DRV600 www.ti.com SLOS536 – JUNE 2007 DIRECTPATH™ STEREO LINE DRIVER FEATURES • • • • • Space Saving Package – 20-Pin, 4 mm × 4 mm Thin QFN, Thermally Optimized PowerPAD™ Package Ground-Referenced Outputs Eliminate DC-Blocking Capacitor – Reduce Board Area – Reduce Component Cost – Improve THD+N Performance – No Degradation of Low-Frequency Response Due to Output Capacitors Wide Power Supply Range: 1.8 V to 4.5 V 2 Vrms/Ch Output Voltage into 600 Ω at 3.3 V Independent Right and Left Channel Shutdown Control • • Short-Circuit and Thermal Protection Pop Reduction Circuitry APPLICATIONS • • • • • Set-top boxes CD / DVD Players DVD-Receivers HTIB PDP / LCD TV's DESCRIPTION The DRV600 is a stereo line driver designed to allow the removal of the output dc-blocking capacitors for reduced component count and cost. The DRV600 is ideal for single supply electronics where size and cost are critical design parameters. The DRV600 is capable of driving 2 Vrms into a 600-Ω load at 3.3 V. The DRV600 has a fixed gain of –1.5 V/V and line outputs that has ±8-kV IEC ESD protection. The DRV600 has independent shutdown control for the right and left audio channels. The DRV600 is available in a 4 mm × 4 mm Thin QFN package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DIRECTPATH, PowerPAD, DirectPath are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated DRV600 www.ti.com SLOS536 – JUNE 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. NC PVDD SDL SGND NC 20 19 18 17 16 RTJ (QFN) PACKAGE (TOP VIEW) 13 INL NC 4 12 NC PVSS 5 11 OUTR 10 3 SVDD C1N 9 SDR OUTL 14 8 2 NC PGND 7 INR SVSS 15 6 1 NC C1P DRV600RTJ NC − No internal connection TERMINAL FUNCTIONS TERMINAL NAME C1P 1 PGND 2 C1N 3 NC 4, 6, 8, 12, 16, 20 PVSS 5 SVSS OUTL I/O DESCRIPTION I/O Charge pump flying capacitor positive terminal I Power ground, connect to ground. I/O Charge pump flying capacitor negative terminal No connection O Output from charge pump. 7 I Amplifier negative supply, connect to PVSS via star connection. 9 O Left audio channel output signal SVDD 10 I Amplifier positive supply, connect to PVDD via star connection. OUTR 11 O Right audio channel output signal INL 13 I Left audio channel input signal SDR 14 I Right channel shutdown, active low logic. INR 15 I Right audio channel input signal SGND 17 I Signal ground, connect to ground. SDL 18 I Left channel shutdown, active low logic. PVDD 19 I Supply voltage, connect to positive supply. Exposed Pad 2 QFN Exposed pad must be soldered to a floating plane. Do NOT connect to power or ground. DRV600 www.ti.com SLOS536 – JUNE 2007 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range, TA = 25°C (unless otherwise noted) VALUE / UNIT Supply voltage, AVDD, PVDD –0.3 V to 5.5 V VI Input voltage R(Load) Minimum load impedance TA Operating free-air temperature range –40°C to 85°C TJ Operating junction temperature range –40°C to 150°C Tstg Storage temperature range –65°C to 85°C (1) VSS - 0.3 V to VDD + 0.3 V ≥ 100 Ω Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. AVAILABLE OPTIONS (1) (2) TA PACKAGED DEVICES (1) PART NUMBER SYMBOL –40°C to 85°C 20-pin, 4 mm × 4 mm QFN DRV600RTJ (2) AKQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. The RTJ package is only available taped and reeled. To order, add the suffix “R” to the end of the part number for a reel of 3000, or add the suffix “T” to the end of the part number for a reel of 250 (e.g., DRV600RTJR). RECOMMENDED OPERATING CONDITIONS VSS Supply voltage, AVDD, PVDD VIH High-level input voltage SDL, SDR VIL Low-level input voltage SDL, SDR TA Operating free-air temperature (1) MIN MAX UNIT 1.8 4.5 (1) V 1.5 V –40 0.5 V 85 °C MAX UNIT Device can shut down for VDD > 4.5 V to prevent damage to the device. ELECTRICAL CHARACTERISTICS TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP –80 |VOS| Output offset voltage VDD = 1.8 V to 4.5 V, Inputs grounded PSRR Power Supply Rejection Ratio VDD = 1.8 V to 4.5 V –69 VOH High-level output voltage VDD = 3.3 V, RL = 600 Ω 3.10 VOL Low-level output voltage VDD = 3.3 V, RL = 600 Ω |IIH| High-level input current (SDL, SDR) VDD = 4.5 V, VI = VDD |IIL| Low-level input current (SDL, SDR) VDD = 4.5 V, VI = 0 V IDD Supply Current 8 dB V –3.05 V 1 µA 1 µA VDD = 1.8 V, No load, SDL= SDR = VDD 5.3 6.5 VDD = 3.3 V, No load, SDL = SDR = VDD 6.7 8.2 VDD = 4.5 V, No load, SDL = SDR = VDD 8 10 Shutdown mode, VDD = 1.8 V to 4.5 V mV 1 mA µA 3 DRV600 www.ti.com SLOS536 – JUNE 2007 OPERATING CHARACTERISTICS VDD = 3.3 V , TA = 25°C, RL = 600 Ω (unless otherwise noted) PARAMETER VO THD+N TEST CONDITIONS Output Voltage(Outputs In Phase) Total harmonic distortion plus noise Crosstalk MIN 2.1 THD = 1%, VDD = 4.5 V, f = 1 kHz 2.7 THD = 1%, VDD = 4.5 V, f = 1 kHz, RL = 100 kΩ 2.8 VO = 2 Vrms, f = 1 kHz 0.04% VO = 2 Vrms, f = 20 kHz 0.07% VO = 2 Vrms, f = 1 kHz kSVR Supply ripple rejection ratio Av Closed-loop voltage gain ΔAv Gain matching fosc –82.5 200-mVpp ripple, f = 1 kHz –70.4 VRMS dB dB –1.5 –1.55 V/V 1% Slew rate 2.2 Maximum capacitive load 400 Noise output voltage 22-kHz filter, A-weighted Electrostatic discharge, IEC OUTR, OUTL 280 Vo = 2 Vrms (THD+N = 0.1%), 22-kHz BW, A-weighted Threshold kV 420 kHz 18 kΩ SVDD Audio In − R Audio Out − R SVSS SVDD Short Circuit Protection Audio Out − L Audio In − L SVSS Av = −1.5 V/V Bias Circuitry C1P Charge Pump C1N PVSS µs 109 dB 170 15 Functional Block Diagram SGND 15 150 Hysteresis SDx 320 450 12 Thermal shutdown pF µVrms ±8 Charge pump switching frequency Signal-to-noise ratio V/µs 7 Input impedance 4 UNIT –45.1 -1.45 Start-up time from shutdown SNR MAX -80 200-mVpp ripple, f = 217 Hz 200-mVpp ripple, f = 20 kHz Vn TYP THD = 1%, VDD = 3.3 V, f = 1 kHz °C °C DRV600 www.ti.com SLOS536 – JUNE 2007 TYPICAL CHARACTERISTICS C(PUMP) = C(PVSS) = 2.2 µF , CIN = 1 µF (unless otherwise noted) Table of Graphs FIGURE Total harmonic distortion + noise vs Output Voltage 1-6 Total harmonic distortion + noise vs Frequency 7-8 Quiescent supply current vs Supply voltage 9 Output spectrum 10 Gain and phase vs Frequency 0.1 1 0.01 0.001 3m 10m 100m 500m 2 3 VO - Output Voltage - Vrms 100 10 VDD = 3.3 V, RL = 100 kW, fIN = 1kHz 1 0.1 0.01 0.001 3m 10m 100m 500m 1 2 3 VO - Output Voltage - Vrms TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE THD+N - Total Harmonic Distortion + Noise - % 10 VDD = 1.8 V, RL = 100 kW, fIN = 1kHz THD+N - Total Harmonic Distortion + Noise - % 100 TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE 100 10 VDD = 4.5 V, RL = 100 kW, fIN = 1kHz 1 0.1 0.01 0.001 3m 10m 100m 500m 1 2 3 VO - Output Voltage - Vrms Figure 2. Figure 3. TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE 100 10 VDD = 1.8 V, RL = 600 W, fIN = 1kHz 1 0.1 0.01 0.001 3m 10m 100m 500m1 2 3 VO - Output Voltage - Vrms Figure 4. 100 10 VDD = 3.3 V, RL = 600 W, fIN = 1kHz 1 0.1 0.01 0.001 3m 10m 100m 500m 1 2 3 VO - Output Voltage - Vrms Figure 5. THD+N - Total Harmonic Distortion + Noise - % Figure 1. THD+N - Total Harmonic Distortion + Noise - % THD+N - Total Harmonic Distortion + Noise - % THD+N - Total Harmonic Distortion + Noise - % TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE 11-12 100 10 VDD = 4.5 V, RL = 600 W, fIN = 1kHz 1 0.1 0.01 0.001 3m 500m 1 10m 100m VO - Output Voltage - Vrms 2 3 Figure 6. 5 DRV600 www.ti.com SLOS536 – JUNE 2007 VDD = 3.3 V, RL = 600 W, Vrms = 0.1 1 0.1 0.01 0.001 20 50 100 500 1k 2k f - Frequency - Hz 5k 20k 10 10 VDD = 3.3 V, RL = 600 W, Vrms = 2 1 0.1 0.01 0.001 20 8 7 6 5 4 3 2 1 0 50 100 500 1k 2k f - Frequency - Hz 5k 20k 0 1 1.5 2 2.5 3 3.5 Figure 8. Figure 9. FFT vs FREQUENCY GAIN vs FREQUENCY PHASE vs FREQUENCY VDD = 3.3 V, RL 600 W, -60 dB rel to 2Vrmvs 0 VDD = 3.3 V, RL = 600 W, Vrms = 2 4 4 4.5 5 VDD − Supply Voltage − V VDD = 3.3 V, RL = 600 W, Vrms = 2 -25 -50 Gain - dBr -60 -80 Phase - Degrees -40 FFT - dBr 9 Figure 7. 0 -20 QUIESCENT SUPPLY CURRENT vs SUPPLY VOLTAGE I DD − Quiescent Supply Current − mA 10 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY THD+N - Total Harmonic Distortion + Noise - % THD+N - Total Harmonic Distortion + Noise - % TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 3 2 -100 -75 -100 -125 -150 1 -120 -175 -140 -0 0 5k 10k 15k f - Frequency - Hz Figure 10. 6 20k -200 10 100 1k 10k f - Frequency - Hz Figure 11. 100k 10 100 1k 10k f - Frequency - Hz Figure 12. 100k DRV600 www.ti.com SLOS536 – JUNE 2007 APPLICATION INFORMATION Line Driver Amplifiers Single-supply Line Driver amplifiers typically require dc-blocking capacitors. The top drawing in Figure 13 illustrates the conventional Line Driver amplifier connection to the load and output signal. DC blocking capacitors are often large in value. The line load (typical resistive values of 600 Ω to 10 kΩ) combine with the dc blocking capacitors to form a high-pass filter. Equation 1 shows the relationship between the load impedance (RL), the capacitor (CO), and the cutoff frequency (fC). 1 fc = 2pRLCO (1) CO can be determined using Equation 2, where the load impedance and the cutoff frequency are known. 1 CO = 2pRLfc (2) If fC is low, the capacitor must then have a large value because the load resistance is small. Large capacitance values require large package sizes. Large package sizes consume PCB area, stand high above the PCB, increase cost of assembly, and can reduce the fidelity of the audio output signal. Conventional VDD CO VOUT CO VDD/2 GND DirectPath VDD GND VSS Figure 13. Amplifier Applications The DirectPath™ amplifier architecture operates from a single supply but makes use of an internal charge pump to provide a negative voltage rail. Combining the user provided positive rail and the negative rail generated by the IC, the device operates in what is effectively a split supply mode. The output voltages are now centered at zero volts with the capability to swing to the positive rail or negative rail. The DirectPath™ amplifier requires no output dc blocking capacitors. The bottom block diagram and waveform of Figure 13 illustrate the ground-referenced Line Driver architecture. This is the architecture of the DRV600. Input-Blocking Capacitors DC input-blocking capacitors are required to be added in series with the audio signal into the input pins of the DRV600. These capacitors block the DC portion of the audio source and allow the DRV600 inputs to be properly biased to provide maximum performance. These capacitors form a high-pass filter with the input impedance of the DRV600. The cutoff frequency is calculated using Equation 3. For this calculation, the capacitance used is the input-blocking capacitor and the resistance is the input impedance of the DRV600. Because the gain of the DRV600 is fixed, the input impedance remains a constant value. Using the input impedance value from the operating characteristics table, the frequency and/or capacitance can be determined when one of the two values are given. 1 1 fc IN + or C IN + 2p fc R 2p RIN C IN IN IN (3) 7 DRV600 www.ti.com SLOS536 – JUNE 2007 APPLICATION INFORMATION (continued) Charge Pump Flying Capacitor and PVSS Capacitor The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage. The PVSS capacitor must be at least equal to the charge pump capacitor in order to allow maximum charge transfer. Low ESR capacitors are an ideal selection, and a value of 2.2 µF is typical. Capacitor values that are smaller than 2.2 µF can be used, but the maximum output power is reduced and the device may not operate to specifications. THD+N - Total Harmonic Distortion + Noise - % TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE 100 10 VDD = 3.3 V, RL = 600 kW, fIN = 1kHz, 1 mF Charge Pump Capacitor 1 0.1 0.01 0.001 3m 10m 100m 500m 1 VO - Output Voltage - Vrms 2 3 Figure 14. Decoupling Capacitors The DRV600 is a DirectPath™ Line Driver amplifier that require adequate power supply decoupling to ensure that the noise and total harmonic distortion (THD) are low. A good low equivalent-series-resistance (ESR) ceramic capacitor, typically 2.2 µF, placed as close as possible to the device VDD lead works best. Placing this decoupling capacitor close to the DRV600 is important for the performance of the amplifier. For filtering lower frequency noise signals, a 10-µF or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of this device. Supply Voltage Limiting At 4.5 V The DRV600 have a built-in charge pump which serves to generate a negative rail for the line driver. Because the line driver operates from a positive voltage and negative voltage supply, circuitry has been implemented to protect the devices in the amplifier from an overvoltage condition. Once the supply is above 4.5 V, the DRV600 can shut down in an overvoltage protection mode to prevent damage to the device. The DRV600 resume normal operation once the supply is reduced to 4.5 V or lower. Layout Recommendations Exposed Pad On DRV600RTJ Package The exposed metal pad on the DRV600RTJ package must be soldered down to a pad on the PCB in order to maintain reliability. The pad on the PCB should be allowed to float and not be connected to ground or power. Connecting this pad to power or ground prevents the device from working properly because it is connected internally to PVSS. SGND and PGND Connections The SGND and PGND pins of the DRV600 must be routed separately back to the decoupling capacitor in order to provide proper device operation. If the SGND and PGND pins are connected directly to each other, the part functions without risk of failure, but the noise and THD performance do not meet the specifications. 8 DRV600 www.ti.com SLOS536 – JUNE 2007 APPLICATION INFORMATION (continued) VOUT_R 1 mF 200 R Right Output Audio In - R 22 nF Audio Out - R 7.5 kW SGND PCM1754 PGND DRV600 VOUT_L Audio Out - L 1 mF 200 R Left Output Audio In - L 22 nF 7.5 kW C1P SDL SDR Shuntdown Control PVDD SVDD C1N PVSS 2.2 mF 2.2 mF 1.8 – 4.5V 2.2 mF Figure 15. Application Circuit 9 PACKAGE OPTION ADDENDUM www.ti.com 2-Jul-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty DRV600RTJR ACTIVE QFN RTJ 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DRV600RTJT ACTIVE QFN RTJ 20 250 CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Jul-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 2-Jul-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DRV600RTJR RTJ 20 MLA 330 12 4.3 4.3 1.5 8 12 Q2 DRV600RTJT RTJ 20 MLA 180 12 4.3 4.3 1.5 8 12 Q2 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) DRV600RTJR RTJ 20 MLA 346.0 346.0 29.0 DRV600RTJT RTJ 20 MLA 190.0 212.7 31.75 Pack Materials-Page 2 Height (mm) IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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