SCDS169A − MAY 2004 − REVISED APRIL 2005
D Functionally Similar to M52055, NJM2283,
D
D
D
D
D
D
D
D OR PW PACKAGE
(TOP VIEW)
MM1231, and BA7602
VCC Operating Range From 4.5 V to 9 V
Wide Frequency Range (0 dB at 40 MHz,
VCC = 5 V)
Crosstalk (−75 dB at 4.43 MHz)
BiCMOS Technology
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model (A114-B,
Class II)
− 1000-V Charged-Device Model (C101)
Applications
− Digital TV, LCD TV, PDP TV, and CRT TV
− VCR, Projector, and DVD Player
1B
1C
1Y
GND2
2Y
3Y
3C
3A
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
1A
GND1
2B
VCC
2C
2A
GND3
3B
description/ordering information
The TL52055 is a wide-bandwidth, 2-input, 1-output, 3-circuit video switch. All inputs are bias types. The select
(1C, 2C, 3C) inputs control the signal path of A port and B port. The device can be used for switching separate
video signals and component-video signals and is suitable for DTV, LCD, PDP, and other high-quality AV
systems. The device provides no loss (0 dB) up to 40 MHz and has a very low crosstalk.
ORDERING INFORMATION
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC − D
Tube
TL52055D
Tape and reel
TL52055DR
TOP-SIDE
MARKING
TL52055
TSSOP − PW
Tape and reel
TL52055PWR
ZA055
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
INPUT
C
ON CHANNEL
L
H
OPEN
A port to Y port
B port to Y port
A port to Y port
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"#$ $%$ $&'"%$ !''#$ % & (!)*%$ %#+ '! $&'" (#&%$ (#' # #'" & #,% $'!"#$ %$%' -%''%$.+
'!$ ('#$/ # $ $##%'*. $*!# #$/ & %**
(%'%"##'+
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1
SCDS169A − MAY 2004 − REVISED APRIL 2005
block diagram
1A
16
GND1
15
VCC
13
2B
14
Bias
H
Bias
2C
12
L
2A
11
GND3
10
Bias
3B
9
Bias
L
H
H
L
Bias
Bias
1
2
3
4
5
6
7
8
1B
1C
1Y
GND2
2Y
3Y
3C
3A
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 12 V
Package thermal impedance, θJA (see Note 1): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
MAX
UNIT
VCC
Supply voltage
4.5
9
V
TA
Operating free-air temperature
−40
85
°C
2
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SCDS169A − MAY 2004 − REVISED APRIL 2005
electrical characteristics VCC = 5 V/9 V, TA = 255C (see Note 2)
PARAMETER
TEST CONDITION
ICC1
ICC2
f†
Operating current 1
GV
GF‡
Voltage gain
CTSW§
CTCH¶
Switch crosstalk
DG
DP
VOS
ZI
Output offset voltage
VIH
VIL
High-level control input voltage (C inputs)
MIN
VCC = 9 V, No signal
VCC = 5 V, No signal
Operating current 2
Frequency bandwidth
VCC = 5 V, VIN = 1 VP-P
FIN = 1, 10 MHz, VIN = 1 VP-P
Flatness of voltage gain
TYP
MAX
10.3
14
mA
9.4
12
mA
40
−0.6
FIN = 30 MHz/1 MHz, VIN = 1 VP−P
FIN = 4.43 MHz, VIN = 1 VP-P
−0.1
UNIT
MHz
0.4
0
dB
dB
−75
−60
dB
−75
−60
dB
Differential gain
FIN = 4.43 MHz, VIN = 1 VP-P
VIN = 1 VP-P, 10-step video signal
0.3
%
Differential phase
VIN = 1 VP-P, 10-step video signal
0.3
deg
Channel crosstalk
−10
Input impedance
0
10
20
VCC = 5 V and 9 V
VCC = 5 V and 9 V
2
kΩ
VCC
0.8
Low-level control input voltage (C inputs)
0
† Frequency bandwidth is defined as the maximum frequency, with 0-dB gain.
‡ GF is the difference of GV at 30 MHz and at 1 MHz.
§ Switch crosstalk is defined as the crosstalk from an ON-channel to an OFF-channel (xA to xB).
¶ Channel crosstalk is defined as the crosstalk between two ON-channels (1Y to 2Y, 2Y to 3Y).
NOTE 2: All unused inputs of the device must be open or connected to GND through a capacitor to ensure proper device operation.
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mV
V
V
3
SCDS169A − MAY 2004 − REVISED APRIL 2005
equivalent circuit, VCC = 5 V (9 V)†
PIN
NO.
PIN
NAME
INSIDE EQUIVALENT CIRCUIT
VOLTAGE
NOTE
2.9 V
(5.2 V)†
Input
2.1 V
(4.4 V)†
Output
VCC VBIAS = 2.9 V (5.2 V)‡
16
1
11
14
8
9
1A
1B
2A
2B
3A
3B
20 kΩ
A
B
100 Ω
VCC
3
5
6
VCC
1Y
2Y
3Y
Y
1 mA
VCC
2
12
7
1C
2C
3C
20 kΩ
Control
C
50 kΩ
13
VCC
15
4
10
GND1
GND2
GND3
† Voltages in parentheses are associated with VCC = 9 V.
‡ VBIAS is an internal voltage source.
4
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SCDS169A − MAY 2004 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
22 mF
0.1 mF
Vo1
VCC 13
2 S1
1
VI
2
1
2
16
1B
1
2A
11
10 mF
S2
10 mF
1
2
1A
S3
2B
1
10 mF
2 S5
1
2 S6
10 mF
1
10 mF
1C
3
1Y
10 mF
uo1
10 kW
12 2C
10 mF
S4
2
5
2Y
7
3C
6
3Y
Vo2
10 mF
uo2
14
3A
8
3B
9
4
10
15
10 kW
Vo3
S7
GND
10 mF
uo3
2
1
5 V (Vc)
10 kW
MEASUREMENT
POINT
SYMBOL
S1
S2
S3
S4
S5
S6
S7
ICC1
ICC2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
GF
GV
2
1
1
1
1
1
1
2
1
1
1
1
1
1
DG/DP
2
1
1
1
1
1
1
CTSW1
CTSW2
2
1
1
1
1
1
2
1
2
1
1
1
1
1
CTSW3
CTSW4
1
1
2
1
1
1
2
1
1
1
2
1
1
1
CTSW5
CTSW6
1
1
1
1
2
1
2
1
1
1
1
1
2
1
υo3
2
1
1
2
1
1
1
1
1
1
1
1
1
2
υo2, υo3
1
1
2
1
1
1
1
1
1
1
2
1
1
2
υo1, υo3
CTCH1
CTCH2
1
1
1
1
2
1
1
CTCH3
1
1
1
1
1
2
2
VOS
VIH/VIL
1
1
1
1
1
1
1/2
1/2
1/2
1
1
1
1
VC
VCC
υo1, υo2, υo3
υo1
υo2
υo1, υo2
Vo1, Vo2, Vo3
VC
Figure 1. Load Circuit and Test Conditions
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5
SCDS169A − MAY 2004 − REVISED APRIL 2005
TYPICAL CHARACTERISTICS
10
2
VIN = 1 VP−P
F = 1 MHz
VCC = 9 V
Output Voltage Swing − VP-P
0
Gain − dB
VCC = 5 V
−2
−4
−6
4
VCC = 5 V
3
2
1
−8
1M
100 k
10 M
100 M
VCC = 9 V
5
2
3
4
5
Input Voltage Swing − VP-P
1
Input Frequency − Hz
Figure 2. Gain vs Frequency
Figure 3. Output Voltage Swing vs Input
Voltage Swing
0
VIN = 1 VP–P
INPUT1
50 Ω
−20
OUTPUT
10 µF
INPUT2
10 µF
Crosstalk Measurement
Crosstalk − dB
−40
−60
Rg = 500
Rg = 75
−80
Rg = 0
−100
−120
100 k
1M
10 M
Input Frequency − Hz
Figure 4. Crosstalk vs Frequency
6
10
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100 M
SCDS169A − MAY 2004 − REVISED APRIL 2005
APPLICATION INFORMATION
VCC
10 mF
2
Cr In A
SW
1
75 W
10 mF
Cr In B
75 W
9
8
10
7
11
6
12
5
10 mF
10 mF
Cb In A
75 W
13
4
14
3
15
2
16
1
Cr Out
Cb Out
10 mF
10 mF
Cb In B
75 W
22 mF
0.1 mF
Y Out
10 mF
10 mF
Y In A
75 W
10 mF
Y In B
75 W
Figure 5. Application of TL52055
Figure 5 shows a typical application of the TL52055 in component-video signaling. Typically, the peak-to-peak
amplitude of a component-video signal is less than 1 V. If the frequency of operation is less than 40 MHz, the
switch does not cause any loss of signal. Also, due to low crosstalk, there is no degradation of the video switch.
USAGE NOTES
1. When using this device, the output drive current should be 5 mA or less.
2. Voltage applied to the control pins (2, 7, and 12) should be less than the power supply voltage (VCC) and
greater than the ground voltage (GND).
3. The types of output pins for this device are emitter follower. The drive current list below is applied inside
the device. If the drive performance is insufficient, apply external drive current within the range in step 1.
Power-Supply Voltage (VCC)
Drive Current in the Device (standard value)
5V
1 mA
9V
1 mA
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7
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TL52055DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL52055DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL52055DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL52055PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL52055PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL52055PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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