HIGH TECH CHIPS, INC. GENERAL PURPOSE CLOCK GENERATOR 1.0 General description. HTC555 is a general-purpose clock generator. It requires no external components and provides wide range of clock frequencies. It’s very easy to use and provides general clock solution in wide range of applications. It is very simple to design and operate. Output frequency is determined by value of D[0:4]. Refer to Output frequency table. PDIP, SOIC 1 2 3 4 VDD CLKOUT D4 D3 8 7 6 5 HTC555 Features • • • • • GND D0 D1 D2 Single chip solution. Replaces clock generator. Has one percent frequency accuracy at room temperature. Has ten percent frequency accuracy over temperature range and VDD voltage range. Requires no external components for operation. 2.0 Application. Typical connection diagram. VDD VDD R1 R2 R3 R4 R5 10K 10K 10K 10K 10K C1 100n HTC555 1 2 3 4 5 10 9 8 7 6 7 6 5 4 3 D0 D1 D2 D3 D4 VDD CLKOUT GND 1 CLOCK OUTPUT 2 8 FREQUENCY SELECTION 01/04/00 1 HIGH TECH CHIPS, INC. With this application we can generate thirty-two different output frequencies. See output frequency selection table for dip switch settings. Setting “Frequency Selection” dip switch sets frequency. HTC555 reads input switch value constantly and output frequency is set per new value if D[0:4] inputs are changed. Time that takes to change output frequency to new value is relative to period of previous frequency setting. For example if HTC555 was generating 10000Hz clock and we changed it to 25000Hz clock, then output frequency will change in 1/10000Hz or 100uS. In order to avoid output glitches, HTC555 changes its output frequency after finishing current output period. R1-R5 value could be in a range of 1K to 10K in this application. Please note that if only one frequency is needed then we can connect D [0:4] pins directly to ground or VDD. C1 is used, as de-coupling capacitor and could be omitted. 3.0 Pin out description. Abbreviations used: O - output, I - input, P - power. Pin number 1 2 3 4 5 6 7 8 Name VDD CLKOUT D4 D3 D2 D1 D0 GND I/O P O I I I I I P Description Power Clock Output Frequency selector input. Frequency selector input. Frequency selector input. Frequency selector input. Frequency selector input. Ground Notes +2.5V to + 5.5V. Output frequency. Tie to GND or VDD. Tie to GND or VDD. Tie to GND or VDD. Tie to GND or VDD. Tie to GND or VDD. Connect to ground. Output Frequency Selection. Abbreviations used: 0 – connection to GND, 1 – connection to VDD. D4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 01/04/00 D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 CLK ( output frequency) 1Hz 10 Hz 20 Hz 30 Hz 40 Hz 50 Hz 60 Hz 70 Hz 80 Hz 90 Hz 100 Hz 200 Hz 300 Hz 400 Hz 500 Hz 2 HIGH TECH CHIPS, INC. 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 600 Hz 700 Hz 800 Hz 900 Hz 1000 Hz 2000 Hz 3000 Hz 4000 Hz 5000 Hz 6000 Hz 7000 Hz 8000 Hz 9000 Hz 10000 Hz 25000 Hz 50000 Hz 100000 Hz 4.0 Electrical characteristics. Voltage on VDD pin in respect to GND Current consumption with no load attached CLKOUT output low voltage (5mA load) CLKOUT output low voltage (25mA load) CLKOUT output high voltage (5mA source) CLKOUT output source current max CLKOUT output sink current max +2.5 to +5.5V 3 mA1 0.4V1 0.75V1 VDD-0.7V1 25mA1 25mA1 NOTES: 1. Those values are characterized but not tested. 5.0 Ordering information. H T C 5 5 5 X X OPTIONAL: Temperature range: C = 0oC to +70oC , I = - 40oC to + 85oC. PACKAGE: S – 208 mil SOIC D – 300 mil PDIP. PART NUMBER. 01/04/00 3 HIGH TECH CHIPS, INC. 6.0 Mechanical information. 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) Units INCHES* Dimension Limits MIN NOM Number of Pins n 8 Pitch p .100 Top to Seating Plane A .140 .155 Molded Package Thickness A2 .115 .130 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 Molded Package Width E1 .240 .250 Overall Length D .360 .373 Tip to Seating Plane L .125 .130 Lead Thickness c .008 .012 Upper Lead Width B1 .045 .058 Lower Lead Width B .014 .018 Overall Row Spacing eB .310 .370 Mold Draft Angle Top α 5 10 Mold Draft Angle Bottom β 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold not exceed .010” (0.254mm)per side. JEDEC Equivalent:MS-001 01/04/00 MAX .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM MAX 8 2.54 3.56 3.94 4.32 2.92 3.30 3.68 0.38 7.62 7.94 8.26 6.10 6.35 6.60 9.14 9.46 9.78 3.18 3.30 3.43 0.20 0.29 0.38 1.14 1.46 1.78 0.36 0.46 0.56 7.87 9.40 10.92 5 10 15 5 10 15 MIN flash protrusions. Mold flash or protrusions shell 4 HIGH TECH CHIPS, INC. 8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC) Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch P .050 1.27 Overall Height A .070 .075 .080 1.78 1.97 2.03 Molded Package Thickness A2 .069 .074 .078 1.75 1.88 1.98 Standoff A1 .002 .005 .010 0.05 0.13 0.25 Overall Width E .300 .313 .325 7.62 7.95 8.26 Molded Package Width E1 .201 .208 .212 5.11 5.28 5.38 Overall Length D .202 .205 .210 5.13 5.21 5.33 Foot Length L .020 .025 .030 0.51 0.64 0.76 Foot Angle φ 0 4 8 0 4 8 Lead Thickness c .008 .009 .010 0.20 0.23 0.25 Lead Width B .014 .017 .020 0.36 0.43 0.51 α Mold Draft Angle Top 0 12 15 0 12 15 Mold Draft Angle Bottom β 0 12 15 0 12 15 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash protrusions. Mold flash or protrusions shell not exceed .010” (0.254mm)per side. 01/04/00 5 HIGH TECH CHIPS, INC. HTC makes no warranty, express, statutory implied or by description, regarding information set forth herein or regarding the freedom of described devices from patent infringement. HTC makes no warranty or merchantability or fitness for any purposes. HTC reserves right to discontinue production and change specifications and prices at any time and without notice. HTC's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by HTC for such applications. High Tech Chips, Inc. www.hightechips.com [email protected] 01/04/00 6