TI SN65LVDS315RGER

SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
CAMERA PARALLEL RGB TO MIPI CSI-1 SERIAL CONVERTER
FEATURES
The serialized data is presented on the differential
serial data output DOUT with a differential clock
signal on output CLK. The frequency of CLK is 8× the
DCLK input pixel clock rate.
1
•
•
•
•
•
•
•
MIPI CSI-1 and SMIA CCP Support
Connects Directly to OMAP CSI Interface
4×4 mm QFN Package
ESD Rating >3 kV (HBM) Camera Input Ports
and >2 kV (HBM) All Other Ports
Pixel Clock Range 3.5–26 MHz
Three Operating Modes to Conserve Power
– Active Mode VGA Camera 30 fps: 7 mA
– Typical Shutdown and Standby: 0.5 µA
EMI
Flexible printed circuit (FPC) cabling typically
interconnects the SN65LVDS315 with the CSI-1
compliant receiver. Compared to parallel signalling,
the SN65LVDS315 outputs significantly reduce the
EMI of the interconnect.
The SN65LVDS315 supports three power modes
(shutdown, standby and active) to conserve power.
The TXEN input may be used to put the
SN65LVDS315 in a shutdown mode. The
SN65LVDS315 enters an active standby mode if the
input clock, DCLK, stops. This minimizes power
consumption without the need for controlling an
external terminal.
APPLICATIONS
•
•
Camera to Host Controller (e.g. OMAP2420,
OMAP2430, OMAP3430)
Mobile Phones and Smart Phones
The SN65LVDS315 is characterized for operation
over ambient air temperatures of –40°C to 85°C. All
CMOS inputs offer failsafe operation to protect the
input from damage during power up and to avoid
current flow into the device inputs during power up.
The core supply of the SN65LVDS315 is 1.8 V. To
provide greater flexibility, the camera data inputs
support a supply range from 1.8 V to 3.3 V.
DESCRIPTION
The SN65LVDS315 is a camera serializer that
converts 8-bit parallel camera data into MIPI-CSI1 or
SMIA CCP compliant serial signals.
The device converts the parallel 8-bit data to two
sub-low-voltage differential signaling (SubLVDS)
serial data and clock output. The parallel data is
latched in with the pixel clock input DCLK on the
falling clock edge. The control inputs VS and HS are
used to determine line and frame synchronization.
Camera
RGB IF
LVDS315
FPC
Application
processor
with
integrated
MIPI CSI-1
receiver
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
8
Packet Engine:
Packet Validation
8
Force EOF
D[0:7]
HS
Load
SubLVDS
PLL
x8
SubLVDS
DOUT+
DOUT-
++
Reset
VS
8-Bit Parallel to Serial
FUNCTIONAL BLOCK DIAGRAM
Counter
Line Count
&
MODE
DCLK
CLK+
CLK-
Low Frequency
Detector
Standby, Shutdown, and Startup Controller
Glitch
Supression
TXEN
2
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
D6
GNDD
DCLK
D5
D4
D3
24-PIN QFN 0.5MM PITCH (RGE)
18
17
16
15
14
13
D1
HS 21
10
D0
VDDIO 22
9
VDDA
VDDD 23
8
MODE
FSEL 24
7
TXEN
GNDD
1
2
3
4
5
6
GNDA
11
CLK+
VS 20
CLK-
D2
DOUT+
12
DOUT-
D7 19
Table 1. Pin Description QFN Package
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
PIN
1
GNDD
2
DOUT–
3
SIGNAL
7
TXEN
13
D3
19
D7
8
MODE
14
D4
20
VS
DOUT+
9
VDDA
15
D5
21
HS
4
CLK–
10
D0
16
DCLK
22
VDDIO
5
CLK+
11
D1
17
GNDD
23
VDDD
6
GNDA
12
D2
18
D6
24
FSEL
Table 2. TERMINAL FUNCTIONS
TERMINAL
NAME
DOUT+, DOUT–
DESCRIPTION
TYPE
SubLVDS out
SubLVDS data link CSI-1 compliant (active during normal operation; high-impedance during
power down or standby) DOUT is valid on the rising edge of CLK+.
CLK+, CLK–
SubLVDS clock output (CSI-1 Mode 0 compliant)
D0–D7
Data inputs (8) for pixel data;
These inputs are sampled on the falling DCLK edge;
inputs incorporate bus hold
Note: D[7:0] states are latched into the SN65LVDS315 on the falling DCLK input edge
VS
Vertical Sync (also called frame sync);
Data input (high active). This input is sampled on every falling DCLK edge
Input incorporates bus hold
CMOS in (1)
HS
Horizontal Sync (also called line sync);
Data input (high active). This input is sampled on every falling DCLK edge
Input incorporates bus hold
DCLK
Data input Clock;
DCLK represents the camera pixel clock. All 8 pixel bits as well as VS and HS are latched into
the device on the falling edge of DCLK (falling edge clocking)
Input incorporates bus hold
(1)
These inputs are referenced to the VDDIO supply rail and support a voltage range of 1.65 V to 3.6 V
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
3
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Table 2. TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
DESCRIPTION
TYPE
Disables the subLVDS Drivers and turns off the PLL putting device in Shutdown mode
1 – Transmitter enabled
0 – Transmitter disabled (shutdown)
TXEN
Note: TXEN input incorporates glitch-suppression logic to avoid device malfunction on short
input spikes. It is necessary to pull TXEN high for longer than 10 µs to enable the transmitter. It
is necessary to pull the TXEN input low for longer than 10 µs to disable the transmitter. At
power up, the transmitter is enabled immediately if TXEN = 1 and disabled if TXEN = 0.
Do not leave TXEN floating.
CMOS in (2)
Frequency Select
FSEL=0: DCLK input frequencies from 3.5 MHz to 13 MHz are supported
FSEL=1: DCLK input frequencies from 7.0 MHz to 26 MHz are supported
Do not leave FSEL floating.
FSEL
MODE
The mode pin enables line counting to generate proper EOF signalling in case VS and HS do
not reset during the same DCLK cycle (0-line counter disable; 1-counter enabled). The impact
of the MODE pin setting is described in detail in the VS and HS Timing to Generate the Correct
Control Signals section. If you are unsure about the proper setting of the MODE input, it is
recommended to set MODE=high. Do not leave the MODE input floating.
VDDIO
IO Supply Voltage for inputs D[0:7], HS, VS, and DCLK, (1.8 V up to 3.3 V)
VDDD
Digital supply voltage (1.8 V only)
GNDD
Power Supply
(3)
Supply Ground for VDDIO and VDDD
VDDA
PLL and SubLVDS I/O supply voltage (1.8 V only)
GNDA
PLL and SubLVDS Ground
(2)
(3)
These inputs can tolerate an input voltage up to 3.6 V while the actual input threshold from logic low to logic high is at 0.9 V nominal;
This allows driving these inputs from a 1.8 V or 3.3 V GPIO independent of the camera supply voltage.
In a multilayer PCB, it is recommended to keep one common GND layer underneath the device and connect all ground terminals directly
to this plane.
FUNCTIONAL DESCRIPTION
Parallel Input Port Timing Information
The parallel input data must comply with the following signal timing:
HS
(Line Valid)
DCLK
Valid Image Data
Blanking
D[0:7]
P0
P1
P2
Blanking
P3
P4
P(n-1)
Pn
Figure 1. Parallel Input Timing Diagram
4
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
The relationship between frame sync and line sync shall be the following:
VS (Frame Valid)
Last Visible Line
HS (Line Valid)
A
B
C
B
D
E
0 £ tA
0 £ tB
8x1/fDCLK £ tC
0 £ tD
if MODE = high or tD = 0: 8x1/fDCLK £ tE
if MODE = low or tD > 0: 12x1/fDCLK £ tE
A - Time between VS and HS rising edge:
B - Number of pixel in active line:
C - Horizonal line blanking:
D - Time between VS and HS falling edge:
E - Time between HS falling and HS rising edge:
Figure 2. VS and HS Timing Diagram
MIPI CSI-1 / CCP2-Class 0 Interface
When MODE is held low, the SN65LVDS315 provides a MIPI CSI-1 compliant serial output. The output data on
DOUT is set on each falling edge of the differential clock signal, CLK. The CSI-1/CCP2 receiver should latch the
data in on the rising CLK edge. The clock signal is free running (and not gated as optional in the CCP2 spec).
The data format is bytewise (8-bit boundary) with the least significant bit (LSB) sent first. When nothing is being
transferred (e.g. during blanking), DOUT remains high, except during power shutdown.
CLK+
D0+/- 1
1
1
1
1
1
1
1 1
0
0
0
0
0
0
0
0
1
0
0
1
0
0
0
1
1
0
0
0
1
0
0
Figure 3. Data and Clock Output in CSI-1/CCP2
Camera Mode Class-0 Transferring a Data Sequence of 0xFF011223h
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
5
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Frame Structure and Synchronization Codes
Camera images are transferred in frames. Each frame contains one camera image. Each frame consists of a
number of lines. A frame is always larger than the number of visible lines. The non-visible lines within a frame
are called frame blanking. Frame blanking must be signaled on the SN65LVDS315 parallel input via a low VS
signal. Each line within a frame has an invisible area as well — this area is called line blanking, and is indicated
with a low HS signal. The CSI-1/CCP2-compliant output only transmits visible pixels within each frame. During
line and frame blanking (also called horizontal and vertical blanking), the data output is set high. To indicate the
line start, line end, frame start, and frame end, the SN65LVDS315 transmits synchronization codes.
Four synchronization codes are generated and embedded in the serial bit-stream:
Start Of Line Code
SOL=0xFF00:0000
This code identifies the start of a new line SOL; It is received for
every line, except for the first line, which starts with a FSC
End Of Line Code
EOL=0xFF00:0001
This code identifies the end of a line EOL; It is received for every
line, except for the last line, which ends with a FEC
Start of Frame Code SOF=0xFF00:0002
This code identifies the start of a new frame SOF
End of Frame Code
This code identifies the end of the last line and the end of the
current frame EOF
EOF=0xFF00:0003
Every synchronization code is transmitted byte-wise least significant bit (LSB) first. For example, the code
0xFF00:0002 transmitted from the image sensor corresponds to the following bit stream: 11111111 – 00000000
– 00000000 – 01000000.
Every default code starts with a set of eight 1s and sixteen 0s that are never received in pixel data (as having
eight 1s and sixteen 0s is not allowed in pixel data).
6
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Preventing Wrong Synchronization
To avoid actual pixel data from being erroneously interpreted as a control command, the SN65LVDS315
incorporates bit manipulation. If the SN65LVDS315 parallel input detects a bit sequence of eight 1s followed by
sixteen 0s, it replaces the LSB of the 0x00 parallel input word with a one instead of a zero (so the actual pixel
value will be adjusted from 0x00 to 0x01). Here are a few examples:
input code on DIN: 0xFF.00.00
serial output sequence on D0: 0xFF.00.01
input code on DIN: 0xFE.01.00.00
serial output sequence on D0: 0xFE.01.01.00
D[7:0] parallel input Code
serial output code before correction
Byte 1
Byte 2
Byte 3
Byte 4
MSB—LSB
MSB—LSB
MSB—LSB
MSB—LSB
11111111
00000000
00000000
xxxxxxxx
11111111
00000000
00000000
xxxxxxxx
1111111x
00000001
00000000
xxxxxxx0
x1111111
10000000
00000000
0xxxxxxx
111111xx
00000011
00000000
xxxxxx00
xx111111
11000000
00000000
00xxxxxx
11111xxx
00000111
00000000
xxxxx000
xxx11111
11100000
00000000
000xxxxx
1111xxxx
00001111
00000000
xxxx0000
xxxx1111
11110000
00000000
0000xxxx
111xxxxx
00011111
00000000
xxx00000
xxxxx111
11111000
00000000
00000xxx
11xxxxxx
00111111
00000000
xx000000
xxxxxx11
11111100
00000000
000000xx
1xxxxxxx
01111111
00000000
x0000000
xxxxxxx1
11111110
00000000
0000000x
---time-------------------------------------------→
↓↓
↓↓
D[7:0] parallel input Code (corrected)
serial output code after correction
Byte 1
Byte 2
Byte 3
Byte 4
MSB—LSB
MSB—LSB
MSB—LSB
MSB—LSB
11111111
00000000
00000001
xxxxxxxx
11111111
00000000
10000000
xxxxxxxx
1111111x
00000001
00000001
xxxxxxx0
x1111111
10000000
10000000
0xxxxxxx
111111xx
00000011
00000001
xxxxxx00
xx111111
11000000
10000000
00xxxxxx
11111xxx
00000111
00000001
xxxxx000
xxx11111
11100000
10000000
000xxxxx
1111xxxx
00001111
00000001
xxxx0000
xxxx1111
11110000
10000000
0000xxxx
111xxxxx
00011111
00000001
xxx00000
xxxxx111
11111000
10000000
00000xxx
11xxxxxx
00111111
00000001
xx000000
xxxxxx11
11111100
10000000
000000xx
1xxxxxxx
01111111
00000001
x0000000
xxxxxxx1
11111110
10000000
0000000x
---time------------------------------------------------------→
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
7
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Frame Structure
SOF
Line 1
Frame of imageCheck
data (visible)
EOL
SOL
Last visible line
EOF
Line blanking period
The next two graphs show the construction and transmission of a frame:
Frame blanking period
Figure 4. Frame Structure
SOF
Line 1
EOL
SOL
Line 4
EOL
SOL
Line 2
EOL
SOL
SOF
Line 1
last visible line
EOL
SOL
Line 3
EOL
EOF
SOL
Line 2
time
Figure 5. Data and Clock Output in CSI-1 / CCP2 Camera Mode Class-0 Transferring a Data Sequence of
0xFF011223h
8
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
VS and HS Timing to Generate the Correct Control Signals
The VS and HS timing received from camera sensors varies. The SN65LVDS315 responds in the following way:
CLK
Frame Start and Line Start
Frame start is indicated by a VS transition from low to high. The
rising edge on HS following the VS high transition or occurring
simultaneously with VS indicates the first valid data line and initiates
the transmission of SOF.
D[0:8]
B
B
B
B
B
B
B
B
P1
P2
P3
P4
P5
SOF3
SOF4
P1
P3
P4
P5
P6
SOL3
SOL4
P1
P2
VS
HS
OUT
(Serial)
SOF1 SOF2
CLK
Any additional rising edge on HS initiates transmission of SOL until
VS is de-asserted to low.
D[0:8]
P1
P2
VS
HS
OUT
(Serial)
SOL1 SOL2
CLK
Line End and Frame End
A falling edge of HS indicates the end of a valid line, causing the
SN65LVDS315 to transmit the EOL data word.
D[0:8] P480
B
B
B
B
B
B
B
VS
HS
OUT P476 P477 P478 P479 P480 EOL1 EOL2 EOL3 EOL4
(Serial)
B
CLK
If HS and VS are set low with the same DCLK cycle, the device will
transmit EOF instead of EOL.
D[0:8] P480
B
B
B
B
B
B
B
VS
HS
OUT P476 P477 P478 P479 P480 EOF1 EOF2 EOF3 EOF4
(Serial)
B
Ideally, the VS and HS falling edge occur during the same clock period. In such case, the MODE input can be
kept low (MODE=0), and the response of the SN65LVDS315 output to the parallel input data looks like the
following:
Line 1
Blanking Line 1
Line 2
Blanking Last Line
New Frame
CLK
D[0:8]
B
B
B
B
P1
P2
P3
P4
P479
480
B
B
B
B
B
B
B
B
B
B
B
B
B
B
P1
P2
P3
P4
P5
180
B
B
B
B
B
B
B
B
P1
476 P477 P478 P479 P480 EOF1 EOF2 EOF3 EOF4
B
B
B
B
B
B
P1
P2
P3
P4
P5
VS
HS
OUT
(Serial)
SOF1 SOF2 SOF3 SOF4 P1
176 P477 P478 P479 P480 EOL1 EOL2 EOL3 EOL4
SOL1 SOL2 SOL3 SOL4
SOF1 SOF2 SOF3 SOF4
P1
Figure 6. VS and HS Timing
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
9
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
MODE = 1
MODE = 0
Caution: Some camera sensors generate a frame
CLK
sync (VS) signal that lasts longer than the HS of the
last visible line. In such case, and with MODE=low,
B
D[0:7] P480
B
B
B
B
B
B
B
the SN65LVDS315 transmits EOL during the last HS
VS
low transition and transmits EOF when VS transitions
low. If the CSI-1 receiver can tolerate receiving EOL
HS
followed by EOF, it is recommended to keep the
OUT
P476 P477 P478 P479 P480 EOL1 EOL2 EOL3 EOL4 EOF1
(Serial)
MODE input pin set to low.
If the CSI-1 receiver cannot tolerate reception of an
CLK
EOL packet followed by an EOF packet, the
SN65LVDS315 can also be configured in a mode that
B
B
B
B
B
B
B
B
D[0:7] P480
allows it to predict the number of visible lines and
VS
generate an EOF packet at the proper time. A high
MODE = High and Line_Count = Frame_ Count
HS
level on the the MODE input enables a line counter
OUT
within the SN65LVDS315 that counts every HS rising
P476 P477 P478 P479 P480 EOF1 EOF2 EOF3 EOF4 B
(Serial)
edge while VS is high. The OMAP processors require
the MODE signal to be set high.
The counter value is stored into register frame_count when VS transitions low and the counter is reset to zero.
When the counter reaches the value stored in frame_count, an EOF packet is transmitted instead of the EOL
packet. As long as the active number of lines remains constant, this implementation ensures proper transmission
of EOF.
If, however, the camera sensor changes the number of transmitted lines during active transmission, the EOF will
not be generated properly for that particular frame.
If the number of lines transmitted by the camera sensor increases, an EOF will be sent too early. All active lines
following EOF are then ignored during this particular frame. Blanking will be signaled instead. The frame_count
register will be updated at the end of the frame in order to properly transmit the next frame.
Line 4 - Last visible line
Frame blanking period
New Frame
Line 1 – first visible line
visible image data
Line 8 - Last visible line
Line blanking period
visible image data
Line blanking period
Original Frame
Line 1 – first visible line
Frame blanking period
[MODE=0]
VS and HS edge aligned;
(ideal response)
B
B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
1
2
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOF
B
B
B
B
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOF
B
B
B
B
B
B
B
B
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOF
B
B
B
B
B
B
B
B
[MODE=1]
B
B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
1
2
[MODE=0]
VS lags behind HS by
>1/fDCLK cycle
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOF
B
B
B
B
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOF
B
B
B
B
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOF
B
B
B
B
B
B
B
B
B
B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
1
2
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOL
B
B
B
EOF
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 6
Line 5
Line 6
Line 6
Line 7
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOL
B
B
B
B
B
B
B
EOF
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOL
B
B
B
B
B
B
B
EOF
Figure 7.
If the number of lines transmitted by the camera sensor decreases, EOL will be sent improperly after the last
camera line. When VS is detected low, the EOF command will follow.
10
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
Original Frame
Line 1 – first visible line
visible image data
Line 8 - Last visible line
Line blanking period
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Frame blanking period
visible image data
Line 4 - Last visible line
Line blanking period
New Frame
Line 1 – first visible line
Frame blanking period
[MODE=0]
VS and HS aligned
(ideal response)
B
B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
1
2
[MODE=1]
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOF
B
B
B
B
B
B
B
B
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOF
B
B
B
B
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOF
B
B
B
B
B
B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
1
2
[MODE=0]
VS lags behind HS by>1/fDCLK
cycle
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOF
B
B
B
B
B
B
B
B
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOL
B
B
B
EOF B
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOF
B
B
B
B
B
B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
6 B
7 B
8 B
9 B
10 B
1 B
2 B
3 B
4 B
5 B
1
2
SOF
SOL
SOL
SOL
SOL
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
EOL
EOL
EOL
EOL
EOL
EOL
EOL
EOL
B
B
B
B
B
B
B
EOF B
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOL
B
B
B
EOF B
SOF
SOL
SOL
SOL
Line 1
Line 2
Line 3
Line 4
EOL
EOL
EOL
EOL
B
B
B
EOF B
Frame Counter Size
The maximum size of frame_count is limited to 2046 lines. Transmitting more than 2046 active lines within one
frame causes an error if MODE is held high.
Data Formats
The SN65LVDS315 supports the transfer of following data formats:
Table 3. Supported Data Formats
DATA TYPE
ABBR.
COMMENT
YUV 422 image
data
YUV422
D[0:7] inputs are used as data inputs; The host processor must be configured to receive YUV 422
data; the SN65LVDS315 is transparent to these data formats (no special configuration required); The
camera sensor must provide a UYVY output data sequence (e.g. U1,Y1,V1,Y2,U2,Y3,V3,Y4,U3,Y5...)
YUV 420 image
data
YUV420
D[0:7] inputs are used as data inputs; The host processor must be configured to receive YUV 420
data; the SN65LVDS315 is transparent to these data formats (no special configuration required); The
camera sensor must provide an odd/even (or UYY.../ VYY...) output data sequence (e.g. odd like
U1,Y1,Y2,U3,Y3,Y4,... followed by an even line V1,Y1,Y2,V3,Y3,Y4,...)
RGB 888 image
data
RGB888
D[0:7] inputs are used as data inputs; The host processor must be configured to receive RGB888
data; the SN65LVDS315 is transparent to these data formats (no special configuration required); The
camera sensor must provide an output data sequence of B1,G1,R1,B2,G2,R2,...
RGB 565 image
data
RGB565
This data format can only be supported if the camera sensor outputs a 16-bit data format (two output
bytes of 8-bit each) with the following format:
First byte: B[0:4] and G[0:2] (G2 is MSB on device input D7)
Second byte: G[3:5] and R[0:4] (R4 is MSB on device input D7)
Raw bayer, 8-bit
image data
RAW8
D[0:7] inputs are used as data inputs; The host processor must be configured to receive RAW8 data;
The camera line length should be a multiple of 4 pixel; the SN65LVDS315 is transparent to these data
formats (no special configuration required); The camera sensor must provide an output data
sequence of P1,P2,P3,P4,,...
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
11
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Following data formats are not supported by the SN65LVDS315:
– RGB 444 image data
– Raw Bayer 10-bit image data
– Raw Bayer 6-bit image data
– Raw Bayer 12-bit image data
– Raw Bayer 7-bit image data
– JPEG 8-bit data
POWERDOWN MODES
The SN65LVDS315 transmitter has two power-down modes to facilitate efficient power management.
Shutdown Mode
The SN65LVDS315 enters shutdown mode when the TXEN terminal is asserted low. This turns off all transmitter
circuitry, including the CMOS input, PLL, serializer, and SubLVDS transmitter output stage. All outputs are high
impedance. Current consumption in shutdown mode is nearly zero.
Standby Mode
The SN65LVDS315 enters the standby mode if TXEN is high and the DCLK input signal frequency is less than
500 kHz. All circuitry except the DCLK input monitor is shut down, and all outputs enter the high-impedance
state. The current consumption in standby mode is very low. When the DCLK input signal is completely stopped,
the IDD current consumption is minimized.
NOTE:
Leaving the TXEN, FSEL or MODE input floating (left open) allows leakage currents
to flow from VDD to GND. To prevent excessive leakage current, a CMOS gate must
be kept at a valid logic level, either high (above VIH min) or low (below VIL min). This
can be achieved by applying an external voltage or ground to these inputs. Inputs Dx,
VS, HS, and DCLK incorporate bus hold, and can be left floating or tied high or low.
Switching inputs also causes increased leakage currents. Only if no input signal is
switching will the IDD current be at its minimum.
ACTIVE MODES
When TXEN is high and the DCLK input clock frequency is higher than 3 MHz, the SN65LVDS315 enters the
active mode. Current consumption in the active mode depends on operating frequency and the number of data
transitions in the data payload.
Acquire Mode (PLL Approaches Lock)
The PLL is enabled and attempts to lock to the input clock. All outputs remain in the high-impedance state. First,
the PLL monitor waits until it detects stable PLL operation. If MODE is set low, the digital core will wait for one
HS low-to-high transition (new frame start) before the device switches from the acquire mode to the transmit
mode. This ensures that the outputs turn on when a new image frame is transmitted by the camera sensor. If
MODE is set low, the digital core will wait for two (instead of one) HS low-to-high transitions before the device
switches from the acquire mode to the transmit mode. This not only ensures that the device waits for a new
camera frame, but also allows the internal SN65LVDS315 counter to be initiated with the proper line count. For
proper device operation, the pixel-clock frequency (fDCLK) must fall within the valid fDCLK range specified under
recommended operating conditions. If the pixel clock frequency is higher than 3 MHz but lower than fDCLK(min),
the SN65LVDS315 PLL is enabled. Under such conditions, it is possible for the PLL to lock temporarily to the
pixel clock, causing the PLL monitor to release the device into transmit mode. If this happens, the PLL may or
may not be properly locked to the pixel clock input, potentially causing data errors, frequency oscillation, and PLL
deadlock (loss of VCO oscillation).
Transmit Mode
After the PLL achieves lock, the device enters the normal transmit mode. The CLK and DOUT terminals output
CSI-1 compliant serial data.
12
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
STATUS DETECT AND OPERATING MODES FLOW DIAGRAM
The SN65LVDS315 switches between the power saving and active modes in the following way:
Power Up
TXEN=1
DCLK Input Inactive
TXEN Low
for > 10 ms
Power Up
TXEN=0
ShutDown
Mode
Standby
Mode
TXEN High
for > 10 ms
DCLK Stops
or Lost
TXEN Low
for > 10 ms
DCLK Stops
or Lost
DCLK Active
Power Up
TXEN=1
DCLK Active
Transmit
Mode
TXEN Low
for > 10 ms
PLL Achieved Lock;
if MODE=High:
Wait for 2 Frame Counts
Acquire
Mode
(so counter is initiated properly)
Figure 8. Status Detect and Operating Modes Flow Diagram
Table 4. Status Detect and Operating Modes Descriptions
MODE
CHARACTERISTICS
CONDITIONS
TXEN is low for longer than 10 µs (1)
(2)
Shutdown Mode
Least amount of power consumption (most circuitry turned off);
All outputs high impedance.
Standby Mode
Low power consumption (only clock activity circuit active; PLL
TXEN is high for longer than 10 µs; DCLK input signal
is disabled to conserve power); all outputs are high impedance. is missing or inactive. (2)
Acquire Mode
PLL tries to achieve lock; if MODE is high, initiate line counter
(to place EOF at proper position); All outputs are high
impedance.
TXEN is high; DCLK input monitor detected input
activity.
Transmit Mode
Data transfer (normal operation); transmitter serializes data
and transmits data on serial output.
TXEN is high and PLL is locked to the incoming clock.
(1)
(2)
In Shutdown Mode, all SN65LVDS315 internal switching circuits (e.g., PLL, serializer, etc.) are turned off to minimize power
consumption. The input stage of any input pin remains active.
Leaving inputs unconnected can cause random noise to toggle the input stage and potentially harm the device. All CMOS inputs without
an internal bus hold (e.g. FSEL, TXEN, MODE) must be tied to a valid logic level during shutdown or standby Mode.
Table 5. Mode Transition Use Cases
MODE TRANSITION
Shutdown -> Standby
USE CASE
TRANSITION SPECIFICS
Set TXEN high to enable
transmitter
1.
TXEN high > 10 µs
2.
Transmitter enters Standby mode
a. All outputs are in high-impedance state.
b. Transmitter turns on clock input monitor
Standby-> Acquire
DCLK input activity detected
1.
DCLK input monitor detects clock input activity;
2.
Outputs remain in high-impedance state.
3.
PLL circuit is enabled
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
13
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Table 5. Mode Transition Use Cases (continued)
MODE TRANSITION
Acquire -> Transmit
USE CASE
TRANSITION SPECIFICS
Device is ready to transfer data
Transmit -> Standby
Request transmitter to enter
standby mode by stopping DCLK
Transmit/Standby ->
Shutdown
Turn off transmitter by pulling
TXEN low
1.
PLL is active and approaches lock
2.
PLL achieves lock within twakeup
3.
Parallel data input latches into shift register.
4.
Data input patterns are monitored and the line counter is initialized
5.
CLK output turns on
6.
DOUT turns on and sends out first serial data bit.
1.
DCLK Input monitor detects missing DCLK.
2.
Transmitter indicates standby, putting all outputs into high-impedance
state.
3.
PLL shuts down.
4.
DCLK activity input monitor remains active.
1.
TXEN pulled low for > tpwrdn.
2.
Transmitter indicates standby by switching output CLK+ and CLK– into
high-impedance state.
3.
Transmitter drives DOUT into high-impedance state.
4.
Most IC circuitry is shut down for least power consumption.
ORDERING INFORMATION
PART NUMBER
PACKAGE
SHIPPING METHOD
SN65LVDS315RGER
24-Pin QFN 0,5 mm pitch
Reel
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
UNIT
–0.3 to 4
V
–0.3 to 2.175
V
Voltage range at any output terminal
–0.5 to 2.175
V
Voltage range at any input terminal
–0.5 to 2.175
V
±3
kV
Charged-Device Model (4) (All pins)
±500
V
Machine Model (5) (All pins)
±200
V
VDDIO
Supply voltage range (2)
VDDD, VDDA
Human Body Model (3) (All pins)
Electrostatic discharge
Continuous power dissipation
(1)
(2)
(3)
(4)
(5)
See Dissipation Rating Table
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum- rated conditions for extended periods may affect device reliability.
All voltage values are with respect to the GND terminals.
In accordance with JEDEC Standard 22, Test Method A114-A.
In accordance with JEDEC Standard 22, Test Method C101.
In accordance with JEDEC Standard 22, Test Method A115-A
DISSIPATION RATINGS
(1)
(2)
14
PACKAGE
CIRCUIT BOARD
MODEL
TA ≤ 25°C
DERATING FACTOR (1)
ABOVE TA = 25°C
TA = 85°C
POWER RATING
RGE
Low-K (2)
536 mW
6.7 mW/°C
134 mW
RGE
High-K
1.6 W
21.1 mW/°C
>420 mW
This is the inverse of the junction-to-ambient thermal resistance with the Low-K thermal metric definitions of EIA/JESD51–2 and with no
air flow..
In accordance with the Low-K thermal metric definitions of EIA/JESD51–2.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
THERMAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
fDCLK = 3.5 MHz
fDCLK = 11 MHz
fDCLK = 26 MHz
10.8
17.7
21.2
mW
mW
mW
VDDx = 1.95 V, TA = –40°C
fDCLK = 3.5 MHz
fDCLK = 26 MHz
15.7
26.0
mW
mW
Device power dissipation
Maximum
UNIT
VDDx = 1.8 V, TA = 25°C
Typical
PD
VALUE
RECOMMENDED OPERATING CONDITIONS (1)
MIN
VDDIO
VDDD
VDDA
1.65
1.65
1.65
Supply voltage
VDDn(PP)
Supply voltage noise magnitude
fDCLK
Data clock frequency
f(VDDn(PP)) = 1 Hz to 2 GHz (test set-up see
Figure 15)
NOM
MAX
UNIT
1.8
1.8
3.6
1.95
1.95
V
100
mV
FSEL = 0, See Figure 1, Figure 2, Figure 3
3.5
13
FSEL = 1, See Figure 1, Figure 2, Figure 3
7
26
Standby mode
(2)
MHz
500
kHz
tH x fDCLK
DCLK Input duty cycle
0.35
0.65
TA
Operating free-air temperature
–40
85
°C
tjit(per)DCLK
DCLK RMS period jitter (3)
5
ps-rms
tjit(TJ)DCLK
DCLK total jitter (4)
tjit(CC)DCLK
DCLK peak cycle to cycle jitter (5)
Measured on DCLK input
(6)
MODE = VIH; count the number of HS↓
transitions within one frame
1
0.05/fDCLK
s
0.02/fDCLK
s
Icount
Number of active video lines
2046
thblank
Horizontal blanking time
4
UI
(1/DCLK)
tvblank
Vertical blanking time
8
UI
(1/DCLK)
DCLK, D[0:1], VS, HS
VIH
High-level input voltage
See Figure 9
0.7×VDDIO
VDDIO
VIL
Low-level input voltage
See Figure 9
0
0.3×VDDIO
V
tDS
Data set up time prior to ↑↓ DCLK
See Figure 10
2.0
ns
tDH
Data hold time after ↑↓ DCLK
See Figure 10
2.0
ns
V
MODE, TXEN, FSEL
VIH
High-level input voltage
See Figure 9
0.7×VDDO
3.6
V
VIL
Low-level input voltage
See Figure 9
0
0.3×VDDO
V
(1)
(2)
(3)
(4)
(5)
(6)
Unused single-ended inputs must be held high or low to prevent them from floating.
DCLK input frequencies lower than 500 kHz will force the SN65LVDS315 into standby mode. Input frequencies between 500 kHz and 3
MHz might activate the SN65LVDS315. Input frequencies beyond 3MHz will activate the SN65LVDS315.
Period jitter is the deviation in cycle time of a signal with respect to the ideal period over a random sample of 100,000 cycles.
Total jitter reflects the maximum jitter amplitude observed over a time period of 1012 data bits. It is often derived by adding all
deterministic jitter components (ps peak-to-peak values) and the geometric sum of all random components (ps-rms values × 14.069 for
10–12 bit error rate)
Cycle-to-cycle jitter is the variation in cycle time of a signal between adjacent cycles over a random sample of 1,000 adjacent cycle
pairs.
For a VGA resolution of 640x480, lcount would be 480
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
15
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
DEVICE ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Supply
current
IDD
TYP (1)
MAX
VDDIO = VDDD = VDDA, RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO,
VIL=0V, TXEN and MODE at VDDD, typical blanking power
test pattern. See Table 6
FSEL
FSEL
FSEL
FSEL
= VIL, fDCLK = 3.5 MHz
= VIL, fDCLK = 11 MHz
= VIH, fDCLK = 11 MHz
= VIH, fDCLK = 26 MHz
4.8
7.6
5.9
9.6
VDDIO = VDDD = VDDA, RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO,
VIL=0V, TXEN and MODE at VDDD, Alternating (worst-case)
1010 serial bit pattern. See Table 7
FSEL
FSEL
FSEL
FSEL
= VIL, fDCLK = 3.5 MHz
= VIL, fDCLK = 11 MHz
= VIH, fDCLK = 11 MHz
= VIH, fDCLK = 26 MHz
5.7
8.9
7.2
11.3
8.1
11.2
9.5
13.3
Standby mode (TXEN at VDD)
VDDIO = VDDD = VDDA,
RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO, VIL=0
V, TXEN and MODE at VDDD, All inputs
held static high (VIH) or static low (VIL)
0.2
10
0.2
10
VDDIO = VDDD = VDDA,
RL(CLK) = RL(D0) = 100 Ω, VIH=VDDIO, VIL=0
V, TXEN and Mode = VIL; D[7:0] VS, HS,
and DCLK left open
0.02
10
0.03
5
Shutdown mode (TXEN at GND)
Standby mode (TXEN at VDD)
Shutdown mode (TXEN at GND)
(1)
MIN
UNIT
mA
µA
All typical values are at 25°C and with 1.8 V supply unless otherwise noted.
OUTPUT ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
0.925
1.0
V
10
mV
UNIT
subLVDS OUTPUTS (DOUT+, DOUT–, CLK+, and CLK–)
VOCM(SS)
Steady-state common-mode output voltage
0.8
ΔVOCM(SS)
Change in steady-state common-mode output voltage
between logic states
–10
VOCM(PP)
Peak-to-peak common mode output voltage
|VOD|
Differential output voltage magnitude
|VDOUT+ – VDOUT– |, |VCLK+ – VCLK–|
Δ|VOD|
Change in differential output voltage between logic states
ZOD
Differential small-signal output impedance
TXEN at VDD
IOSD
Differential short-circuit output current
VOD = 0 V; fDCLK = 26 MHz
IOZ
High-impedance state output current
VO = 0 V or VDD(max), TXEN at GND
(1)
See Figure 9, Output load see
Figure 13
100
170
–10
75
mV
250
mV
10
mV
10
mA
3
µA
5
kΩ
1
–3
All typical values are at 25°C and with 1.8V supply unless otherwise noted.
INPUT ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
Dx, VS, HS, DCLK
IIL(hold)
Bus hold input current (2)
VDDIO = 1.65 V and VDDIO = 3.6 V
15
100
µA
IIH(hold)
Bus hold input current (3)
VDDIO = 1.65 V and VDDIO = 3.6 V
–15
–100
µA
CIN
Input capacitance
1.5
pF
MODE, TXEN, FSEL
IIL
High-level input current
VIH = 0.7 VDDD, See Figure 9
–200
–0.7
200
nA
IIH
Low-level input current
VIL = 0.3 VDDD, See Figure 9
–200
0.5
200
nA
CIN
Input capacitance
VI = TBD
(1)
(2)
(3)
16
1.5
pF
All typical values are at 25°C and with 1.8 V supply unless otherwise noted.
IIL(hold) is the input current the bus-hold input stage is able to source to maintain a low logic level; The bus-hold current becomes minimal
as the input approaches GND. IIL(hold) is the least amount of current a camera output must source to overcome the bus hold and force a
high signal.
IIH(hold) is the input current the bus-hold input stage is able to source to maintain a high logic level. The bus-hold current becomes
minimal as the input approaches VDDIO. IIL(hold) is the least amount of current a camera output must be able source to overcome the bus
hold and switch to a low signal.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
MIN
TYP (1)
MAX
UNIT
tr
20%-to-80% differential output signal rise fDCLK=3.5 MHz, See Figure 12 and
time
Figure 13
360
460
730
ps
tf
20%-to-80% differential output signal fall
time
360
460
730
ps
ts(DOUT)
Setup time DOUT valid before CLK+
rising edge
FSEL = 0, fDCLK = 13 MHz
FSEL = 1, fDCLK = 26 MHz
3.327
1.163
4.2
1.8
ns
th(DOUT)
Hold time DOUT valid before CLK+
ringing edge
FSEL = 0, fDCLK = 13 MHz
FSEL = 1, fDCLK = 26 MHz
4.627
2.463
5.4
3.0
ns
tpd(L)
Propagation delay time, input to serial
output (data latency)
4.5/fDCLK
4.7/fDCLK
5.5/fDCLK
0.45
0.50
0.55
PARAMETER
TEST CONDITIONS
fDCLK=3.5 MHz, See Figure 12 and
Figure 13
See
Figure 11
TXEN at VDDD, VIH = VDDD, VIL=GND,
RL = 100 Ω, See Figure 14
tH x fCLKO Output CLK duty cycle
tGS
TXEN glitch suppression pulse width (2)
VIH = VDDD, VIL=GND, TXEN toggles
between VIL and VIH, See Figure 16
3.8
Enable time from power down (↑TXEN)
MODE at VDD; time from TXEDN pulled
high to CLK and DOUT outputs enabled
and transmit valid data; See Figure 16
100
tpwnup
Disable time from active mode (↓TXEN)
tpwrdn
Enable time from standby (↑↓DCLK)
twakup
Disable time from standby (DCLK
stopping)
(1)
(2)
100µs +
2×VS↑
11
TXEN and MODE at VDD; device in
standby; time measurement from DCLK
starts switching to CLK and DOUT
enabled and transmit valid data; See
Figure 17
100
100µs +
2×VS↑
<8/fDCLK
µs
µs
TXEN is pulled low during transmit mode;
time measurement until output becomes
disabled and PLL is shutdown; See
Figure 16
TXEN at VDD; device in transmitting; time
measurement from DCLK input signal
stops starts until CLK + DOUT outputs
becomes disabled and PLL is shutdown,
See Figure 17
tsleep
10
µs
µs
100
µs
All typical values are at 25°C and with 1.8 V supply unless otherwise noted.
The TXEN input incorporates glitch-suppression circuitry to disregard short input pulses. tGS is the duration of either a high-to-low or
low-to-high transition that is suppressed.
MEASUREMENT INFORMATION
(VO++VO-)/2
II
D[0:7], VS,
HS, FSEL,
TXEN, MODE
IO
CLK+,
DOUT+
IO
CLK-,
DOUT-
V OD
V O+
VI
V OInput
V OCM
Output
Figure 9. I/O Voltage and Current Definition
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
17
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
tDS
80% VOH
D[0:7], VS, HS
20% VOL
tDH
80% VOH
DCLK
20% VOL
tF
Figure 10. Input signal Setup and Hold Time Definition tDS and tDH
tCLK+
CLK-
CLK+
ts(DOUT)
th(DOUT)
Bit(n-1)
DOUT+/-
Bitn
Figure 11. Output signal Setup and Hold Time Definition ts(DOUT) and th(DOUT)
VOD
tF
tR
150 mV (nom)
80%
0V
20%
-150 mV (nom)
Figure 12. Rise and Fall Time Definition
18
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
CLK+
DOUT+
R1 = 49.9 W
VDx+ or VCLK+
975 mV (nom)
VDx- or VCLK-
825 mV (nom)
VOD
CLKDOUT-
VOCM
R2 = 49.9 W
SN65LVDS315
C1
1 pF
VOCM(PP)
C2
1 pF
VOCM(SS)
NOTES:
A. 88 MHz output test pattern on CLK output and 44 MHz output test pattern on DOUT;
this is achieved by:
1. MODE = 0
2. fPCLK = 11 MHz
3. Inputs D0 ¯
= D2 ¯= D4 = D6 = VDDIO
and
¯ D1 = D3 = D5¯ = D7
¯
¯ = GND
4. Toggle VS , HS , HS ¯, VS¯, VS , HS , HS¯, VS¯, VS , HS
B. C1 and C2 include instrumentation and Fixture capacitance; +/- 20%
C. R1 and R2 tolerance +/- 1%
D. The measurement of VOCM(PP) and VOC(SS) are taken with test equipment bandwidth > 1 GHz
Figure 13. Driver Output Voltage Test Circuit and Definitions
D[0:7]
pixel(n)
pixel(n + 1)
VDD2
DCLK
tPROP
CLK+
D0(n)
DOUT+
D1(n)
D2(n)
Figure 14. tpd(L) Propagation Delay Input to Output
SN65LVDS315
1W
1
Noise
Generator
100 mV
VDDIO
VDDA
2
VDDD
10 nF
GND
Note: The generator regulates the
noise amplitude at point 1 to the
target amplitude given under the
table
1.6 mH
1.8 V
Supply
Figure 15. Power Supply Noise Test Set-up
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
19
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
3 ms
2 ms
<20 ns
Glitch shorter
than t GS will be
ignored
less than 20 ns
Spike will be
rejected
Glitch shorter
than t GS will be
ignored
TXEN
tpwrup
tpwrdn
CLK+
tGS
I CC
tGS
DCLK
Transmitter aquires lock; when
MODE=VDD TX also detects
line count for one entire frame
Transmitter output remains
disabled
Transmitter disabled
(OFF)
Transmitter Transmitter
turns OFF disabled
(OFF)
Transmitter enabled
(ON)
Figure 16. Glitch Suppression Enable/Disable Time
DCLK
twakeup
tsleep
CLK+
Transmitter Disabled
(OFF)
Transmitter acquires lock;
Transmitter enabled Transmitter Transmitter
When MODE = VDD also acquires line
output data valid enabled; output Disabled
count for frame boundary detection, outputs
(OFF)
data invalid
still disabled
Figure 17. Standby Detection
20
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Typical Blanking Power Consumption Test Pattern
During blanking VS is low, and the SN65LVDS315 data output DOUT presents a high signal. The typical power
consumption test patterns during the blanking time consists of one data word. The pattern repeats itself
throughout the entire measurement.
Table 6. Typical IC Power Consumption Test During
Blanking
WORD
1
TEST PATTERN
D[7:0]
VS
HS
0x00
0
x
Maximum Power Consumption Test Pattern
The maximum (or worst-case) power consumption of the SN65LVDS315 is tested using an alternating 1010 test
pattern. The pattern repeats itself throughout the entire measurement.
Table 7. Worst Case IC Power Consumption Test
Pattern 1
WORD
TEST PATTERN
D[7:0]
VS
HS
1
0x00
1
1
2
0xFF
1
1
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
21
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
Jitter Performance
The jitter performance of the SN65LVDS315 is tested using a pattern that stresses the interconnect, particularly
to test for ISI. The test pattern uses very long run lengths of consecutive bits. The pattern incorporates very high
and low data rates, and maximizes switching noise. The pattern is self-repeating for the duration of the test.
Table 8. Jitter Test Pattern
WORD
22
TEST PATTERN
D[7:0]
VS
HS
1
0x00
1
1
2
0x00
1
1
3
0x00
1
1
4
0x01
1
1
5
0x03
1
1
6
0x07
1
1
7
0x18
1
1
8
0xE7
1
1
9
0x35
1
1
10
0x02
1
1
11
0x54
1
1
12
0xA5
1
1
13
0xAD
1
1
14
0x55
1
1
15
0xA6
1
1
16
0xA6
1
1
17
0x55
1
1
18
0x55
1
1
19
0xAA
1
1
20
0x52
1
1
21
0x5A
1
1
22
0xAB
1
1
23
0xFD
1
1
24
0xCA
1
1
25
0x18
1
1
26
0xE7
1
1
27
0xF8
1
1
28
0xFC
1
1
29
0xFE
1
1
30
0xFF
1
1
31
0xFF
1
1
32
0xFF
1
1
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS
SUPPLY CURRENT IDD OVER TEMPERATURE
SUPPLY CURRENT IDD OVER PCLK FREQUENCY
20
12
-40C, FSEL=low
18
IDD - Supply Current - mA
16
IDD - Supply Current - mA
85C, FSEL=low
10
13 MHz
FSEL = 0
14
12
10
26 MHz
FSEL = 1
8
6
25C, FSEL=low
8
6
-40C, FSEL=high
85C, FSEL=high
4
25C, FSEL=high
4
2
2
0
-50
0
50
-10
10
30
TA - Free-Air Temperature - °C
-30
70
0
90
5
10
20
15
f - Frequency - MHz
Figure 18.
30
Figure 19.
DIFFERENTIAL OUTPUT SWING VOD AS A
FUNCTION DCLK INPUT FREQUENCY vs
CYCLE-TO-CYCLE OUTPUT JITTER
140
335
VOD @ 85°C
330
120
325
Cycle-to-Cycle Output Jitter - ps
VOD - Differential Output Swing - mV
25
320
315
310
VOD @ 25°C
305
300
295
VOD @ -40°C
290
100
80
60
FSEL = 1
FSEL = 0
40
20
285
FSEL = Low
0
280
0
5
30
15
20
25
10
f(PCLK) - Input Pixel Clock Frequency - MHz
0
5
10
15
20
f - Frequency - MHz
25
30
Figure 20.
Figure 21.
BUS HOLD LEAKAGE CURRENT
SN65LVDS315 OUTPUT DATA AND CLOCK SIGNAL AT
208MBPS (MAXIMUM SPEED)
4
3.5
VDDIO = 3.6 V
VI - Input Voltage - V
3
2.5
2
1.5
1
VDDIO = 1.8 V
0.5
0
-0.1 -0.08 -0.06 -0.04 -0.02
0
0.02
Input Current - mA
0.04
0.06
0.08
0.1
Figure 22.
Figure 23.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
23
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS (continued)
SN65LVDS315 OUTPUT DATA AND CLOCK SIGNAL AT
208MBPS
A.
24
The asymmetrical setup and hold time is
optimized to meet OMAP processor input
timing.
Figure 24.
SN65LVDS315 OUTPUT CLOCK AND DATA(A)
A.
Through pcb interconnect of 80-inch of FR4 at
208Mbps
Figure 25.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
APPLICATION INFORMATION
PREVENTING CONTROL INPUTS FROM INCREASED LEAKAGE CURRENTS
To ensure the lowest possible leakage current during
standby or power down, all inputs must be held static.
Any kind of input switching will cause increased
leakage current. Hold inputs TXEN and MODE either
at VIH or VIL. The LVDS315 incorporates a bus-hold
feature on the D[0:7] inputs, DCLK, VS, and HS. This
feature ensures that the input-stage leakage current
is minimized during times when the camera output is
in a high impedance state. Inputs with the bus-hold
feature can be left open without the need of an
external pullup or pulldown. This feature minimizes
the power consumption of standby and power down
modes in particular.
A
Y
>75 kW
BUS Hold
POWER SUPPLY DESIGN RECOMMENDATION
For a multilayer PCB, it is recommended to keep one common GND layer underneath the device and connect all
ground terminals directly to this plane.
SN65LVDS315 DECOUPLING RECOMMENDATION
The SN65LVDS315 was designed to operate reliably in a constricted environment with other digital switching
ICs. In cell phone designs, the SN65LVDS315 often shares a power supply with various other ICs. The
SN65LVDS315 can operate with power supply noise as specified in Recommend Device Operating Conditions.
To minimize the power supply noise floor, provide good decoupling near the SN65LVDS315 power pins. The use
of four ceramic capacitors (two 0.01 µF and two 0.1 µF) provides good performance. At the very least, it is
recommended to install one 0.1 µF and one 0.01 µF capacitor near the SN65LVDS315. To avoid large current
loops and trace inductance, the trace length between decoupling capacitor and IC power inputs pins must be
minimized. Placing the capacitor underneath the SN65LVDS315 on the bottom of the pcb is often a good choice.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
25
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
VGA CAMERA APPLICATION
Figure 26 shows a possible implementation of a 10-Mpixel camera transfer with 30Hz frame refresh rate. The
SN65LVDS315 interfaces to the OMAP2420, a TI application processor with integrated CSI receiver. The pixel
clock rate is 11 MHz, assuming ≈10% blanking overhead. The application assumes 8-bit color resolution.
FPC
0.1 mF
0.1 mF
1.8 V to 3.3 V
Image
Sensor
11 MHz
D[0:7]
DCLK
CLK+
CLK-
88 MHz
ccp_clkp
ccp_clkn
DOUT+
DOUT-
88 Mbps
ccp_datap
ccp_datan
D[0:7]
OMAP2420
8
HS, VS
HS, VS
cam_xclk
MODE
GND
REFCLK
I2C
TXEN
SN65LVDS315
2
1.8 V to 3.3 V
I2C
Pixel CLK
1.8 V
GND
1.8 V
GND
VDD
VDDPLLD
VDDLVDS
VDDPLLA
1.8 V
Serial Interface
2
Figure 26. Typical VGA Display Application
TYPICAL APPLICATION FREQUENCIES
The SN65LVDS315 in display mode supports pixel clock frequencies from 7 MHz to 26 MHz (which translates to
DCLK frequencies of 56 MHz to 208 MHz). Table 9 provides a few typical display resolution examples. The table
also shows the assumed blanking overhead, which often times is smaller in the final application, resulting in a
lower data rate.
26
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
SN65LVDS315
www.ti.com
SLLS881A – DECEMBER 2007 – REVISED MARCH 2008
8-Bit Camera Application
Table 9. Typical Application Data Rates and Serial Lane Usage
DISPLAY SCREEN
RESOLUTION
VISIBLE
PIXEL COUNT
CONTROL
OVERHEAD
FRAME
REFRESH
RATE
DCLK PIXEL CLOCK
FREQUENCY [MHz]
DATA RATE ON D0
WITH LS=0
f(CLK)
640x480 (VGA)
307,200
14%
10 Hz
3.5 MHz
28 Mbps
28 MHz
640x480 (VGA)
307,200
2%
15 Hz
4.7 MHz
38 Mbps
38 MHz
640x480 (VGA)
307,200
10%
30 Hz
10.1 MHz
81 Mbps
81 MHz
3 Mpixel
3,000,000
10%
7 Hz
23.1 MHz
185 Mbps
185 MHz
4 Mpixel
4,000,000
10%
5 Hz
22.0 MHz
176 Mbps
176 MHz
5 Mpixel
5,000,000
10%
4 Hz
22.0 MHz
176 Mbps
176 MHz
6 Mpixel
6,000,000
10%
3 Hz
19.8 MHz
158 Mbps
158 MHz
8 Mpixel
8,000,000
10%
2 Hz
17.6 MHz
141 Mbps
141 MHz
10 Mpixel
10,000,000
10%
2 Hz
22.0 MHz
176 Mbps
176 MHz
12 Mpixel
12,000,000
10%
2 Hz
25.1 MHz
201 Mbps
201 MHz
Calculation Example: VGA Camera Sensor
The following calculation shows an example for a VGA camera with following parameter:
Visible area = 640 column
display resolution:
640 x 480
frame refresh rate:
30 fps
vertical visible pixel:
480 lines
vertical blanking:
10 lines
horizontal visible pixel:
640 columns
horizontal blanking:
5 columns
Visible area
=480 lines
Vertical
blanking
horizontal
blanking
Visible area
Entire Frame
Calculation of the total number of pixel and Blanking overhead:
visible area pixel count:
640 x 480 = 307,200 pixel
total frame pixel count:
(640+5) x (480+10) = 316,050 pixel
blanking overhead:
(316,050–307,200) div 307,200 = 2.8%
The application requires following serial link parameters:
pixel clk frequency:
fDCLK = 316.050 x 30 Hz = 9.5 MHz
DOUT serial data rate:
dR = fDCLK x8 = 76 Mbps
CLK output clock rate:
fCLK = f(dR) = 76 MHz
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s) :SN65LVDS315
27
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65LVDS315RGER
ACTIVE
VQFN
RGE
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN65LVDS315RGERG4
ACTIVE
VQFN
RGE
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN65LVDS315RGET
ACTIVE
VQFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN65LVDS315RGETG4
ACTIVE
VQFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65LVDS315RGER
VQFN
RGE
24
2500
330.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
SN65LVDS315RGET
VQFN
RGE
24
250
180.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65LVDS315RGER
VQFN
RGE
24
2500
346.0
346.0
29.0
SN65LVDS315RGET
VQFN
RGE
24
250
190.5
212.7
31.8
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated