ETC AG403

AG403-89
The Communications Edge TM
InGaP HBT Gain Block
Product Features
•
•
•
•
•
•
•
DC – 6000 MHz
+17.5 dBm P1dB at 900 MHz
+31 dBm OIP3 at 900 MHz
21 dB Gain at 900 MHz
Single Voltage Supply
Internally matched to 50 Ω
Lead-free/Green/RoHScompliant SOT-89 Package
• MTTF > 1000 years
Applications
•
•
•
•
•
•
Mobile Infrastructure
CATV / DBS
W-LAN / ISM
RFID
Defense / Homeland Security
Fixed Wireless
Product Information
Product Description
Functional Diagram
The AG403-89 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG403-89 typically provides 21
dB of gain, +31 dBm Output IP3, and +17.5 dBm P1dB.
The device combines dependable performance with superb
quality to maintain MTTF values exceeding 1000 years at
mounting temperatures of +85°C and is available in both
the standard SOT-89 package and the environmentallyfriendly lead-free/green/RoHS-compliant SOT-89 package.
GND
The AG403-89 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT technology process
technology and only requires DC-blocking capacitors, a
bias resistor, and an inductive RF choke for operation.
1
2
3
RF IN
GND
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG403-89 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and fixed wireless.
Specifications (1)
Parameter
4
Typical Performance (1)
Units
Min
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
DC
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output IP3 (2)
Output IP2
Output P1dB
Noise Figure
Test Frequency
Gain
Output IP3 (2)
Output P1dB
Device Voltage
Device Current
17.9
Typ
900
21.1
13
15
+31.1
+44
+17.7
3.1
1900
18.9
+28.2
+15.9
4.91
60
Max
Parameter
Units
6000
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
Typical
500
21.8
-14
-24
+17.9
+32.3
2.9
900
21.1
-13
-15
+17.7
+31.1
3.1
1900
18.9
-14
-10.4
+15.9
+28.2
3.3
2140
18.5
-15
-10.6
+15.3
+27.6
3.3
19.9
1. Test conditions: 25º C, Supply Voltage = +6 V, Rbias = 18.2 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 °C
-55 to +150 °C
+6.2 V
+10 dBm
+250° C
Ordering Information
Part No.
AG403-89
AG403-89G
AG403-89PCB
Description
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
700 – 2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG403-89
The Communications Edge TM
InGaP HBT Gain Block
Product Information
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 18.2 Ω, Icc = 60 mA
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
100
22.1
-18
-25
+17.9
+32.8
2.9
500
21.8
-14
-24
+17.9
+32.3
2.9
900
21.2
-13
-15
+17.7
+31.1
3.1
1900
18.9
-14
-10.4
+15.9
+28.2
3.3
2140
18.5
-15
-10.6
+15.3
+27.6
3.3
2400
18.0
-18
-10.9
+14.4
+26.9
3.4
3500
16.3
-28
-14
+10.5
5800
12.5
-15
-8
1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.91 V, Rbias = 18.2 Ω, Icc = 60 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 10MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
Return Loss
18
16
14
-40 C
+25 C
1
-10
-20
-30
S11
+85 C
2
Frequency (GHz)
3
0
4
1
2
3
4
5
45
25
20
0
3.0
2
2.5
40
-40c
3
0
+25c
200
G a in (d B )
20
10
1
+85c
-40 C
400
600
800
Gain
18
20
18
16
16
12
16
8
4
12
0.5
1
1.5
2
2.5
Frequency (GHz)
3
3.5
4
+85 C
0.5
1
0
-12
-8
-4
0
Input Power (dBm)
1.5
2
2.5
3
Output Power / Gain vs. Input Power
14
+85 C
0
0
+25 C
Frequency (GHz)
Output Power
+25 C
0
1000
frequency = 900 MHz
5
-40 C
2
Output Power / Gain vs. Input Power
P1dB vs. Frequency
15
5.4
3
Frequency (MHz)
22
5.0
0
Frequency (GHz)
20
4.6
4
O u tp u t P ow e r (d B m )
G a in (d B )
1.5
4.2
Noise Figure vs. Frequency
30
1
3.8
5
+85 C
15
0.5
3.4
Device Voltage (V)
35
0
20
6
NF (dB)
30
OIP2 (dBm)
50
+25 C
40
Output IP2 vs. Frequency
35
-40 C
Optimal operating point
60
Frequency (GHz)
Output IP3 vs. Frequency
OIP3 (dBm)
S22
80
-40
12
0
100
Device Current (mA)
S11, S22 (dB)
G a in (d B )
20
P1dB (dBm)
I-V Curve
0
4
8
frequency = 2000 MHz
20
16
Gain
14
12
12
8
Output Power
10
4
8
O u tp u t P ow e r (d B m )
22
0
-12
-8
-4
0
Input Power (dBm)
4
8
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG403-89
The Communications Edge TM
InGaP HBT Gain Block
Product Information
Typical Device RF Performance (cont’d)
Supply Bias = +8 V, Rbias = 51 Ω, Icc = 60 mA
Gain vs. Frequency
Output IP3 vs. Frequency
OIP3 (dBm)
G a in (d B )
20
18
16
Output IP2 vs. Frequency
35
50
30
45
OIP2 (dBm)
22
25
35
20
14
-40 C
+25 C
-40 C
+85 C
+25 C
-40c
+85 C
0
1
2
Frequency (GHz)
3
0
4
0.5
1
1.5
2
2.5
0
3
200
+85c
400
600
800
1000
Frequency (MHz)
Frequency (GHz)
P1dB vs. Frequency
Noise Figure vs. Frequency
5
20
4
15
NF (dB)
P1dB (dBm)
+25c
30
15
12
40
10
5
-40 C
+25 C
3
2
1
+85 C
-40 C
0
+25 C
+85 C
0
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
Vcc
Icc = 60 mA
1.5
2
2.5
3
Frequency (GHz)
Frequency (GHz)
Application Circuit
R1
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
RF OUT
AG403-89
C2
Blocking
Capacitor
C1
Blocking
Capacitor
Recommended Component Values
Reference
Designator
50
500
L1
820 nH
220 nH
C1, C2, C4
.018 µF
1000 pF
Frequency (MHz)
900
1900
2200
68 nH
27 nH
22 nH
100 pF
68 pF
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R1
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018 µF chip capacitor
Do Not Place
18.2 Ω 1% tolerance
Size
0603
0603
0603
0805
Recommended Bias Resistor Values
S upply
R1 value
S ize
Voltage
6V
18.2 ohms
0805
7V
34.8 ohms
1206
8V
52 ohms
1210
9V
68 ohms
1210
10 V
85 ohms
2010
12 V
118 ohms
2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
1% tolerance resistor is recommended.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG403-89
The Communications Edge TM
InGaP HBT Gain Block
Product Information
AG403-89 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The AG403-89 will be marked with
“AG403” designator. An alphanumeric
code (“XXXX-X”) is also marked below
part designator on the top surface of
package.
an
lot
the
the
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85°C
191° C/W
141° C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+4.91V, 60 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 °C.
MTTF vs. GND Tab Temperature
1000
M T T F (m illio n h rs )
Thermal Specifications
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
100
10
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG403-89
The Communications Edge TM
InGaP HBT Gain Block
Product Information
AG403-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG403-89G will be marked with
“A403G” designator. An alphanumeric
code (“XXXX-X”) is also marked below
part designator on the top surface of
package.
an
lot
the
the
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85°C
191° C/W
141° C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+4.91V, 60 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 °C.
MTTF vs. GND Tab Temperature
1000
M T T F (m illio n h rs )
Thermal Specifications
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
100
10
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004
AG403-89
The Communications Edge TM
InGaP HBT Gain Block
Product Information
Typical Device Data
S-Parameters (Vdevice = +4.91 V, ICC = 60 mA, T = 25° C, calibrated to device leads)
Freq (MHz)
50
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
3200
3400
3600
3800
4000
4200
4400
4600
4800
5000
5200
5400
5600
5800
6000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-18.06
-18.00
-15.88
-14.16
-13.14
-12.46
-11.77
-11.76
-12.19
-13.21
-14.50
-15.73
-18.84
-20.91
-26.39
-33.53
-31.29
-28.28
-27.13
-24.00
-20.10
-17.35
-15.03
-13.62
-12.84
-12.39
-12.68
-13.14
-13.88
-15.35
-16.66
179.79
162.07
151.81
144.50
136.28
128.31
126.07
121.44
119.08
117.69
113.06
92.78
90.66
86.20
74.33
31.90
-6.38
-12.01
7.99
29.15
40.29
45.76
48.62
48.88
49.53
49.21
47.67
46.17
44.73
41.74
35.71
21.71
21.60
21.41
21.18
20.85
20.39
19.99
19.55
19.07
18.62
18.22
17.87
17.50
17.26
16.92
16.59
16.24
15.92
15.58
15.23
14.80
14.36
13.92
13.48
13.08
12.75
12.49
12.23
12.17
11.96
11.80
176.98
168.63
157.30
146.55
136.27
126.44
116.97
108.73
100.30
92.81
85.14
77.98
70.69
65.75
58.47
50.79
43.76
36.24
28.94
21.76
14.35
7.42
0.66
-6.25
-12.47
-18.86
-24.71
-30.45
-38.29
-43.15
-49.72
-24.09
-24.80
-25.08
-24.73
-25.01
-24.95
-25.18
-24.83
-24.56
-24.54
-24.40
-24.46
-24.05
-23.99
-23.40
-23.33
-23.08
-22.95
-22.73
-22.31
-22.29
-22.24
-21.92
-22.10
-22.05
-21.74
-21.66
-21.22
-20.74
-20.67
-20.06
0.40
-2.09
-1.46
-4.98
-6.39
-9.99
-7.81
-8.09
-8.70
-9.08
-10.37
-11.40
-12.45
-17.67
-17.55
-18.82
-19.04
-22.98
-27.62
-31.86
-35.48
-38.20
-41.07
-44.85
-49.13
-50.61
-54.65
-57.84
-62.12
-64.22
-69.98
-24.87
-26.15
-26.28
-21.81
-17.43
-14.78
-12.79
-11.66
-10.84
-10.49
-10.38
-10.62
-10.94
-11.43
-12.05
-12.81
-13.60
-13.98
-13.93
-12.87
-11.51
-10.04
-8.65
-7.89
-7.36
-6.98
-7.06
-7.34
-10.48
-8.42
-9.09
-13.72
-31.34
-125.16
-150.37
-164.96
-173.27
-178.65
177.17
174.87
173.17
172.92
-174.44
-176.38
-177.94
178.15
171.21
162.52
148.23
130.33
113.55
99.23
88.87
81.23
75.64
70.54
68.07
64.15
60.90
-14.30
52.62
45.11
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
September 2004