FBI2B5S2.......FBI2M5S2 2. Amp. Glass Passivated Bridge Rectifier Plastic Case Dimensions in mm. 20 Voltage 100 to 1000 V. Current 2.0 A. 3.5 ® _ + 1.5 1.5 1 + 0.05 5 5 5 L suffix 13.5 7 –4 • Glass Passivated Junction Chips. 0.5 1 • Mounting Instructions • High temperature soldering guaranteed: 260 ºC – 10 sc. • Recommended mounting torque: 8 Kg.cm. • UL recognized under component index file number E130180. • Lead and polarity identifications. • Case: Molded Plastic. • Ideal for printed circuit board (P.C.B.). • The plastic material carries U/L recognition 94 V-O. Maximum Ratings, according to IEC publication No. 134 FBI2B 5S2 FBI2D 5S2 FBI2F 5S2 FBI2J 5S2 FBI2L 5S2 FBI2M 5S2 100 200 300 600 900 1000 VRRM Peak Recurrent Reverse Voltage (V) VRMS Maximum RMS Voltage (V) 70 140 210 420 630 700 VR Recommended Input Voltage (V) 40 80 125 250 380 500 IF(AV) IFRM Max. Average forward current with heatsink without heatsink Recurrent peak forward current IFSM 10 ms. peak forward surge current 2 2 4.5 A at 65 ºC 2.0 A at 25 ºC 15 A 100 A It I t value for fusing (t = 10 ms) VDIS Dielectric strength (terminals to case, AC 1 min.) Tj Operating temperature range – 40 to + 150 °C Tstg Storage temperature range – 40 to +150 ºC 50 A2 sec 1500 V Electrical Characteristics at Tamb = 25°C VF Max. forward voltage drop per element at IF =3 A 1.1 V IR Max. reverse current per element at VRRM 5 A MAXIMUM THERMAL RESISTANCE Rth (j-c) Junction-Case. With Heatsink. Rth (j-a) Junction-Ambient. Without Heatsink. 12 ºC/W 40 ºC/W Jan - 00 FBI2 - 5S2 Characteristic Curves TYPICAL FORWARD CHARACTERISTIC FORWARD CURRENT DERATING CURVE 4.5 Tamb = 25° C 10 4 heatsink Tc Tc _ 3 on glass-epoxi substrate 1.0 _ + sine wave R-load on heatsink + P.C.B. soldering land 5 mm ø sine wave R-load free in air 2 0.1 1 0 0 0.6 1.0 1.4 0 VF , instantaneous forward voltage (V) 25 50 75 100 125 150 175 Tamb, ambient temperature (°C) MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 100 75 50 25 0 1 10 100 Number of cycles at 50 Hz. Jan - 00