ETC ECG012B

ECG012
The Communications Edge TM
Product Information
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Features
x 60 – 2500 MHz
x +20 dBm P1dB
x +36 dBm Output IP3
x 14 dB Gain @ 900 MHz
x 12.5 dB Gain @ 1900 MHz
x Single Positive Supply (+3V)
x Available in a lead-free / green
SOT-89 Package Style
Applications
x Final stage amplifiers for Repeaters
x Mobile Infrastructure
x CATV / DBS
x Defense / Homeland Security
Product Description
Functional Diagram
The ECG012 is a high dynamic range driver amplifier in
a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance across a broad
range with +36 dBm OIP3 and +20 dBm of compressed
1dB power. It is housed in a lead-free/green/RoHScompliant SOT-89 SMT package. All devices are 100%
RF and DC tested.
GND
The ECG012 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECG012 to maintain high linearity over temperature and
operate directly off a single +3 V supply. This
combination makes the device an excellent candidate for
transceiver line cards in current and next generation
multi-carrier 3G base stations.
Specifications (1)
Parameters
4
1
2
3
RF IN
GND
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Typical Performance (3)
Units
Min
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
IS-95A Channel Power
MHz
MHz
dB
dB
dB
dBm
dBm
60
dBm
+13
Noise Figure
Operating Current Range
Device Voltage
dB
mA
V
4.9
100
+3
@ -45 dBc ACPR
11
65
Typ
Max
Parameters
Units
Typical
2500
Frequency
S21 - Gain
S11 - Input R.L.
S22 - Output R.L.
Output P1dB
Output IP3
Noise Figure
Supply Bias
MHz
dB
dB
dB
dBm
dBm
dB
900
1900
2140
14
12.5
11.5
-14
-15
-15
-10
-10
-10
+20
+20
+20
+35
+36
+36
4.7
4.9
5.4
+3 V @ 100 mA
1900
12.5
15
10
+20
+36
3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +3 V, I =
100 mA, +25 C
145
1. Test conditions unless otherwise noted: 25ºC, Vsupply = +3 V, in a tuned application circuit.
2. 3OIP measured with two tones at an output power of +6 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Junction Temperature
Ordering Information
Part No.
Rating
-40 to +85 qC
-65 to +150 qC
+15 dBm
+6 V
220 mA
+250 qC
Description
0.1 Watt, High Linearity InGaP HBT Amplifier
ECG012B
(lead-tin SOT-89 Pkg)
0.1 Watt, High Linearity InGaP HBT Amplifier
ECG012B-G
(lead-free/green/RoHS-compliant SOT-89 Pkg)
ECG012B-PCB900 900 MHz Evaluation Board
ECG012B-PCB1900 1900 MHz Evaluation Board
ECG012B-PCB2140 2140 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 1 of 5
April 2005
ECG012
The Communications Edge TM
Product Information
0.1 Watt, High Linearity InGaP HBT Amplifier
Typical Device Data
S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 C, unmatched 50 ohm system)
S11
1.0
2.
0
6
0.
0
2.
0.
0
3.
4
4.
20
Swp Max
3000MHz
0.
4
25
0
3.
0
0
4.
0
5.
5.0
0 .2
0.2
10.0
5.0
4.0
3.0
2.0
1.0
0.8
0.6
0.4
0.2
-10.0
-5.
0
.0
2000
.
-0
3000
4
.4
-0
.0
-2
Swp Min
50MHz
-1.0
- 0.8
6
-0
.
Swp Min
50MHz
-1.0
-0 .8
-0
.6
-2
.0
Frequency (MHz)
-3
.0
1000
2
-4
0
-0.
-
2
3.
0
- 0.
-4
.0
5
0
0
10.0
5.0
4.0
3.0
2.0
1.0
0.8
DB(|S(2,1)|)
DB(GMax())
10.0
-5.
0
10
0.6
0
0.2
15
0.4
10.0
-10.0
Gain (dB)
0 .8
1.0
0.8
0.
30
S22
Swp Max
3000MHz
6
Gain / Maximum Stable Gain
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The impedance plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increments.
S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
50
-6.10
-155.37
20.62
150.95
-25.48
18.56
-8.19
250
-3.49
-176.62
14.94
140.53
-23.11
6.69
-5.84
500
-3.10
174.48
13.45
129.49
-22.77
5.89
-5.64
750
-2.96
167.11
12.26
115.68
-22.45
3.33
-5.43
1000
-2.79
160.22
11.17
102.37
-22.24
1.71
-5.27
1250
-2.64
153.20
10.12
89.48
-21.89
-0.69
-5.06
1500
-2.55
146.05
9.07
78.22
-21.32
-2.91
-5.01
1750
-2.44
138.76
8.18
67.48
-21.09
-5.27
-4.84
2000
-2.49
132.13
7.30
57.62
-20.45
-7.61
-4.77
2250
-2.39
125.66
6.45
48.01
-20.33
-11.25
-4.69
2500
-2.35
119.11
5.69
39.53
-19.88
-16.63
-4.68
2750
-2.28
111.83
4.98
30.50
-19.58
-18.56
-4.70
3000
-2.29
104.87
4.30
21.43
-18.98
-24.51
-4.54
S22 (ang)
-109.32
-166.90
178.74
170.66
162.86
156.23
149.29
142.22
135.81
128.87
122.52
115.41
108.72
Device S-parameters are available for download off of the website at: http://www.wj.com
Application Circuit PC Board Layout
Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness, 1 oz copper
Microstrip line details: width = .026”, spacing = .026”
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 2 of 5
April 2005
ECG012
The Communications Edge TM
Product Information
0.1 Watt, High Linearity InGaP HBT Amplifier
900 MHz Application Circuit (ECG012B-PCB900)
Typical RF Performance
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output IP3
(+6 dBm / tone, 1 MHz spacing)
Output P1dB
Noise Figure
Supply Voltage
Supply Current
CAP
ID=C1
C=100000 pF
size 1206
Vcc = +3 V
900 MHz
14 dB
-14 dB
-10 dB
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
+35 dBm
+20 dBm
4.7 dB
+3 V
100 mA
size 0805
IND
ID=L1
L=33 nH
CAP
ID=C5
C=56 pF
size 0603
SUBCKT
ID=U1
NET="ECG012"
CAP
ID=C7
C=5.6 pF
CAP
ID=C3
C=1000 pF
5.6 V
RES
ID=R1
RES
R=820 Ohm
ID=L2
R=0 Ohm
CAP
ID=C4
C=56 pF
PORT
P=1
Z=50 Ohm
CAP
ID=C2
C=56 pF
DIODE1
ID=D1
RES
ID=L3
R=0 Ohm
CAP
ID=C9
C=1 pF
C9 should be placed between
silk screen markers '8'and '
9'
on the WJ evaluation board.
C7 should be placed at the silk screen
marker ’F’ on the WJ evaluation board.
Measured parameters were taken at 25 C.
The capacitor should be placed
19° @ 0.9GHz from pin 3
of the ECG012.
The capacitor should be placed
13.7°@ 0.9GHz from pin 1 of the ECG012
1900 MHz Application Circuit (ECG012B-PCB1900)
Typical RF Performance
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output IP3
(+6 dBm / tone, 1 MHz spacing)
Output P1dB
Noise Figure
Supply Voltage
Supply Current
Vcc = +3 V
1900 MHz
12.5 dB
-15 dB
-10 dB
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
+36 dBm
+20 dBm
4.9 dB
+3 V
100 mA
PORT
P=1
Z=50 Ohm
CAP
ID=C4
C=56 pF
RES
ID=L2
R=0 Ohm
CAP
ID=C3
C=1000 pF
5.6 V
SUBCKT
ID=U1
NET="ECG012"
CAP
ID=C7
C=2.4 pF
size 0805
IND
ID=L1
L=18 nH
RES
ID=L3
R=0 Ohm
RES
ID=R1
R=820 Ohm
CAP
ID=C5
C=56 pF
CAP
ID=C9
C=1.2 pF
C7 should be placed at the silk screen
marker ’A’ on the WJ evaluation board.
Measured parameters were taken at 25 C.
CAP
ID=C1
C=100000 pF
size 1206
CAP
ID=C2
C=56 pF
DIODE1
ID=D1
L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
PORT
P=2
Z=50 Ohm
PORT
P=2
Z=50 Ohm
C9 should be placed at
silk screen marker '
7'
on the WJ evaluation board.
The capacitor should be placed
34° @ 1.9GHz from pin 3
of the ECG012.
The capacitor should be placed
4.6°@ 1.9GHz from pin 1 of the ECG012
2140 MHz Application Circuit (ECG012B-PCB2140)
Typical RF Performance
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output IP3
(+6 dBm / tone, 1 MHz spacing)
Output P1dB
Noise Figure
Supply Voltage
Supply Current
CAP
ID=C1
C=100000 pF
size 1206
Vcc = +3 V
2140 MHz
11.5 dB
-15 dB
-10 dB
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
Component R1 is shown in the silkscreen but is not used for this
configuration.
+20 dBm
5.4 dB
+3 V
100 mA
CAP
ID=L2
C=2 pF
CAP
ID=C6
C=1.5 pF
IND
ID=L1
L=18 nH
SUBCKT
ID=U1
NET="ECG012"
C6 should be placed between silk screen
markers ’E’ & ’F’ on the WJ evaluation board.
The capacitor should be placed
28.9° @ 2.14GHz from pin 1 of the ECG012
Measured parameters were taken at 25 C.
CAP
ID=C3
C=1000 pF
5.6 V
L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
RES
CAP
ID=R1
PORT
ID=C4
R=820 Ohm
P=1
C=56 pF
Z=50 Ohm
+34 dBm
CAP
ID=C2
C=56 pF
DIODE1
ID=D1
RES
ID=L3
R=0 Ohm
CAP
ID=C9
C=.8 pF
size 0805
CAP
ID=C5
C=56 pF
PORT
P=2
Z=50 Ohm
C9 should be placed at
silk screen marker '
3'
on the WJ evaluation board.
The capacitor should be placed
14.2° @ 2.14GHz from pin 3
of the ECG012.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]wj.com
Web site: www.wj.com
Page 3 of 5
April 2005
ECG012
The Communications Edge TM
Product Information
0.1 Watt, High Linearity InGaP HBT Amplifier
ECG012B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an
“E012” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85q C
149q C / W
130q C
MTTF vs. GND Tab Temperature
10000
1000
100
10
Notes:
1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C.
2. This corresponds to the typical biasing condition of
+3V, 100 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 C.
1
60
70
80
90
100
Tab Temperature (°C)
110
120
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 4 of 5
April 2005
ECG012
The Communications Edge TM
Product Information
0.1 Watt, High Linearity InGaP HBT Amplifier
ECG012B (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“ E012G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the “ Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85q C
149q C / W
130q C
MTTF vs. GND Tab Temperature
10000
1000
100
10
Notes:
1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C.
2. This corresponds to the typical biasing condition of
+3V, 100 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 C.
1
60
70
80
90
100
Tab Temperature (°C)
110
120
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
Page 5 of 5
April 2005