ETC AG103-PCB

AG103
The Communications Edge TM
High Dynamic Range Gain Block
Product Features
•
•
•
•
•
•
•
•
50 – 870 MHz
13 dB Gain
3 dB Noise Figure
>+36 dBm OIP3
+20 dBm P1dB
Single +5 Bias Supply
Internally matched to 50 Ω
Lead-free/Green/RoHScompliant SOT-89 Package
• MTTF > 1000 years
Product Description
Functional Diagram
The AG103 is a general-purpose gain block that offers good
dynamic range and low noise figure in a low-cost surfacemount package. The combination of high OIP3 and tight
gain variation window makes it attractive for a multitude of
applications. The device combines dependable performance
with superb quality to maintain MTTF values exceeding
1000 years at mounting temperatures of +85°C and is
available in both the standard SOT-89 package and the
environmentally-friendly lead-free/green/RoHS-compliant
and green SOT-89 package. All devices are 100% RF &
DC tested.
GND
The AG103 uses a high reliability GaAs MMIC technology
and only requires DC-blocking and bypass capacitors, and
an inductive RF choke for operation. Internal matching
provides a 50 ohm input / output impedance minimizing the
number of required external components.
Applications
•
•
•
•
Product Information
Mobile Infrastructure
CATV / DBS
Defense / Homeland Security
NMT-450 Infrastructure
4
1
2
3
RF IN
GND
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
The AG103 GaAs MMIC amplifier is well suited for
wireless infrastructure such as NMT-450, homeland
security, and 2nd generation mobile infrastructure utilizing
the cellular band. In addition, the amplifier can be used for
applications in various IF frequency bands.
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise Figure
Operating Current Range
Supply Voltage
Units
Min
MHz
MHz
dB
dB
dB
dBm
dBm
dB
mA
V
50
12
+33
120
Typ
Max
Comment
870
800
12.9
10
20
+20
>+36
2.9
150
+5
14
See note 2
Pout = +5 dBm/tone, 10 MHz spacing.
See note 2
180
1. Test conditions unless otherwise noted: T = 25º C, 50 Ω system.
2. S11 and Noise Figure can be improved using an optional input matching network (typically just a series inductor).
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 °C
-55 to +150 °C
+6 V
+10 dBm
+220° C
Ordering Information
Part No.
AG103
AG103-G
AG103-PCB
Description
GaAs MMIC Gain Block
(leaded SOT-89 Pkg)
GaAs MMIC Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
200 – 600 MHz Fully Assembled Application Circuit
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice.
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG103
The Communications Edge TM
High Dynamic Range Gain Block
Product Information
Typical Device Data
S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25°C, unmatched 50 ohm system)
Gain
16
Return Loss
0
14
Return Loss (dB)
Gain (dB)
-10
12
10
-20
-30
8
DB(|S[2,1]|)
DB(|S[1,1]|)
6
DB(|S[2,2]|)
-40
0
200
400
600
Frequency (MHz)
800
1000
0
200
400
600
Frequency (MHz)
800
1000
The device can be used as a gain block with no input or output matching. For optimal input return loss and noise figure performance, the
amplifier can be slightly tuned for the frequency of operation as shown in the reference designs in this datasheet.
S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25°C, calibrated to device leads)
Freq (MHz)
50
100
150
200
250
300
350
400
450
500
550
600
650
700
750
800
850
900
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-11.30
-12.11
-12.46
-12.29
-12.35
-12.16
-12.14
-11.95
-11.88
-11.73
-11.60
-11.48
-11.26
-11.08
-10.90
-10.73
-10.51
-10.34
-30.04
-24.59
-25.65
-29.97
-32.81
-38.15
-42.37
-47.75
-52.03
-57.01
-61.03
-66.17
-70.02
-74.52
-79.00
-83.40
-87.42
-91.85
14.35
14.17
14.13
14.10
14.07
14.06
14.02
14.01
13.98
13.91
13.85
13.73
13.76
13.72
13.68
13.62
13.57
13.47
170.13
171.02
169.71
167.82
165.49
163.30
160.54
158.38
155.78
153.04
150.70
148.73
146.23
144.01
141.28
138.73
136.01
133.71
-20.20
-20.12
-20.08
-20.05
-19.99
-19.99
-20.01
-19.99
-20.01
-19.97
-19.95
-20.00
-20.03
-20.01
-19.93
-19.95
-19.94
-19.96
8.20
3.18
1.39
-0.31
-1.51
-2.59
-3.37
-4.74
-5.79
-6.12
-7.43
-8.03
-9.00
-9.46
-10.57
-11.34
-12.38
-12.95
-19.64
-22.19
-22.73
-23.12
-22.90
-23.03
-23.03
-22.80
-22.87
-22.90
-22.68
-22.48
-22.64
-22.19
-22.38
-22.12
-21.94
-21.78
-120.38
-142.79
-155.71
-160.90
-166.97
-167.62
-172.30
-173.68
-176.13
-176.83
179.96
178.91
177.09
176.83
175.26
173.64
172.78
171.76
Specifications and information are subject to change without notice.
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG103
The Communications Edge TM
High Dynamic Range Gain Block
Product Information
Application Circuit: 200 – 600 MHz (AG103-PCB)
15
0
S21 (dB)
DB(|S[1,1]|) (R)
DB(|S[2,1]|) (L)
DB(|S[2,2]|) (R)
14
-5
13
-10
12
-15
11
-20
10
-25
0
100
200
300
400
500
Frequency (MHz)
600
700
800
CAP
ID=C5
C=10000 pF
+5 V
IND
ID=L1
L=12 nH
PORT
P=1
Z=50 Ohm
SUBCKT
ID=S1
NET="AG103"
IND
ID=L2
L=390 nH
size 0805
Notes:
1.
The amplifier should be connected directly to a +5 V regulator; no dropping resistor is required.
2.
If no DC signal is present at the input, C1 can be removed. The input is internally grounded in the amplifier.
3.
C2, C3, C5, & R1 are not used in the circuit. R2 is shorted across with 0 Ω in the circuit. These placeholders shown in
the silkscreen are for applications with other devices.
Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness
Reference Design: 70 MHz
Reference Design: 900 MHz
CAP
ID=C5
C=1e4 pF
IND
ID=L2
L=270 nH
+5 V
CAP
ID=C4
C=1000 pF
CAP
ID=C1
C=56 pF
SUBCKT
ID=S1
NET="AG103"
PORT
P=1
Z=50 Ohm
PORT
P=2
Z=50 Ohm
DB(|S[1,1]|) * (R)
-10
12
-15
-20
11
-20
-25
10
-10
12
-15
11
200
250
S21 (dB)
13
13
150
Frequency (MHz)
DB(|S[2,2]|) * (R)
-5
-5
10
DB(|S[2,1]|) * (L)
14
14
100
0
DB(|S[2,2]|) (R)
S11, S22 (dB)
S21 (dB)
15
0
50
PORT
P=2
Z=50 Ohm
IND
ID=L3
L=15 nH
15
DB(|S[2,1]|) * (L)
IND
ID=L2
L=100 nH
CAP
ID=C4
C=100 pF
CAP
ID=C1
C=100 pF
IND
ID=L3
L=150 nH
DB(|S[1,1]|) * (R)
CAP
ID=C5
C=10000 pF
600
700
800
900
1000
Frequency (MHz)
1100
S11, S22 (dB)
SUBCKT
ID=S1
NET="AG103"
PORT
P=1
Z=50 Ohm
PORT
P=2
Z=50 Ohm
CAP
ID=C4
C=1000 pF
CAP
ID=C1
C= 1000 pF
+5 V
S11, S22 (dB)
Typical Performance
450 MHz
S21 - Gain
13.5 dB
S11
-23 dB
S22
-14 dB
Output P1dB
+21 dBm
Output IP3
+36 dBm
Noise Figure
2.7 dB
Bias
+5 V @ 150 mA
Frequency
-25
1200
Specifications and information are subject to change without notice.
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG103
The Communications Edge TM
High Dynamic Range Gain Block
Product Information
AG103 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The AG103 will be marked with an “AG103”
designator.
An alphanumeric lot code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85°C
59° C / W
129° C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 °C.
MTTF vs. GND Tab Temperature
1000
M T T F (m illio n h rs )
Thermal Specifications
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
100
10
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice.
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG103
The Communications Edge TM
High Dynamic Range Gain Block
Product Information
AG103-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG103-G will be marked with
“103G” designator. An alphanumeric
code (“XXXX-X”) is also marked below
part designator on the top surface of
package.
an
lot
the
the
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85°C
59° C / W
129° C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 °C.
MTTF vs. GND Tab Temperature
1000
M T T F (m illio n h rs )
Thermal Specifications
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
100
10
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice.
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004