TI TS3USB221DRCRG4

TS3USB221
www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
FEATURES
1
•
•
•
•
•
•
•
•
•
•
VCC Operation at 2.5 V and 3.3 V
VI/O Accepts Signals up to 5.5 V
1.8-V Compatible Control-Pin Inputs
Low-Power Mode When OE Is Disabled (1 µA)
rON = 6 Ω Maximum
ΔrON = 0.2 Ω Typical
Cio(on) = 6 pF Maximum
Low Power Consumption (30 µA Maximum)
ESD > 2000-V Human-Body Model (HBM)
High Bandwidth (1.1 GHz Typical)
DRC PACKAGE
(TOP VIEW)
1D+
1
10
VCC
1D–
2
9
S
2D+
3
8
D+
2D–
4
7
D–
GND
5
6
OE
RSE PACKAGE
(TOP VIEW)
APPLICATIONS
•
•
Routes Signals for USB 1.0, 1.1, and 2.0
Mobile Industry Processor Interface (MIPI)
Signal Routing
DESCRIPTION/
ORDERING INFORMATION
The TS3USB221 is a high-bandwidth switch specially
designed for the switching of high-speed USB 2.0
signals in handset and consumer applications, such
as cell phones, digital cameras, and notebooks with
hubs or controllers with limited USB I/Os. The wide
bandwidth (1.1 GHz) of this switch allows signals to
pass with minimum edge and phase distortion. The
device multiplexes differential outputs from a USB
host device to one of two corresponding outputs. The
switch is bidirectional and offers little or no
attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0
(480 Mbps).
VCC
1D+
1
1D–
10
9
S
2
8
D+
2D+
3
7
D–
2D–
4
6
OE
5
GND
RSE PACKAGE
(BOTTOM VIEW)
VCC
S
9
D+
10
1
1D+
8
2
1D–
D–
7
3
2D+
OE
6
4
2D–
5
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2008, Texas Instruments Incorporated
TS3USB221
SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN – RSE
Reel of 3000
TS3USB221RSER
L5O
SON – DRC
Reel of 3000
TS3USB221DRCR
ZWG
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PIN DESCRIPTION
NAME
DESCRIPTION
OE
Bus-switch enable
S
Select input
D
Bus A
nD
Bus B
TRUTH TABLE
S
OE
FUNCTION
X
H
Disconnect
L
L
D = 1D
H
L
D = 2D
BLOCK DIAGRAM
D+
1D+
D−
1D−
2D+
2D−
S
OE
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
VCC
Charge
Pump
EN (see Note A)
A.
2
EN is the internal enable signal applied to the switch.
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TS3USB221
www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
(2) (3) (4)
VI/O
Switch I/O voltage range
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±120
mA
±100
mA
II/O
ON-state switch current
–0.5
(5)
Continuous current through VCC or GND
θJA
Package thermal impedance (6)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
7
UNIT
DRC package
48.7
RSE package
243
–65
150
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
MIN
MAX
UNIT
2.3
3.6
VCC = 2.3 V to 2.7 V
0.46 × VCC
5.5
V
VCC = 2.7 V to 3.6 V
0.46 × VCC
5.5
VCC = 2.3 V to 2.7 V
0
0.25 × VCC
VCC = 2.7 V to 3.6 V
0
0.25 × VCC
0
5.5
V
–40
85
°C
V
V
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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TS3USB221
SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
UNIT
–1.8
V
VIN = 0 V to 3.6 V
±1
µA
VIN = VCC or GND,
Switch OFF
±1
µA
VI/O = 0 V to 3.6 V
±2
VI/O = 0 V to 2.7 V
±1
VCC = 3.6 V, 2.7 V,
VIN = VCC or GND,
II/O = 0 V,
Switch ON or OFF
30
µA
VCC = 3.6 V, 2.7 V,
VIN = VCC or GND
Switch disabled
(OE in high state)
1
µA
II = –18 mA
VCC = 3.6 V, 2.7 V, 0 V,
IOZ (3)
VCC = 3.6 V, 2.7 V,
VO = 0 V to 3.6 V, VI = 0 V,
I(OFF)
VCC = 0 V
ICC
ICC
(low power
mode)
Control
inputs
IIN
TYP (2)
MAX
VCC = 3.6 V, 2.7 V,
MIN
ΔICC (4)
Control
inputs
One input at 1.8 V,
Other inputs at VCC or GND
VCC = 3.6 V
20
VCC = 2.7 V
0.5
Cin
Control
inputs
VCC = 3.3 V, 2.5 V,
VIN = 3.3 V or 0 V
Cio(OFF)
VCC = 3.3 V, 2.5 V,
VI/O = 3.3 V or 0 V,
Cio(ON)
VCC = 3.3 V, 2.5 V,
VI/O = 3.3 V or 0 V,
VI = 0 V,
IO = 30 mA
6
VI = 2.4 V,
IO = –15 mA
6
VI = 0 V,
IO = 30 mA
0.2
VI = 1.7,
IO = –15 mA
0.2
VI = 0 V,
IO = 30 mA
1
VI = 1.7,
IO = –15 mA
1
ron (5)
VCC = 3 V, 2.3 V
Δron
VCC = 3 V, 2.3 V
ron(flat)
VCC = 3 V, 2.3 V
(1)
(2)
(3)
(4)
(5)
µA
µA
1
2
pF
Switch OFF
3
4
pF
Switch ON
5
6
pF
Ω
Ω
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
TEST CONDITIONS
TYP (1)
UNIT
XTALK
Crosstalk
RL = 50 Ω, f = 250 MHz
–40
OIRR
OFF isolation
RL = 50 Ω, f = 250 MHz
–41
dB
BW
Bandwidth (–3 dB)
RL = 50 Ω
1.1
GHz
(1)
4
dB
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
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TS3USB221
www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008
DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 2.5 V ± 10%, GND = 0 V
PARAMETER
TYP (1)
TEST CONDITIONS
UNIT
XTALK
Crosstalk
RL = 50 Ω, f = 250 MHz
–39
dB
OIRR
OFF isolation
RL = 50 Ω, f = 250 MHz
–40
dB
BW
Bandwidth (–3 dB)
RL = 50 Ω
1.1
GHz
(1)
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
SWITCHING CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
tpd
Propagation delay
MIN
(2) (3)
TYP (1)
MAX
0.25
UNIT
ns
S to D, nD
30
OE to D, nD
17
S to D, nD
12
OE to D, nD
10
tON
Line enable time
tOFF
Line disable time
tSK(O)
Output skew between center port to any other port (2)
0.1
0.2
ns
tSK(P)
Skew between opposite transitions of the same output (tPHL – tPLH) (2)
0.1
0.2
ns
(1)
(2)
(3)
ns
ns
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Specified by design
The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
SWITCHING CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 2.5 V ± 10%, GND = 0 V
PARAMETER
tpd
Propagation delay
MIN
(2) (3)
TYP (1)
MAX
0.25
UNIT
ns
S to D, nD
50
OE to D, nD
32
S to D, nD
23
OE to D, nD
12
tON
Line enable time
tOFF
Line disable time
tSK(O)
Output skew between center port to any other port (2)
0.1
0.2
ns
tSK(P)
Skew between opposite transitions of the same output (tPHL – tPLH) (2)
0.1
0.2
ns
(1)
(2)
(3)
ns
ns
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Specified by design
The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
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TS3USB221
SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com
APPLICATION INFORMATION
0
0
–1
–20
VCC = 3.3 V
VCC = 2.5 V
Attenuation (dB)
Gain (dB)
–2
–3
–4
–40
–60
–80
–5
–100
VCC = 3.3 V
VCC = 2.5 V
–6
–120
–7
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
100.0E+3
10.0E+9
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
Frequency (Hz)
Frequency (Hz)
Figure 1. Gain vs Frequency
Figure 2. OFF Isolation vs Frequency
3.5
0
3.4
–20
ron (Ω)
Attenuation (dB)
3.3
–40
–60
3.2
3.1
–80
3.0
–100
VCC = 3.3 V
VCC = 2.5 V
2.9
–120
VCC = 3.0 V
VCC = 2.3 V
2.8
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
0.0
0.5
1.0
1.5
Frequency (Hz)
2.0
2.5
3.0
3.5
VIN (V)
Figure 3. Crosstalk vs Frequency
Figure 4. ron vs VIN (IOUT = –15 mA)
3.5
3.4
ron (Ω)
3.3
3.2
3.1
3.0
2.9
VCC = 3.0 V
VCC = 2.3 V
2.8
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VIN (V)
Figure 5. ron vs VIN (IOUT = –30 mA)
6
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0.5
0.5
0.4
0.4
0.3
0.3
Differential Signal (V)
Differential Signal (V)
www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008
0.2
0.1
0.0
–0.1
–0.2
0.2
0.1
0.0
–0.1
–0.2
–0.3
–0.3
–0.4
–0.4
–0.5
–0.5
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0
0.2
0.4
0.5
–9
0.8
1.0
1.2
1.4
1.6
1.8
2.0
–9
Time (X 10 ) (s)
Time (X 10 ) (s)
Figure 6. Eye Pattern: 480-Mbps USB Signal With No
Switch (Through Path)
Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch
NC Path
0.5
0.4
Differential Signal (V)
0.3
0.2
0.1
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
–9
Time (X 10 ) (s)
Figure 8. Eye Pattern: 480-Mbps USB Signal With Switch
NO Path
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TS3USB221
SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
1D or 2D VOUT1 or VOUT2
VIN
RL
CL
VCOM
tON
500 Ω
50 pF
V+
tOFF
500 Ω
50 pF
V+
D
CL(2)
1D or 2D
VCTRL
TEST
RL
S
CL(2)
Logic
Input(1)
RL
GND
1.8 V
Logic
Input
(VI)
50%
50%
0
tON
Switch
Output
(VOUT1 or VOUT2)
(1)
(2)
tOFF
90%
90%
VOH
VOL
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 9. Turn-On (tON) and Turn-Off Time (tOFF)
VCC
Network Analyzer
Channel OFF: 1D to D
50 W
VOUT1 1D
VCTRL = VCC or GND
D
Source
Signal
50 W
VIN
2D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
VCTRL S
50 W
+
GND
DC Bias = 350 mV
Figure 10. OFF Isolation (OISO)
8
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TS3USB221
www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Network Analyzer
Channel ON: 1D to D
50 W
VOUT1 1D
Channel OFF: 2D to D
VIN
Source
Signal
VCTRL = VCC or GND
VOUT2 2D
50 W
Network Analyzer Setup
50 W
VCTRL S
+
Source Power = 0 dBm
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
Figure 11. Crosstalk (XTALK)
VCC
Network Analyzer
50 W
VOUT1
1D
Channel ON: 1D to D
D
Source
Signal
VIN
VCTRL = VCC or GND
2D
Network Analyzer Setup
50 W
VCTRL
+
Source Power = 0 dBm
(632-mV P-P at 50-W load)
S
GND
DC Bias = 350 mV
Figure 12. Bandwidth (BW)
400 mV
Figure 13. Propagation Delay
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PARAMETER MEASUREMENT INFORMATION (continued)
800 mV
50%
50%
Input
400 mV
tPLH
tPHL
VOH
50%
Output
VOL
tSK(P) = | tPHL – tPLH |
PULSE SKEW tSK(P)
800 mV
50%
50%
Input
400 mV
tPLH1
tPHL1
VOH
50%
50%
Output 1
VOL
tSK(O)
tSK(O)
VOH
50%
50%
Output 2
tPLH2
VOL
tPHL2
tSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 |
OUTPUT SKEW tSK(P)
Figure 14. Skew Test
VCC
VOUT1 1D
+
D
VIN
Channel ON
VOUT2 2D
r on +
VCTRL
IIN
S
VIN * VOUT2 or VOUT1
W
IIN
VCTRL = VIH or VIL
+
GND
Figure 15. ON-State Resistance (ron)
10
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TS3USB221
www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
VOUT1 1D
VIN
D
+
VOUT2 2D
VCTRL
+
S
OFF-State Leakage Current
Channel OFF
VCTRL = VIH or VIL
+
GND
Figure 16. OFF-State Leakage Current
VCC
VOUT1 1D
Capacitance
Meter
VBIAS
VBIAS = VCC or GND
VOUT2 2D
VCTRL = VCC or GND
VIN D
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
VCTRL S
GND
Figure 17. Capacitance
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11
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jan-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TS3USB221DRCR
ACTIVE
SON
DRC
10
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TS3USB221DRCRG4
ACTIVE
SON
DRC
10
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TS3USB221RSER
ACTIVE
UQFN
RSE
10
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3USB221RSERG4
ACTIVE
UQFN
RSE
10
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Dec-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS3USB221DRCR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.3
1.1
8.0
12.0
Q2
SON
DRC
10
3000
330.0
12.4
TS3USB221DRCR
SON
DRC
10
3000
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q2
TS3USB221RSER
UQFN
RSE
10
3000
179.0
8.4
1.75
2.25
0.65
4.0
8.0
Q1
Pack Materials-Page 1
3.3
B0
(mm)
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Dec-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3USB221DRCR
SON
DRC
10
3000
346.0
346.0
29.0
TS3USB221DRCR
SON
DRC
10
3000
370.0
355.0
55.0
TS3USB221RSER
UQFN
RSE
10
3000
220.0
205.0
50.0
Pack Materials-Page 2
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