = 25º C, 50 Ω system. 2. S11 and Noise Figure can be improved using an optional input matching network (typically just a series inductor). Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage RF Input Power (continuous) Junction Temperature Rating -40 to +85 °C -55 to +150 °C +6 V +10 dBm +220° C Ordering Information Part No. AG103 AG103-G AG103-PCB Description GaAs MMIC Gain Block (leaded SOT-89 Pkg) GaAs MMIC Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) 200 – 600 MHz Fully Assembled Application Circuit Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 AG103 The Communications Edge TM High Dynamic Range Gain Block Product Information Typical Device Data S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25°C, unmatched 50 ohm system) Gain 16 Return Loss 0 14 Return Loss (dB) Gain (dB) -10 12 10 -20 -30 8 DB(|S[2,1]|) DB(|S[1,1]|) 6 DB(|S[2,2]|) -40 0 200 400 600 Frequency (MHz) 800 1000 0 200 400 600 Frequency (MHz) 800 1000 The device can be used as a gain block with no input or output matching. For optimal input return loss and noise figure performance, the amplifier can be slightly tuned for the frequency of operation as shown in the reference designs in this datasheet. S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25°C, calibrated to device leads) Freq (MHz) 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -11.30 -12.11 -12.46 -12.29 -12.35 -12.16 -12.14 -11.95 -11.88 -11.73 -11.60 -11.48 -11.26 -11.08 -10.90 -10.73 -10.51 -10.34 -30.04 -24.59 -25.65 -29.97 -32.81 -38.15 -42.37 -47.75 -52.03 -57.01 -61.03 -66.17 -70.02 -74.52 -79.00 -83.40 -87.42 -91.85 14.35 14.17 14.13 14.10 14.07 14.06 14.02 14.01 13.98 13.91 13.85 13.73 13.76 13.72 13.68 13.62 13.57 13.47 170.13 171.02 169.71 167.82 165.49 163.30 160.54 158.38 155.78 153.04 150.70 148.73 146.23 144.01 141.28 138.73 136.01 133.71 -20.20 -20.12 -20.08 -20.05 -19.99 -19.99 -20.01 -19.99 -20.01 -19.97 -19.95 -20.00 -20.03 -20.01 -19.93 -19.95 -19.94 -19.96 8.20 3.18 1.39 -0.31 -1.51 -2.59 -3.37 -4.74 -5.79 -6.12 -7.43 -8.03 -9.00 -9.46 -10.57 -11.34 -12.38 -12.95 -19.64 -22.19 -22.73 -23.12 -22.90 -23.03 -23.03 -22.80 -22.87 -22.90 -22.68 -22.48 -22.64 -22.19 -22.38 -22.12 -21.94 -21.78 -120.38 -142.79 -155.71 -160.90 -166.97 -167.62 -172.30 -173.68 -176.13 -176.83 179.96 178.91 177.09 176.83 175.26 173.64 172.78 171.76 Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 AG103 The Communications Edge TM High Dynamic Range Gain Block Product Information Application Circuit: 200 – 600 MHz (AG103-PCB) 15 0 S21 (dB) DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R) 14 -5 13 -10 12 -15 11 -20 10 -25 0 100 200 300 400 500 Frequency (MHz) 600 700 800 CAP ID=C5 C=10000 pF +5 V IND ID=L1 L=12 nH PORT P=1 Z=50 Ohm SUBCKT ID=S1 NET="AG103" IND ID=L2 L=390 nH size 0805 Notes: 1. The amplifier should be connected directly to a +5 V regulator; no dropping resistor is required. 2. If no DC signal is present at the input, C1 can be removed. The input is internally grounded in the amplifier. 3. C2, C3, C5, & R1 are not used in the circuit. R2 is shorted across with 0 Ω in the circuit. These placeholders shown in the silkscreen are for applications with other devices. Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness Reference Design: 70 MHz Reference Design: 900 MHz CAP ID=C5 C=1e4 pF IND ID=L2 L=270 nH +5 V CAP ID=C4 C=1000 pF CAP ID=C1 C=56 pF SUBCKT ID=S1 NET="AG103" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm DB(|S[1,1]|) * (R) -10 12 -15 -20 11 -20 -25 10 -10 12 -15 11 200 250 S21 (dB) 13 13 150 Frequency (MHz) DB(|S[2,2]|) * (R) -5 -5 10 DB(|S[2,1]|) * (L) 14 14 100 0 DB(|S[2,2]|) (R) S11, S22 (dB) S21 (dB) 15 0 50 PORT P=2 Z=50 Ohm IND ID=L3 L=15 nH 15 DB(|S[2,1]|) * (L) IND ID=L2 L=100 nH CAP ID=C4 C=100 pF CAP ID=C1 C=100 pF IND ID=L3 L=150 nH DB(|S[1,1]|) * (R) CAP ID=C5 C=10000 pF 600 700 800 900 1000 Frequency (MHz) 1100 S11, S22 (dB) SUBCKT ID=S1 NET="AG103" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm CAP ID=C4 C=1000 pF CAP ID=C1 C= 1000 pF +5 V S11, S22 (dB) Typical Performance 450 MHz S21 - Gain 13.5 dB S11 -23 dB S22 -14 dB Output P1dB +21 dBm Output IP3 +36 dBm Noise Figure 2.7 dB Bias +5 V @ 150 mA Frequency -25 1200 Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 AG103 The Communications Edge TM High Dynamic Range Gain Block Product Information AG103 (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The AG103 will be marked with an “AG103” designator. An alphanumeric lot code (“XXXX-X”) is also marked below the part designator on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes 1000V to <2000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85°C 59° C / W 129° C 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85°C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 °C. MTTF vs. GND Tab Temperature 1000 M T T F (m illio n h rs ) Thermal Specifications 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. 100 10 1 60 70 80 90 100 Tab Temperature (°C) 110 Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 AG103 The Communications Edge TM High Dynamic Range Gain Block Product Information AG103-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The AG103-G will be marked with “103G” designator. An alphanumeric code (“XXXX-X”) is also marked below part designator on the top surface of package. an lot the the Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes 1000V to <2000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85°C 59° C / W 129° C 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85°C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 °C. MTTF vs. GND Tab Temperature 1000 M T T F (m illio n h rs ) Thermal Specifications 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. 100 10 1 60 70 80 90 100 Tab Temperature (°C) 110 Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004