TI TLV5633CPW

TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
D
D
D
D
D
D
D
DW OR PW PACKAGE
(TOP VIEW)
12-Bit Voltage Output DAC
Programmable Internal Reference
Programmable Settling Time vs Power
Consumption
1 µs in Fast Mode
3.5 µs in Slow Mode
8-Bit µController Compatible Interface
Differential Nonlinearity . . . <0.5 LSB Typ
Voltage Output Range . . . 2x the
Reference Voltage
Monotonic Over Temperature
D2
D3
D4
D5
D6
D7
A1
A0
SPD
DVDD
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
D1
D0
CS
WE
LDAC
PWR
AGND
OUT
REF
AVDD
applications
D
D
D
D
D
Digital Servo Control Loops
Digital Offset and Gain Adjustment
Industrial Process Control
Machine and Motion Control Devices
Mass Storage Devices
description
The TLV5633 is a 12-bit voltage output digital-to-analog converter (DAC) with an 8-bit microcontroller
compatible parallel interface. The 8 LSBs, the 4 MSBs, and 5 control bits are written using three different
addresses. Developed for a wide range of supply voltages, the TLV5633 can be operated from 2.7 V to 5.5 V.
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class A
(slow mode: AB) output stage to improve stability and reduce settling time. The programmable settling time of
the DAC allows the designer to optimize speed versus power dissipation. With its on-chip programmable
precision voltage reference, the TLV5633 simplifies overall system design. Because of its ability to source up
to 1 mA, the internal reference can also be used as a system reference. The settling time and the reference
voltage can be chosen by a control register.
Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It
is available in 20-pin SOIC and TSSOP packages in standard commercial and industrial temperature ranges.
AVAILABLE OPTIONS
PACKAGE
TA
SOIC
(DW)
TSSOP
(PW)
0°C to 70°C
TLV5633CDW
TLV5633CPW
– 40°C to 85°C
TLV5633IDW
TLV5633IPW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
functional block diagram
REF
AGND
DVDD
AVDD
PGA With
Output Enable
Voltage
Bandgap
SPD
PWR
Powerdown
and Speed
Control
Power-On
Reset
5
2
A(0,1)
Interface
Control
CS
WE
x2
2
5-Bit
Control
Latch
4
4-Bit
DAC MSW
Holding
Latch
4
8
8-Bit
DAC LSW
Holding
Latch
8
12
12-Bit
DAC
Register
12
D(0–7)
LDAC
Terminal Functions
TERMINAL
NAME
NO.
I/O/P
DESCRIPTION
A1, A0
7, 8
I
Address input
AGND
14
P
Ground
AVDD
CS
11
P
Positive power supply (analog part)
18
I
Chip select. Digital input active low, used to enable/disable inputs
D0 – D1
19, 20
I
Data input
D2 – D7
1–6
I
Data input
DVDD
10
P
Positive power supply (digital part)
LDAC
16
I
Load DAC. Digital input active low, used to load DAC output
OUT
13
O
DAC analog voltage output
PWR
15
I
Power down. Digital input active low
REF
12
I/O
SPD
9
I
Speed select. Digital input
WE
17
I
Write enable. Digital input active low, used to latch data
2
Analog reference voltage input/output
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OUT
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage (DVDD, AVDD to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Supply voltage difference range, AVDD – DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 2.8 V to 2.8 V
Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Operating free-air temperature range, TA: TLV5633C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
TLV5633I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
Supply voltage
voltage, DVDD, AVDD
MIN
NOM
MAX
5-V operation
4.5
5
5.5
V
3-V operation
2.7
3
3.3
V
0
0
0
V
2
V
Supply voltage difference, ∆VDD = AVDD – DVDD
Power on reset voltage, POR
0.55
High-level digital input voltage, VIH
2
Low-level digital input voltage, VIL
DVDD
0
Reference voltage, Vref to REF terminal (5-V supply), See Note 1
AGND
2.048
Reference voltage, Vref to REF terminal (3-V supply), See Note 1
AGND
1.024
Load resistance, RL
Operating free-air
free air temperature,
temperature TA
V
0.8
V
AVDD –1.5
AVDD – 1.5
V
2
Load capacitance, CL
TLV5633I
V
kΩ
100
TLV5633C
UNIT
0
70
– 40
85
pF
°C
NOTE 1: Due to the x2 output buffer, a reference input voltage ≥ AVDD/2 causes clipping of the transfer function. The output buffer of the internal
reference must be disabled, if an external reference is used.
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
electrical characteristics over recommended operating free-air temperature range, Vref = 2.048 V,
Vref = 1.024 V (unless otherwise noted)
power supply
PARAMETER
TEST CONDITIONS
MIN
REF on
AVDD = 5 V,,
DVDD = 5 V
IDD
Power supply current
No load,
All inputs = AGND or DVDD,
DAC latch = 0x800
REF off
REF on
AVDD = 3 V,,
DVDD = 3 V
REF off
TYP
MAX
Fast
2.3
2.8
mA
Slow
1.3
1.6
mA
Fast
1.9
2.4
mA
Slow
0.9
1.2
mA
Fast
2.1
2.6
mA
Slow
1.2
1.5
mA
Fast
1.8
2.3
mA
0.9
1.1
mA
0.01
1
µA
Slow
Power down supply current
PSRR
Power supply rejection ratio
Zero scale, external reference, See Note 2
–60
Full scale, external reference, See Note 3
–60
UNIT
dB
NOTES: 2. Power supply rejection ratio at zero scale is measured by varying AVDD and is given by:
PSRR = 20 log [(EZS(AVDDmax) – EZS(AVDDmin))/AVDDmax]
3. Power supply rejection ratio at full scale is measured by varying AVDD and is given by:
PSRR = 20 log [(EG(AVDDmax) – EG(AVDDmin))/AVDDmax]
static DAC specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
Resolution
MAX
12
UNIT
bits
INL
Integral nonlinearity, end point adjusted
RL = 10 kΩ, CL = 100 pF, See Note 4
± 1.2
±3
LSB
DNL
Differential nonlinearity
RL = 10 kΩ, CL = 100 pF, See Note 5
± 0.3
± 0.5
LSB
EZS
EZS TC
Zero-scale error (offset error at zero scale)
See Note 6
Zero-scale-error temperature coefficient
See Note 7
EG
Gain error
See Note 8
± 12
20
mV
ppm/°C
± 0.3
% full
scale V
EG TC
Gain error temperature coefficient
See Note 9
20
ppm/°C
NOTES: 4. The relative accuracy or integral nonlinearity (INL) sometimes referred to as linearity error, is the maximum deviation of the output
from the line between zero and full scale excluding the effects of zero code and full-scale errors (see text).
5. The differential nonlinearity (DNL) sometimes referred to as differential error, is the difference between the measured and ideal 1
LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains
constant) as a change in the digital input code.
6. Zero-scale error is the deviation from zero voltage output when the digital input code is zero (see text).
7. Zero-scale-error temperature coefficient is given by: EZS TC = [EZS (Tmax) – EZS (Tmin)]/2Vref × 106/(Tmax – Tmin).
8. Gain error is the deviation from the ideal output (2Vref – 1 LSB) with an output load of 10 kΩ excluding the effects of the zero-error.
9. Gain temperature coefficient is given by: EG TC = [EG(Tmax) – EG (Tmin)]/2Vref × 106/(Tmax – Tmin).
output specifications
PARAMETER
VO
TEST CONDITIONS
Output voltage
RL = 10 kΩ
Output load regulation accuracy
4
TYP
MAX
AVDD–0.4
VO = 4.096 V, 2.048 V,
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RL = 2 kΩ
• DALLAS, TEXAS 75265
± 0.29
UNIT
V
% full
scale V
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
electrical characteristics over recommended operating free-air temperature range, Vref = 2.048 V,
Vref = 1.024 V (unless otherwise noted) (Continued)
reference pin configured as output (REF)
PARAMETER
Vref(OUTL)
Vref(OUTH)
Low reference voltage
Iref(source)
Iref(sink)
Output source current
PSRR
Power supply rejection ratio
TEST CONDITIONS
High reference voltage
AVDD = DVDD > 4.75 V
MIN
TYP
MAX
UNIT
1.003
1.024
1.045
V
2.027
2.048
2.069
1
Output sink current
–1
V
mA
mA
–48
dB
reference pin configured as input (REF)
PARAMETER
VI
RI
Input voltage
CI
Input capacitance
TEST CONDITIONS
MIN
TYP
0
Input resistance
Reference input bandwidth
REF = 0.2
0 2 Vpp + 1.024
1 024 V dc
10 kHz
H
i di
t ti
f
Harmonic
distortion,
reference
in
ut
input
REF = 1 Vpp + 2.048 V dc, AVDD = 5 V
50 kHz
100 kHz
Reference feedthrough
V
MΩ
5
pF
900
Slow
500
Fast
–87
Slow
–77
Fast
–74
Slow
–61
Fast
UNIT
10
Fast
REF = 1 Vpp at 1 kHz + 1.024 V dc (see Note 10)
MAX
AVDD–1.5
kHz
dB
dB
–66
dB
– 80
dB
NOTE 10: Reference feedthrough is measured at the DAC output with an input code = 0x000.
digital inputs
PARAMETER
IIH
IIL
High-level digital input current
CI
Input capacitance
TEST CONDITIONS
VI = DVDD
VI = 0 V
Low-level digital input current
MIN
TYP
1
• DALLAS, TEXAS 75265
UNIT
µA
µA
–1
8
POST OFFICE BOX 655303
MAX
pF
5
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
SLAS190 – MARCH 1999
operating characteristics over recommended operating free-air temperature range, Vref = 2.048 V,
and Vref = 1.024 V, (unless otherwise noted)
analog output dynamic performance
PARAMETER
TEST CONDITIONS
ts(FS)
(FS)
Output settling time,
time full scale
RL = 10 kΩ,,
See Note 11
CL = 100 pF,,
ts(CC)
(CC)
time code to code
Output settling time,
RL = 10 kΩ,,
See Note 12
CL = 100 pF,,
SR
Slew rate
RL = 10 kΩ,,
See Note 13
CL = 100 pF,,
Glitch energy
DIN = 0 to 1,
CS = VDD
fCLK = 100 kHz,
MIN
TYP
MAX
Fast
1
3
Slow
3.5
7
Fast
0.5
1.5
Slow
1
2
Fast
6
10
Slow
1.2
1.7
Signal-to-noise ratio
73
78
SINAD
Signal-to-noise + distortion
61
67
THD
Total harmonic distortion
SFDR
Spurious free dynamic range
fs = 480 kSPS,, fB = 20 kHz,, fout = 1 kHz,,
RL = 10 kΩ,,
CL = 100 pF
–69
63
µs
µs
V/µs
5
SNR
UNIT
nV–S
–62
dB
74
NOTES: 11. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change
of 0x020 to 0xFDF or 0xFDF to 0x020 respectively.
12. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change
of one count.
13. Slew rate determines the time it takes for a change of the DAC output from 10% to 90% full-scale voltage.
digital input timing requirements
MIN
NOM
MAX
UNIT
tsu(CS–WE)
tsu(D)
Setup time, CS low before negative WE edge
15
ns
Setup time, data ready before positive WE edge
10
ns
tsu(A)
th(DA)
Setup time, addresses ready before positive WE edge
20
ns
Hold time, data and addresses held valid after positive WE edge
5
ns
tsu(WE-LD)
twH(WE)
Setup time, positive WE edge before LDAC low
5
ns
Pulse duration, WE high
20
ns
tw(LD)
Pulse duration, LDAC low
23
ns
6
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
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PARAMETER MEASUREMENT INFORMATION
D(0–7)
X
A(0,1)
X
Data
X
Address
X
tsu(D)
tsu(A)
CS
th(DA)
twH(WE)
tsu(CS-WE)
WE
tw(LD)
tsu(WE-LD)
LDAC
Figure 1. Timing Diagram
D(0–7)
X
MSW
A(0,1)
X
0
X
X
LSW
X
1
X
CS
WE
LDAC
Figure 2. Example of a Complete Write Cycle (MSW, LSW) Using LDAC for Update
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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PARAMETER MEASUREMENT INFORMATION
D(0–7)
X
MSW
A(0,1)
X
0
X
X
LSW
1
X
Control
X
3
X
X
CS
WE
LDAC
Figure 3. Example of a Complete Write Cycle (MSW, LSW, Control)
8
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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DNL – Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY ERROR
1
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
512
1024
1536
2048
2560
3072
3584
4096
3584
4096
Digital Code
Figure 4
INL – Intergral Nonlinearity – LSB
INTEGRAL NONLINEARITY ERROR
3
2
1
0
–1
–2
–3
0
512
1024
1536
2048
2560
3072
Digital Code
Figure 5
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT VOLTAGE
vs
LOAD CURRENT
MAXIMUM OUTPUT VOLTAGE
vs
LOAD CURRENT
4.08
2.04
AVDD = 3 V,
Vref = Int. 1 V,
Input Code = 0xFFF
2.0395
4.079
VO – Output Voltage – V
2.039
VO – Output Voltage – V
AVDD = 5 V,
Vref = Int. 2 V,
Input Code = 0xFFF
4.0795
Fast Mode, Source
4.0785
Fast Mode, Source
2.0385
2.038
4.078
4.0775
2.0375
2.037
Slow Mode, Source
4.077
Slow Mode, Source
2.0365
4.0765
2.036
4.076
4.0755
2.0355
0
0.5
1
1.5
2
2.5
3
3.5
4
0
4.5
0.5
1
Load Current – mA
Figure 6
4.5
0.25
Fast Mode, Sink
Fast Mode, Sink
0.2
VO – Output Voltage – V
0.2
VO – Output Voltage – V
4
MINIMUM OUTPUT VOLTAGE
vs
LOAD CURRENT
0.25
0.15
0.1
Slow Mode, Sink
0.15
0.1
Slow Mode, Sink
0.05
0.05
AVDD = 3 V,
Vref = Int. 1 V,
Input Code = 0x000
AVDD = 5 V,
Vref = Int. 2 V,
Input Code = 0x000
0
0
0.5
1
1.5
2
2.5
3
Load Current – mA
3.5
4
4.5
0
0.5
Figure 8
10
3.5
Figure 7
MINIMUM OUTPUT VOLTAGE
vs
LOAD CURRENT
0
1.5
2
2.5
3
Load Current – mA
1
1.5
2
2.5
3
Load Current – mA
Figure 9
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3.5
4
4.5
TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
TOTAL HARMONIC DISTORTION AND NOISE
vs
FREQUENCY
THD+N – Total Harmonic Distortion and Noise – dB
–10
AVDD = 5 V,
REF = 1 V dc + 1 V pp Sinewave,
Output Full Scale
–20
–30
–40
–50
–60
Slow Mode
–70
–80
Fast Mode
–90
–100
100
10000
1000
100000
0
–10
AVDD = 5 V,
REF = 1 V dc + 1 V pp Sinewave,
Output Full Scale
–20
–30
–40
–50
–60
Slow Mode
–70
–80
Fast Mode
–90
–100
100
10000
1000
f – Frequency – Hz
f – Frequency – Hz
Figure 10
Figure 11
100000
POWER DOWN SUPPLY CURRENT
vs
TIME
1
0.9
0.8
I DD – Supply Current – mA
THD – Total Harmonic Distortion – dB
0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
10
20
30
40
50
60
t – Time – µs
70
80
90
Figure 12
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TLV5633C, TLV5633I
2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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APPLICATION INFORMATION
general function
The TLV5633 is a 12-bit, single supply DAC, based on a resistor string architecture. It consists of a parallel
interface, a speed and power down control logic, a programmable internal reference, a resistor string, and a
rail-to-rail output buffer. The output voltage (full scale determined by reference) is given by:
2 REF
CODE
0 1000
[V]
Where REF is the reference voltage and CODE is the digital input value in the range 0x000 to 0xFFF. A power
on reset initially puts the internal latches to a defined state (all bits zero).
parallel interface
The device latches data on the positive edge of WE. It must be enabled with CS low. Whether the data is written
to one of the DAC holding latches (MSW, LSW) or the control register depends on the address bits A1 and A0.
LDAC low updates the DAC with the value in the holding latch. LDAC is an asynchronous input and can be held
low, if a separate update is not necessary. However, to control the DAC using the load feature, there should be
approximately a 5 ns delay after the positive WE edge before driving LDAC low. Two more asynchronous inputs,
SPD and PWR control the settling times and the power-down mode:
SPD:
PWR:
Speed control
Power control
1 → fast mode
1 → normal operation
0 → slow mode
0 → power down
It is also possible to program the different modes (fast, slow, power down) and the DAC update latch using the
control register. The following tables list the possible combinations of control signals and control bits.
12
PIN
BIT
SPD
SPD
0
0
Slow
0
1
Fast
1
0
Fast
1
1
Fast
MODE
PIN
BIT
PWR
PWD
0
0
0
1
Down
1
0
Normal
1
1
Down
PIN
BIT
LDAC
RLDAC
0
0
Transparent
0
1
Transparent
1
0
Hold
1
1
Transparent
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LATCH
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CONVERTERS WITH INTERNAL REFERENCE AND POWER DOWN
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APPLICATION INFORMATION
data format
The TLV5633 writes data either to one of the DAC holding latches or to the control register depending on the
address bits A1 and A0.
ADDRESS BITS
A1
A0
REGISTER
0
0
DAC LSW holding
0
1
DAC MSW holding
1
0
Reserved
1
1
Control
The following table lists the meaning of the bits within the control register.
D7
D6
D5
D4
D3
D2
D1
D0
X
X†
X
X†
X
X†
REF1
0†
REF0
0†
RLDAC
0†
PWR
0†
SPD
0†
† Default values
X: don’t care
SPD: Speed control bit
PWR: Power control bit
RLDAC: Load DAC latch
1 → fast mode
1 → power down
1 → latch transparent
0 → slow mode
0 → normal operation
0 → DAC latch controlled by LDAC pin
REF1 and REF0 determine the reference source and the reference voltage.
REFERENCE BITS
REF1
REF0
REFERENCE
0
0
External
0
1
2.048 V
1
0
1.024 V
1
1
External
If an external reference voltage is applied to the REF pin, external reference must be selected.
layout considerations
To achieve the best performance, it is recommended to have separate power planes for GND, AVDD, and DVDD.
Figure 13 shows how to lay out the power planes for the TLV5633. As a general rule, digital and analog signals
should be separated as wide as possible. To avoid crosstalk, analog and digital traces must not be routed in
parallel. The two positive power planes ( AVDD and DVDD) should be connected together at one point with a
ferrite bead.
A 100-nF ceramic low series inductance capacitor between DVDD and GND and a 1-µF tantalum capacitor
between AVDD and GND placed as close as possible to the supply pins are recommended for optimal
performance.
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2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG
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APPLICATION INFORMATION
layout considerations (continued)
DVDD
AVDD
Figure 13. TLV5633 Board Layout
linearity, offset, and gain error using single end supplies
When an amplifier is operated from a single supply, the voltage offset can still be either positive or negative. With
a positive offset, the output voltage changes on the first code change. With a negative offset the output voltage
may not change with the first code, depending on the magnitude of the offset voltage.
The output amplifier attempts to drive the output to a negative voltage. However, because the most negative
supply rail is ground, the output cannot drive below ground and clamps the output at 0 V.
The output voltage remains at zero until the input code value produces a sufficient positive output voltage to
overcome the negative offset voltage, resulting in the transfer function shown in Figure 14.
Output
Voltage
0V
DAC Code
Negative
Offset
Figure 14. Effect of Negative Offset (Single Supply)
14
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APPLICATION INFORMATION
The offset error, not the linearity error, produces this breakpoint. The transfer function would have followed the
dotted line if the output buffer could drive below the ground rail.
For a DAC, linearity is measured between zero input code (all inputs 0) and full scale code (all inputs 1) after
offset and full scale are adjusted out or accounted for in some way. However, single supply operation does not
allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the linearity
is measured between full scale code and the lowest code that produces a positive output voltage.
TLV5633 interfaced to an Intel MCS51 controller
The circuit in Figure 15 shows how to interface the TLV5633 to an Intel MCS51 microcontroller. The address
bus and the data bus of the controller are multiplexed on port 0 (non page mode) to save port pins. To separate
the address bits and the data bits, the controller provides a dedicated signal, address latch enable (ALE), which
is connected to a latch at port 0.
An address decoder is required to generate the chip select signal for the TLV5633. In this example, a simple
3-to-8 decoder (74AC138) is used for the interface as shown in Figure 15. The DAC is memory mapped at
addresses 0x8000/1/2/3 within the data memory address space and mirrored every 32 address locations
(0x8020/1/2/3, 0x8040/1/2/3, etc.). In a typical microcontroller system, programmable logic should be used to
generate the chip select signals for the entire system.
The data pins and the WE pin of the TLV5633 can be connected directly to the multiplexed address and data
bus and the WR signal of the controller.
The application uses the TLV5633 device’s internal reference at 2.048 V. The LDAC pin is connected to P3.5
and is used to update the DAC after both data bytes have been written.
8xC51
8
P2 A(15–8)
16
8
8
P0 AD(7–0)
AD(7–0)
74AC138
74AC373
8
D(7–0) Q(7–0)
A2
A3
A4
A
8
Y(7–0)
CS(7–0)
B
C
DVDD
TLV5633
ALE
LE
A(15–0)
OE
A15
DVDD
G1
G2A
G2B
2
G2A SPD
A(1–0)
D(7–0)
PWR
CS
OUT
WE
WR
P3.5
RL
LDAC
To Other Devices Requiring
Voltage Reference
REF
Figure 15. TLV5633 Interfaced to an Intel MCS51 Controller
MCS is a registered trademark of Intel Corporation.
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APPLICATION INFORMATION
software
In the following example, the code generates a waveform at 20 KSPS with 32 samples stored in a table within
the program memory space of the microcontroller.
The waveform data is located in the program memory space at segment SINTBL beginning with the MSW of
the first 16-bit word (the 4 MSBs are ignored), followed by the LSW. Two bytes are required for each DAC word
(the table is not shown in the code example).
The program consists of two parts:
D
D
A main routine, which is executed after reset and which initializes the timer and the interrupt system of the
microcontroller.
An interrupt service routine, which reads a new value from the waveform table and writes it to the DAC.
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; File:
WAVE.A51
; Function: wave generation with TLV5633
; Processors: 80C51 family (running at 12MHz)
; Software: ASM51 assembler, Keil BL51 code–banking linker
; (C) 1999 Texas Instruments
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Program function declaration
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
NAME
WAVE
MAIN
ISR
WAVTBL
VAR1
STACK
SEGMENT
SEGMENT
SEGMENT
SEGMENT
SEGMENT
CODE
CODE
CODE
DATA
IDATA
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Code start at address 0, jump to start
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSEG AT 0
LJMP
start
; Execution starts at address 0 on power–up.
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Code in the timer0 interrupt vector
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSEG AT 0BH
LJMP
timer0isr ; Jump vector for timer 0 interrupt is 000Bh
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Define program variables
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEG VAR1
rolling_ptr: DS 1
16
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APPLICATION INFORMATION
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Interrupt service routine for timer 0 interrupts
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEG ISR
timer0isr:
PUSH
PSW
PUSH
ACC
;
;
;
;
;
The signal to be output on the dac is stored in a table
as 32 samples of msb, lsb pairs (64 bytes).
The pointer, rolling_ptr, rolls round the table of samples
incrementing by 2 bytes (1 sample) on each interrupt
(at the end of this routine).
MOV
DPTR, #wavetable ; set DPTR to the start of the table
MOV
MOV
MOVC
MOVX
R0, #001H
A,rolling_ptr
A,@A+DPTR
@R0, A
;
;
;
;
R0 selects DAC MSW
ACC loaded with the pointer into the wave table
get msb from the table
write DAC MSW
MOV
MOV
INC
MOVC
MOVX
R0, #000H
A,rolling_ptr
A
A,@A+DPTR
@R0, A
;
;
;
;
;
R0 selects DAC LSW
move rolling pointer back in to ACC
increment ACC holding the rolling pointer
which is the lsb of this sample, now in ACC
write DAC LSW
MOV
INC
INC
ANL
MOV
A,rolling_ptr
A
A
A,#003FH
rolling_ptr,A
; load ACC with rolling pointer again
; increment the ACC twice, to get next sample
CLR
SETB
T1
T1
; set LDACB = 0 (update DAC)
; set LDACB = 1
POP
POP
ACC
PSW
; wrap back round to 0 if >64
; move value held in ACC back to the rolling pointer
RETI
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Set up stack
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEG
STACK
DS 10h
; 16 Byte Stack!
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Main Program
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEG
MAIN
start:
MOV
SP,#STACK–1 ; first set Stack Pointer
CLR
MOV
MOV
MOV
A
rolling_ptr,A ; set rolling pointer to 0
TMOD,#002H
; set timer 0 to mode 2 – auto–reload
TH0,#0CEH
; set timer 2 re–load value for 20 kHz interrupts
MOV
P2, #080H
; set A15 of address bus high to ’memory map’
; device up beyond used address space
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APPLICATION INFORMATION
SETB
T1
MOV
MOV
R0, #003H
A, #011H
MOVX
@R0, A
;
;
;
;
;
;
;
;
;
SETB
SETB
SETB
ET0
EA
TR0
; enable timer 0 interrupts
; enable all interrupts
; start timer 0
always:
SJMP
RET
; set LDACB = 1 (on P3.5)
TLV5633 setup
R0 selects control register
LOAD ACC with control register value:
REF1=1, REF0=0 –> 2.048V internal reference
RLDAC=0 –> use LDACB pin to control DAC
PD=0
–> DAC enabled
SPD=1 –> FAST mode
write control word:
write DAC control word
always
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
; Table of 32 wave samples used as DAC data
;––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
RSEG WAVTBL
wavetable:
;...insert 32 samples here...
.END
18
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definitions of specifications and terminology
integral nonlinearity (INL)
The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum
deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale
errors.
differential nonlinearity (DNL)
The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the
measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage
changes in the same direction (or remains constant) as a change in the digital input code.
zero-scale error (EZS)
Zero-scale error is defined as the deviation of the output from 0 V at a digital input value of 0.
gain error (EG)
Gain error is the error in slope of the DAC transfer function.
signal-to-noise ratio + distortion (SINAD)
Signal-to-noise ratio + distortion is the ratio of the rms value of the output signal to the rms sum of all other
spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD
is expressed in decibels.
spurious free dynamic range (SFDR)
Spurious free dynamic range is the difference between the rms value of the output signal and the rms value of
the spurious signal within a specified bandwidth. The value for SFDR is expressed in decibels.
total harmonic distortion (THD)
Total harmonic distortion is the ratio of the rms sum of the first six harmonic components to the rms value of the
fundamental signal and is expressed in decibels.
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MECHANICAL DATA
DW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
16 PIN SHOWN
0.050 (1,27)
0.020 (0,51)
0.014 (0,35)
16
0.010 (0,25) M
9
0.419 (10,65)
0.400 (10,15)
0.010 (0,25) NOM
0.299 (7,59)
0.293 (7,45)
Gage Plane
0.010 (0,25)
1
8
0°– 8°
A
0.050 (1,27)
0.016 (0,40)
Seating Plane
0.104 (2,65) MAX
0.012 (0,30)
0.004 (0,10)
0.004 (0,10)
PINS **
16
20
24
A MAX
0.410
(10,41)
0.510
(12,95)
0.610
(15,49)
A MIN
0.400
(10,16)
0.500
(12,70)
0.600
(15,24)
DIM
4040000 / D 02/98
NOTES: A.
B.
C.
D.
20
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MS-013
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MECHANICAL DATA
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
0,75
0,50
A
Seating Plane
1,20 MAX
0,10
0,05 MIN
PINS **
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064 / E 08/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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Copyright  1999, Texas Instruments Incorporated