SCAS555C − NOVEMBER 1995 − REVISED OCTOBER 2003 D SN54AC533 . . . J OR W PACKAGE SN74AC533 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 2-V to 6-V VCC Operation Inputs Accept Voltages to 6 V Max tpd of 10.5 ns at 5 V 3-State Inverting Outputs Drive Bus Lines Directly Full Parallel Access for Loading OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND description/ordering information The ’AC533 devices are octal transparent D-type latches with 3-state outputs. When the latch-enable (LE) input is high, the Q outputs follow the complements of the data (D) inputs. When LE is taken low, the Q outputs are latched at the inverse logic levels set up at the D inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q LE SN54AC533 . . . FK PACKAGE (TOP VIEW) 1D 1Q OE VCC A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. 2D 2Q 3Q 3D 4D 8Q D D D D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4Q GND LE 5Q 5D OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. 8D 7D 7Q 6Q 6D To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PDIP − N SN74AC533N Tube SN74AC533DW Tape and reel SN74AC533DWR SOP − NS Tape and reel SN74AC533NSR AC533 SSOP − DB Tape and reel SN74AC533DBR AC533 Tube SN74AC533PW Tape and reel SN74AC533PWR CDIP − J Tube SNJ54AC533J SNJ54AC533J CFP − W Tube SNJ54AC533W SNJ54AC533W LCCC − FK Tube SNJ54AC533FK SNJ54AC533FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube SOIC − DW −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER PACKAGE† TA SN74AC533N AC533 AC533 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !" "#" "$%#" %%!" # $ &'(#" #!) % "$% &!$#" &!% ! !% $ !*# "%!" #"#% +#%%#",) %" &%!"- ! " "!!#%(, "(! !"- $ #(( &#%#!!%) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCAS555C − NOVEMBER 1995 − REVISED OCTOBER 2003 FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H L L H L H L L X Q0 H X X Z logic diagram (positive logic) OE LE 1 11 C1 1D 3 2 1Q 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCAS555C − NOVEMBER 1995 − REVISED OCTOBER 2003 recommended operating conditions (see Note 3) SN54AC533 VCC VIH Supply voltage VCC = 3 V VCC = 4.5 V High-level input voltage VCC = 5.5 V VCC = 3 V VIL Input voltage IOL ∆t/∆v 2 6 Low-level output current MAX 2 6 2.1 3.15 3.15 3.85 3.85 0 High-level output current MIN 2.1 0 Output voltage IOH MAX VCC = 4.5 V VCC = 5.5 V Low-level input voltage VI VO MIN SN74AC533 0.9 1.35 1.35 1.65 1.65 0 0 VCC VCC VCC = 3 V VCC = 4.5 V −12 −12 −24 −24 VCC = 5.5 V VCC = 3 V −24 −24 12 12 VCC = 4.5 V VCC = 5.5 V 24 24 24 24 8 8 Input transition rise or fall rate V V 0.9 VCC VCC UNIT V V V mA mA ns/V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = −50 µA VOH VOL IOH = −12 mA VCC MIN TA = 25°C TYP MAX SN54AC533 MIN MAX SN74AC533 MIN 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 5.5 V 5.4 5.4 5.4 3V 2.56 2.4 2.46 MAX UNIT V 4.5 V 3.86 3.7 3.76 IOH = −24 mA 5.5 V 4.86 4.7 4.76 3V 0.1 0.1 0.1 IOL = 50 µA 4.5 V 0.1 0.1 0.1 5.5 V 0.1 0.1 0.1 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 5.5 V ±0.25 ±5 ±2.5 µA 5.5 V ±0.1 ±1 ±1 µA 4 80 40 µA IOL = 12 mA IOL = 24 mA IOZ II VO = VCC or GND VI = VCC or GND ICC Ci VI = VCC or GND, VI = VCC or GND IO = 0 5.5 V 5V 4.5 V pF . "$%#" "!%" &% " ! $%#/! % !-" &#! $ !/!(&!") #%#!% ## #" !% &!$#" #%! !-" -#() !*# "%!" %!!%/! ! %- #"-! % ""! !! &% + "!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCAS555C − NOVEMBER 1995 − REVISED OCTOBER 2003 timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX SN54AC533 MIN SN74AC533 MAX MIN MAX UNIT tw tsu Pulse duration, LE high 6 8 6.5 ns Setup time, data before LE↓ 5.5 7.5 6 ns th Hold time, data after LE↓ 1.5 2.5 1 ns timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX tw tsu Pulse duration, LE high th Hold time, data after LE↓ Setup time, data before LE↓ FROM (INPUT) TO (OUTPUT) tPLH tPHL D Q tPLH tPHL LE Q tPZH tPZL OE Q tPHZ tPLZ OE Q FROM (INPUT) TO (OUTPUT) tPLH tPHL D Q tPLH tPHL LE Q tPZH tPZL OE Q tPHZ tPLZ OE Q MAX MIN MAX UNIT 6.5 5 ns 4 6 4.5 ns 1.5 2.5 1 ns free-air TA = 25°C MIN MAX temperature SN54AC533 MAX MIN MAX 14 1 17.5 1.5 16 2 13 1 16 1.5 14.5 2 14.5 1 18 1.5 16.5 2 13 1 16 1.5 14.5 2 12.5 1 15.5 1.5 14 2 12.5 1 15.5 1.5 14 2 13 1 16 1.5 14.5 2 13 1 16 1.5 14.5 free-air TA = 25°C MIN MAX temperature SN54AC533 range, SN74AC533 MIN 2 switching characteristics over recommended operating VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER MIN SN74AC533 4.5 switching characteristics over recommended operating VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER SN54AC533 UNIT ns ns ns ns range, SN74AC533 MIN MAX MIN MAX 2 10 1 12.5 1.5 11 2 9.5 1 12 1.5 10.5 2 10.5 1 13 1.5 11.5 2 10 1 13 1.5 11 2 9.5 1 12 1.5 10.5 2 9.5 1 12 1.5 10.5 2 10 1 12.5 1.5 11 2 10 1 12.5 1.5 11 UNIT ns ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance CL = 50 pF, . "$%#" "!%" &% " ! $%#/! % !-" &#! $ !/!(&!") #%#!% ## #" !% &!$#" #%! !-" -#() !*# "%!" %!!%/! ! %- #"-! % ""! !! &% + "!) 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz TYP UNIT 40 pF SCAS555C − NOVEMBER 1995 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test CL = 50 pF (see Note A) Open 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC Open LOAD CIRCUIT VCC 50% VCC Timing Input 0V tw tsu VCC 50% VCC Input th 50% VCC VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS Output Control (low-level enabling) VCC 50% VCC Input 50% VCC 0V tPLH tPHL 50% VCC In-Phase Output tPHL Out-of-Phase Output VOH 50% VCC VOL tPLZ tPZL VOH 50% VCC VOL 50% VCC 0V Output Waveform 1 S1 at 2 × VCC (see Note B) ≈VCC 50% VCC VOL + 0.3 V VOL tPHZ tPZH tPLH 50% VCC VCC 50% VCC Output Waveform 2 S1 at Open (see Note B) 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AC533DBLE OBSOLETE SSOP DB 20 SN74AC533DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AC533NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AC533NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533PWLE OBSOLETE TSSOP PW 20 SN74AC533PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC533PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD TBD Lead/Ball Finish Call TI Call TI MSL Peak Temp (3) Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AC533DBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1 SN74AC533DWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1 SN74AC533NSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1 SN74AC533PWR PW 20 MLA 330 16 6.95 7.1 1.6 8 16 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74AC533DBR DB 20 MLA 342.9 336.6 28.58 SN74AC533DWR DW 20 MLA 333.2 333.2 31.75 SN74AC533NSR NS 20 MLA 333.2 333.2 31.75 SN74AC533PWR PW 20 MLA 342.9 336.6 28.58 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 3 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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