LP358, LP2904 ULTRA-LOW-POWER DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS475 – AUGUST 2005 FEATURES • • • • • • D OR DGK PACKAGE (TOP VIEW) Low Supply Current . . . 85 µA Typ Low Offset Voltage . . . 2 mV Typ Low Input Bias Current . . . 2 nA Typ Input Common Mode to GND Wide Supply Voltage . . . 3 V < VCC < 32 V Pin Compatible With LM358 1OUT 1IN− 1IN+ GND 1 8 2 7 3 6 4 5 VCC 2OUT 2IN− 2IN+ APPLICATIONS • • • • • LCD Displays Portable Instrumentation Sensor/Metering Equipment Consumer Electronics (MP3 Players, Toys) Power Supplies DESCRIPTION/ORDERING INFORMATION The LP358 and LP2904 are dual low-power operational amplifiers especially suited for battery-operated applications. Good input specifications and wide supply-voltage range still are achieved, despite the ultra-low supply current. Single-supply operation is achieved with an input common-mode range that includes GND. The LP358 and LP2904 are ideal in applications where wide supply voltage and low power are more important than speed and bandwidth. These applications include portable instrumentation, LCD displays, consumer electronics (MP3 players, toys, etc.), and power supplies. ORDERING INFORMATION PACKAGE (1) TA SOIC – D 0°C to 70°C VSSOP – DGK SOIC – D –40°C to 85°C VSSOP – DGK ORDERABLE PART NUMBER Tube of 75 LP358D Reel of 2500 LP358DR Tube of 100 LP358DGK Reel of 250 LP358DGKT Reel of 2500 LP358DGKR Tube of 75 LP2904D Reel of 2500 LP2904DR Tube of 100 LP2904DGK Reel of 250 LP2904DGKT Reel of 2500 LP2904DGKR TOP-SIDE MARKING LP358 PREVIEW PREVIEW PREVIEW SYMBOL (EACH AMPLIFIER) − IN− OUT (1) + IN+ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated LP358, LP2904 ULTRA-LOW-POWER DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS475 – AUGUST 2005 SCHEMATIC (EACH AMPLIFIER) VCC OUT IN− IN+ Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC MAX Supply voltage range (2) Differential input VI Input voltage (either input) Package thermal impedance (5) (6) TJ Operating virtual junction temperature Tstg Storage temperature range (6) V 32 V Unlimited D package θJA (2) (3) (4) (5) ±32 –0.3 Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VCC ≤ 15 V (4) (1) V voltage (3) VID UNIT ±16 or 32 97 DGK package 172 –65 °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+, with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. ESD Protection TEST CONDITIONS Human-Body Model 2 TYP UNIT ±2 kV LP358, LP2904 ULTRA-LOW-POWER DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS475 – AUGUST 2005 Electrical Characteristics TA = 25°C, VCC = 5 V, VIC = VCC/2, RL = 100 kΩ to GND (unless otherwise noted) PARAMETER TEST CONDITIONS (1) TA (2) LP358 MAX MIN TYP (3) MAX 2 4 2 4 25°C VIO Input offset voltage IIB Input bias current IIO Input offset current AV Large-signal voltage gain RL = 10 kΩ to GND, VCC = 30 V 25°C 50 Full range 40 CMRR Common-mode rejection ratio VCC = 30 V, VIC = 0 V to VCC – 1.5 V 25°C 80 Full range 75 kVSR Power-supply rejection ratio VCC = 5 V to 30 V 25°C 80 Full range 75 ICC Supply current RL = ∞ VOH Output voltage swing (high) IL = 0.35 mA to GND, VIC = 0 V VOL Output voltage swing (low) IL = 0.35 mA from VCC, VIC = 0 V IO Output source current VO = 3 V, VID = 1 V Full range 9 25°C 2 Full range 25°C 0.2 25°C Output sink current VO = 1.5 V, VID = –1 V, VIC = 0 V 25°C 25°C 2 2 0.5 40 70 90 80 90 80 90 85 1 25°C 7 Full range 4 25°C 4 Full range 3 25°C 2 Full range 1 150 275 3.6 3.4 3.6 0.82 0.7 7 10 mA 4 5 4 5 3 4 2 µA V 1 10 nA V VCC – 1.9 0.7 nA V 75 150 mV dB 75 90 UNIT V/mV 30 VCC – 1.9 0.82 4 8 250 3.4 20 40 100 85 Full range 25°C 10 4 Full range Full range 10 20 Full range VO = 1.5 V, VID = –1 V IO LP2904 MIN TYP (3) mA 4 1 20 35 20 35 IOS,GND Output short to GND VID = 1 V IOS,VCC Output short to VCC αVIO Input offset voltage drift 25°C 10 10 µV/°C αIIO Input offset current drift 25°C 10 10 pA/°C (1) (2) (3) VID = –1 V Full range 25°C 40 15 Full range 30 40 15 45 30 45 mA mA For full-range temperature limits: VCC = 3 V to 32 V, VICR = 0 V to VCC – 1.5 V (unless otherwise noted) Full range is 0°C to 70°C for LP358 and –40°C to 85°C for LP2904. All typical values are at TA = 25°C. Operating Conditions VCC = ±15 V, TA = 25°C PARAMETER TYP UNIT GBW Gain bandwidth product 100 kHz SR Slew rate 50 V/ms 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty LP2904D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2904DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2904DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2904DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP358D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP358DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP358DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP358DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP358DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP358DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP2904DR D 8 SITE 27 330 12 6.4 5.2 2.1 8 12 Q1 LP358DR D 8 SITE 27 330 12 6.4 5.2 2.1 8 12 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) LP2904DR D 8 SITE 27 342.9 336.6 20.64 LP358DR D 8 SITE 27 342.9 336.6 20.64 Pack Materials-Page 2