ECG012 The Communications Edge TM Product Information 0.1 Watt, High Linearity InGaP HBT Amplifier Product Features x 60 – 2500 MHz x +20 dBm P1dB x +36 dBm Output IP3 x 14 dB Gain @ 900 MHz x 12.5 dB Gain @ 1900 MHz x Single Positive Supply (+3V) x Available in a lead-free / green SOT-89 Package Style Applications x Final stage amplifiers for Repeaters x Mobile Infrastructure x CATV / DBS x Defense / Homeland Security Product Description Functional Diagram The ECG012 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +36 dBm OIP3 and +20 dBm of compressed 1dB power. It is housed in a lead-free/green/RoHScompliant SOT-89 SMT package. All devices are 100% RF and DC tested. GND The ECG012 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the ECG012 to maintain high linearity over temperature and operate directly off a single +3 V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations. Specifications (1) Parameters 4 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 Typical Performance (3) Units Min Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) IS-95A Channel Power MHz MHz dB dB dB dBm dBm 60 dBm +13 Noise Figure Operating Current Range Device Voltage dB mA V 4.9 100 +3 @ -45 dBc ACPR 11 65 Typ Max Parameters Units Typical 2500 Frequency S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP3 Noise Figure Supply Bias MHz dB dB dB dBm dBm dB 900 1900 2140 14 12.5 11.5 -14 -15 -15 -10 -10 -10 +20 +20 +20 +35 +36 +36 4.7 4.9 5.4 +3 V @ 100 mA 1900 12.5 15 10 +20 +36 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +3 V, I = 100 mA, +25 C 145 1. Test conditions unless otherwise noted: 25ºC, Vsupply = +3 V, in a tuned application circuit. 2. 3OIP measured with two tones at an output power of +6 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Junction Temperature Ordering Information Part No. Rating -40 to +85 qC -65 to +150 qC +15 dBm +6 V 220 mA +250 qC Description 0.1 Watt, High Linearity InGaP HBT Amplifier ECG012B (lead-tin SOT-89 Pkg) 0.1 Watt, High Linearity InGaP HBT Amplifier ECG012B-G (lead-free/green/RoHS-compliant SOT-89 Pkg) ECG012B-PCB900 900 MHz Evaluation Board ECG012B-PCB1900 1900 MHz Evaluation Board ECG012B-PCB2140 2140 MHz Evaluation Board Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 1 of 5 April 2005 ECG012 The Communications Edge TM Product Information 0.1 Watt, High Linearity InGaP HBT Amplifier Typical Device Data S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 C, unmatched 50 ohm system) S11 1.0 2. 0 6 0. 0 2. 0. 0 3. 4 4. 20 Swp Max 3000MHz 0. 4 25 0 3. 0 0 4. 0 5. 5.0 0 .2 0.2 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 -10.0 -5. 0 .0 2000 . -0 3000 4 .4 -0 .0 -2 Swp Min 50MHz -1.0 - 0.8 6 -0 . Swp Min 50MHz -1.0 -0 .8 -0 .6 -2 .0 Frequency (MHz) -3 .0 1000 2 -4 0 -0. - 2 3. 0 - 0. -4 .0 5 0 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 DB(|S(2,1)|) DB(GMax()) 10.0 -5. 0 10 0.6 0 0.2 15 0.4 10.0 -10.0 Gain (dB) 0 .8 1.0 0.8 0. 30 S22 Swp Max 3000MHz 6 Gain / Maximum Stable Gain Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increments. S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) 50 -6.10 -155.37 20.62 150.95 -25.48 18.56 -8.19 250 -3.49 -176.62 14.94 140.53 -23.11 6.69 -5.84 500 -3.10 174.48 13.45 129.49 -22.77 5.89 -5.64 750 -2.96 167.11 12.26 115.68 -22.45 3.33 -5.43 1000 -2.79 160.22 11.17 102.37 -22.24 1.71 -5.27 1250 -2.64 153.20 10.12 89.48 -21.89 -0.69 -5.06 1500 -2.55 146.05 9.07 78.22 -21.32 -2.91 -5.01 1750 -2.44 138.76 8.18 67.48 -21.09 -5.27 -4.84 2000 -2.49 132.13 7.30 57.62 -20.45 -7.61 -4.77 2250 -2.39 125.66 6.45 48.01 -20.33 -11.25 -4.69 2500 -2.35 119.11 5.69 39.53 -19.88 -16.63 -4.68 2750 -2.28 111.83 4.98 30.50 -19.58 -18.56 -4.70 3000 -2.29 104.87 4.30 21.43 -18.98 -24.51 -4.54 S22 (ang) -109.32 -166.90 178.74 170.66 162.86 156.23 149.29 142.22 135.81 128.87 122.52 115.41 108.72 Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness, 1 oz copper Microstrip line details: width = .026”, spacing = .026” Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 2 of 5 April 2005 ECG012 The Communications Edge TM Product Information 0.1 Watt, High Linearity InGaP HBT Amplifier 900 MHz Application Circuit (ECG012B-PCB900) Typical RF Performance Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output IP3 (+6 dBm / tone, 1 MHz spacing) Output P1dB Noise Figure Supply Voltage Supply Current CAP ID=C1 C=100000 pF size 1206 Vcc = +3 V 900 MHz 14 dB -14 dB -10 dB All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. +35 dBm +20 dBm 4.7 dB +3 V 100 mA size 0805 IND ID=L1 L=33 nH CAP ID=C5 C=56 pF size 0603 SUBCKT ID=U1 NET="ECG012" CAP ID=C7 C=5.6 pF CAP ID=C3 C=1000 pF 5.6 V RES ID=R1 RES R=820 Ohm ID=L2 R=0 Ohm CAP ID=C4 C=56 pF PORT P=1 Z=50 Ohm CAP ID=C2 C=56 pF DIODE1 ID=D1 RES ID=L3 R=0 Ohm CAP ID=C9 C=1 pF C9 should be placed between silk screen markers '8'and ' 9' on the WJ evaluation board. C7 should be placed at the silk screen marker ’F’ on the WJ evaluation board. Measured parameters were taken at 25 C. The capacitor should be placed 19° @ 0.9GHz from pin 3 of the ECG012. The capacitor should be placed 13.7°@ 0.9GHz from pin 1 of the ECG012 1900 MHz Application Circuit (ECG012B-PCB1900) Typical RF Performance Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output IP3 (+6 dBm / tone, 1 MHz spacing) Output P1dB Noise Figure Supply Voltage Supply Current Vcc = +3 V 1900 MHz 12.5 dB -15 dB -10 dB All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. +36 dBm +20 dBm 4.9 dB +3 V 100 mA PORT P=1 Z=50 Ohm CAP ID=C4 C=56 pF RES ID=L2 R=0 Ohm CAP ID=C3 C=1000 pF 5.6 V SUBCKT ID=U1 NET="ECG012" CAP ID=C7 C=2.4 pF size 0805 IND ID=L1 L=18 nH RES ID=L3 R=0 Ohm RES ID=R1 R=820 Ohm CAP ID=C5 C=56 pF CAP ID=C9 C=1.2 pF C7 should be placed at the silk screen marker ’A’ on the WJ evaluation board. Measured parameters were taken at 25 C. CAP ID=C1 C=100000 pF size 1206 CAP ID=C2 C=56 pF DIODE1 ID=D1 L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. PORT P=2 Z=50 Ohm PORT P=2 Z=50 Ohm C9 should be placed at silk screen marker ' 7' on the WJ evaluation board. The capacitor should be placed 34° @ 1.9GHz from pin 3 of the ECG012. The capacitor should be placed 4.6°@ 1.9GHz from pin 1 of the ECG012 2140 MHz Application Circuit (ECG012B-PCB2140) Typical RF Performance Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output IP3 (+6 dBm / tone, 1 MHz spacing) Output P1dB Noise Figure Supply Voltage Supply Current CAP ID=C1 C=100000 pF size 1206 Vcc = +3 V 2140 MHz 11.5 dB -15 dB -10 dB All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Component R1 is shown in the silkscreen but is not used for this configuration. +20 dBm 5.4 dB +3 V 100 mA CAP ID=L2 C=2 pF CAP ID=C6 C=1.5 pF IND ID=L1 L=18 nH SUBCKT ID=U1 NET="ECG012" C6 should be placed between silk screen markers ’E’ & ’F’ on the WJ evaluation board. The capacitor should be placed 28.9° @ 2.14GHz from pin 1 of the ECG012 Measured parameters were taken at 25 C. CAP ID=C3 C=1000 pF 5.6 V L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. RES CAP ID=R1 PORT ID=C4 R=820 Ohm P=1 C=56 pF Z=50 Ohm +34 dBm CAP ID=C2 C=56 pF DIODE1 ID=D1 RES ID=L3 R=0 Ohm CAP ID=C9 C=.8 pF size 0805 CAP ID=C5 C=56 pF PORT P=2 Z=50 Ohm C9 should be placed at silk screen marker ' 3' on the WJ evaluation board. The capacitor should be placed 14.2° @ 2.14GHz from pin 3 of the ECG012. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 3 of 5 April 2005 ECG012 The Communications Edge TM Product Information 0.1 Watt, High Linearity InGaP HBT Amplifier ECG012B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with an “E012” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specification for this part is located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85q C 149q C / W 130q C MTTF vs. GND Tab Temperature 10000 1000 100 10 Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. 2. This corresponds to the typical biasing condition of +3V, 100 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. 1 60 70 80 90 100 Tab Temperature (°C) 110 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 4 of 5 April 2005 ECG012 The Communications Edge TM Product Information 0.1 Watt, High Linearity InGaP HBT Amplifier ECG012B (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The component will be marked with an “ E012G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specification for this part is located on the website in the “ Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85q C 149q C / W 130q C MTTF vs. GND Tab Temperature 10000 1000 100 10 Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. 2. This corresponds to the typical biasing condition of +3V, 100 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. 1 60 70 80 90 100 Tab Temperature (°C) 110 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com Page 5 of 5 April 2005