Features ! W NE ■ ■ ■ ■ ■ Applications Compact design to save board space 1206 footprint Small size results in very fast time to react to fault events Symmetrical design Low profile Agency recognition: ■ ■ ■ ■ ■ USB port protection - On the Go and 2.0 PC motherboards - Plug and Play protection Mobile phones - Battery and port protection PDAs / Digital Cameras Game console port protection MF-NSMF Series - PTC Resettable Fuses Electrical Characteristics Ihold Model MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 V max. Volts I max. Amps 30.0 13.2 6.0 6.0 6.0 10 100 100 100 100 Itrip Amperes at 23 °C Hold Trip Ohms at 23 °C RMin. R1Max. 0.12 0.50 0.75 1.10 1.50 1.50 0.15 0.10 0.06 0.03 0.29 1.00 1.50 1.80 3.00 Max. Time To Trip Resistance 6.00 0.70 0.29 0.20 0.13 Amperes at 23 °C Seconds at 23 °C 1.0 8.0 8.0 8.0 8.0 0.20 0.10 0.10 0.10 0.30 Tripped Power Dissipation Watts at 23 °C Typ. 0.4 0.4 0.4 0.6 0.6 Environmental Characteristics Operating Temperature ......................................-40 °C to +85 °C Maximum Device Surface Temperature in Tripped State ................................................125 °C Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-MSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 Thermal Derating Chart - Ihold / Itrip (Amps) Ambient Operating Temperature Model MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 -40 ˚C 0.19 / 0.38 0.76 / 1.52 1.11 / 2.22 1.64 / 3.28 2.20 / 4.40 -20 ˚C 0.17 / 0.34 0.68 / 1.36 1.00 / 2.00 1.46 / 2.92 1.99 / 3.98 0 ˚C 0.15 / 0.30 0.59 / 1.18 0.85 / 1.70 1.30 / 2.60 1.77 / 3.54 23 ˚C 0.12 / 0.24 0.50 / 1.00 0.75 / 1.50 1.10 / 2.20 1.50 / 3.00 40 ˚C 0.11 / 0.22 0.44 / 0.88 0.67 / 1.34 0.92 / 1.84 1.34 / 2.68 50 ˚C 0.10 / 0.20 0.40 / 0.80 0.61 / 1.22 0.83 / 1.66 1.23 / 2.46 60 ˚C 0.09 / 0.18 0.35 / 0.70 0.52 / 1.04 0.80 / 1.60 1.10 / 2.20 70 ˚C 0.08 / 0.16 0.32 / 0.64 0.50 / 1.00 0.65 / 1.30 1.01 / 2.02 85 ˚C 0.07 / 0.14 0.26 / 0.52 0.42 / 0.84 0.52 / 1.04 0.84 / 1.68 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Additional Features ■ Additional Applications Patents pending ■ Automotive electronic control modules MF-NSMF Series - PTC Resettable Fuses Product Dimensions A Model MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) B Max. 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) Min. 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) C Max. 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) Packaging: 2000 pcs. per reel. Top and Bottom View A Max. 1.10 (0.043) 0.85 (0.033) 0.85 (0.033) 1.35 (0.053) 1.35 (0.053) D Min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) E Min. 0.127 (0.005) 0.127 (0.005) 0.127 (0.005) 0.127 (0.005) 0.127 (0.005) UNIT = Side View Recommended Pad Layout C 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 1.6 ± 0.1 (.063 ± .004) B 2.0 ± 0.1 (.079 ± .004) D Min. 0.7 (0.028) 0.48 (0.019) 0.48 (0.019) 0.7 (0.028) 0.7 (0.028) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3. E Recommended Storage: 40 °C max./70 % RH max. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MM (INCHES) MF-NSMF Series - PTC Resettable Fuses How to Order Typical Time to Trip at 23 ˚C MF - NSMF 075 T - 2 Multifuse® Product Designator Series NSMF = 1206 Surface Mount Component MF-NSMF110 MF-NSMF012 Hold Current, Ihold 012-150 (0.12 Amps - 1.50 Amps) MF-NSMF150 1 Time to Trip (Seconds) MF-NSMF075 Optional Terminal Finish __ = Standard Au Finish T = Optional Sn Finish MF-NSMF050 Packaging Packaged per EIA 481-1 -2 = Tape and Reel 0.1 Typical Part Marking 0H Represents total content. Layout may vary. 0.01 BIWEEKLY DATE CODE: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z PART IDENTIFICATION: MF-NSMF012 = 0 MF-NSMF050 = 4 MF-NSMF075 = 5 MF-NSMF110 = 6 MF-NSMF150 = 8 0.001 0.1 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Solder Reflow Recommendations 300 Preheating Soldering Cooling Temperature (°C) 250 200 Notes: • MF-NSMF models cannot be wave soldered. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. 150 100 50 Circuit Protection Division 0 160–220 10–20 Time (seconds) MF-NSMF SERIES, REV. A, 01/04 120 Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 North America: Tel: +1-909 781-5500 • Fax: +1-909 781-5700 www.bourns.com Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-NSMF & MF-SMDF Series Tape and Reel Specifications MF-NSMF Series per EIA 481-1 MF-SMDF Series per EIA 481-2 W 8.0 ± 0.30 (0.315 ± 0.012) 16.0 ± 0.3 (0.630 ± 0.012) P0 4.0 ± 0.10 (0.157 ± 0.004) 4.0 ± 0.1 (0.157 ± 0.004) P1 P2 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 8.0 ± 0.1 (0.315 ± 0.004) 2.0 ± 0.1 (0.079 ± 0.004) A0 1.85 ± 0.10 (0.073 ± 0.004) 5.1 ± 0.15 (0.201 ± 0.006) B0 3.45 ± 0.10 (0.136 ± 0.004) 5.6 ± 0.23 (0.220 ± 0.009) Tape Dimensions 12.1 (0.476) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 7.5 ± 0.10 (0.295 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 4.35 (0.171) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) B1 max. D0 F 1.75 ± 0.10 (0.069 ± 0.004) 6.25 (0.246) 0.6 (0.024) E1 E2 min. T max. 0.1 (0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 0.74 ± 0.10 (0.029 ± 0.004) 1.0 ± 0.15 (0.039 ± 0.015) 390 (15.35) 160 (6.30) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) 331 (13.03) 50 (1.97) T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max. UNIT = P0 T D0 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) P2 MM (INCHES) E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 W1(MEASURED AT HUB) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.