TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 FEATURES APPLICATIONS • • • • • • • • • • • • • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 3 Ω Typ) 0- to 10-V Switching on Data I/O Ports Bidirectional Data Flow With Near-Zero Propagation Delay Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 20 pF Max, B Port) VCC Operating Range From 4.75 V to 5.25 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Supports Both Digital and Analog Applications PCI Interface Differential Signal Interface Memory Interleaving Bus Isolation Low-Distortion Signal Gating DBQ OR PW PACKAGE (TOP VIEW) B4 B3 B2 B1 A NC OE GND 1 16 2 15 3 14 4 13 5 12 6 7 11 10 8 9 VCC B5 B6 B7 B8 S0 S1 S2 NC − No internal connection DESCRIPTION/ORDERING INFORMATION The TS5N118 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the TS5N118 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems. The TS5N118 is a 1-of-8 multiplexer/demultiplexer with a single output-enable (OE) input. The select (S0, S1, S2) inputs control the data path of the multiplexer/demultiplexer. When OE is low, the multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists between the A and B ports. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) ORDERABLE PART NUMBER SSOP (QSOP) – DBQ Tape and reel TS5N118DBQR TSSOP – PW Tape and reel TS5N118PWR TOP-SIDE MARKING YB118 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 FUNCTION TABLE INPUTS S0 INPUT/OUTPUT A FUNCTION L L B1 A port = B1 port L H B2 A port = B2 port L H L B3 A port = B3 port L L H H B4 A port = B4 port L H L L B5 A port = B5 port L H L H B6 A port = B6 port L H H L B7 A port = B7 port L H H H B8 A port = B8 port H X X X Z Disconnect OE S2 S1 L L L L L LOGIC DIAGRAM (POSITIVE LOGIC) A 5 4 SW 3 SW B1 B2 2 SW B3 1 B4 SW 15 SW B5 14 SW B6 13 B7 SW 12 SW 11 S0 10 S1 9 S2 OE 2 7 B8 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) A B VCC Charge Pump EN(1) (1) EN is the internal enable signal applied to the switch. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VIN Control input voltage range (2) (3) –0.5 7 V VI/O Switch I/O voltage range (2) (3) (4) –0.5 II/O ON-state switch current (5) ±100 mA Continuous current through VCC or GND ±100 mA θJA Package thermal impedance (6) Tstg Storage temperature range (1) (2) (3) (4) (5) (6) 11 DBQ package 90 PW package 108 –65 UNIT V °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MIN MAX UNIT 4.75 5.25 V High-level control input voltage 2 5.25 V VIL Low-level control input voltage 0 0.8 V VI/O Data input/output voltage 0 10 V TA Operating free-air temperature –40 85 °C VCC Supply voltage VIH (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 Electrical Characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER IIN TEST CONDITIONS Control inputs MIN TYP (2) MAX VCC = 5.25 V, VIN = 0 to VCC VCC = 5.25 V, VO = 0 to 10 V, VI = 0, Switch OFF, VIN = VCC or GND 10 VCC = 0 V, VO = Open, VI = 0 to 10 V 10 VCC = 5.25 V, II/O = 0, Switch ON or OFF, VIN = VCC or GND VCC = 5 V, VIN = 10 V or 0 A port VCC = 5 V, Switch OFF, VIN = VCC or GND, VI/O = 10 V or 0 B port VCC = 5 V, Switch OFF, VIN = VCC or GND, VI/O = 10 V or 0 Cio(ON) VCC = 5 V, Switch ON, VIN = VCC or GND, VI/O = 10 V or 0 VCC = 4.75 V, TYP at VCC = 5 V VI = 0, IO = 50 mA ron (4) VI = 8 V, IO = –50 mA 7.5 VI = 10 V, IO = –50 mA 12.5 IOZ (3) ICC Cin Control inputs Cio(OFF) (1) (2) (3) (4) 10 UNIT µA µA 10 10 mA pF 120 20 160 3 pF pF 7.5 Ω VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. For I/O ports, the parameter IOZ includes the I/O leakage current. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) TO (OUTPUT) tpd (1) A or B B or A 0.1 ns tpd(s) S A 200 ns S B 200 OE A or B 200 S B 200 OE A or B 200 ten tdis (1) VCC = 5 V ± 0.25 V FROM (INPUT) PARAMETER UNIT MIN MAX ns ns The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). Dynamic Characteristics over recommended operating free-air temperature range, VCC = 5 V ± 5% (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT RL = 50 Ω, VI = 0.632 V (P-P), See Figure 4 OFF isolation (OISO) RL = 50 Ω, VI = 0.632 V (P-P), f = 25 MHz, See Figure 5 –50 dB Crosstalk (XTALK) RL = 50 Ω, VI = 0.632 V (P-P), f = 25 MHz, See Figure 6 –50 dB Bandwidth (1) (2) 4 (BW) (2) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. Bandwidth is the frequency at which the gain is –3 dB below the DC gain. 25 MHz TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 TYPICAL PERFORMANCE 6 ron − ON-State Resistance − Ω TA = 25°C 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 VI − V Figure 1. Typical ron vs VI, VCC = 5 V and IO = –50 mA 0 0 Gain −20 Gain − dB −4 Phase −30 −6 −40 −8 −50 −10 −12 0.1 Phase Margin − Deg −10 −2 −60 −70 1 10 f − Frequency − MHz 100 500 Figure 2. Frequency Response vs Bandwidth 5 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 TYPICAL PERFORMANCE 160 0 140 Phase 120 100 80 Gain − dB −40 60 Gain −60 40 20 −80 Phase Margin − Deg −20 0 −20 −100 0.1 −40 1 10 f − Frequency − MHz 100 500 Figure 3. Frequency Response vs OFF Isolation 180 0 140 Phase −20 60 Gain − dB −40 Gain 20 −60 −20 −80 −60 −100 −100 −140 −120 0.1 1 10 100 f − Frequency − MHz Figure 4. Frequency Response vs Crosstalk 6 −180 500 Phase Margin − Deg 100 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 VCC Input Generator VI 50 Ω 50 Ω CL (see Note A) RL TEST VCC S1 RL VI CL tpd(s)† 5 V ± 0.25 V Open 100 Ω VCC 35 pF tPLZ/tPZL 5 V ± 0.25 V 2 VCC 100 Ω GND 35 pF 0.3 V tPHZ/tPZH 5 V ± 0.25 V GND 100 Ω VCC 35 pF 0.3 V V∆ tpds is measured with Demux inputs at opposite voltage levels, i.e. VB1 = 5 V, VB2 = GND. VCC Output Control (VIN) VCC/2 VCC VCC/2 VCC/2 0V tPLH VOH Output VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (tpd(s)) Output Waveform 1 S1 at 2 × VCC (see Note B) tPLZ VOH VCC/2 VOL + V∆ VOL tPZH tPHL VCC/2 0V tPZL Output Control (VIN) Open GND VG2 † S1 RL VO Output Waveform 2 S1 at GND (see Note B) tPHZ VOH VCC/2 VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 25 ns, tf < 25 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. Figure 5. Test Circuit and Voltage Waveforms 7 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 PARAMETER MEASUREMENT INFORMATION VCC Network Analyzer 50 B1 Channel ON: B1 to A A Source Signal Network Analyzer Setup B2−B8 Source Power = 0 dBM (632-mV P-P at 50- load) GND DC Bias = 350 mV 50 Figure 6. Bandwidth (BW) VCC Network Analyzer 50 B1 Channel OFF: B2−B8 to A A Source Signal 50 Network Analyzer Setup B2−B8 Source Power = 0 dBM (632-mV P-P at 50- load) GND 50 DC Bias = 350 mV Figure 7. OFF Isolation (OISO) VCC Network Analyzer 50 B1 Channel ON: B1 to A A Source Signal Channel OFF: B2−B8 to A B2−B8 Network Analyzer Setup 50 50 GND Source Power = 0 dBM (632-mV P-P at 50- load) DC Bias = 350 mV Figure 8. Crosstalk (XTALK) 8 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 MECHNICAL DATA DBQ (R-PDSO-G**) 0.012 (0,30) 0.008 (0,20) 0.025 (0,64) 24 0.005 (0,13) 13 0.157 (3,99) 0.150 (3,81) 0.244 (6,20) 0.228 (5,80) 0.008 (0,20) NOM Gauge Plane 1 12 A 0.010 (0,25) 0°−8° 0.035 (0,89) 0.016 (0,40) 0.069 (1,75) MAX Seating Plane 0.010 (0,25) 0.004 (0,10) 0.004 (0,10) PINS ** 16 20 24 28 A MAX 0.197 (5,00) 0.344 (8,74) 0.344 (8,74) 0.394 (10,01) A MIN 0.189 (4,80) 0.337 (8,56) 0.337 (8,56) 0.386 (9,80) M0−137 VARIATION AB AD AE AF DIM D 4073301/F 02/2002 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO−137. 9 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS205 – AUGUST 2005 MECHNICAL DATA PW (R-PDSO-G**) 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°− 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. 10 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS5N118DBQR ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS5N118DBQRE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS5N118DBQRG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS5N118PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS5N118PWR Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 7.0 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS5N118PWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. 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