TI TRS3318ECDBR

TRS3318E
www.ti.com
SLLS805A – APRIL 2007 – REVISED APRIL 2010
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
Check for Samples: TRS3318E
FEATURES
1
•
•
•
•
•
•
•
ESD Protection for RS-232 I/O Pins
– ±15 kV (Human-Body Model)
– ±8 kV (IEC 61000-4-2, Contact Discharge)
– ±15 kV (IEC 61000-4-2, Air-Gap Discharge)
300-µA Operating Supply Current
1-µA Low-Power Standby Mode (With
Receivers Active)
Designed to Transmit at a Data Rate of
460 kbps
Auto-Powerdown Plus Option Features
Flexible Power-Saving Mode
Operates From a Single 2.25-V to 3-V VCC
Supply
Designed to be Interchangeable With Industry
Standard '3318 Devices
DB OR PW PACKAGE
(TOP VIEW)
READY
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Cellular Phones
Notebooks
Hand-Held Equipment
Pagers
DESCRIPTION/ORDERING INFORMATION
The TRS3318E is a dual-driver, dual-receiver, RS-232-compatible transceiver. The device features
auto-powerdown plus and enhanced electrostatic discharge (ESD) protection integrated into the chip. Driver
output and receiver input are protected to ±15 kV using the IEC 61000-4-2 Air-Gap Discharge method, ±8 kV
using the IEC 61000-4-2 Contact Discharge method, and ±15 kV using the Human-Body Model (HBM).
The device operates at a data rate of 460 kbps. The transceiver has a proprietary low-dropout driver output
stage, enabling RS-232-compatible operation from a 2.25-V to 3-V supply with a dual charge pump. The charge
pump requires only four 0.1-µF capacitors and features a logic-level output (READY) that asserts when the
charge pump is regulating and the device is ready to begin transmitting.
The TRS3318E achieves a 1-µA supply current using the auto-powerdown feature. This device automatically
enters a low-power power-down mode when the RS-232 cable is disconnected or the drivers of the connected
peripherals are inactive for more than 30 s. The device turns on again when it senses a valid transition at any
driver or receiver input. Auto-powerdown saves power without changes to the existing BIOS or operating system.
This device is available in two space-saving packages: 20-pin SSOP and 20-pin TSSOP.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2010, Texas Instruments Incorporated
TRS3318E
SLLS805A – APRIL 2007 – REVISED APRIL 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
SSOP – DB
0°C to 70°C
TSSOP – PW
SSOP – DB
–40°C to 85°C
TSSOP – PW
(1)
(2)
ORDERABLE PART NUMBER
Tube of 70
TRS3318ECDB
Reel of 2000
TRS3318ECDBR
Tube of 70
TRS3318ECPW
Reel of 2000
TRS3318ECPWR
Tube of 70
TRS3318EIDB
Reel of 2000
TRS3318EIDBR
Tube of 70
TRS3318EIPW
Reel of 2000
TRS3318EIPWR
TOP-SIDE MARKING
RV18EC
RV18EC
RV18EI
RV18EI
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DETAILED DESCRIPTION
Flexible control options for power management are featured when the serial port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense valid signal transitions on all receiver and driver inputs for approximately
30 s, the built-in charge pump and drivers are powered down, reducing the supply current to 1 µA. By
disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus can be disabled when
FORCEON and FORCEOFF are high. With auto-powerdown plus enabled, the device activates automatically
when a valid signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input
voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 µs
(typical number). INVALID is low (invalid data) if all receiver input voltage are between –0.3 V and 0.3 V for more
than 30 µs (typical number).
2
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TRS3318E
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SLLS805A – APRIL 2007 – REVISED APRIL 2010
FUNCTION TABLE (1)
INPUT CONDITIONS
FORCEON
FORCEOFF
RECEIVER
OR DRIVER
EDGE
WITHIN 30 s
OUTPUT STATES
VALID
RS-232
LEVEL
PRESENT AT
RECEIVER
DRIVER
RECEIVER
INVALID
READY
OPERATING
MODE
Auto-Powerdown Plus Conditions
H
H
No
No
Active
Active
L
H
Normal operation,
auto-powerdown
plus disabled
H
H
No
Yes
Active
Active
H
H
Normal operation,
auto-powerdown
plus disabled
L
H
Yes
No
Active
Active
L
H
Normal operation,
auto-powerdown
plus enabled
L
H
Yes
Yes
Active
Active
H
H
Normal operation,
auto-powerdown
plus enabled
L
H
No
No
Z
Active
L
L
Power down,
auto-powerdown
plus enabled
L
H
No
Yes
Z
Active
H
L
Power down,
auto-powerdown
plus enabled
X
L
X
No
Z
Active
L
L
Manual power
down
X
L
X
Yes
Z
Active
H
L
Manual power
down
Auto-Powerdown Conditions
(1)
INVALID
INVALID
X
No
Z
Active
L
L
Power down,
auto-powerdown
enabled
INVALID
INVALID
X
Yes
Active
Active
H
H
Normal operation,
auto-powerdown
enabled
H = high level, L = low level, X = irrelevant, Z = high impedance
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TRS3318E
SLLS805A – APRIL 2007 – REVISED APRIL 2010
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LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
FORCEOFF
FORCEON
ROUT1
13
17
12
8
20
14
11
Auto-powerdown Plus
1
15
16
DOUT1
DOUT2
INVALID
READY
RIN1
5 kΩ
ROUT2
9
10
RIN2
5 kΩ
TERMINAL FUNCTIONS
TERMINAL
NAME
DESCRIPTION
NO.
C1+
2
Positive voltage-doubler charge-pump capacitor
C1–
4
Negative voltage-doubler charge-pump capacitor
C2+
5
Positive inverting charge-pump capacitor
C2–
6
Negative inverting charge-pump capacitor
DIN
12, 13
CMOS driver inputs
DOUT
8, 17
RS-232 driver outputs
FORCEOFF
20
Force-off input, active low. Drive low to power down transmitters, receivers, and charge pump. This overrides
auto-powerdown and FORCEON (see Function Table).
FORCEON
14
Force-on input, active high. Drive high to override auto-powerdown, keeping transmitters and receivers on
(FORCEOFF must be high) (see Function Table).
GND
18
Ground
INVALID
11
Valid signal detector output, active low. A logic high indicates that a valid RS-232 level is present on a receiver
input.
READY
1
Ready to transmit output, active high. READY is enabled high when V– goes below –3.5 V and the device is
ready to transmit.
RIN
9, 16
RS-232 receiver inputs
ROUT
10, 15
CMOS receiver outputs
V+
3
2 × VCC generated by the charge pump
V–
7
–2 × VCC generated by the charge pump
VCC
19
2.25-V to 3-V single-supply voltage
4
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TRS3318E
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SLLS805A – APRIL 2007 – REVISED APRIL 2010
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC to GND
–0.3
6
V
V+ to GND (2)
–0.3
7
V
V– to GND (2)
–7
0.3
V
13
V
V+ + IV–I
(2)
Input voltage
Output voltage
Short-circuit duration
Continuous power dissipation (TA = 70°C)
DIN, FORCEON, FORCEOFF to GND
–0.3
6
RIN to GND
DOUT to GND
±13.2
ROUT, INVALID, READY to GND
–0.3
DOUT to GND
V
VCC + 0.3
Continuous
20-pin SSOP (derate 8 mW/°C above 70°C)
640
20-pin TSSOP (derate 7 mW/°C above 70°C)
559
–65
Lead temperature (soldering, 10 s)
(2)
V
±25
Storage temperature range
(1)
UNIT
mW
150
°C
300
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
Recommended Operating Conditions
See Figure 4
MIN NOM
Supply voltage
2.25
2.5
MAX UNIT
3
V
VIH
Driver and control high-level input voltage
DIN, FORCEOFF,
FORCEON
VCC = 2.5 V to 3 V
0.7 × VCC
5.5
V
VIL
Driver and control low-level input voltage
DIN, FORCEOFF,
FORCEON
VCC = 2.5 V to 3 V
0
0.3 × VCC
V
VI
Receiver input voltage
–25
25
V
0
70
–40
85
TA
Operating free-air temperature
TRS3318EC
TRS3318EI
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°C
5
TRS3318E
SLLS805A – APRIL 2007 – REVISED APRIL 2010
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Supply Current Section
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1) MAX
UNIT
DC Characteristics (VCC = 2.5 V, TA = 25°C)
Auto-powerdown plus supply current
FORCEON = GND, FORCEOFF = VCC, All RIN and DIN idle
1
10
Auto-powerdown supply current
FORCEOFF = GND
1
10
µA
Supply current
FORCEON = FORCEOFF = VCC, No load
0.3
2
mA
(1)
µA
Typical values are at VCC = 2.5 V, TA = 25°C.
ESD Protection
PARAMETER
RIN, DOUT
6
TEST CONDITIONS
TYP
HBM
±15
IEC 61000-4-2 Air-Gap Discharge method
±15
IEC 61000-4-2 Contact Discharge method
±8
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UNIT
kV
Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): TRS3318E
TRS3318E
www.ti.com
SLLS805A – APRIL 2007 – REVISED APRIL 2010
Driver Section
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
MIN TYP (1)
TEST CONDITIONS
Driver input hysteresis
MAX
0.3
±0.01
UNIT
V
Input leakage current
FORCEON, DIN, FORCEOFF
Output voltage swing
All driver outputs loaded with 3 kΩ to ground
±3.7
±4
V
Output resistance
VCC = 0, Driver output = ±2 V
300
10M
Ω
Output short-circuit current (2)
Output leakage current
(1)
(2)
±25
VCC = 0 or 2.25 V to 3 V, VOUT = ±12 V, Drivers disabled
±1
µA
±60
mA
±25
µA
Typical values are at VCC = 2.5 V, TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 1)
PARAMETER
Maximum data rate
|tPHL – tPLH| Driver skew
MIN
RL = 3 kΩ, CL = 1000 pF, One transmitter switching
TYP (1)
MAX
460
(2)
Transition-region slew rate
(1)
(2)
TEST CONDITIONS
kbps
100
VCC = 2.5 V, TA = 25°C, RL = 3 kΩ to 7 kΩ,
Measured from 3 V to –3 V or –3 V to 3 V,
CL = 150 pF to 2500 pF
4
UNIT
ns
30
V/µs
Typical values are at VCC = 2.5 V, TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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Receiver Section
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
MIN TYP (1)
TEST CONDITIONS
Input voltage range
–25
Input threshold low
TA = 25°C
Input threshold high
TA = 25°C
V
0.3 × VCC
V
V
0.3
Input resistance
TA = 25°C
3
Output leakage current
Output voltage low
IOUT = 0.5 mA
Output voltage high
IOUT = –0.5 mA
UNIT
25
0.7 × VCC
Input hysteresis
(1)
MAX
V
5
7
kΩ
±0.05
±10
µA
0.1 × VCC
V
0.9 × VCC
V
Typical values are at VCC = 2.5 V, TA = 25°C.
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF (unless otherwise noted) (see Figure 4)
PARAMETER
tPHL
Receiver propagation delay
tPLH
|tPHL – tPLH|
(1)
(2)
8
TEST CONDITIONS
RIN to ROUT, CL = 150 pF
Receiver skew (2)
TYP (1)
0.175
0.175
50
UNIT
µs
ns
Typical values are at VCC = 2.5 V, TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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SLLS805A – APRIL 2007 – REVISED APRIL 2010
Auto-Powerdown Plus Section
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
MAX
Positive threshold
Receiver input threshold to INVALID high
2.7
Negative threshold
–2.7
Receiver input threshold INVALID low
–0.3
INVALID, READY voltage low
IOUT = 0.5 mA
INVALID, READY voltage high
IOUT = –0.5 mA
UNIT
V
0.3
V
0.1 × VCC
V
0.8 × VCC
V
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
tINVH
Receiver positive or negative threshold to INVALID high
VCC = 2.5 V
1
µs
tINVL
Receiver positive or negative threshold to INVALID low
VCC = 2.5 V
30
µs
tWU
Receiver or driver edge to driver enabled
VCC = 2.5 V
tAUTOPRDN
Receiver or driver edge to driver shutdown
VCC = 2.5 V
(1)
100
15
30
µs
60
s
Typical values are at VCC = 2.5 V, TA = 25°C.
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PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
tTLH
tTHL
Output
−3 V
−3 V
6V
SR(tr) +
t THL or tTLH
VOH
3V
3V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
2.25 V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.125 V
1.125 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3V
Input
0V
0V
−3 V
Output
Generator
(see Note B)
tPHL
50 Ω
tPLH
CL
(see Note A)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
10
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PARAMETER MEASUREMENT INFORMATION (continued)
Receiver
Inputs
}
Invalid
Region
Driver
Inputs
Driver
Outputs
VCC
INVALID
Output
tINVL
tINVH
0
tWU
tWU
VCC
Ready
Output
0
V+
VCC
0
V−
VOLTAGE WAVEFORMS
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High
ROUT
Generator
(see Note B)
2.7 V
50 Ω
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
−0.3 V
Auto-powerdown
Plus
Indeterminate
INVALID
−2.7 V
CL = 30 pF
(see Note A)
†
FORCEON
FORCEOFF
Valid RS-232 Level, INVALID High
DIN
DOUT
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
TEST CIRCUIT
Figure 4. INVALID Propagation Delay Times and Supply Enabling Time
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APPLICATION INFORMATION
2.5 V
+ 0.1 mF
19
CBYPASS
2
C1
0.1 mF
C2
0.1 mF
+
4
+
5
6
VCC
C1+
V+
3
+
C1−
V−
C2+
7
C2−
13 DIN1
DOUT1 17
12 DIN2
DOUT2 8
C4
+ 0.1 mF
RS-232-Compatible
Outputs
RS-232-Compatible
Inputs
RIN1 16
15 ROUT1
C3
0.1 mF
5k
10 ROUT2
1
RIN2 9
5k
READY
To Power-Management Unit
Autopowerdown INVALID 11
Plus
VCC
FORCEOFF 20
14
FORCEON
GND
18
Figure 5. Typical Application Circuit
12
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TRS3318ECDB
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318ECDBG4
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318ECDBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318ECDBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318ECPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318ECPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318ECPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318ECPWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIDB
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIDBG4
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIDBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIDBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TRS3318EIPWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2010
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Mar-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
12.0
16.0
Q1
TRS3318ECDBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
TRS3318ECPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
TRS3318EIDBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
TRS3318EIPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Mar-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRS3318ECDBR
SSOP
DB
20
2000
346.0
346.0
33.0
TRS3318ECPWR
TSSOP
PW
20
2000
346.0
346.0
33.0
TRS3318EIDBR
SSOP
DB
20
2000
346.0
346.0
33.0
TRS3318EIPWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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