ETC RF212-11

RF212
Image-Reject Front End for Dual or Tri-Band GSM Applications
The RF212 device is available as a dual-band (EGSM900/DCS1800) front end or
as a tri-band (EGSM900/DCS1800/PCS1900) front end for Global System for
Mobile Communications (GSM) mobile telephony applications. Each device
integrates all the required front-end components after the frequency pre-select
filters. These components include the Low Noise Amplifiers (LNAs), the internal
image-reject filters, mixers, and a Local Oscillator (LO) amplifier.
Features
•
•
•
•
•
•
The main advantage of the RF212 is its ability to provide a minimum of 35 dB of
image rejection for each band. The block diagrams of the devices are shown in
Figures 1 and 2. The device packages and pin configurations are shown in Figures
3 and 4.
•
•
•
•
•
•
Supports EGSM
LNA and mixer for RF to IF conversion
12 dB or 20 dB switchable gain step
Minimum 35 dB of image rejection
No external post-LNA filters required
Common Intermediate Frequency (IF) port for all
bands
IF range from 350 MHz to 450 MHz
High isolation LO input buffer
Differential IF output
High dynamic range with low current consumption
Three-cell battery operation (2.7 to 3.6 V)
20-pin Exposed paddle, Thin Shrink Small Outline
Package (ETSSOP)
Applications
• Dual/tri-band digital cellular mobile telephony
(EGSM900/DCS1800, or
EGSM900/DCS1800/PCS1900)
LOIN
LOIN
LNA900IN
IFout
LNA900IN
LNA1800IN
IFout
LNA1800IN
LNA1900IN
control
Step
Sel
Band Select 1
Gain
Sel
control
Step
Sel
C0002
Figure 1. RF212 Dual-Band Device Block Diagram
Data Sheet
Band Select 1
Band Select 2
Gain
Sel
C0001
Figure 2. RF212 Tri-Band Device Block Diagram
Conexant
Proprietary Information and Specifications are Subject to Change
Doc. No. 100780D
May 24, 2000
RF212
Image-Reject Front End
NC
1
20
VCC
NC
1
20
VCC
GND
2
19
GND
GND
2
19
GND
GND
3
18
STEPSEL
GND
3
18
STEPSEL
LNA900IN
4
17
IFOUT+
LNA900IN
4
17
IFOUT+
VCC
5
16
IFOUT-
VCC
5
16
IFOUT-
VCC
6
15
GND
VCC
6
15
BANDSEL2
GAINSEL
7
14
BANDSEL1
GAINSEL
7
14
BANDSEL1
LNA1800IN
8
13
LOIN
LNA1800IN
8
13
LOIN
GND
9
12
LOGND
LNA1900IN
9
12
LOGND
ENA
10
11
NC
10
11
NC
ENA
C122
C067
Figure 4. RF212 Tri-Band Device Pin Configuration – 20-Pin
ETSSOP
Figure 3. RF212 Dual-Band Device Pin Configuration − 20-Pin
ETSSOP
Technical Description
Both RF212 devices form front ends of a dual-band or a tri-band
super-heterodyne receiver. The RF212 dual-band device is
optimized for an EGSM900/DCS1800 design, while the RF212
tri-band device is suitable for EGSM900, DCS1800, and PCS
1900. Each frequency band has its own separate front-end
receiver path. Each receiver path contains an LNA, an imagereject filter, and a mixer. The IF and LO ports are common to all
frequency bands. The image rejection achievable by this frontend design without any additional external components is 35 dB
minimum for an IF of 400 MHz. Both devices operate over a
supply voltage range of 2.7 V to 3.6 V.
The RF212 dual-band device has one band selection pin
(BANDSEL1 on pin 14). When BANDSEL1 is set to logic “0,” the
EGSM900 receiver path is active. The LO frequency needs to
be higher than the RF input frequency (i.e., a high side injection
is used). When BANDSEL1 is set to logic “1,” the DCS1800
receiver path is active. The LO frequency needs to be less than
the RF input frequency (i.e., a low-side injection is used). With a
400 MHz IF, this arrangement allows a single, wide-range
Voltage Controlled Oscillator (VCO) to be used for each band of
operation.
Similarly, the RF212 tri-band device has two band selection pins
(BANDSEL1 and BANDSEL2, pins 14 and 15, respectively). The
EGSM900 path uses the high side injection for the LO, while
DCS1800 and PCS1900 paths use the low side injection. Tables
1 and 2 provide the frequency band selection settings for the
dual and tri-band devices, respectively.
All the LNAs have switchable gain. The gain mode is selectable
using the GAINSEL signal (pin 7). Low gain mode is selected by
driving the GAINSEL signal to a logic “1”; high gain mode is
selected by driving the signal to a logic “0.” Depending on the
need of the handset design on the gain distribution, the gain
step between the high gain and low gain modes can be set to
either a 12 dB step or a 20 dB step. This gain step is selectable
with the STEPSEL signal (pin 18).
Electrical and Mechanical Specifications ________________
The RF212 signal pin assignments and functional pin
descriptions are found in Table 3 (dual-band) and Table 4 (triband). The absolute maximum ratings of the RF212 are
provided in Table 5, the operating conditions are specified in
Table 6, and electrical specifications are provided in Table 7.
Figure 3 shows the diagram for a typical application circuit using
the RF212 front end. Figure 4 provides the package dimensions
for both of the 20-pin ETSSOP devices.
ESD Sensitivity
The RF212 is a static-sensitive electronic device. Do not operate
or store near strong electrostatic fields. Take proper ESD
precautions.
2
May 24, 2000
Conexant
Proprietary Information and Specifications are Subject to Change
100780D
Image-Reject Front End
RF212
Table 1. RF212 Dual-Band Selection
BANDSEL1, pin 14
Mode
0
EGSM900
1
DCS1800
Table 2. RF212 Tri-Band Selection
BANDSEL1, pin 14
BANDSEL2, pin 15
Mode
0
0
EGSM900
0
1
1
0
DCS1800
1
1
PCS1900
Table 3. RF212 Dual-Band Device Signal Description
Pin #
Name
Description
Pin #
Name
Description
1
NC
No connect (recommend connecting to
ground)
11
NC
No connect (recommend connecting to
ground)
2
GND
Ground
12
LOGND
LO input ground
3
GND
Ground
13
LOIN
LO input
4
LNA900IN
900 MHz LNA input
14
BANDSEL1
Band select control
5
VCC
Supply
15
GND
Ground
6
VCC
Supply
16
IFOUT−
Mixer negative output
7
GAINSEL
LNA gain select
17
IFOUT+
Mixer positive output
8
LNA1800IN
1800 MHz LNA input
18
STEPSEL
Gain step select. STEPSEL= 0 selects a
12 dB gain step; STEPSEL = 1 selects a
20 dB gain step
9
GND
Ground
19
GND
Ground
10
ENA
Device enable, active high
20
VCC
Supply
Table 4. RF212 Tri-Band Device Signal Description
Pin #
1
Name
NC
Description
No connect (recommend connecting to
ground)
Pin #
11
Name
NC
Description
No connect (recommend connecting to
ground)
2
GND
Ground
12
LOGND
LO input ground
3
GND
Ground
13
LOIN
LO input
4
LNA900IN
900 MHz LNA input
14
BANDSEL1
Band select control 1
5
VCC
Supply
15
BANDSEL2
Band select control 2
6
VCC
Supply
16
IFOUT−
Mixer negative output
7
GAINSEL
LNA gain select
17
IFOUT+
Mixer positive output
8
LNA1800IN
1800 MHz LNA input
18
STEPSEL
Gain step select. STEPSEL= 0 selects a
12 dB gain step; STEPSEL = 1 selects a
20 dB gain step
9
LNA1900IN
1900 MHz LNA input
19
GND
Ground
10
ENA
Device enable, active high
20
VCC
Supply
100956A
May 18, 2000
Conexant – Preliminary
Proprietary Information and Specifications are Subject to Change
3
RF212
Image-Reject Front End
Table 5. Absolute Maximum Ratings
Parameter
Minimum
Maximum
Units
Storage Temperature
−40
+125
°C
Supply Voltage (VCC)
−0.3
+3.6
V
Input Voltage Range
−0.3
Vcc
V
Table 6. RF212 Recommended Operating Conditions
Parameter
Min
Typical
Max
Units
Supply Voltage
2.7
3.0
3.6
V
Operating Temperature
−30
+25
+85
°C
Table 7. RF212 Electrical Specifications (1 of 3)
(TA = 25 °C, Vcc = 2.7 V, fIF = 400 MHz, Plo = −10 dBm)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
30
mA
µA
EGSM900 Mode
Supply current::
Enable mode
Sleep mode
ENA = 1
ENA = 0
15
RF Input frequency
925
IF frequency
fIF
350
LO to RF input isolation
960
MHz
450
MHz
30
Input impedance
dB
Ω
50
Power gain (for 2 kΩ differential output impedance):
High gain mode
Low gain mode 1
Low gain mode 2
Gain step 1
Gain step 2
Temperature coefficient
Gain variation versus frequency
GMAX1
GMIN1
GMIN2
GSTEP1
GSTEP2
FTC1
GAINSEL = 0
GAINSEL = 1, STEPSEL = 1
GAINSEL = 1, STEPSEL = 0
20
–24
–14
22
0
10
–22
–12
–0.02
25
–20
–10
0.8
Noise figure:
High gain
Low gain mode 1
Low gain mode 2
GAINSEL = 0
GAINSEL = 1, STEPSEL = 1
GAINSEL = 1, STEPSEL = 0
Noise figure degradation with blocker:
High gain
−22 dBm blocker,
GAINSEL = 0 (Note 1)
Input 1 dB compression point
IP1DB
Input third order intercept point
IP3
high gain mode
low gain mode
2.3
18
10
−22
−18
Differential IF shunt output resistance
Image rejection:
fIF = 400 MHz
fIF = 350 or 450 MHz
4
May 24, 2000
400
35
25
Conexant
Proprietary Information and Specifications are Subject to Change
3.5
dB
dB
dB
dB
dB
dB/°C
dB
dB
dB
dB
1.6
dB
–20
–13
dBm
dBm
−12
dBm
2
kΩ
50
dB
dB
100780D
Image-Reject Front End
RF212
Table 7. RF212 Electrical Specifications (2 of 3)
(TA = 25 °C, Vcc = 2.7 V, fIF = 400 MHz, Plo = −10 dBm)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
30
mA
µA
1880
MHz
450
MHz
DCS1800 Mode
Supply current:
Enable mode
Sleep mode
ENA = 1
ENA = 0
19
RF input frequency
1805
IF frequency
350
LO to RF input isolation
30
Input impedance
400
dB
Ω
50
Power gain (for 2 kΩ differential output impedance):
High gain mode
Low gain mode 1
Low gain mode 2
Gain step 1
Gain step 2
Temperature coefficient
Gain variation versus frequency
GMAX1
GMIN1
GMIN2
GSTEP1
GSTEP2
FTC1
GAINSEL = 0
GAINSEL = 1, STEPSEL = 1
GAINSEL = 1, STEPSEL = 0
20
–22
–14
22
2
10
–20
–12
–0.02
25
–18
–10
1.2
dB
dB
dB
dB
dB
dB/°C
dB
Noise figure:
High gain
Low gain mode 1
Low gain mode 2
GAINSEL = 0
GAINSEL = 1, STEPSEL = 1
GAINSEL = 1, STEPSEL = 0
3.5
16.5
11
Noise figure degradation with blocker:
High gain
−22 dBm blocker,
GAINSEL = 0 (Note 2)
1.6
dB
–20
–16
dBm
dBm
−12
dBm
2
kΩ
40
dB
dB
Input 1 dB compression point
IP1DB
Input third order intercept point
IP3
high gain mode
low gain mode
−23
−20
Differential IF shunt output resistance
Image rejection:
fIF = 400 MHz
fIF = 350 or 450 MHz
35
25
4.5
dB
dB
dB
PCS1900 Mode (for tri-band device only)
Supply current:
Enable mode
Sleep mode
ENA = 1
ENA = 0
19
RF input frequency
1930
IF frequency
350
LO to RF input isolation
30
Input impedance
400
mA
µA
1990
MHz
450
MHz
dB
Ω
50
Power gain (for 2 kΩ differential output impedance):
High gain mode
Low gain mode 1
Low gain mode 2
Gain step 1
Gain step 2
Temperature coefficient
Gain variation versus frequency
GMAX1
GMIN1
GMIN2
GSTEP1
GSTEP2
FTC1
GAINSEL = 0
GAINSEL = 1, STEPSEL = 1
GAINSEL = 1, STEPSEL = 0
20
–22
–14
22
2
10
–20
–12
–0.02
25
–18
–10
1.2
Noise figure:
High gain
Low gain mode 1
Low gain mode 2
GAINSEL = 0
GAINSEL = 1, STEPSEL = 1
GAINSEL = 1, STEPSEL = 0
3.5
16.5
11
Noise figure degradation with blocker:
High gain
−22 dBm blocker,
GAINSEL = 0 (Note 3)
1.6
100956A
May 18, 2000
30
Conexant – Preliminary
Proprietary Information and Specifications are Subject to Change
4.5
dB
dB
dB
dB
dB
dB/°C
dB
dB
dB
dB
dB
5
RF212
Image-Reject Front End
Table 7. RF212 Electrical Specifications (3 of 3)
(TA = 25 °C, Vcc = 2.7 V, fIF = 400 MHz, Plo = −10 dBm)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
−23
−20
–20
–16
dBm
dBm
−12
dBm
2
kΩ
40
dB
dB
PCS1900 Mode (for tri-band device only) (continued)
Input 1 dB compression point
high gain mode
low gain mode
Input third order intercept point
Differential IF shunt output resistance
Image rejection:
fIF = 400 MHz
fIF = 350 or 450 MHz
35
25
Local Oscillator (LO)
LO frequency
1275
LO input return loss (with external matching circuit)
1640
fIF = 400 MHz
LO input power
−15
PLO
−10
MHz
−10
dB
−5
dBm
Control Signals (All Modes)
Digital input voltages (ENA, GAINSEL, BANDSEL1,
BANDSEL2, and STEPSEL)
VIH
Enable time
tON
Vcc –
0.4
VIL
V
0.4
10
Bandselect switching time
V
µs
µs
15
Note 1: Assumes −5 dBm @ 915 MHz blocker at the antenna input attenuated by 17 dB.
Note 2: Assumes −12 dBm @ 1785 MHz blocker at the antenna input attenuated by 10 dB.
Note 3: Assumes −12 dBm @ 1910 MHz blocker at the antenna input attenuated by 10 dB.
Vcc
10
10
22 pF
2000
10 pF
2.2 F
GAINSEL
7
5
6
20
22 pF
L2
82 nH
L1
82 nH
EGSM Rx filter
LNA900IN
47pF
4
12 nH
12 pF
DCS Rx Filter
100 pF
IFOUT+
1.5 pF
to
IF SAW
match
17
LNA1800IN
8
16
3.0 nH
IFOUT-
100 pF
PCS Rx Filter
BANDSEL1
LNA1900IN
1.2 pF
22 pF
Control
ENABLE
10
2000
14
9
3.0 nH
2000
2 K || (L1+L2)
differential
BANDSEL2
2000
15
2000
STEPSEL
Bias
18
LOIN
22 pF
27 pF
22 pF
13
2
3
12
19
4.7 nH
C903
Figure 3. Typical RF212 Application Circuit
(for dual-band device, ground pins 9 and 15)
6
May 24, 2000
Conexant
Proprietary Information and Specifications are Subject to Change
100780D
Image-Reject Front End
RF212
0.65 mm
4.20 mm
Pin 1 indicator
2
1
3
2
1
3.0 mm
6.40 mm
3
base metal
TOP VIEW
BOTTOM VIEW
6.50±0.10 mm
1.00+0.5/-0.2 mm
1.20 mm max
1.00 mm Ref
4.40±0.10 mm
0.24+0.06/-0.05 mm
SIDE VIEW
END VIEW
0.10±0.05 mm
C003
Figure 4. RF212 Package Dimensions − 20-Pin ETSSOP
100956A
May 18, 2000
Conexant – Preliminary
Proprietary Information and Specifications are Subject to Change
7
RF212
Image-Reject Front End
Ordering Information
Model Name
Manufacturing Part
Number
Dual-Band Image-Reject Front End
RF212-11
Tri-Band Image-Reject Front End
RF212-21
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100780D
Further Information
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