TPS63000 TPS63001 TPS63002 (3,25 mm x 3,25 mm) www.ti.com SLVS520 – MARCH 2006 HIGH EFFICIENT SINGLE INDUCTOR BUCK-BOOST CONVERTER WITH 1.8-A SWITCHES FEATURES • • • • • • • • • • • • DESCRIPTION Up to 95% Efficiency 1200-mA Output Current at 3.3 V in Step Down Mode (VIN 3.6 V...5.5 V) up to 800-mA Output Current at 3.3 V in Boost Mode (VIN > 2.4 V) Automatic Transition between Step Down and Boost Mode Device Quiescent Current less than 50 µA Input Voltage Range: 1.8 V to 5.5 V Fixed and Adjustable Output Voltage Options from 1.2 V to 5.5 V Power Save Mode for Improved Efficiency at Low Output Power Forced fixed Frequency Operation and Synchronization possible Load Disconnect During Shutdown Over-Temperature Protection Available in Small 3 mm x 3 mm, QFN-10 Package The TPS6300x devices provide a power supply solution for products powered by either a two-cell, or three-cell alkaline, NiCd or NiMH, or one-cell Li-Ion or Li-polymer battery. Output currents can go as high as 1200 mA while using a single-cell Li-Ion or Li-Polymer Battery, and discharge it down to 2.5 V or lower. The buck-boost converter is based on a fixed frequency, pulse-width-modulation (PWM) controller using synchronous rectification to obtain maximum efficiency. At low load currents the converter enters the Power Save mode to maintain a high efficiency over a wide load current range. The Power Save mode can be disabled, forcing the converter to operate at a fixed switching frequency. The maximum average current in the switches is limited to a typical value of 1800 mA. The output voltage can be programmed by an external resistor divider, or is fixed internally on the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is completely disconnected from the battery. The device is packaged in a 10-pin QFN PowerPAD™package measuring 3 mm x 3 mm (DRC). APPLICATIONS • • • • • • All Two-Cell and Three-Cell Alkaline, NiCd or NiMH or Single-Cell Li Battery Powered Products Portable Audio Players PDAs Cellular Phones Personal Medical Products White LED`s L1 2.2 µF L1 VIN 1.8 V to 5.5 V L2 VIN C1 10 µF R3 VOUT VINA R1 EN C3 FB PS/SYNC GND C2 10 µF VOUT 3.3 V up to 1200 mA R2 PGND TPS63000 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OUTPUT VOLTAGE OPTIONS (1) TA OUTPUT VOLTAGE DC/DC PACKAGE MARKING Adjustable BNQ 3.3 V BNR 5.0 V BNS 40°C to 85°C (1) (2) PART NUMBER (2) PACKAGE TPS63000DRC 10-Pin QFN TPS63001DRC TPS63002DRC Contact the factory to check availability of other fixed output voltage versions. The DRC package is available taped and reeled. Add R suffix to device type (e.g., TPS63000DRCR) to order quantities of 3000 devices per reel. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) TPS6300x Input voltage range on VBAT, L1, L2, VOUT, PS, EN, FB -0.3 V to 7 V Operating virtual junction temperature range, TJ -40°C to 150°C Storage temperature range Tstg -65°C to 150°C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS TABLE PACKAGE THERMAL RESISTANCE ΘJA POWER RATING TA≤ 25°C DERATING FACTOR ABOVE TA = 25°C DRC 48.7 °C/W 2054 mW 21 mW/°C RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Supply voltage at VBAT, VI 1.8 5.5 V Operating free air temperature range, TA -40 85 °C Operating virtual junction temperature range, TJ -40 125 °C 2 Submit Documentation Feedback TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 ELECTRICAL CHARACTERISTICS over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted) DC/DC STAGE PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VI Input voltage range 1.8 5.5 V VI Input voltage range for startup 1.9 5.5 V VO TPS63000 output voltage range 1.2 VFB TPS63000 feedback voltage 495 f Oscillator frequency Frequency range for synchronization ISW 5.5 V 505 mV 1250 1500 kHz 1250 1800 kHz 2000 mA 500 Switch current limit VIN = VINA = 3.6 V, TA = 25°C 1600 1800 High side switch on resistance VIN = VINA = 3.6 V 100 Low side switch on resistance VIN = VINA = 3.6 V 100 0.5% Load regulation 0.5% VINA Quiescent current VOUT (adjustable output voltage) IO = 0 mA, VEN = VIN = VINA = 3.6 V, VOUT = 3.3 V FB input impedance (fixed output voltage) IS mΩ Line regulation VIN Iq mΩ Shutdown current 1 1.5 µA 40 50 µA 4 6 µA 1 VEN = 0 V, VIN = VINA = 3.6 V 0.1 MΩ 1 µA CONTROL STAGE PARAMETER VUVLO Under voltage lockout threshold VIL EN, PS input low voltage VIH EN, PS input high voltage EN, PS input current TEST CONDITIONS VLBI voltage decreasing MIN TYP MAX 1.5 1.7 1.8 V 0.4 V 0.1 µA 1.2 Clamped on GND or VBAT UNIT V 0.01 Overtemperature protection 140 °C Overtemperature hysteresis 20 °C Submit Documentation Feedback 3 TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 PIN ASSIGNMENTS DRC PACKAGE (TOP VIEW) VOUT L2 PGND L1 VIN FB GND VINA SYNC/PS EN Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION EN 6 I Enable input. (1 enabled, 0 disabled) FB 10 I Voltage feedback of adjustable versions, must be connected to VOUT at fixed output voltage versions GND 9 PS/SYNC 7 I Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization) L1 4 I Connection for Inductor L2 2 I Connection for Inductor PGND 3 VIN 5 I Supply voltage for power stage VOUT 1 O Buck-boost converter output VINA 8 I Supply voltage for control stage PowerPAD™ 4 Control / logic ground Power ground Must be soldered to achieve appropriate power dissipation. Should be connected to PGND. Submit Documentation Feedback TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 FUNCTIONAL BLOCK DIAGRAM (TPS63000) L1 L2 VIN VOUT Current Sensor VBAT VOUT PGND PGND Gate Control _ VINA Modulator PS/SYNC Oscillator + + _ FB VREF + - Device Control EN Temperature Control PGND PGND GND Submit Documentation Feedback 5 TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 DETAILED DESCRIPTION CONTROLLER CIRCUIT The controlling circuit of the device is based on an average current mode topology. The average inductor current is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses input and output voltage feedforward. Changes of input and output voltage are monitored and immediately can change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must be connected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense the voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will be compared with the internal reference voltage to generate a stable and accurate output voltage. The controller circuit also senses the average input current as well as the peak input current. With this, maximum input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under all possible conditions. To finally protect the device from getting overheated an internal temperature sensor is implemented. Synchronous Operation The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible operating conditions. This enables the device to keep high efficency over a wide input voltage and output power range. To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and PGND are used. The reference for all control functions is the GND pin. The power switches are connected to PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the 4 switch topology, the load is always disconnected from the input during shutdown of the converter. Buck-Boost Operation To be able to regulate the output voltage properly at all possible input voltage conditions the device automatically switches from step down operation to boost operation and back as required by the configuration. It always uses one active switch, one rectifying switch, one switch permanently on and one switch permanently off. So it is operating as a step down converter (buck) when input voltage is higher than the output voltage and it is operating as a boost converter when the input voltage is lower than the output voltage. There is no mode of operation where all 4 switches are permanently switching. Controlling the switches this way allows to maintain high efficency at the most important point of operation, when input voltage is close to the output voltage. The RMS current through switches and inductor is kept at a minimum which minimizes losses there. Switching losses are also kept low by just using one active and one passive switch. At the remaining 2 switches one is kept permanently on and the other is kept permanently off thus causing no switching losses. Power Save Mode and Synchronization The SYNC/PS pin can be used to select different operation modes. To enable power save, SYNC/PS must be set low. Power save mode is used to improve efficiency at light load. If power save mode is enabled, the converter stops operating if the average inductor current gets lower than about 300 mA and the output voltage is at or above its nominal value. If the output voltage decreases below its nominal value, the device ramps up the output voltage again by starting operation using a programmed average inductor current higher than required by the current load condition. Operation can last for one or several pulses. The converter again stops operating once the conditions for stopping operation are met again. The power save mode can be disabled by programming high at the SYNC/PS. Connecting a clock signal at SYNC/PS forces the device to synchronize to the connected clock frequency. Syncronization is done by a PLL, so synchronizing to lower and higher frequencies compared to the internal clock works without any issues. The PLL also can handle missing clock pulses without causing malfunction in the converter. The SYNC/PS input supports standard logic thresholds. 6 Submit Documentation Feedback TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 DETAILED DESCRIPTION (continued) Device Enable The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In shutdown mode, the regulator stops switching, all internal control circuitry is switched off and the load is disconnected from the input. This also means that the output voltage can drop below the input voltage during shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high peak currents flowing from the input. Softstart and Short Circuit Protection When the device enables, the device starts operating. The average current limit is ramping up from an initial 400mA following the output voltage increasing. At an output voltage of about 1.2 V the current limit is at its nominal value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented. Thus the output voltage overshoot at startup is kept at a minimum as well as the inrush current at the input. The device ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output. When the output voltage does not increase above 1.2 V the device is assuming a short circuit at the output and keeps the current limit low to protect itself and the application. At a short at the output during operation the current limit also will be decreased accordingly. At 0 V at the output for example the output current will not exceed abaout 400 mA. Undervoltage Lockout An undervoltage lockout function prevents device start-up if the supply voltage on VINA is lower than approximately its threshold (see electrical characteristics table). When in operation the device automatically enters the shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device automatically restarts if the input voltage recovers to the minimum operating input voltage. Overtemperature Protection The device has a built in temperature sensor which monitors the internal IC temperature. If the temperature exceeds the programmed threshold (see electrical characteristics table) the device stops operating. As soon as the IC temperature has decreased below the programmed threshold it starts operating again. There is a built in hysteresis to avoid instable operation at IC temperatures at the overtemperature threshold. Submit Documentation Feedback 7 TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 APPLICATION INFORMATION DESIGN PROCEDURE The TPS6300x dc/dc converters are intended for systems powered by one-cell Li-Ion or Li-Polymer with a typical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell Alkaline, NiCd, NiMH battery with a typical terminal voltage between 1.8 V and 5.5 V . Additionally, any other voltage source with a typical output voltage between 1.8 V and 5.5 V can power systems where the TPS6300x is used. Programming the Output Voltage Within the TPS6300X family there are fixed and adjustable output voltages available. To properly configure the fixed output voltage devices the FB pin is used to sense the output voltage. This means that it must be connected directly to VOUT. At the adjustable output voltage versions and external resistor divider is used to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. When the output voltage is regulated properly the typical value of the voltage at the FB pin is 500 mV. The maximum recommended value for the output voltage is 5.5 V. The current through the resistive divider should be about 100 times greater than the current into the FB pin. The typical current into the FB pin is 0.01 µA, and the voltage across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the recommended value for R2 should be lower than 500 kΩ, in order to set the divider current at 1 µA or higher. It is recommended to keep the value for this resistor in the range of 200 kΩ. From that, the value of the resistor connected between VOUT and FB, R1, depending on the needed output voltage (VO), can be calculated using Equation 1: VOUT R 1 R2 1 V FB (1) If as an example, an output voltage of 3.3 V is needed, a 1.0 MΩ resistor should be chosen for R1. To improve control performance using a feedforward capacitor in parallel to R1 is recommended. The value for the feedforward capacitor can be calculated using Equation 2. 10 s C ff R1 (2) L1 4.7 F L1 VIN 1.8 V to 5.5 V L2 VIN C1 4.7 F R3 VOUT VINA R1 EN C3 FB PS/SYNC GND C2 10 F VOUT 3.3 V up to 800 mA R2 PGND TPS63000 Figure 1. Typical Application Circuit for Adjustable Output Voltage Option Inductor Selection To properly configure the TPS6300X devices an inductor must be connected between pin L1 and pin L2. To estimate the inductance value Equation 3 and Equation 4can be used. 8 Submit Documentation Feedback TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 APPLICATION INFORMATION (continued) L1 VOUT VIN1 VOUT V IN1 f 0.3 A L2 Vin2 VOUT VIN2 V OUT f 0.3 A (3) (4) In both equations f is the nominal switching frequency. In Equation 3 the minimum inductance value, L1 for step down mode operation is calculated. VIN1 is the maximum input voltage. In Equation 4 the minimum inductance, L2, for boost mode operation is calculated. VIN2 is the minimum input voltage. The recommended minimum inductor value is either L1 or L2 whichever is higher. As an example, a suitable inductor, for generating 3.3V from a Li-Ion battery with a battery voltage range from 2.5V up to 4.2V, is 2.2 µH. The recommended inductor value range is between 1.5 µH and 4.7 µH. In general this means that at high voltage conversion rates higher inductor values offer better performance. With the choosen inductance value the peak current for the inductor in steady state operation can be calculated. Equation 5 shows how to calculate the peak current I1 in step down mode operation and Equation 6 shows how to calculate the peak current I2 in boost mode operation. VOUT V IN1 V OUT I I 1 OUT 0.8 2 V IN1 f L (5) V I OUT VIN2 V OUT V IN2 I 2 OUT 0.8 V IN2 2 VOUT f L (6) The critical current value for selecting the right inductor is the higher value of I1 and I2. It also needs to be considered that load transients and error conditions may cause higher inductor currents. It also needs to be taken into account when selecting an appropriate inductor. The following inductor series from different suppliers have been used with the TPS6300x converters: Table 1. List of Inductors VENDOR INDUCTOR SERIES Coiltronics MuRata Tajo Yuden TDK VLF4012 VLF3215 Capacitor Selection Input Capacitor At least a 4.7 µF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND pins of the IC, is recommended. Output Capacitor For the output capacitor it is as well recommended to use small ceramic capacitors placed as close as possible to the VOUT and PGND pins of the IC. If, for any reason, the application requires to use a large capacitors which needs longer connections to the IC, using a smaller ceramic capacitor in parallel to the large one is recommended. This small capacitor should be as close as possible to the VOUT and PGND pins of the IC. To get an estimate of the recommended minimum output capacitance Equation 7 can be used. Submit Documentation Feedback 9 TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 C OUT 5 L F H (7) A capacitor with a value in the range of the calculated minimum should be used. This is required to maintain control loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output voltage drop during load transients. Layout Considerations As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the control ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current. 10 Submit Documentation Feedback TPS63000 TPS63001 TPS63002 www.ti.com SLVS520 – MARCH 2006 THERMAL INFORMATION Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below. • Improving the power dissipation capability of the PCB design • Improving the thermal coupling of the component to the PCB • Introducing airflow in the system The maximum recommended junction temperature (TJ) of the TPS6300x devices is 125 °C. The thermal resistance of the 10-pin QFN 3 x 3 package (DRC) is RθJA = 48.7 °C/W, if the PowerPAD is soldered. Specified regulator operation is assured to a maximum ambient temperature TA of 85 °C. Therefore, the maximum power dissipation is about 820 mW. More power can be dissipated if the maximum ambient temperature of the application is lower. T T J(MAX) A P 125°C 85°C 820 mW D(MAX) R 48.7 °CW JA (8) Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 6-Apr-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS63000DRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63001DRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63002DRCR ACTIVE SON DRC 10 3000 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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