ETC KP3216SURCK

3.2x1.6mm SMD CHIP LED LAMP
KP-3216SURCK HYPER RED
Features
Description
!3.2mmx1.6mm SMT LED, 1.1mm THICKNESS.
The Hyper Red source color devices are made with DH
!LOW POWER CONSUMPTION.
InGaAlP on GaAs substrate Light Emitting Diode.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
SPEC NO: KDA0113
APPROVED:J.Lu
REV NO: V.1
CHECKED:
DATE: SEP/07/2001
DRAWN: S. H. CHEN
PAGE: 1 OF 4
Selection Guide
Par t No .
Dic e
KP-3216SURCK
Iv (m c d )
@ 20 m A
L en s Ty p e
HYPER RED( InGaAlP )
WATER CLEAR
V i ew i n g
An g l e
Min .
Ty p .
2θ1/2
50
150
12 0 °
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°°C
Sy m b o l
Par am et er
D ev i c e
λpeak
Peak Wavelength
Hyper Red
λD
Dominate Wavelength
∆λ1/2
Ty p .
Max .
Un it s
Tes t Co n d it io n s
640
nm
IF=20mA
Hyper Red
6 30
nm
IF=20mA
Spectral Line Halfwidth
Hyper Red
28
nm
IF=20mA
C
Capacitance
Hyper Red
35
pF
VF=0V;f=1MHz
VF
Forward Voltage
Hyper Red
1.95
2.5
V
IF=20mA
IR
Reverse Current
Hyper Red
10
uA
V R = 5V
Absolute Maximum Ratings at T)=25°°C
P ar am e t e r
H y p e r R ed
Un it s
Power dissipation
170
mW
DC Forward Current
30
mA
Peak Forward Current [1]
185
mA
Reverse Voltage
5
V
Operating Temperature
-40°C To +85°C
Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: KDA0113
APPROVED:J.Lu
REV NO: V.1
CHECKED:
DATE: SEP/07/2001
DRAWN: S. H. CHEN
PAGE: 2 OF 4
Hyper Red KP-3216SURCK
SPEC NO: KDA0113
APPROVED:J.Lu
REV NO: V.1
CHECKED:
DATE: SEP/07/2001
DRAWN: S. H. CHEN
PAGE: 3 OF 4
KP-3216SURCK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: KDA0113
APPROVED:J.Lu
REV NO: V.1
CHECKED:
DATE: SEP/07/2001
DRAWN: S. H. CHEN
PAGE: 4 OF 4