SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
D Output Voltage Translation Tracks VCC
D Supports Mixed-Mode Signal Operation On
D
D
D
D
D
D
D VCC Operating Range From 2.3 V to 3.6 V
D Data I/Os Support 0 to 5-V Signaling Levels
All Data I/O Ports
− 5-V Input Down To 3.3-V Output Level
Shift With 3.3-V VCC
− 5-V/3.3-V Input Down To 2.5-V Output
Level Shift With 2.5-V VCC
5-V-Tolerant I/Os With Device Powered-Up
or Powered-Down
Bidirectional Data Flow, With Near-Zero
Propagation Delay
Low ON-State Resistance (ron)
Characteristics (ron = 5 Ω Typical)
Low Input/Output Capacitance Minimizes
Loading (Cio(OFF) = 5 pF Typical)
Data and Control Inputs Provide
Undershoot Clamp Diodes
Low Power Consumption
(ICC = 40 µA Max)
D
D
D
D
D
D
(For Example: 0.8-V, 1.2-V, 1.5-V, 1.8-V,
2.5-V, 3.3-V, 5-V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V/2.5-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
Supports Digital Applications: Level
Translation, Memory Interleaving, Bus
Isolation
Ideal for Low-Power Portable Equipment
DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
description/ordering information
ORDERING INFORMATION
SOIC − DW
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (QSOP) − DBQ
TSSOP − PW
Tube
SN74CB3T3384DW
Tape and reel
SN74CB3T3384DWR
Tape and reel
SN74CB3T3384DBQR
Tube
SN74CB3T3384PW
Tape and reel
SN74CB3T3384PWR
TOP-SIDE
MARKING
CB3T3384
CB3T3384
KS384
TVSOP − DGV
Tape and reel
SN74CB3T3384DGVR
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%&'#! ( )*$$+!' &( #" ,*-.)&'#! /&'+
$#/*)'( )#!"#$% '# (,+)")&'#!( ,+$ '0+ '+$%( #" +1&( !('$*%+!'(
('&!/&$/ 2&$$&!'3 $#/*)'#! ,$#)+((!4 /#+( !#' !+)+((&$.3 !).*/+
'+('!4 #" &.. ,&$&%+'+$(
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1
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
description/ordering information (continued)
The SN74CB3T3384 is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron),
allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O
ports by providing voltage translation that tracks VCC. The SN74CB3T3384 supports systems using 5-V TTL,
3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Figure 1).
VCC
5.5 V
VCC
IN
≈VCC − 1 V
≈VCC
OUT
≈VCC − 1 V
CB3T
0V
0V
Input Voltages
Output Voltages
NOTE A: If the input high voltage (VIH) level is greater than or equal to VCC − 1 V, and less than or equal to 5.5 V, the output high
voltage (VOH) level will be equal to approximately the VCC voltage level.
Figure 1. Typical DC-Voltage-Translation Characteristics
The SN74CB3T3384 is organized as two 5-bit bus switches with separate ouput-enable (1OE, 2OE) inputs. It
can be used as two 5-bit bus switches or as one 10-bit bus switch. When OE is low, the associated 5-bit bus
switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When
OE is high, the associated 5-bit bus switch is OFF, and a high-impedance state exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each 5-bit bus switch)
2
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
A port = B port
H
Z
Disconnect
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SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
logic diagram (positive logic)
2
3
1A1
1B1
SW
10
11
1A5
1B5
SW
1
1OE
14
15
2A1
2B1
SW
22
23
2A5
SW
2B5
13
2OE
simplified schematic, each FET switch (SW)
† Gate Voltage (VG) is approximately
equal to VCC + VT when the switch is ON
and VI > VCC + VT.
A
B
VG†
Control
Circuit
EN‡
‡ EN is the internal enable signal applied to the switch.
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3
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA
Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
VCC
Supply voltage
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VI/O
TA
Data input/output voltage
Operating free-air temperature
MIN
MAX
2.3
3.6
UNIT
1.7
5.5
2
5.5
0
0.7
0
0.8
0
5.5
V
−40
85
°C
V
V
V
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VCC = 3 V,
II = −18 mA
VOH
See Figures 3 and 4
IIN
Control inputs
TYP†
VCC = 3.6 V,
VIN = 3.6 V to 5.5 V or GND
MAX
UNIT
−1.2
V
±10
µA
±20
VI = VCC − 0.7 V to 5.5 V
VI = 0.7 V to VCC − 0.7 V
VCC = 3.6 V,
Switch ON,
VIN = GND
II
MIN
−40
µA
±5
VI = 0 to 0.7 V
IOZ‡
VCC = 3.6 V,
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC
±10
µA
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
10
µA
ICC
∆ICC§
Control inputs
Cin
Control inputs
VCC = 3.6 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
VCC = 3 V to 3.6 V,
One input at VCC − 0.6 V,
Other inputs at VCC or GND
VI = VCC or GND
40
VI = 5.5 V
40
A
µA
300
µA
VCC = 3.3 V,
VIN = VCC or GND
3
pF
Cio(OFF)
VCC = 3.3 V,
VI/O = 5.5 V, 3.3 V, or GND,
Switch OFF,
VIN = VCC
5
pF
VCC = 3.3 V,
Switch ON,
VIN = GND
VI/O = 5.5 V or 3.3 V
Cio(ON)
VI/O = GND
12
VCC = 2.3 V,
TYP at VCC = 2.5 V,
VI = 0
IO = 24 mA
5
8
IO = 16 mA
5
8
VCC = 3 V,
VI = 0
IO = 64 mA
IO = 32 mA
5
7
5
7
ron¶
4
pF
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
† All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡ For I/O ports, the parameter IOZ includes the input leakage current.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
¶ Measured by the voltage drop between A and B terminals at the indicated current through the switch. ON-state resistance is determined by the
lower of the voltages of the two (A or B) terminals.
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5
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 2)
PARAMETER
tpd†
ten
FROM
(INPUT)
TO
(OUTPUT)
A or B
B or A
OE
A or B
VCC = 2.5 V
± 0.2 V
MIN
MAX
VCC = 3.3 V
± 0.3 V
MIN
0.15
1
10.5
1
UNIT
MAX
0.25
ns
7.5
ns
tdis
OE
A or B
1
6.5
1
8
ns
† The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
6
POST OFFICE BOX 655303
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SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
Input Generator
VI
S1
RL
VO
2 × VCC
Open
GND
50 Ω
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
V∆
tPLZ/tPZL
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 × VCC
2 × VCC
500 Ω
500 Ω
GND
GND
30 pF
50 pF
0.15 V
0.3 V
tPHZ/tPZH
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
3.6 V
5.5 V
30 pF
50 pF
0.15 V
0.3 V
Output
Control
(VIN)
VCC
VCC/2
VCC/2
0V
tPLZ
tPZL
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
VCC
VCC/2
VOL
tPHZ
tPZH
Output
Waveform 2
S1 at Open
(see Note B)
VOL + V∆
VCC/2
VOH − V∆
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
Figure 2. Test Circuit and Voltage Waveforms
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SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
4.0
VCC = 2.3 V
IO = 1 µA
TA = 25°C
3.0
V − Output Voltage − V
O
V − Output Voltage − V
O
4.0
2.0
1.0
0.0
VCC = 3 V
IO = 1 µA
TA = 25°C
3.0
2.0
1.0
0.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
VI − Input Voltage − V
2.0
Figure 3. Data Output Voltage vs Data Input Voltage
8
POST OFFICE BOX 655303
3.0
4.0
VI − Input Voltage − V
• DALLAS, TEXAS 75265
5.0
6.0
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS (continued)
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
V
− Output Voltage High − V
OH
3.5
4.0
VCC = 2.3 V ~ 3.6 V
VI = 5.5 V
TA = 85°C
100 µA
8 mA
16 mA
24 mA
3.0
2.5
2.0
1.5
VCC = 2.3 V ~ 3.6 V
VI = 5.5 V
TA = 25°C
3.5
100 µA
8 mA
16 mA
24 mA
3.0
2.5
2.0
1.5
2.3
2.5
2.7
2.9
3.1
3.3
VCC − Supply Voltage − V
3.5
3.7
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
VCC − Supply Voltage − V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4.0
V
− Output Voltage High − V
OH
V
− Output Voltage High − V
OH
4.0
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
3.5
VCC = 2.3 V to 3.6 V
VI = 5.5 V
TA = -40°C
100 µA
8 mA
16 mA
24 mA
3.0
2.5
2.0
1.5
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
VCC − Supply Voltage − V
Figure 4. VOH Values
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9
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
74CB3T3384DBQRE4
ACTIVE
SSOP/
QSOP
DBQ
24
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74CB3T3384DBQR
ACTIVE
SSOP/
QSOP
DBQ
24
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74CB3T3384DGVR
PREVIEW
TVSOP
DGV
24
2000
TBD
Call TI
SN74CB3T3384DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3384DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3384DWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3384DWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3384PW
ACTIVE
TSSOP
PW
24
60
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74CB3T3384PWE4
ACTIVE
TSSOP
PW
24
60
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74CB3T3384PWR
ACTIVE
TSSOP
PW
24
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74CB3T3384PWRE4
ACTIVE
TSSOP
PW
24
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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