MICROCHIP TC1040CEUA

TC1040
Linear Building Block – Dual Low Power Comparator and
Voltage Reference with Shutdown
Features
General Description
• Combines Two Comparators and a Voltage
Reference in a Single Package
• Optimized for Single Supply Operation
• Small Package: 8-Pin MSOP
• Ultra Low Input Bias Current: Less than 100pA
• Low Quiescent Current, Operating: 10µA (Typ.)
Shutdown Mode: 6µA (Typ.)
• Rail-to-Rail Inputs and Outputs
• Operates Down to VDD = 1.8V
• Reference and One Comparator Remain Active in
Shutdown to Provide Supervisory Functions
The TC1040 is a mixed-function device combining two
comparators and a voltage reference in a single 8-pin
package. The inverting input of Comparator A and the
non-inverting input of Comparator B are internally
connected to the reference.
Applications
•
•
•
•
Power Supply Circuits
Battery Operated Equipment
Consumer Products
Replacements for Discrete Components
This increased integration allows the user to replace
two packages, which saves space, lowers supply
current and increases system performance. The
TC1040 operates from two 1.5V alkaline cells down to
VDD = 1.8V. It requires only 10µA typical of supply
current, which significantly extends battery life. A low
power shutdown input (SHDN) disables one of the
comparators, placing its outputs in a high-impedance
state. This mode saves battery power and allows
comparator outputs to share common analog lines
(multiplexing). Shutdown current is 6µA (typical).
Rail-to-rail inputs and outputs allow operation from low
supply voltages with large input and output signal
swings.
Packaged in an 8-Pin MSOP, the TC1040 is ideal for
applications requiring low power level detection.
Device Selection Table
Part Number
Package
Temperature
Range
TC1040CEUA
8-Pin MSOP
-40°C to +85°C
Functional Block Diagram
OUTA
TC1040
1
8
OUTB
Package Type
8-Pin MSOP
VSS
2
7
A
VSS
8
7
2
INA+
3
INB-
4
TC1040CEUA
OUTB
VDD
6
REF
5
SHDN
+
1
INA+
–
6
3
REF
Voltage
Reference
INB-
 2002 Microchip Technology Inc.
–
+
OUTA
VDD
B
4
5
SHDN
VSS
DS21345B-page 1
TC1040
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage ......................................................6.0V
Voltage on Any Pin .......... (V SS – 0.3V) to (VDD + 0.3V)
Junction Temperature....................................... +150°C
Operating Temperature Range............. -40°C to +85°C
Storage Temperature Range .............. -55°C to +150°C
TC1040 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Typical values apply at 25°C and VDD = 3.0V. Minimum and maximum values apply for TA = -40° to
+85°C and VDD = 1.8V to 5.5V, unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VDD
Supply Voltage
1.8
—
5.5
V
IQ
Supply Current Operating
—
10
15
µA
All outputs unloaded, SHDN = VDD
ISHDN
Supply Current, Shutdown
—
0.05
0.1
µA
SHDN = VSS
V
Shutdown Input
VIH
Input High Threshold
80% VDD
—
—
VIL
Input Low Threshold
—
—
20% VDD
V
ISI
Shutdown Input Current
—
—
±100
nA
Comparators
ROUT(SD)
Output Resistance in Shutdown
20
—
—
MΩ
COUT(SD)
Output Capacitance in Shutdown
—
—
5
pF
SHDN = VSS, COMPB only
TSEL
Select Time (For Valid Output)
—
20
—
µsec
(SHDN = VIH to VOUT)
RL =10kΩ to VSS, COMPB only
TDESEL
Deselect Time
—
500
—
nsec
(SHDN = VIL to VOUT)
RL =10kΩ to VSS, COMPB only
VIR
Input Voltage Range
VSS – 0.2
—
VDD + 0.2
V
VOS
Input Offset Voltage
-5
-5
—
+5
+5
mV
IB
Input Bias Current
VOH
Output High Voltage
VOL
PSRR
SHDN = VSS, COMPB only
VDD = 3V, TA = 25°C
TA = -40°C to 85°C
—
—
±100
pA
VDD – 0.3
—
—
V
RL = 10kΩ to VSS
TA = 25°C, INA+, INB- = VDD to VSS
Output Low Voltage
—
—
0.3
V
RL = 10kΩ to VDD
Power Supply Rejection Ratio
60
—
—
dB
TA = 25°C
VDD = 1.8V to 5V
ISRC
Output Source Current
1
—
—
mA
INA+ = VDD , INB- = VSS
Output Shorted to VSS
VDD = 1.8V
ISINK
Output Sink Current
2
—
—
mA
INA+ = VSS, INB- =VDD,
Output Shorted to VDD
VDD = 1.8V
tPD1
Response Time
—
4
—
µsec
100mV Overdrive, CL = 100pF
tPD2
Response Time
—
6
—
µsec
10mV Overdrive, CL = 100pF
1.176
1.200
1.224
V
Voltage Reference
VREF
Reference Voltage
50
—
—
µA
IREF(SINK)
Sink Current
50
—
—
µA
CL(REF)
Load Capacitance
—
—
100
pF
EVREF
Voltage Noise
—
20
—
µVRMS
eVREF
Noise Density
—
1.0
—
µV/√Hz 1kHz
IREF(SOURCE) Source Current
DS21345B-page 2
100Hz to 100kHz
 2002 Microchip Technology Inc.
TC1040
2.0
PIN DESCRIPTION
The description of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin MSOP)
Symbol
1
OUTA
2
VSS
Negative power supply.
3
INA+
Non-inverting input to Comparator A.
Description
Comparator output.
4
INB-
5
SHDN
6
REF
Voltage reference output.
7
VDD
Positive power supply.
8
OUTB
 2002 Microchip Technology Inc.
Inverting input to Comparator B.
Shutdown input.
Comparator output.
DS21345B-page 3
TC1040
3.0
DETAILED DESCRIPTION
The TC1040 is one of a series of very low power, linear
building block products targeted at low voltage, single
supply applications. The TC1040 minimum operating
voltage is 1.8V and typical supply current is only 10µA
(fully enabled). It combines two comparators and a
voltage reference in a single package. A shutdown
mode is incorporated for easy adaptation to system
power management schemes. During shutdown, one
comparator is disabled (i.e., powered down with output
at a high impedance). The “still awake” comparator and
voltage reference can be used as a wake-up timer,
power supply monitor, LDO controller or other
continuous duty circuit function.
3.1
Comparators
The TC1040 contains two comparators. The comparator’s input range extends beyond both supply voltages
by 200mV and the outputs will swing to within several
millivolts of the supplies, depending on the load current
being driven. The inverting input of Comparator A and
the non-inverting input of Comparator B are internally
connected to the output of the voltage reference.
The comparators exhibit a propagation delay and
supply current which are largely independent of supply
voltage. The low input bias current and offset voltage
make them suitable for high impedance precision
applications.
Comparator B is disabled during shutdown and has a
high impedance output. Comparator COMPA remains
active.
4.0
TYPICAL APPLICATIONS
The TC1040 lends itself to a wide variety of
applications, particularly in battery powered systems. It
typically finds application in power management,
processor supervisory and interface circuitry.
4.1
Wake-Up Timer
Many microcontrollers have a low-power “sleep” mode
that significantly reduces their supply current. Typically,
the microcontroller is placed in this mode via a software
instruction, and returns to a fully-enabled state upon
reception of an external signal (“wake-up”). The wakeup signal is usually supplied by a hardware timer. Most
system applications demand that this timer have a long
duration (typically seconds or minutes), and consume
as little supply current as possible.
The circuit shown in Figure 4-1 is a wake-up timer
made from Comparator A. (Comparator A is used
because the wake-up timer must operate when SHDN
is active.) Capacitor C1 charges through R1 until a
voltage equal to V R is reached, at which point the
“wake-up” is driven active. Upon wake-up, the
microcontroller resets the timer by forcing a logic low
on a dedicated, open drain I/O port pin. This discharges
C1 through R4 (the value of R4 is chosen to limit
maximum current sunk by the I/O port pin). With a 3V
supply, the circuit as shown consumes typically 8µA
and furnishes a nominal timer duration of 25 seconds.
FIGURE 4-1:
WAKE-UP TIMER
Microcontroller
3.2
Voltage Reference
A 2.0 percent tolerance, internally biased, 1.20V
bandgap voltage reference is included in the TC1040.
It has a push-pull output capable of sourcing and
sinking 50µA. The voltage reference remains fully
enabled during shutdown.
3.3
R4
Shutdown Input
SHDN at VIL disables one comparator. The SHDN input
cannot be allowed to float; when not used, connect it to
VDD. The disabled comparator’s output is in a high
impedance state when shutdown is active. The
disabled comparator’s inputs and outputs can be driven
from rail-to-rail by an external voltage when the
TC1040 is in shutdown. No latchup will occur when the
device is driven to its enabled state when SHDN is set
to VIH.
DS21345B-page 4
I/O*
VDD
1/2
R1
5M
VDD
COMPA
+
Wake-Up
C1
10µF
–
VR
TC1040
*Open Drain Port Pin
 2002 Microchip Technology Inc.
TC1040
4.2
Precision Battery Monitor
Figure 4-2 is a precision battery low/battery dead
monitoring circuit. Typically, the battery low output
warns the user that a battery dead condition is
imminent. Battery dead typically initiates a forced
shutdown to prevent operation at low internal supply
voltages (which can cause unstable system operation).
The circuit in Figure 4-2 uses a single TC1040, onehalf of a TC1029, and only six external resistors.
COMPA and COMPB provide precision voltage
detection using VR as a reference. Resistors R2 and
R4 set the detection threshold for BATT LOW, while
Resistors R1 and R7 set the detection threshold for
BATT FAIL. The component values shown assert
BATT LOW at 2.2V (typical) and BATT FAIL at 2.0
(typical). Total current consumed by this circuit is
typically 22µA at 3V. Resistors R5 and R6 provide
hysteresis for comparators COMPA and COMPB,
respectively.
4.3
External Hysteresis (Comparator)
Hysteresis can be set externally with two resistors
using positive feedback techniques (see Figure 4-3).
The design procedure for setting external comparator
hysteresis is as follows:
1.
2.
Choose the feedback resistor RC. Since the
input bias current of the comparator is at most
100pA, the current through RC can be set to
100nA (i.e., 1000 times the input bias current)
and retain excellent accuracy. The current
through RC at the comparator’s trip point is VR /
R C where VR is a stable reference voltage.
Determine the hysteresis voltage (VHY) between
the upper and lower thresholds.
 2002 Microchip Technology Inc.
3.
Calculate RA as follows:
EQUATION 4-1:
VH Y
R A = R C  -----------
VD D
4.
5.
Choose the rising threshold voltage for VSRC
(VTHR).
Calculate RB as follows:
EQUATION 4-2:
1
R B = ----------------------------------------------------------V
THR  1
1
 -------------------- – ------- – ------V × R  R
R
A
A RC
6.
Verify the
formulas:
threshold
voltages
with
these
VSRC rising:
EQUATION 4-3:
1
1
1
V TH R = ( V R ) ( R A )  ------- +  ------- +  -------
R 
R 
R 
A
B
C
VSRC falling:
EQUATION 4-4:
V THF = V THR –
R A × V DD
 -----------------------
RC 
DS21345B-page 5
TC1040
FIGURE 4-2:
PRECISION BATTERY MONITOR
To System DC/DC
Converter
R4, 470k, 1%
R5, 7.5M
VDD
VDD
TC1034
+
R2, 330k, 1%
+
AMP1
–
3V
Alkaline
COMPA
–
BATTLOW
+
VDD
TC1040
R1, 270k, 1%
VR
–
BATTFAIL
COMPB
+
R6, 7.5M
R3, 470k, 1%
FIGURE 4-3:
COMPARATOR
EXTERNAL HYSTERESIS
CONFIGURATION
RC
TC1040
VDD
RA
VSRC
+
–
RB
VR
DS21345B-page 6
VOUT
COMPA
1/2
 2002 Microchip Technology Inc.
TC1040
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Comparator Propagation Delay
vs. Supply Voltage
7
TA = 25°C
CL = 100pF
DELAY TO FALLING EDGE (µsec)
6
Overdrive = 10mV
5
4
Overdrive = 50mV
3
2
6
Overdrive = 10mV
5
Overdrive = 100mV
Overdrive = 50mV
4
3
2
2.5
3
3.5
4
4.5
5
1.5
5.5
2
6
VDD = 5V
5
VDD = 4V
VDD = 2V
4
VDD = 3V
2.5
3
3.5
4
4.5
5
5.5
-40°C
SUPPLY VOLTAGE (V)
2.5
7
2.5
VDD = 4V
VDD = 3V
VDD = 2V
4
VOUT - VSS (V)
VDD - VOUT (V)
VDD = 5V
TA = 25°C
2.0
2.0
6
85°C
Comparator Output Swing
vs. Output Sink Current
TA = 25°C
Overdrive = 100mV
25°C
TEMPERATURE (°C)
Comparator Output Swing
vs. Output Source Current
Comparator Propagation Delay
vs. Temperature
5
Overdrive = 100mV
3
SUPPLY VOLTAGE (V)
DELAY TO FALLING EDGE (µsec)
7
TA = 25°C
CL = 100pF
2
1.5
VDD = 3V
1.5
VDD = 1.8V
1.0
VDD = 5.5V
.5
1.5
VDD = 3V
1.0
VDD = 1.8V
.5
VDD = 5.5V
3
-40°C
0
0
25°C
0
85°C
3
2
4
ISOURCE (mA)
1
TEMPERATURE (°C)
Comparator Output Short-Circuit
Current vs. Supply Voltage
5
TA = -40°C
50
TA = 25°C
40
TA = 85°C
0°
30
TA
20
Sinking
10
Sourcing
0
0
=
C
-4
TA = 25°C
TA = 85°C
3
1
2
4
5
SUPPLY VOLTAGE (V)
 2002 Microchip Technology Inc.
VDD = 1.8V
VDD = 3V
1.220
VDD = 5.5V
Sinking
1.200
Sourcing
1.180
VDD = 5.5V
1.160
VDD = 1.8V
VDD = 3V
1.140
6
0
2
4
6
1
2
3
4
5
6
ISINK (mA)
1.240
60
0
6
Reference Voltage vs.
Load Current
REFERENCE VOLTAGE (V)
OUTPUT SHORT-CIRCUIT CURRENT (mA)
Comparator Propagation Delay
vs. Temperature
8
LOAD CURRENT (mA)
10
SUPPLY AND REFERENCE VOLTAGES (V)
DELAY TO RISING EDGE (µsec)
7
Comparator Propagation Delay
vs. Supply Voltage
DELAY TO RISING EDGE (µsec)
5.0
Line Transient
Response of VREF
4
VDD
3
2
VREF
1
0
0
100
200
300
400
TIME (µsec)
DS21345B-page 7
TC1040
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Reference Voltage
vs. Supply Voltage
Supply Current vs. Supply Voltage
12
SUPPLY CURRENT (µA)
REFERENCE VOLTAGE (V)
1.25
1.20
1.15
1.10
11
TA = 85°C
10
TA = -40°C
9
TA = 25°C
8
7
1.05
6
1
4
2
3
SUPPLY VOLTAGE (V)
DS21345B-page 8
5
0
1
2
3
4
5
SUPPLY VOLTAGE (V)
6
 2002 Microchip Technology Inc.
TC1040
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
6.3
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Package Dimensions
8-Pin MSOP
PIN 1
.122 (3.10)
.114 (2.90)
.197 (5.00)
.189 (4.80)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.008 (0.20)
.005 (0.13)
6° MAX.
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21345B-page 9
TC1040
NOTES:
DS21345B-page 10
 2002 Microchip Technology Inc.
TC1040
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21345B-page11
TC1040
NOTES:
DS21345B-page12
 2002 Microchip Technology Inc.
TC1040
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21345B-page 13
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Japan
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain
China - Beijing
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-6766200 Fax: 86-28-6766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
Hong Kong
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
New York
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
*DS21345B*
DS21345B-page 14
 2002 Microchip Technology Inc.