ETC SX18AC/DP

January 19, 2000
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
Configurable Communications Controllers with EE/Flash Program
Memory, In-System Programming Capability and On-Chip Debug
1.0
1.1
PRODUCT OVERVIEW
Introduction
teristics enables the device to implement hard real-time
functions as software modules (Virtual Peripheral™) to
replace traditional hardware functions.
The Scenix SX family of configurable communications
controllers are fabricated in an advanced CMOS process
technology. The advanced process, combined with a
RISC-based architecture, allows high-speed computation, flexible I/O control, and efficient data manipulation.
Throughput is enhanced by operating the device at frequencies up to 50/75 MHz and by optimizing the instruction set to include mostly single-cycle instructions. In
addition, the SX architecture is deterministic and totally
reprogramable. The unique combination of these charac-
On-chip functions include a general-purpose 8-bit timer
with prescaler, an analog comparator, a brown-out detector, a watchdog timer, a power-save mode with multisource wakeup capability, an internal R/C oscillator, userselectable clock modes, and high-current outputs.
RT C C
O S C 1 O S C2
O SC
8-bit W atchdog
8-bit T im er
Clock
D river
RT C C
T im er (W DT )
S
elect
4M Hz
Internal
÷ 4 or ÷ 1
RC OSC
Interrupt Stack
System C lock
8
M C LR
Prescaler for R T CC
P ow er-O n
A nalog
3
or
R eset
Interrupt
RE S ET
M IW U
P ort B
C om p
P rescaler for W DT
B row n-O ut
8
8
8
M IW U S ystem
C lock
Internal D ata B us
8
8
8
8
8 8
8
8
W
In-System
PC
D ebugging
Port A Port C
3 Level
8
A LU
FSR
A
ddress
S
tack
Fetch
In-S ystem
4
8
Instruction
PC
P rogram m ing
Decode
Pipeline
136 Bytes
STATU S
S R AM
E xecutive
2k W ords
A ddress 12
E E P RO M
O PT IO N
W rite Back
MODE
8
W rite D ata
R ead D ata
8
Instruction
12
IR E A D
Figure 1-1. Block Diagram
Scenix™ and the Scenix logo are trademarks of Scenix Semiconductor, Inc.
I2C™ is a trademark of Philips Corporation
Microwire™ is a trademark of National Semiconductor Corporation
© 2000 Scenix Semiconductor, Inc. All rights reserved.
All other trademarks mentioned in this document are property of their respective companies.
-1-
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Product
1.1
1.2
1.3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3.1
The Virtual Peripheral Concept . . . . . . . . 4
1.3.2
The Communications Controller . . . . . . . . 4
1.4
Programming and Debugging Support . . . . . . . . . . 4
1.5
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3
Part Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Port Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1
Reading and Writing the Ports . . . . . . . . . . . . . . . . . 7
3.1.1
Read-Modify-Write Considerations . . . . . 9
3.2
Port Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2.1
MODE Register . . . . . . . . . . . . . . . . . . . . 9
3.2.2
Port Configuration Registers . . . . . . . . . . 9
3.2.3
Port Configuration Upon Reset . . . . . . . 10
Special-Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1
PC Register (02h) . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2
STATUS Register (03h) . . . . . . . . . . . . . . . . . . . . . 11
4.3
OPTION Register . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Device Configuration Registers . . . . . . . . . . . . . . . . . . . . . 13
5.1
FUSE Word (Read/Program at FFFh in main memory
map) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2
FUSEX Word (Read/Program via Programming
Command) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3
DEVICE Word (Hard-Wired Read-Only) . . . . . . . . 14
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1
Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1.1
Program Counter . . . . . . . . . . . . . . . . . . 15
6.1.2
Subroutine Stack . . . . . . . . . . . . . . . . . . 15
6.2
Data Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.1
File Select Register (04h) . . . . . . . . . . . 15
Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.1
Multi-Input Wakeup . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2
Port B MIWU/Interrupt Configuration . . . . . . . . . . . 18
Interrupt Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Oscillator Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
9.1
XT, LP or HS modes . . . . . . . . . . . . . . . . . . . . . . . 21
9.2
External RC Mode . . . . . . . . . . . . . . . . . . . . . . . . . 23
9.3
Internal RC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . 23
© 2000 Scenix Semiconductor, Inc. All rights reserved.
11.0
12.0
13.0
14.0
15.0
16.0
17.0
18.0
-2-
Real Time Clock (RTCC)/Watchdog Timer . . . . . . . . . . . . .23
10.1
RTCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
10.2
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . .23
10.3
The Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Brown-Out Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Register States Upon DiffeRent reset operations . . . . . . .29
Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
15.1
Instruction Set Features . . . . . . . . . . . . . . . . . . . . .30
15.2
Instruction Execution . . . . . . . . . . . . . . . . . . . . . . .30
15.3
Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . .30
15.4
RAM Addressing . . . . . . . . . . . . . . . . . . . . . . . . . .31
15.5
The Bank Instruction . . . . . . . . . . . . . . . . . . . . . . .31
15.6
Bit Manipulation . . . . . . . . . . . . . . . . . . . . . . . . . . .31
15.7
Input/Output Operation . . . . . . . . . . . . . . . . . . . . . .31
15.8
Increment/Decrement . . . . . . . . . . . . . . . . . . . . . . .31
15.9
Loop Counting and Data Pointing Testing . . . . . . .31
15.10
Branch and Loop Call Instructions . . . . . . . . . . . . .31
15.10.1 Jump Operation . . . . . . . . . . . . . . . . . . .31
15.10.2 Page Jump Operation . . . . . . . . . . . . . .32
15.10.3 Call Operation . . . . . . . . . . . . . . . . . . . .32
15.10.4 Page Call Operation . . . . . . . . . . . . . . . .32
15.11
Return Instructions . . . . . . . . . . . . . . . . . . . . . . . . .32
15.12
Subroutine Operation . . . . . . . . . . . . . . . . . . . . . . .33
15.12.1 Push Operation . . . . . . . . . . . . . . . . . . .33
15.12.2 Pop Operation . . . . . . . . . . . . . . . . . . . .33
15.13
Comparison and Conditional Branch Instructions .34
15.14
Logical Instruction . . . . . . . . . . . . . . . . . . . . . . . . .34
15.15
Shift and Rotate Instructions . . . . . . . . . . . . . . . . .34
15.16
Complement and SWAP . . . . . . . . . . . . . . . . . . . .34
15.17
Key to Abbreviations and Symbols . . . . . . . . . . . . .34
Instruction Set Summary Table . . . . . . . . . . . . . . . . . . . . . .35
16.1
Equivalent Assembler Mnemonics . . . . . . . . . . . . .38
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .39
17.1
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . .39
17.2
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .40
17.3
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .41
17.4
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .42
17.5
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .43
17.6
Comparator DC and AC Specifications . . . . . . . . .43
17.7
Typical Performance Characteristics. . . . . . . . . . . .44
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
1.2
Key Features
Hardware Peripheral Features
• One 8-bit Real Time Clock/Counter (RTCC) with programable 8-bit prescaler
• Watchdog Timer (shares the RTCC prescaler)
• Analog comparator
• Brown-out detector
• Multi-Input Wakeup logic on 8 pins
• Internal RC oscillator with configurable rate from 31.25
kHz to 4 MHz
• Power-On-Reset
50 MIPS Performance
• SX18AC/SX20AC/SX28AC: DC - 50 MHz operation
SX18AC75/SX20AC75/SX28AC75: DC - 75 MHz
• SX18AC/SX20AC/SX28AC: 20 ns instruction cycle,
60 ns internal interrupt response
SX18AC75/SX20AC75/SX28AC75: 13.3 ns instruction
cycle, 39.9 ns internal interrupt response
• 1 instruction per clock (branches 3)
EE/FLASH Program Memory and SRAM Data Memory
•
•
•
•
Packages
• 18-pin SOP/DIP, 20-pin SSOP, 28-pin SOP/DIP/SSOP
Access time of < 10 ns provides single cycle access
EE/Flash rated for > 10,000 rewrite cycles
2048 Words EE/Flash program memory
136x8 bits SRAM data memory
Programming and Debugging Support
• On- chip in-system programming support with serial
and parallel interfaces
• In-system serial programming via oscillator pins
• On-chip in-System debugging support logic
• Real-time emulation, full program debug, and integrated development environment offered by third party tool
vendors
CPU Features
• Compact instruction set
• All instructions are single cycle except branch
• Eight-level push/pop hardware stack for subroutine
linkage
• Fast table lookup capability through run-time readable
code (IREAD instruction)
• Totally predictable program execution flow for hard
real-time applications
Fast and Deterministic Interrupt
• Jitter-free 3-cycle internal interrupt response
• Hardware context save/restore of key resources such
as PC, W, STATUS, and FSR within the 3-cycle interrupt response time
• External wakeup/interrupt capability on Port B (8 pins)
Flexible I/O
•
•
•
•
•
•
•
All pins individually programmable as I/O
Inputs are TTL or CMOS level selectable
All pins have selectable internal pull-ups
Selectable Schmitt Trigger inputs on Ports B, and C
All outputs capable of sourcing/sinking 30 mA
Port A outputs have symmetrical drive
Analog comparator support on Port B (RB0 OUT, RB1
IN-, RB2 IN+)
• Selectable I/O operation synchronous to the oscillator
clock
© 2000 Scenix Semiconductor, Inc. All rights reserved.
-3-
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
1.3
Architecture
•
•
•
•
The SX devices use a modified Harvard architecture.
This architecture uses two separate memories with separate address buses, one for the program and one for
data, while allowing transfer of data from program memory to SRAM. This ability allows accessing data tables
from program memory. The advantage of this architecture is that instruction fetch and memory transfers can be
overlapped with a multi-stage pipeline, which means the
next instruction can be fetched from program memory
while the current instruction is being executed using data
from the data memory.
Delta/Sigma ADC
DTMF generation/detection
PSK/FSK generation/detection
FFT/DFT based algorithms
1.3.2 The Communications Controller
The combination of the Scenix hardware architecture and
the Virtual Peripheral concept create a powerful, creative
platform for the communications design communities: SX
communications controller. Its high processing power,
recofigurability, cost-effectiveness, and overall design
freedom give the designer the power to build products for
the future with the confidence of knowing that they can
keep up with innovation in standards and other areas.
Scenix has developed a revolutionary RISC-based architecture and memory design techniques that is 20 times
faster than conventional MCUs, deterministic, jitter free,
and totally reprogramable.
1.4
Programming and Debugging Support
The SX devices are currently supported by third party
tool vendors. On-chip in-system debug capabilities have
been added, allowing tools to provide an integrated
development environment including editor, macro assembler, debugger, and programmer. Un-obtrusive in-system
programming is provided through the OSC pins. There is
no need for a bon-out chip, so the user does not have to
worry about the potential variations in electrical characteristics of a bond-out chip and the actual chip used in the
target applications. the user can test and revise the fully
debugged code in the actual SX, in the actual application,
and get to production much faster.
The SX family implements a four-stage pipeline (fetch,
decode, execute, and write back), which results in execution of one instruction per clock cycle. For example, at
the maximum operating frequency of 50 MHz, instructions are executed at the rate of one per 20-ns clock
cycle.
1.3.1 The Virtual Peripheral Concept
Virtual Peripheral concept enables the “software system
on a chip” approach. Virtual Peripheral, a software module that replaces a traditional hardware peripheral, takes
advantage of the Scenix architecture’s high performance
and deterministic nature to produce same results as the
hardware peripheral with much greater flexibility.
1.5
Applications
Emerging applications and advances in existing ones
require higher performance while maintaining low cost
and fast time-to-production.
The speed and flexibility of the Scenix architecture complemented with the availability of the Virtual Peripheral
library, simultaneously address a wide range of engineering and product development concerns. They decrease
the product development cycle dramatically, shortening
time to production to as little as a few days.
The device provides solutions for many familiar applications such as process controllers, electronic appliances/tools, security/monitoring systems, consumer
automotive, sound generation, motor control, and personal communication devices. In addition, the device is
suitable for applications that require DSP-like capabilities, such as closed-loop servo control (digital filters), digital answering machines, voice notation, interactive toys,
and magnetic-stripe readers.
Scenix’s time-saving Virtual Peripheral library gives the
system designers a choice of ready-made solutions, or a
head start on developing their own peripherals. So, with
Virtual Peripheral modules handling established functions, design engineers can concentrate on adding value
to other areas of the application.
Furthermore, the growing Virtual Peripheral library features new components, such as the Internet Protocol
stack, and communication interfaces, that allow design
engineers to embed Internet connectivity into all of their
products at extremely low cost and very little effort.
The concept of Virtual Peripheral combined with in-system re-programmability provides a power development
platform ideal for the communications industry because
of the numerous and rapidly evolving standards and protocols.
Overall, the concept of Virtual Peripheral provides benefits such as using a more simple device, reduced component count, fast time to market, increased flexibility in
design, customization to your application, and ultimately
overall system cost reduction.
Some examples of Virtual Peripheral modules are:
• Communication interfaces such as I2C™, Microwire™
(µ-Wire), SPI, IrDA Stack, UART, and Modem functions
• Frequency generation and measurement
• PPM/PWM output
© 2000 Scenix Semiconductor, Inc. All rights reserved.
-4-
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
2.0
CONNECTION DIAGRAMS
2.1
Pin Assignments
SX 28-PIN
SX 20-PIN
SX 18-PIN
RA2
RA3
RTCC
MCLR
Vss
RB0
RB1
RB2
RB3
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
RA1
RA0
OSC1
OSC2
Vdd
RB7
RB6
RB5
RB4
RA2
RA3
RTCC
MCLR
Vss
Vss
RB0
RB1
RB2
RB3
1
2
3
4
5
6
7
8
9
10
DIP/SOP
20
19
18
17
16
15
14
13
12
11
RTCC
Vdd
n.c.
Vss
n.c.
RA0
RA1
RA2
RA3
RB0
RB1
RB2
RB3
RB4
RA1
RA0
OSC1
OSC2
Vdd
Vdd
RB7
RB6
RB5
RB4
SSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DIP/SOP
2.2
SX 28-PIN
MCLR
OSC1
OSC2
RC7
RC6
RC5
RC4
RC3
RC2
RC1
RC0
RB7
RB6
RB5
Vss
RTCC
Vdd
Vdd
RA0
RA1
RA2
RA3
RB0
RB1
RB2
RB3
RB4
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
MCLR
OSC1
OSC2
RC7
RC6
RC5
RC4
RC3
RC2
RC1
RC0
RB7
RB6
RB5
SSOP
Pin Descriptions
Name
Pin Type Input Levels
Description
RA0
I/O
TTL/CMOS
Bidirectional I/O Pin; symmetrical source / sink capability
RA1
I/O
TTL/CMOS
Bidirectional I/O Pin; symmetrical source / sink capability
Bidirectional I/O Pin; symmetrical source / sink capability
RA2
I/O
TTL/CMOS
RA3
I/O
TTL/CMOS
Bidirectional I/O Pin; symmetrical source / sink capability
RB0
I/O
TTL/CMOS/ST Bidirectional I/O Pin; comparator output; MIWU input
RB1
I/O
TTL/CMOS/ST Bidirectional I/O Pin; comparator negative input; MIWU input
RB2
I/O
TTL/CMOS/ST Bidirectional I/O Pin; comparator positive input; MIWU input
RB3
I/O
TTL/CMOS/ST Bidirectional I/O Pin; MIWU input
RB4
I/O
TTL/CMOS/ST Bidirectional I/O Pin; MIWU input
RB5
I/O
TTL/CMOS/ST Bidirectional I/O Pin; MIWU input
RB6
I/O
TTL/CMOS/ST Bidirectional I/O Pin; MIWU input
RB7
I/O
TTL/CMOS/ST Bidirectional I/O Pin; MIWU input
RC0
I/O
TTL/CMOS/ST Bidirectional I/O pin
RC1
I/O
TTL/CMOS/ST Bidirectional I/O pin
RC2
I/O
TTL/CMOS/ST Bidirectional I/O pin
RC3
I/O
TTL/CMOS/ST Bidirectional I/O pin
RC4
I/O
TTL/CMOS/ST Bidirectional I/O pin
RC5
I/O
TTL/CMOS/ST Bidirectional I/O pin
RC6
I/O
TTL/CMOS/ST Bidirectional I/O pin
RC7
I/O
TTL/CMOS/ST Bidirectional I/O pin
Input to Real-Time Clock/Counter
RTCC
I
ST
MCLR
I
ST
Master Clear reset input – active low
OSC1/In/Vpp
I
ST
Crystal oscillator input – external clock source input
Crystal oscillator output – in R/C mode, internally pulled to Vdd through weak
OSC2/Out
O
CMOS
pull-up
Vdd
Positive supply pin
P
–
Ground pin
Vss
P
–
Note:I = input, O = output, I/O = Input/Output, P = Power, TTL = TTL input, CMOS = CMOS input,
ST = Schmitt Trigger input, MIWU = Multi-Input Wakeup input
© 2000 Scenix Semiconductor, Inc. All rights reserved.
-5-
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
2.3
Part Numbering
Table 2-1. Ordering Information
Pins
I/O
Operating
Frequency (MHz)
EE/Flash
(Words)
RAM
(Bytes)
Operating
Temp. (°C)
SX18AC/SO
SX18AC-I/SO
SX18AC75/SO
18
18
18
12
12
12
50
50
75
2K
2K
2K
136
136
136
0°C to +70°C
-40°C to +85°C
0°C to +70°C
SX18AC/DP
SX18AC-I/DP
SX18AC75/DP
18
18
18
12
12
12
50
50
75
2K
2K
2K
136
136
136
0°C to +70°C
-40°C to +85°C
0°C to +70°C
SX20AC/SS
SX20AC-I/SS
SX20AC75/SS
20
20
20
12
12
12
50
50
75
2K
2K
2K
136
136
136
0°C to +70°C
-40°C to +85°C
0°C to +70°C
SX28AC/SO
SX28AC-I/SO
SX28AC75/SO
28
28
28
20
20
20
50
50
75
2K
2K
2K
136
136
136
0°C to +70°C
-40°C to +85°C
0°C to +70°C
SX28AC/DP
SX28AC-I/DP
SX28AC75/DP
28
28
28
20
20
20
50
50
75
2K
2K
2K
136
136
136
0°C to +70°C
-40°C to +85°C
0°C to +70°C
SX28AC/SS
SX28AC-I/SS
SX28AC75/SS
28
28
28
20
20
20
50
50
75
2K
2K
2K
136
136
136
0°C to +70°C
-40°C to +85°C
0°C to +70°C
Device
SX18ACXX-I/SO
Package Type
DP =
DIP
SO =
SOP
SS =
SSOP
TQ =
Tiny PQFP
PQ =
PQFP
Extended Temperature
Speed
Memory Size
Blank =
50 MHz
75 =
75 MHz
100 =
100 MHz
Feature Set
Blank =
0°C to +70°C
I=
-40°C to +85°C
Pin Count
SceniX
A=
512 word
B=
1k word
C=
2k word
D=
4k word
Figure 2-1. Part Number Reference Guide
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
3.0
PORT DESCRIPTIONS
The associated registers allow for each port bit to be individually configured under software control as shown
below:
The device contains a 4-bit I/O port (Port A) and two 8-bit
I/O ports (Port B, Port C). Port A provides symmetrical
drive capability. Each port has three associated 8-bit registers (Direction, Data, TTL/CMOS Select, and Pull-Up
Enable) to configure each port pin as Hi-Z input or output,
to select TTL or CMOS voltage levels, and to enable/disable the weak pull-up resistor. The upper four bits of the
registers associated with Port A are not used. The least
significant bit of the registers corresponds to the least
significant port pin. To access these registers, an appropriate value must be written into the MODE register.
Table 3-1. Port Configuration
Data Direction
Registers:
RA, RB, RC
Upon power-up, all bits in these registers are initialized to
“1”.
TTL/CMOS
Select Registers:
LVL_A, LVL_B,
LVL_C
Pullup Enable
Registers:
PLP_A, PLP_B,
PLP_C
0
1
0
1
0
1
Output
Hi-Z
Input
CMOS
TTL
Enable
Disable
Mode = 0F
Mode = 0E
Mode = 0D
MODE
WR
Vdd
RA
Direction
Internal Data Bus
0 = Output
1 = Hi-Z Input
Pullup
WR
PLP_A
0 = Pullup Enable
1 = Pullup Disable
WR
RA Data
Port A PIN
WR
LVL_A
0 = CMOS
1 = TTL
TTL Buffer
M
U CMOS Buffer
X
RD
Port A INPUT
Figure 3-1. Port A Configuration
3.1
Reading and Writing the Ports
Writing to a port data register sets the voltage levels of
the corresponding port pins that have been configured to
operate as outputs. Reading from a register reads the
voltage levels of the corresponding port pins that have
been configured as inputs.
The three ports are memory-mapped into the data memory address space. To the CPU, the three ports are available as the RA, RB, and RC file registers at data memory
addresses 05h, 06h, and 07h, respectively.
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Mode = 0F
Mode = 0E
Mode = 0D
Mode = 0C
MODE
Vdd
WR
RB or RC
Direction
Pullup Resistor
(~20kΩ)
0 = Output
1 = Hi-Z Input
WR
Internal Data Bus
PLP_B or PLP_C
WR
0 = Pullup Enable
1 = Pullup Disable
Port B or
Port C PIN
RB or RC
Data
WR
LVL_B or LVL_C
0 = CMOS
1 = TTL
WR
TTL Buffer
M
U CMOS Buffer
X
ST_B or ST_C
0 = Schmitt Trigger Enable
1 = Schmitt Trigger Disable
M
U
X
RD
Port B: Input, MIWU, Comparator
Port C: Input Only
~
~
Schmitt Trigger Buffer
Figure 3-2. Port B, Port C Configuration
For example, suppose all four Port A pins are configured
as outputs and with RA0 and RA1 to be high, and RA2
and RA3 to be low:
mov
W,#$03
mov
$05,W
When a write is performed to a bit position for a port that
has been configured as an input, a write to the port data
register is still performed, but it has no immediate effect
on the pin. If later that pin is configured to operate as an
output, it will reflect the value that has been written to the
data register.
;load W with the value 03h
;(bits 0 and 1 high)
;write 03h to Port A data
;register
When a read is performed from a bit position for a port,
the operation is actually reading the voltage level on the
pin itself, not necessarily the bit value stored in the port
data register. This is true whether the pin is configured to
operate as an input or an output. Therefore, with the pin
configured to operate as an input, the data register contents have no effect on the value that you read. With the
pin configured to operate as an output, what is read generally matches what has been written to the register.
The second “mov” instruction in this example writes the
Port A data register (RA), which controls the output levels
of the four Port A pins, RA0 through RA3. Because Port
A has only four I/O pins, only the four least significant bits
of this register are used. The four high-order register bits
are “don’t care” bits. Port B and Port C are both eight bits
wide, so the full widths of the RB and RC registers are
used.
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After a value is written to the MODE register, that setting
remains in effect until it is changed by writing to the
MODE register again. For example, you can write the
value 0Eh to the MODE register just once, and then write
to each of the three pullup configuration registers using
the three “mov !rx,W” instructions.
3.1.1 Read-Modify-Write Considerations
Caution must be exercised when performing two successive read-modify-write instructions (SETB or CLRB operations) on I/O port pin. Input data used for an instruction
must be valid during the time the instruction is executed,
and the output result from an instruction is valid only after
that instruction completes its operation. Unexpected
results from successive read-modify-write operations on
I/O pins can occur when the device is running at high
speeds. Although the device has an internal write-back
section to prevent such conditions, it is still recommended that the user program include a NOP instruction
as a buffer between successive read-modify-write
instructions performed on I/O pins of the same port.
Table 3-3. MODE Register and Port
Control Register Access
MODE Reg. mov !RA,W
mov !RB,W
mov !RC,W
08h
not used
CMP_B
not used
Also note that reading an I/O port is actually reading the
pins, not the output data latches. That is, if the pin output
driver is enabled and driven high while the pin is held low
externally, the port pin will read low.
09h
not used
WKPND_B
not used
0Ah
not used
WKED_B
not used
0Bh
not used
WKEN_B
not used
3.2
0Ch
not used
ST_B
ST_C
0Dh
LVL_A
LVL_B
LVL_C
0Eh
PLP_A
PLP_B
PLP_C
0Fh
RA Direction
RB Direction
RC Direction
Port Configuration
Each port pin offers the following configuration options:
• data direction
• input voltage levels (TTL or CMOS)
• pullup type (pullup resistor enable or disable)
• Schmitt trigger input (for Port B and Port C only)
Port B offers the additional option to use the port pins for
the Multi-Input Wakeup/Interrupt function and/or the analog comparator function.
The following code example shows how to program the
pullup control registers.
Port configuration is performed by writing to a set of control registers associated with the port. A special-purpose
instruction is used to write these control registers:
• mov !RA,W (move W to Port A control register)
• mov !RB,W (move W to Port B control register)
• mov !RC,W (move W to Port C control register)
Each one of these instructions writes a port control register for Port A, Port B, or Port C. There are multiple control
registers for each port. To specify which one you want to
access, you use another register called the MODE register.
M,#$0E
;MODE=0Eh to access port pullup
;registers
mov
mov
W,#$03
!RA,W
;W = 0000 0011
;disable pullups for A0 and A1
mov
mov
W,#$FF
!RB,W
;W = 1111 1111
;disable all pullups for B0-B7
mov
mov
W,#$00
!RC,W
;W = 0000 0000
;enable all pullups for C0-C7
First the MODE register is loaded with 0Eh to select
access to the pullup control registers (PLP_A, PLP_B,
and PLP_C). Then the MOV !rx,W instructions are used
to specify which port pins are to be connected to the
internal pullup resistors. Setting a bit to 1 disconnects the
corresponding pullup resistor, and clearing a bit to 0 connects the corresponding pullup resistor.
3.2.1 MODE Register
The MODE register controls access to the port configuration registers. Because the MODE register is not memory-mapped, it is accessed by the following specialpurpose instructions:
3.2.2 Port Configuration Registers
• mov M, #lit (move literal to MODE register)
• mov M,W (move W to MODE register)
• mov W,M (move MODE register to W)
The value contained in the MODE register determines
which port control register is accessed by the “mov !rx,W”
instruction as indicated in Table 3-3. MODE register values not listed in the table are reserved for future expansion and should not be used. Therefore, the MODE
register should always contain a value from 08h to 0Fh.
Upon reset, the MODE register is initialized to 0Fh, which
enables access to the port direction registers.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
mov
The port configuration registers that you control with the
MOV !rx,W instruction operate as described below.
RA, RB, and RC Data Direction Registers (MODE=0Fh)
Each register bit sets the data direction for one port pin.
Set the bit to 1 to make the pin operate as a high-impedance input. Clear the bit to 0 to make the pin operate as
an output.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
PLP_A, PLP_B, and PLP_C: Pullup Enable Registers
(MODE=0Eh)
WKPND_B: Wakeup Pending Bit Register
(MODE=09h)
Each register bit determines whether an internal pullup
resistor is connected to the pin. Set the bit to 1 to disconnect the pullup resistor or clear the bit to 0 to connect the
pullup resistor.
When you access the WKPND_B register using MOV
!RB,W, the CPU does an exchange between the contents
of W and WKPND_B. This feature lets you read the
WKPND_B register contents. Each bit indicates the status of the corresponding MIWU pin. A bit set to 1 indicates that a valid edge has occurred on the
corresponding MIWU pin, triggering a wakeup or interrupt. A bit set to 0 indicates that no valid edge has
occurred on the MIWU pin.
LVL_A, LVL_B, and LVL_C: Input Level Registers
(MODE=0Dh)
Each register bit determines the voltage levels sensed on
the input port, either TTL or CMOS, when the Schmitt
trigger option is disabled. Program each bit according to
the type of device that is driving the port input pin. Set the
bit to 1 for TTL or clear the bit to 0 for CMOS.
CMP_B: Comparator Register (MODE=08h)
Each register bit determines whether the port input pin
operates with a Schmitt trigger. Set the bit to 1 to disable
Schmitt trigger operation and sense either TTL or CMOS
voltage levels; or clear the bit to 0 to enable Schmitt trigger operation.
When you access the CMP_B register using MOV
!RB,W, the CPU does an exchange between the contents
of W and CMP_B. This feature lets you read the CMP_B
register contents. Clear bit 7 to enable operation of the
comparator. Clear bit 6 to place the comparator result on
the RB0 pin. Bit 0 is a result bit that is set to 1 when the
voltage on RB2 is greater than RB1, or cleared to 0 otherwise. (For more information using the comparator, see
Section 11.0.)
WKEN_B: Wakeup Enable Register (MODE=0Bh)
3.2.3 Port Configuration Upon Reset
Each register bit enables or disables the Multi-Input
Wakeup/Interrupt (MIWU) function for the corresponding
Port B input pin. Clear the bit to 0 to enable MIWU operation or set the bit to 1 to disable MIWU operation. For
more information on using the Multi-Input Wakeup/Interrupt function, see Section 7.0.
Upon reset, all the port control registers are initialized to
FFh. Thus, each pin is configured to operate as a highimpedance input that senses TTL voltage levels, with no
internal pullup resistor connected. The MODE register is
initialized to 0Fh, which allows immediate access to the
data direction registers using the “MOV !rx,W” instruction.
ST_B and ST_C: Schmitt Trigger Enable Registers
(MODE=0Ch)
WKED_B: Wakeup Edge Register (MODE=0Ah)
Each register bit selects the edge sensitivity of the Port B
input pin for MIWU operation. Clear the bit to 0 to sense
rising (low-to-high) edges. Set the bit to 1 to sense falling
(high-to-low) edges.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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4.0
SPECIAL-FUNCTION REGISTERS
The CPU uses a set of special-function registers to control the operation of the device.
the STATUS register with a result that is different than
intended.
The CPU registers include an 8-bit working register (W),
which serves as a pseudo accumulator. It holds the second operand of an instruction, receives the literal in
immediate type instructions, and also can be programselected as the destination register.
A set of 31 file registers serves as the primary accumulator. One of these registers holds the first operand of an
instruction and another can be program-selected as the
destination register. The first eight file registers include
the Real-Time Clock/Counter register (RTCC), the lower
eight bits of the 11-bit Program Counter (PC), the 8-bit
STATUS register, three port control registers for Port A,
Port B, Port C, the 8-bit File Select Register (FSR), and
INDF used for indirect addressing.
The five low-order bits of the FSR register select one of
the 31 file registers in the indirect addressing mode. Calling for the file register located at address 00h (INDF) in
any of the file-oriented instructions selects indirect
addressing, which uses the FSR register. It should be
noted that the file register at address 00h is not a physically implemented register. The CPU also contains an 8level, 11-bit hardware push/pop stack for subroutine linkage.
Table 4-1. Special-Function Registers
Addr
Name
Function
00h
INDF
Used for indirect addressing
01h
RTCC
Real Time Clock/Counter
02h
PC
Program Counter (low byte)
03h
STATUS
Holds Status bits of ALU
04h
FSR
File Select Register
05h
RA
Port RA Control register
06h
RB
Port RB Control register
07h
RC*
Port RC Control register
PC Register (02h)
The PC register holds the lower eight bits of the program
counter. It is accessible at run time to perform branch
operations.
4.2
STATUS Register (03h)
The STATUS register holds the arithmetic status of the
ALU, the page select bits, and the reset state. The
STATUS register is accessible during run time, except
that bits PD and TO are read-only. It is recommended
that only SETB and CLRB instructions be used on this
register. Care should be exercised when writing to the
STATUS register as the ALU status bits are updated
upon completion of the write operation, possibly leaving
© 2000 Scenix Semiconductor, Inc. All rights reserved.
Bit 7
PA1
PA0
TO
PD
Z
DC
C
Bit 0
Bit 7-5: Page select bits PA2:PA0
000 = Page 0 (000h – 01FFh)
001 = Page 1 (200h – 03FFh)
010 = Page 2 (400h – 05FFh)
011 = Page 3 (600h – 07FFh)
Bit 4: Time Out bit, TO
1 = Set to 1 after power up and upon execution of CLRWDT or SLEEP instructions
0 = A watchdog time-out occurred
Bit 3: Power Down bit, PD
1= Set to a 1 after power up and upon execution of the CLRWDT instruction
0 = Cleared to a ‘0’ upon execution of
SLEEP instruction
Bit 2: Zero bit, Z
1 = Result of math operation is zero
0 = Result of math operation is non-zero
Bit 1: Digit Carry bit, DC
After Addition:
1 = A carry from bit 3 occurred
0 = No carry from bit 3 occurred
After Subtraction:
1 = No borrow from bit 3 occurred
0 = A borrow from bit 3 occurred
Bit 0: Carry bit, C
After Addition:
1 = A carry from bit 7 of the result occurred
*In the SX18 package, Port C is not used, and address
07h is available as a general-purpose RAM location.
4.1
PA2
- 11 -
0 = No carry from bit 7 of the result occurred
After Subtraction:
1 = No borrow from bit 7 of the result occurred
0 = A borrow from bit 7 of the result occurred
Rotate (RR or RL) Instructions:
The carry bit is loaded with the low or high
order bit, respectively. When CF bit is
cleared, Carry bit works as input for ADD
and SUB instructions.
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4.3
OPTION Register
Table 4-2. Prescaler Divider Ratios
RTW
RTE
_IE
RTS
RTE
_ES
PSA
PS2
PS1
Bit 7
PS0
PS2, PS1, PS0
Bit 0
When the OPTIONX bit in the FUSE word is cleared, bits
7 and 6 of the OPTION register function as described
below.
When the OPTIONX bit is set, bits 7 and 6 of the
OPTION register read as ‘1’s.
RTW
RTE_IE
RTS
RTE_ES
PSA
PS2-PS0
RTCC/W register selection:
0 = Register 01h addresses W
1 = Register 01h addresses RTCC
RTCC edge interrupt enable:
0 = RTCC roll-over interrupt is enabled
1 = RTCC roll-over interrupt is disabled
RTCC increment select:
0 = RTCC increments on internal instruction
cycle
1 = RTCC increments upon transition on
RTCC pin
RTCC edge select:
0 = RTCC increments on low-to-high transitions
1 = RTCC increments on high-to-low transitions
Prescaler Assignment:
0 = Prescaler is assigned to RTCC, with divide rate determined by PS0-PS2 bits
1 = Prescaler is assigned to WDT, and divide
rate on RTCC is 1:1
Prescaler divider (see Table 4-2)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
RTCC
Divide Rate
Watchdog Timer
Divide Rate
000
1:2
1:1
001
1:4
1:2
010
1:8
1:4
011
1:16
1:8
100
1:32
1:16
101
1:64
1:32
110
1:128
1:64
111
1:256
1:128
Upon reset, all bits in the OPTION register are set to 1.
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5.0
DEVICE CONFIGURATION REGISTERS
The SX device has three registers (FUSE, FUSEX,
DEVICE) that control functions such as operating the
device in Turbo mode, extended (8-level deep) stack
operation, and speed selection for the internal RC oscillator. These registers are not programmable “on the fly”
5.1
during normal device operation. Instead, the FUSE and
FUSEX registers can only be accessed when the SX
device is being programmed. The DEVICE register is a
read-only, hard-wired register, programmed during the
manufacturing process.
FUSE Word (Read/Program at FFFh in main memory map)
TURBO
SYNC
Reserved
Reserved
IRC
DIV1/
IFBD
Bit 11
DIV0/
FOSC2
Reserved
CP
WDTE
FOSC1
FOSC0
Bit 0
TURBO
Turbo mode enable:
0=
turbo (instruction clock = osc/1)
1=
instr clock = osc/4
SYNC
Synchronous input enable (for turbo mode): This bit synchronizes the signal presented at the input pin
to the internal clock through two internal flip-flops.
0=
enabled
1=
disabled
IRC
Internal RC oscillator enable:
0=
enabled - OSC1 pulled low by weak pullup, OSC2 pulled high by weak pullup
1=
disabled - OSC1 and OSC2 behave according to FOSC2: FOSC0
DIV1: DIV0
Internal RC oscillator divider:
00b
=
4 MHz
01b
=
1 MHz
10
=
128 KHz
11b
=
32 KHz
IFBD
Internal crystal/resonator oscillator feedback resistor:
0=
disabled
Internal feedback resistor disable (external feedback required)
1=
enabled
Internal feedback resistor enabled (valid when IRC = 1)
CP
Code protect enable:
0=
enabled (FUSE, code, and ID memories read back as garbled data)
1=
disabled (FUSE, code, and ID memories can be read normally)
WDTE
Watchdog timer enable:
0=
disabled
1=
enabled
FOSC2: FOSC0 External oscillator configuration (valid when IRC = 1):
000b = LP1 – low power crystal (32KHz)
001b = LP2 – low power crystal/resonator (32 KHz to 1 MHz)
010b = XT1 – normal crystal/resonator (32 KHz to 10 MHz)
011b = XT2 – normal crystal/resonator (1MHz to 24 MHz)
100b = HS1 – high speed crystal/resonator (1MHz to 50 MHz)
101b = HS2 – high speed crystal/resonator (1 MHz to 50 MHz)
110b = HS3 – high speed crystal/resonator (1 MHz to 50 MHz)
111b = RC network - OSC2 is pulled high with a weak pullup (no CLKOUT output)
Note:
The frequencies are target values.
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5.2
FUSEX Word (Read/Program via Programming Command)
IRCTRIM2
PINS
IRCTRIM1
OPTIONX/
STACKX
IRCTRIM0
CF
BOR1
BOR0
BORTRIM1
BORTRIM0
Bit 11
IRCTRIM2:
IRCTRIM0
BP1
BP0
Bit 0
Internal RC oscillator trim bits. This 3-bit field adjusts the operation of the internal RC oscillator to make
it operate within the target frequency range 4 MHz plus or minus 8%. Parts are shipped from the factory
untrimmed. The device relies on the programming toll to provide the trimming function.
000b = minimum frequency
111b = maximum frequency
each step about 3%
Selects the number of pins.
PINS
0 = 18/20 pins
0 = 28 pins
OPTION Register Extension and Stack Extension. Set to 1 to disable the programmability of bit 6 and
OPTIONX/
bit 7 in the OPTION register, the RTW and RTE_IE bits (in other words, to force these two bits to 1) and
STACKX
to limit the program stack size to two locations. Clear to 0 to enable programming of the RTW and
RTE_IE bits in the OPTION register, and to extend the stack size to eight locations.
CF
active low – makes carry bit input to ADD and SUB instructions.
BOR1: BOR0 Brown-Out Reset;These bits enable or disable the brown-out reset function and set the brown-out
threshold voltage as follows:
00b = 4.2V
01b = 2.6V
10b = 2.2V
BORTRIM1:
BORTRIM2
BP1:BP0
5.3
11b = Brown-Out disabled
Brown-Out trim bits (parts are shipped out of factory untrimmed).
Configure Memory Size:
00b =
1 page, 1 bank
01b =
1 page, 2 banks
10b =
4 pages, 4 banks
11b =
4 pages, 8 banks
(default configuration)
DEVICE Word (Hard-Wired Read-Only)
1
1
1
1
1
1
0
Bit 11
© 2000 Scenix Semiconductor, Inc. All rights reserved.
0
1
1
1
0
Bit 0
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6.0
MEMORY ORGANIZATION
6.1
Program Memory
6.2
Data Memory
The program memory is organized as 2K, 12-bit wide
words. The program memory words are addressed
sequentially by a binary program counter. The program
counter starts at zero. If there is no branch operation, it
will increment to the maximum value possible for the
device and roll over and begin again.
The data memory consists of 136 bytes of RAM, organized as eight banks of 16 registers plus eight registers
which are not banked. Both banked and non-banked
memory locations can be addressed directly or indirectly
using the FSR (File Select Register). The special-function registers are mapped into the data memory.
Internally, the program memory has a semi-transparent
page structure. A page is composed of 512 contiguous
program memory words. The lower nine bits of the program counter are zeros at the first address of a page and
ones at the last address of a page. This page structure
has no effect on the program counter. The program
counter will freely increment through the page boundaries.
6.2.1 File Select Register (04h)
6.1.1 Program Counter
The program counter contains the 11-bit address of the
instruction to be executed. The lower eight bits of the program counter are contained in the PC register (02h) while
the upper bits come from the upper three bits of the STATUS register (PA0, PA1, PA2). This is necessary to cause
jumps and subroutine calls across program memory
page boundaries. Prior to the execution of a branch operation, the user program must initialize the upper bits of
the STATUS register to cause a branch to the desired
page. An alternative method is to use the PAGE instruction, which automatically causes branch to the desired
page, based on the value specified in the operand field.
Upon reset, the program counter is initialized with 07FFh.
6.1.2 Subroutine Stack
The subroutine stack consists of eight 11-bit save registers. A physical transfer of register contents from the program counter to the stack or vice versa, and within the
stack, occurs on all operations affecting the stack, primarily calls and returns. The stack is physically and logically
separate from data RAM. The program cannot read or
write the stack.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
Instructions that specify a register as the operand can
only express five bits of register address. This means
that only registers 00h to 1Fh can be accessed. The File
Select Register (FSR) provides the ability to access registers beyond 1Fh.
Figure 6-1 shows how FSR can be used to address RAM
locations. The three high-order bits of FSR select one of
eight SRAM banks to be accessed. The five low-order
bits select one of 32 SRAM locations within the selected
bank. For the lower 16 addresses, Bank 0 is always
accessed, irrespective of the three high-order bits. Thus,
RAM register addresses 00h through 0Fh are “global” in
that they can always be accessed, regardless of the contents of the FSR.
The entire data memory (including the dedicated-function
registers) consists of the lower 16 bytes of Bank 0 and
the upper 16 bytes of Bank 0 through Bank 7, for a total
of (1+8)*16 = 144 bytes. Eight of these bytes are for the
function registers, leaving 136 general-purpose memory
locations. In the 18-pin SX packages, register RC is not
used, which makes address 07h available as an additional general-purpose memory location.
Below is an example of how to write to register 10h in
Bank 4:
- 15 -
mov
FSR,#$90
mov
$10,#$64
;Select Bank 4 by
;setting FSR<7:5>
;load register 10h with
;the literal 64h
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
Function Registers
Bank 0
Bank 0 is always accessed for
the lower 16 addresses,
irrespective of the three highorder bits of FSR.
00
INDF
Registers
(8 bytes)
RTCC
PC
07
STATUS
SRAM
(8 bytes)
FSR
RA
0F
RB
7
RC
6
1
0
FSR
B0
Bank 5
90
Bank 4
70
Bank 3
Bank 1
2
D0
Bank 6
50
Bank 2
3
F0
Bank 7
10
5 4
FF
30
DF
Bank 0
BF
9F
SRAM
(16 bytes
each bank
128 bytes
total)
7F
5F
3F
111
110
101
100
011
010
001
000
1F
Figure 6-1. Data Memory Organization
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
7.0
POWER DOWN MODE
The power down mode is entered by executing the
SLEEP instruction.
feature. The WKEN_B register (Wakeup Enable Register) allows any Port B pin or combination of pins to cause
the wakeup. Clearing a bit in the WKEN_B register
enables the wakeup on the corresponding Port B pin. If
multi-input wakeup is selected to cause a wakeup, the
trigger condition on the selected pin can be either rising
edge (low to high) or falling edge (high to low). The
WKED_B register (Wakeup Edge Select) selects the
desired transition edge. Setting a bit in the WKED_B register selects the falling edge on the corresponding Port B.
Clearing the bit selects the rising edge. The WKEN_B
and WKED_B registers are set to FFh upon reset.
In power down mode, only the Watchdog Timer (WDT) is
active. If the Watchdog Timer is enabled, upon execution
of the SLEEP instruction, the Watchdog Timer is cleared,
the TO (time out) bit is set in the STATUS register, and
the PD (power down) bit is cleared in the STATUS register.
There are three different ways to exit from the power
down mode: a timer overflow signal from the Watchdog
Timer (WDT), a valid transition on any of the Multi-Input
Wakeup pins (Port B pins), or through an external reset
input on the MCLR pin.
Once a valid transition occurs on the selected pin, the
WKPND_B register (Wakeup Pending Register) latches
the transition in the corresponding bit position. A logic ‘1’
indicates the occurrence of the selected trigger edge on
the corresponding Port B pin.
To achieve the lowest possible power consumption, the
Watchdog Timer should be disabled and the device
should exit the power down mode through the Multi-Input
Wakeup (MIWU) pins or an external reset.
7.1
Upon exiting the power down mode, the Multi-Input
Wakeup logic causes program counter to branch to the
maximum program memory address (same as reset).
Multi-Input Wakeup
Multi-Input Wakeup is one way of causing the device to
exit the power down mode. Port B is used to support this
RB7
Figure 7-1 shows the Multi-Input Wakeup block diagram.
RB6
RB1
RB0
Port B
Configured
as Input
8
W
MODE = 0B
Internal Data Bus
MODE
8
MODE = 0A
WKED_B
0 1
WKPND_B
MODE = 09
Wake-up : Exit Power Down
WKEN_B
0 = Enable
1 = Disable
8
Figure 7-1. Multi-Input Wakeup Block Diagram
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
7.2
Port B MIWU/Interrupt Configuration
The WKPND_B register comes up with a random value
upon reset. The user program must clear the register
prior to enabling the wake-up condition or interrupts. The
proper initialization sequence is:
Here is an example of a program segment that configures the RB0, RB1, and RB2 pins to operate as MultiInput Wakeup/Interrupt pins, sensitive to falling edges:
mov M,#$0F
1. Select the desired edge (through WKED_B register).
2. Clear the WKPND_B register.
3. Enable the Wakeup condition (through WKEN_B register).
Below is an example of how to read the WKPND_B register to determine which Port B pin caused the wakeup or
interrupt, and to clear the WKPND_B register:
mov
clr
mov
M,#$09
W
!RB,W
mov W,#$07
mov !RB,W
mov M,#$0A
mov !RB,W
mov M,#$09
mov W,#$00
mov !RB,W
;W contains WKPND_B
;contents of W exchanged
;with contents of WKPND_B
;prepare to write port data
;direction registers
;load W with the value 07h
;configure RB0-RB2 to be inputs
;prepare to write WKED_B
;(edge) register
;W contains the value 07h
;configure RB0-RB2 to sense
;falling edges
;prepare to access WKPND_B
;(pending) register
;clear W
;clear all wakeup pending bits
mov M,#$0B
The final “mov” instruction in this example performs an
exchange of data between the working register (W) and
the WKPND_B register. This exchange occurs only with
Port B accesses. Otherwise, the “mov” instruction does
not perform an exchange, but only moves data from the
source to the destination.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
;prepare to write WKEN_B (enable)
;register
mov W,#$F8h ;load W with the value F8h
mov !RB,W
;enable RB0-RB2 to operate as
;wakeup inputs
To prevent false interrupts, the enabling step (clearing
bits in WKEN_B) should be done as the last step in a
sequence of Port B configuration steps. After this program segment is executed, the device can receive interrupts on the RB0, RB1, and RB2 pins. If the device is put
into the power down mode (by executing the SLEEP
instruction), the device can then receive wakeup signals
on those same pins.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
8.0
INTERRUPT SUPPORT
The device supports both internal and external maskable
interrupts. The internal interrupt is generated as a result
of the RTCC rolling over from 0FFh to 00h. This interrupt
source has an associated enable bit located in the
OPTION register. There is no pending bit associated with
this interrupt.
Port B provides the source for eight external software
selectable, edge sensitive interrupts. These interrupt
sources share logic with the Multi-Input Wakeup circuitry.
The WKEN_B register allows interrupt from Port B to be
individually enabled or disabled. Clearing a bit in the
WKEN_B register enables the interrupt on the corresponding Port B pin. The WKED_B selects the transition
edge to be either positive or negative. The WKEN_B and
WKED_B registers are set to FFh upon reset. Setting a
bit in the WKED_B register selects the falling edge while
clearing the bit selects the rising edge on the corresponding Port B pin.
The WKPND_B register serves as the external interrupt
pending register.
The WKPND_B register comes up a with random value
upon reset. The user program must clear the WKPND_B
register prior to enabling the interrupt. The proper
sequence is described in Section 7.2 .
Figure 8-1 shows the structure of the interrupt logic.
Port B PIN
WKED_B
WKED_B
RTCC
Overflow
In te rn a l D a ta B u s
From MODE
(MODE = 0A)
WKPND_B
WKPND_B
STATUS
Register
PD bit
From MODE
(MODE = 09)
Interrupt
1 = Ext. Interrupt through Port B
0 = Power Down Mode, no Ext. Interrupt
PC
000
Interrupt Stack
PC
RTE_IE
OPTION
WKEN_B
Figure 8-1. Interrupt Structure
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All interrupts are global in nature; that is, no interrupt has
priority over another. Interrupts are handled sequentially.
Figure 8-2 shows the interrupt processing sequence.
Once an interrupt is acknowledged, all subsequent global
interrupts are disabled until return from servicing the current interrupt. The PC is pushed onto the single level
interrupt stack, and the contents of the FSR, STATUS,
and W registers are saved in their corresponding shadow
registers. The status bits PA0, PA1, and PA2 bits are
cleared after the STATUS register has been saved in its
shadow register. The interrupt logic has its own singlelevel stack and is not part of the CALL subroutine stack.
The vector for the interrupt service routine is address 0.
Once in the interrupt service routine, the user program
must check all external interrupt pending bits (contained
in the WKPND_B register) to determine the source of the
interrupt. The interrupt service routine should clear the
corresponding interrupt pending bit. If both internal and
external interrupts are enabled, the user program may
also need to read the contents of RTCC to determine any
recent RTCC rollover. This is needed since there is no
interrupt pending bit associated with the RTCC rollover.
Normally it is a requirement for the user program to process every interrupt without missing any. To ensure this,
the longest path through the interrupt routine must take
less time than the shortest possible delay between interrupts.
If an external interrupt occurs during the interrupt routine,
the pending register will be updated but the trigger will be
ignored unless interrupts are disabled at the beginning of
the interrupt routine and enabled again at the end. This
also requires that the new interrupt does not occur before
interrupts are disabled in the interrupt routine. If there is a
possibility of additional interrupts occurring before they
can be disabled, the device will miss those interrupt triggers. In other words, using more than one interrupt, such
as multiple external interrupts or both RTCC and external
interrupts, can result in missed or, at best, jittery interrupt
handling should one occur during the processing of
another. When handling external interrupts, the interrupt
routine should clear at least one pending register bit. The
bit that is cleared should represent the interrupt being
handled in order for the next interrupt to trigger.
Upon return from the interrupt service routine, the contents of PC, FSR, STATUS, and W registers are restored
from their corresponding shadow registers. The interrupt
service routine should end with instructions such as RETI
and RETIW. RETI pops the interrupt stack and the special shadow registers used for storing W, STATUS, and
FSR (preserved during interrupt handling). RETIW
behaves like RETI but also adds W to RTCC. The interrupt return instruction enables the global interrupts.
Program
Memory
Address 000h
Interrupt
Service
Routine
PC
RETI
Interrupt
Stack
Interrupt
Stack
000h
PC
PC
W
Register
W
Shadow Register
W
Register
W
Shadow Register
STATUS
Register
STATUS
Shadow Register
STATUS
Register
STATUS
Shadow Register
FSR
Register
FSR
Shadow Register
FSR
Register
FSR
Shadow Register
Note: The interrupt logic has its own single-level
stack and is not part of the CALL subroutine stack.
Figure 8-2. Interrupt Processing
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
9.0
OSCILLATOR CIRCUITS
SX Device
The device supports several user-selectable oscillator
modes. The oscillator modes are selected by programming the appropriate values into the FUSE Word register.
These are the different oscillator modes offered:
LP:
XT:
HS:
RC:
9.1
Internal
Circuitry
SLEEP
Low Power Crystal
Crystal/Resonator
High Speed Crystal/Resonator
External Resistor/Capacitor
Internal Resistor/Capacitor
OSC1
OSC2
RF
XT, LP or HS modes
RS
XTAL
In XT, LP or HS, modes, you can use either an external
resonator network or an external clock signal as the
device clock.
C2
C1
To use an external resonator network, you connect a
crystal or ceramic resonator to the OSC1/CLKIN and
OSC2/CLKOUT pins according to the circuit configuration shown in Figure 9-1. A parallel resonant crystal type
is recommended. Use of a series resonant crystal may
result in a frequency that is outside the crystal manufacturer specifications. Table 9-1 shows the recommended
external components associated with a crystal-based
oscillator. Table 9-2 shows the recommended external
component values for a resonator-based oscillator.
Figure 9-1. Crystal Operation (or Ceramic Resonator)
(HS, XT or LP OSC Configuration)
SX Device
Bits 0, 1 and 5 of the FUSE register (FOSC1:FOSC2) are
used to configure the different external resonator/crystal
oscillator modes. These bits allow the selection of the
appropriate gain setting for the internal driver to match
the desired operating frequency. If the XT, LP, or HS
mode is selected, the OSC1/CLKIN pin can be driven by
an external clock source rather than a resonator network,
as long as the clock signal meets the specified duty
cycle, rise and fall times, and input levels (Figure 9-2). In
this case, the OSC2/CLKOUT pin should be left open.
OSC2
OSC1
Open
Externally
Generated Clock
Figure 9-2. External Clock Input Operation
(HS, XT or LP OSC Configuration)
Table 9-1. External Component Selection for Crystal Oscillator(Vdd=5.0V)
FOSC2:FOSC0
Crystal
Frequency
C1
C2
RF
RS
010
4 MHz
15 pF
22 pF
1 MΩ
0Ω
011
8 MHz
56 pF
33 pF
1 MΩ
0Ω
011
20 MHz
33 pF
22 pF
1 MΩ
0Ω
011
32 MHz
15 pF
22 pF
1 MΩ
0Ω
100
50* MHz
15 pF
15 pF
1 MΩ
0Ω
* 50 MHz fundamental crystal
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
Table 9-2. External Component Selection for Murata Ceramic Resonators (Vdd=5.0V)
FOSC2:FOSC0
Resonator
Frequency
Resonator Part Number
C1
C2
RF
RS
011
4 MHz
CSA4.00MG
30 pF
30 pF
1MΩ
0Ω
011
4 MHz
CST4.00MGW
Internal
(30 pF)
Internal
(30 pF)
1 MΩ
0Ω
011
4 MHz
CSTCC4.00G0H6
Internal
(47 pF)
Internal
(47 pF)
1 MΩ
0Ω
011
8 MHz
CSA8.00MTZ
30 pF
30 pF
1 MΩ
0Ω
011
8 MHz
CST8.00MTW
Internal
(30 pF)
Internal
30 pF)
1 MΩ
0Ω
011
8 MHz
CSTCC8.00MG0H6
Internal
(47 pF)
Internal
47pF)
1 MΩ
0Ω
011
20 MHz
CSA20.00MXZ040
5 pF
5 pF
1 MΩ
0Ω
011
20 MHz
CST20.00MXW0H1
Internal
(5 pF)
Internal
(5 pF)
1 MΩ
0Ω
011
20 MHz
CSACV20.00MXJ040
5 pF
5 pF
22 kΩ
0Ω
011
20 MHz
CSTCV20.00MXJ0H1
Internal
(5 pF)
Internal
(5 pF)
22 kΩ
0Ω
100
33 MHz
CSA33.00MXJ040
5 pF
5 pF
1 MΩ
0Ω
100
33 MHz
CST33.00MXW040
Internal
(5 pF)
Internal
(5 pF)
1 MΩ
0Ω
100
33 MHz
CSACV33.00MXJ040
5 pF
5 pF
1 MΩ
0Ω
100
33 MHz
CSTCV33.00MXJ040
Internal
(5 pF)
Internal
(5 pF)
1 MΩ
0Ω
101
50 MHz
CSA50.00MXZ040
15 pF
15 pF
10 kΩ
0Ω
101
50 MHz
CST50.00MXW0H3
Internal
(15 pF)
Internal
(15 pF)
10 kΩ
0Ω
101
50 MHz
CSACV50.00MXJ040
15 pF
15 pF
10 kΩ
0Ω
101
50 MHz
CSTCV50.00MXJ0H3
Internal
(15 pF)
Internal
(15 pF)
10 kΩ
0Ω
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
9.2
External RC Mode
9.3
The external RC oscillator mode provides a cost-effective
approach for applications that do not require a precise
operating frequency. In this mode, the RC oscillator frequency is a function of the supply voltage, the resistor (R)
and capacitor (C) values, and the operating temperature.
In addition, the oscillator frequency will vary from unit to
unit due to normal manufacturing process variations. Furthermore, the difference in lead frame capacitance
between package types also affects the oscillation frequency, especially for low C values. The external R and
C component tolerances contribute to oscillator frequency variation as well.
Figure 9-3 shows the external RC connection diagram.
The recommended R value is from 3kΩ to 100kΩ. For R
values below 2.2kΩ, the oscillator may become unstable,
or may stop completely. For very high R values (such as
1 MΩ), the oscillator becomes sensitive to noise, humidity, and leakage.
Although the oscillator will operate with no external
capacitor (C = 0pF), it is recommended that you use values above 20 pF for noise immunity and stability. With no
or small external capacitance, the oscillation frequency
can vary significantly due to variation in PCB trace or
package lead frame capacitances.
Internal RC Mode
The internal RC mode uses an internal oscillator, so the
device does not need any external components. At 4
MHz, the internal oscillator provides typically +/–8%
accuracy over the allowed temperature range. The internal clock frequency can be divided down to provide one
of eight lower-frequency choices by selecting the desired
value in the FUSE Word register. The frequency range is
from 31.25 KHz to 4 MHz. The default operating frequency of the internal RC oscillator may not be 4 MHz.
This is due to the fact that the SX device requires trimming to obtain 4 MHz operation. The parts shipped out of
the factory are not trimmed. The device relies on the programming tool provided by the third party vendors to support trimming.
10.0 REAL TIME CLOCK
(RTCC)/WATCHDOG TIMER
The device contains an 8-bit Real Time Clock/Counter
(RTCC) and an 8-bit Watchdog Timer (WDT). An 8-bit
programmable prescaler extends the RTCC to 16 bits. If
the prescaler is not used for the RTCC, it can serve as a
postscaler for the Watchdog Timer. Figure 10-1 shows
the RTCC and WDT block diagram.
10.1
RTCC
RTCC is an 8-bit real-time timer that is incremented once
each instruction cycle or from a transition on the RTCC
pin. The on-board prescaler can be used to extend the
RTCC counter to 16 bits.
SX Device
~
Internal
Circuitry
To select the internal clock source, bit 5 of the OPTION
register should be cleared. In this mode, RTCC is incremented at each instruction cycle unless the prescaler is
selected to increment the counter.
N
OSC1
Vdd
The RTCC counter can be clocked by the internal instruction cycle clock or by an external clock source presented
at the RTCC pin.
OSC2
R
C
Figure 9-3. RC Oscillator Mode
© 2000 Scenix Semiconductor, Inc. All rights reserved.
To select the external clock source, bit 5 of the OPTION
register must be set. In this mode, the RTCC counter is
incremented with each valid signal transition at the RTTC
pin. By using bit 4 of the OPTION register, the transition
can be programmed to be either a falling edge or rising
edge. Setting the control bit selects the falling edge to
increment the counter. Clearing the bit selects the rising
edge.
The RTCC generates an interrupt as a result of an RTCC
rollover from 0FF to 000. There is no interrupt pending bit
to indicate the overflow occurrence. The RTCC register
must be sampled by the program to determine any overflow occurrence.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
10.2 Watchdog Timer
The watchdog logic consists of a Watchdog Timer which
shares the same 8-bit programmable prescaler with the
RTCC. The prescaler actually serves as a postscaler if
used in conjunction with the WDT, in contrast to its use as
a prescaler with the RTCC.
WDTE (from FUSE Word)
WDT
M
U
X
10.3 The Prescaler
The 8-bit prescaler may be assigned to either the RTCC
or the WDT through the PSA bit (bit 3 of the OPTION register). Setting the PSA bit assigns the prescaler to the
WDT. If assigned to the WDT, the WDT clocks the prescaler and the prescaler divide rate is selected by the
PS0, PS1, and PS2 bits located in the OPTION register.
Clearing the PSA bit assigns the prescaler to the RTCC.
Once assigned to the RTCC, the prescaler clocks the
RTCC and the divide rate is selected by the PS0, PS1,
and PS2 bits in the OPTION register. The prescaler is not
mapped into the data memory, so run-time access is not
possible.
The prescaler cannot be assigned to both the RTCC and
WDT simultaneously.
RTCC
Interrupt
Enable
FOSC
RTCC pin
MUX
8-Bit Prescaler
RTW
RTE_IE
RST
RTE_ES
PSA
PS2
PS1
PS0
OPTION
Register
MUX (8 to 1)
M
U
X
RTCC Rollover
Interrupt
RTCC
MUX
8-Bits
WDT Time-out
Data Bus
Figure 10-1. RTCC and WDT Block Diagram
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
11.0 COMPARATOR
The device contains an on-chip differential comparator.
Ports RB0-RB2 support the comparator. Ports RB1 and
RB2 are the comparator negative and positive inputs,
respectively, while Port RB0 serves as the comparator
output pin. To use these pins in conjunction with the comparator, the user program must configure Ports RB1 and
RB2 as inputs and Port RB0 as an output. The CMP_B
register is used to enable the comparator, to read the output of the comparator internally, and to enable the output
of the comparator to the comparator output pin.
The comparator enable bits are set to “1” upon reset,
thus disabling the comparator. To avoid drawing additional current during the power down mode, the comparator should be disabled before entering the power down
mode. Here is an example of how to setup the comparator and read the CMP_B register.
mov M,#$08
;set MODE register to access
;CMP_B
mov W,#$00
;clear W
mov !RB,W
;enable comparator and its
;output
...
;delay after enabling
;comparator for response
mov M,#$08
;set MODE register to access
;CMP_B
mov W,#$00
;clear W
mov !RB,W
;enable comparator and its
;output and also read CMP_B
;(exchange W and CMB_B)
and W,#$01
;set/clear Z bit based on
;comparator result
snb $03.2
;test Z bit in STATUS reg
;(0 => RB2<RB1)
jmp rb2_hi
;jump only if RB2>RB1
The final “mov” instruction in this example performs an
exchange of data between the working register (W) and
the CMP_B register. This exchange occurs only with Port
B accesses. Otherwise, the “mov” instruction does not
perform an exchange, but only moves data from the
source to the destination.
Figure 11-1 shows the comparator block diagram.
CMP_B - Comparator Enable/Status Register
CMP_EN
CMP_OE
Reserved
CMP_RES
Bit 7
Bit 6
Bits 5–1
Bit 0
CMP_RES
CMP_OE
CMP_EN
Comparator result: 1 for RB2>RB1 or 0
for RB2<RB1. Comparator must be enabled (CMP_EN = 0) to read the result.
The result can be read whether or not the
CMP_OE bit is cleared.
When cleared to 0, enables the comparator output to the RB0 pin.
When cleared to 0, enables the comparator.
...
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
Internal Data Bus
CMP_B
CMP_EN
7
CMP_OE
6
W
RB0
RB1
RB2
R
E
S
E
R
V
E
D
+
CMP_RES
MODE
MODE = 08h
0
Point to CMP_B
Figure 11-1. Comparator Block Diagram
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
12.0 RESET
Power-On-Reset, Brown-Out reset, watchdog reset, or
external reset initializes the device. Each one of these
reset conditions causes the program counter to branch to
the top of the program memory. For example, on the
device with 2048K words of program memory, the program counter is initialized to 07FF.
The device incorporates an on-chip Power-On Reset
(POR) circuit that generates an internal reset as V dd rises
during power-up. Figure 12-1 is a block diagram of the
circuit. The circuit contains an 10-bit Delay Reset Timer
(DRT) and a reset latch. The DRT controls the reset timeout delay. The reset latch controls the internal reset signal. Upon power-up, the reset latch is set (device held in
reset), and the DRT starts counting once it detects a valid
logic high signal at the MCLR pin. Once DRT reaches the
end of the timeout period (typically 72 msec), the reset
latch is cleared, releasing the device from reset state.
Figure 12-2 shows a power-up sequence where MCLR is
not tied to the Vdd pin and Vdd signal is allowed to rise
and stabilize before MCLR pin is brought high. The
device will actually come out of reset Tdrt msec after
MCLR goes high.
The brown-out circuitry resets the chip when device
power (Vdd) dips below its minimum allowed value, but
not to zero, and then recovers to the normal value.
.
Vdd
MCLR
POR
Tdrt
drt_time_out
MIWU
POR
Vdd
RESET
POR
Figure 12-2. Time-Out Sequence on Power-Up
(MCLR not tied to Vdd)
BROWN-OUT
MCLR/Vpp pin
wdt_time_out
enable
rc_clk
10-Bit Asynch
S
Ripple
Counter
(DRT Start-Up
R
Timer)
drt_time
_out
Q
RESET
QN
Note:Ripple counter is 10 bits for Power on Reset (POR)
only.
Figure 12-1. Block Diagram of On-Chip Reset Circuit
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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Figure 12-3 shows the on-chip Power-On Reset
sequence where the MCLR and Vdd pins are tied
together. The Vdd signal is stable before the DRT timeout period expires. In this case, the device will receive a
proper reset. However, Figure 12-4 depicts a situation
where Vdd rises too slowly. In this scenario, the DRT will
time-out prior to Vdd reaching a valid operating voltage
level (Vdd min). This means the device will come out of
reset and start operating with the supply voltage not at a
valid level. In this situation, it is recommended that you
use the external RC circuit shown in Figure 12-5. The RC
delay should exceed the time period it takes Vdd to reach
a valid operating voltage
Vdd
D
R
R1
MCLR
C
Figure 12-5. External Power-On Reset Circuit
(For Slow Vdd Power-up)
Note 1: The external Power-On Reset circuit is required
only if Vdd power-up is too slow. The diode D helps discharge the capacitor quickly when Vdd powers down.
Vdd
Note 2: R < 40 kΩ is recommended to make sure that
voltage drop across R does not violate the device electrical specifications.
MCLR
POR
Note 3: R1 = 100Ω to 1kΩ will limit any current flowing
into MCLR from external capacitor C. This helps prevent
MCLR pin breakdown due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS).
Tdrt
drt_time_out
RESET
Figure 12-3. Time-out Sequence on Power-up
(MCLR tied to Vdd): Fast Vdd Rise Time
V1
Vdd
MCLR
13.0
BROWN-OUT DETECTOR
The on-chip brown-out detection circuitry resets the
device when Vdd dips below the specified brown-out voltage. The device is held in reset as long as Vdd stays
below the brown-out voltage. The device will come out of
reset when Vdd rises above the brown-out voltage. The
brown-out level is preset to approximately 4.2V at the
factory. The brown-out circuit can be disabled through
BOR0 and BOR1 bits contained in the FUSEX Word register.
POR
Tdrt
drt_time_out
RESET
Figure 12-4. Time-out Sequence on Power-up
(MCLR tied to Vdd): Slow Rise Time
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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14.0 REGISTER STATES UPON
DIFFERENT RESET OPERATIONS
The effect of different reset operation on a register
depends on the register and the type of reset operation.
Some registers are initialized to specific values, some
are left unchanged, some are undefined, and some are
initialized to an unknown value.
A register that starts with an unknown value should be
initialized by the software to a known value; you cannot
simply test the initial state and rely on it starting in that
state consistently.
Table 14-1 lists the SX registers and shows the state of
each register upon different reset.
Table 14-1. Register States Upon Different Resets
Register
Power-On
Wakeup
Brown-out
Watchdog
Timeout
MCLR
W
Undefined
Unchanged
Undefined
Unchanged
Unchanged
OPTION
FFh
FFh
FFh
FFh
FFh
MODE
0Fh
0Fh
0Fh
0Fh
0Fh
RTCC (01h)
Undefined
Unchanged
Undefined
Unchanged
Unchanged
PC (02h)
FFh
FFh
FFh
FFh
FFh
STATUS (03h)
Bits 0-2: Undefined
Bits 0-2: Unchanged.
Bits 0-4: Undefined
Bits 0-2: Unchanged
Bits 0-2: Unchanged
Bits 3-4: 11
Bits 3-4: Unch.
Bits 5-7: 000
Bits 3-4: (Note 1) Bits 3-4: (Note 2)
Bits 5-7: 000
Bits 5-7: 000
Undefined
Bits 0-6: Unchanged
Bits 5-7: 000
Bits 5-7: 000
Bits 0-6: Undefined
Bits 0-6: Unchanged
Bits 0-6: Unchanged
Bit 7: 1
Bit 7: 1
Bit 7: 1
Bit 7: 1
FFh
FFh
FFh
FFh
FFh
RA/RB/RC Data
Undefined
Unchanged
Undefined
Unchanged
Unchanged
Other File Registers SRAM
Undefined
Unchanged
Undefined
Unchanged
Unchanged
CMP_B
Bits 0, 6-7: 1
Bits 0, 6-7: 1
Bits 0, 6-7: 1
Bits 0, 6-7: 1
Bits 0, 6-7: 1
Bits 1-5: Undefined
Bits 1-5: Undefined
Bits 1-5: Undefined
Bits 1-5: Undefined
Bits 1-5: Undefined
WKPND_B
Undefined
Unchanged
Undefined
Unchanged
Unchanged
WKED_B
FFh
FFh
FFh
FFh
FFh
WKEN_B
FFh
FFh
FFh
FFh
FFh
ST_B/ST_C
FFh
FFh
FFh
FFh
FFh
LVL_A/LVL_B/LVL_C
FFh
FFh
FFh
FFh
FFh
PLP_A/PLP_B/PLP_C
FFh
FFh
FFh
FFh
FFh
Watchdog Counter
Undefined
Unchanged
Undefined
Unchanged
Unchanged
FSR (04h)
RA/RB/RC
Direction
NOTE:
1. Watchdog reset during power down mode: 00 (TO, PD)
Watchdog reset during Active mode: 01 (TO, PD)
NOTE:
2. External reset during power down mode: 10 (TO, PD)
External reset during Active mode: Unchanged (TO, PD)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
15.0 INSTRUCTION SET
As mentioned earlier, the SX family of devices uses a
modified Harvard architecture with memory-mapped
input/output. The device also has a RISC type architecture in that there are 43 single-word basic instructions.
The instruction set contains byte-oriented file register, bitoriented file register, and literal/control instructions.
Working register W is one of the CPU registers, which
serves as a pseudo accumulator. It is a pseudo accumulator in a sense that it holds the second operand,
receives the literal in the immediate type instructions, and
also can be program-selected as the destination register.
The bank of 31 file registers can also serve as the primary accumulators, but they represent the first operand
and may be program-selected as the destination registers.
fetched. Once the pipeline is full, instructions are executed at the rate of one per clock cycle.
Instructions that directly affect the contents of the program counter (such as jumps and calls) require that the
pipeline be cleared and subsequently refilled. Therefore,
these instruction take more than one clock cycle.
The instruction execution time is derived by dividing the
oscillator frequency by either one (turbo mode) or four
(non-turbo mode). The divide-by factor is selected
through the FUSE Word register.
Fetch
Decode
Execute
Write
15.1 Instruction Set Features
1. All single-word (12-bit) instructions for compact code
efficiency.
2. All instructions are single cycle except the jump type instructions (JMP, CALL) and failed test instructions
(DECSZ fr, INCSZ fr, SB bit, SNB bit), which are twocycle.
3. A set of File registers can be addressed directly or indirectly, and serve as accumulators to provide first operand; W register provides the second operand.
4. Many instructions include a destination bit which selects either the register file or the accumulator as the
destination for the result.
5. Bit manipulation instructions (Set, Clear, Test and Skip
if Set, Test and Skip if Clear).
6. STATUS Word register memory-mapped as a register
file, allowing testing of status bits (carry, digit carry, zero, power down, and timeout).
7. Program Counter (PC) memory-mapped as register file
allows W to be used as offset register for indirect addressing of program memory.
8. Indirect addressing data pointer FSR (file select register) memory-mapped as a register file.
9. IREAD instruction allows reading the instruction from
the program memory addressed by W and upper four
bits of MODE register.
10.Eight-level, 11-bit push/pop hardware stack for subroutine linkage using the Call and Return instructions.
11.Six addressing modes provide great flexibility.
An instruction goes through a four-stage pipeline to be
executed (Figure 15-1). The first instruction is fetched
from the program memory on the first clock cycle. On the
second clock cycle, the first instruction is decoded and
the second instruction is fetched. On the third clock cycle,
the first instruction is executed, the second instruction is
decoded, and the third instruction is fetched. On the
fourth clock cycle, the first instruction’s results are written
to its destination, the second instruction is executed, the
third instruction is decoded, and the fourth instruction is
Clock
Cycle
2
Clock
Cycle
3
Clock
Cycle
4
Figure 15-1. Pipeline and Clock Scheme
15.3
Addressing Modes
The device support the following addressing modes:
Data Direct
Data Indirect
Immediate
Program Direct
Program Indirect
Relative
Both direct and indirect addressing modes are available.
The INDF register, though physically not implemented, is
used in conjunction with the indirect data pointer (FSR) to
perform indirect addressing. An instruction using INDF as
its operand field actually performs the operation on the
register pointed by the contents of the FSR. Consequently, processing two multiple-byte operands requires
alternate loading of the operand addresses into the FSR
pointer as the multiple byte data fields are processed.
Examples:
Direct addressing:
mov
15.2 Instruction Execution
© 2000 Scenix Semiconductor, Inc. All rights reserved.
Clock
Cycle
1
RA,#01
;move “1” to RA
Indirect Addressing:
- 30 -
mov
FSR,#RA
;FSR = address of RA
mov
INDF,#$01
;move “1” to RA
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15.4 RAM Addressing
15.6
Direct Addressing
The FSR register must initialized with an appropriate
value in order to address the desired RAM register. The
following table and code example show how to directly
access the banked registers.
The instruction set contains instructions to set, reset, and
test individual bits in data memory. The device is capable
of bit addressing anywhere in data memory.
Bank
FSR Value
0
010h
1
030h
2
050h
3
070h
4
090h
5
0B0h
6
0D0h
7
0F0h
mov
clr
FSR,#$070
$010
mov
clr
FSR,#$D0
$010
FSR
:loop setb SFR.4
clr
INDF
incsz FSR
jmp
:loop
;Select RAM Bank 3
;Clear register 10h on
;Bank 3
;Select RAM Bank 6
;Clear register 10h on
;Bank 6
15.8
15.10 Branch and Loop Call Instructions
Often it is desirable to set the bank select bits of the FSR
register in one instruction cycle. The Bank instruction
provides this capability. This instruction sets the upper
bits of the FSR to point to a specific RAM bank without
affecting the other FSR bits.
;Select Bank 7 in FSR
inc
;increment file register
;1Fh in Bank 7
$1F
© 2000 Scenix Semiconductor, Inc. All rights reserved.
Loop Counting and Data Pointing
Testing
The device has specific instructions to facilitate loop
counting. The DECSZ fr (decrement file register and skip
if zero) tests any one of the file registers and skips the
next instruction (which can be a branch back to loop) if
the result is zero.
15.5 The Bank Instruction
bank $F0
Increment/Decrement
The bank of 31 registers serves as a set of accumulators.
The instruction set contains instructions to increment and
decrement the register file. The device also includes both
INCSZ fr (increment file register and skip if zero) and
DECSZ fr (decrement file register and skip if zero)
instructions.
15.9
;clear FSR to 00h (at address
;04h)
;set bit 4: address 10h-1Fh,
;30-3Fh, etc
;clear register pointed to by
;FSR
;increment FSR and test, skip
;jmp if 00h
;jump back and clear next
;register
Example:
Input/Output Operation
The device contains three registers associated with each
I/O port. The first register (Data Direction Register), configures each port pin as a Hi-Z input or output. The second register (TTL/CMOS Register), selects the desired
input level for the input. The third register (Pull-Up Register), enables a weak pull-up resistor on the pin configured
as a input. In addition to using the associated port registers, appropriate values must be written into the MODE
register to configure the I/O ports.
When two successive read-modify-write instructions are
used on the same I/O port with a very high clock rate, the
“write” part of one instruction might not occur soon
enough before the “read” part of the very next instruction,
resulting in getting “old” data for the second instruction.
To ensure predictable results, avoid using two successive
read-modify-write instructions that access the same port
data register if the clock rate is high.
Indirect Addressing
To access any register via indirect addressing, simply
move the eight-bit address of the desired register into the
FSR and use INDF as the operand. The example below
shows how to clear all RAM locations from 10h to 1Fh in
all eight banks:
clr
15.7
Bit Manipulation
The device contains an 8-level hardware stack where the
return address is stored with a subroutine call. Multiple
stack levels allow subroutine nesting. The instruction set
supports absolute address branching.
15.10.1 Jump Operation
When a JMP instruction is executed, the lower nine bits
of the program counter is loaded with the address of the
specified label. The upper two bits of the program
counter are loaded with the page select bits, PA1:PA0,
contained in the STATUS register. Therefore, care must
be exercised to ensure the page select bits are pointing
to the correct page before the jump occurs.
- 31 -
STATUS<6:5>
JMP LABEL
PC<10:9>
PC<8:0>
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15.10.2 Page Jump Operation
15.10.4 Page Call Operation
When a JMP instruction is executed and the intended
destination is on a different page, the page select bits
must be initialized with appropriate values to point to the
desired page before the jump occurs. This can be done
easily with SETB and CLRB instructions or by writing a
value to the STATUS register. The device also has the
PAGE instruction, which automatically selects the page in
a single-cycle execution.
When a subroutine that resides on a different page is
called, the page select bits must contain the proper values to point to the desired page before the call instruction
is executed. This can be done easily using SETB and
CLRB instructions or writing a value to the STATUS register. The device also has the PAGE instruction, which
automatically selects the page in a single-cycle execution.
PAGE N
PAGE N
STATUS<6:5>
JMP LABEL
STATUS<6:5>
0
CALL LABEL
PC<10:9>
PC<8:0>
PC<10:9>
PC<8>
PC<7:0>
Note: “N” must be 0, 1, 2, or 3.
Note:“N” must be 0, 1, 2, or 3.
15.10.3 Call Operation
15.11 Return Instructions
The following happens when a CALL instruction is executed:
The device has several instructions for returning from
subroutines and interrupt service routines. The return
from subroutine instructions are RET (return without
affecting W), RETP (same as RET but affects PA1:PA0),
RETI (return from interrupt), RETIW (return and add W to
RTCC), and RETW #literal (return and place literal in W).
The literal serves as an immediate data value from memory. This instruction can be used for table lookup operations. To do table lookup, the table must contain a string
of RETW #literal instructions. The first instruction just in
front of the table calculates the offset into the table. The
table can be used as a result of a CALL.
• The current value of the program counter is incremented and pushed onto the top of the stack.
• The lower eight bits of the label address are copied into
the lower eight bits of the program counter.
• The ninth bit of the Program Counter is cleared to zero.
• The page select bits (in STATUS register) are copied
into the upper two bits of the Program Counter.
This means that the call destination must start in the
lower half of any page. For example, 00h-0FFh, 200h2FFh, 400h-4FFh, etc.
STATUS<6:5>
0
PC<10:9>
PC<8>
CALL LABEL
PC<7:0>
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15.12 Subroutine Operation
15.12.1 Push Operation
When a subroutine is called, the return address is
pushed onto the subroutine stack. Specifically, each
address in the stack is moved to the next lower level in
order to make room for the new address to be stored.
Stack 1 receives the contents of the program counter.
Stack 8 is overwritten with what was in Stack 7. The contents of stack 8 are lost.
15.12.2 Pop Operation
When a return instruction is executed the subroutine
stack is popped. Specifically, the contents of Stack 1 are
copied into the program counter and the contents of each
stack level are moved to the next higher level. For example, Stack 1 receives the contents of Stack 2, etc., until
Stack 7 is overwritten with the contents of Stack 8. Stack
8 is left unchanged, so the contents of Stack 8 are duplicated in Stack 7.
PC<10:0>
PC<10:0>
STACK 1
STACK 1
STACK 2
STACK 2
STACK 3
STACK 3
STACK 4
STACK 4
STACK 5
STACK 5
STACK 6
STACK 6
STACK 7
STACK 7
STACK 8
STACK 8
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15.13 Comparison and Conditional Branch
Instructions
15.17 Key to Abbreviations and Symbols
The instruction set includes instructions such as DECSZ
fr (decrement file register and skip if zero), INCSZ fr
(increment file register and skip if zero), SNB bit (bit test
file register and skip if bit clear), and SB bit (bit test file
register and skip if bit set). These instructions will cause
the next instruction to be skipped if the tested condition is
true. If a skip instruction is immediately followed by a
PAGE or BANK instruction (and the tested condition is
true) then two instructions are skipped and the operation
consumes three cycles. This is useful for conditional
branching to another page where a PAGE instruction precedes a JMP. If several PAGE and BANK instructions
immediately follow a skip instruction then they are all
skipped plus the next instruction and a cycle is consumed
for each.
15.14 Logical Instruction
The instruction set contain a full complement of the logical instructions (AND, OR, Exclusive OR), with the W
register and a selected memory location (using either
direct or indirect addressing) serving as the two operands.
15.15 Shift and Rotate Instructions
The instruction set includes instructions for left or right
rotate-through-carry.
15.16 Complement and SWAP
The device can perform one’s complement operation on
the file register (fr) and W register. The MOV W,<>fr
instruction performs nibble-swap on the fr and puts the
value into the W register.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
- 34 -
Symbol
Description
W
Working register
fr
File register (memory-mapped register in the
range of 00h to FFh)
PC
Lower eight bits of program counter (file register 02h)
STATUS STATUS register (file register 03h)
FSR
C
DC
Z
File Select Register (file register 04h)
Carry bit in STATUS register (bit 0)
Digit Carry bit in STATUS register (bit 1)
Zero bit in STATUS register (bit 2
PD
Power Down bit in STATUS register (bit 3)
TO
Watchdog Timeout bit in STATUS register (bit
4)
PA2:PA0 Page select bits in STATUS register (bits 7:5)
OPTION OPTION register (not memory-mapped)
WDT
Watchdog Timer register (not memorymapped)
MODE
MODE register (not memory-mapped)
rx
Port control register pointer (RA, RB, or RC)
!
Non-memory-mapped register designator
f
File register address bit in opcode
k
Constant value bit in opcode
n
Numerical value bit in opcode
b
Bit position selector bit in opcode
.
File register / bit selector separator in assembly language instruction
#
Immediate literal designator in assembly language instruction
lit
Literal value in assembly language instruction
addr8
8-bit address in assembly language instruction
addr9
9-bit address in assembly language instruction
addr12
12-bit address in assembly language instruction
/
Logical 1’s complement
|
Logical OR
^
Logical exclusive OR
&
Logical AND
<>
Swap high and low nibbles (4-bit segments)
<<
Rotate left through carry bit
>>
Rotate right through carry bit
--
Decrement file register
++
Increment file register
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16.0 INSTRUCTION SET SUMMARY TABLE
Table 16-1 lists all of the instructions, organized by category. For each instruction, the table shows the instruction
mnemonic (as written in assembly language), a brief
description of what the instruction does, the number of
instruction cycles required for execution, the binary
opcode, and the status bits affected by the instruction.
The “Cycles” column typically shows a value of 1, which
means that the overall throughput for the instruction is
one per clock cycle. In some cases, the exact number of
cycles depends on the outcome of the instruction (such
as the test-and-skip instructions) or the clocking mode
(Compatible or Turbo). In those cases, all possible numbers of cycles are shown in the table.
The instruction execution time is derived by dividing the
oscillator frequency by either one (Turbo mode) or four
(Compatible mode). The divide-by factor is selected
through the FUSE Word register.
Table 16-1. The SX Instruction Set
Mnemonic,
Operands
Cycles
Cycles
(Compatible) (Turbo)
Description
Opcode
Bits
Affected
Logical Operations
AND fr, W
AND of fr and W into fr (fr = fr & W)
1
1
0001 011f ffff
Z
AND W, fr
AND of W and fr into W (W = W & fr)
1
1
0001 010f ffff
Z
AND W,#lit
AND of W and Literal into W (W = W & lit)
1
1
1110 kkkk kkkk
Z
NOT fr
Complement of fr into fr (fr = fr ^ FFh)
1
1
0010 011f ffff
Z
OR fr,W
OR of fr and W into fr (fr = fr | W)
1
1
0001 001f ffff
Z
OR W,fr
OR of W and fr into fr (W = W | fr)
1
1
0001 000f ffff
Z
OR W,#lit
OR of W and Literal into W (W = W | lit)
1
1
1101 kkkk kkkk
Z
XOR fr,W
XOR of fr and W into fr (fr = fr ^ W)
1
1
0001 101f ffff
Z
XOR W,fr
XOR of W and fr into W (W = W ^ fr)
1
1
0001 100f ffff
Z
XOR W,#lit
XOR of W and Literal into W (W = W ^ lit)
1
1
1111 kkkk kkkk
Z
Arithmetic and Shift Operations
ADD fr,W
Add W to fr (fr = fr + W); carry bit is added if CF
bit in FUSEX register is cleared to 0
1
1
ADD W,fr
Add fr to W (W = W + fr); carry bit is added if CF
bit in FUSEX register is cleared to 0
1
1
CLR fr
Clear fr (fr = 0)
1
1
0000 011f ffff
Z
CLR W
Clear W (W = 0)
1
1
0000 0100 0000
Z
CLR !WDT
Clear Watchdog Timer, clear prescaler if assigned to the Watchdog (TO = 1, PD = 1)
1
1
DEC fr
Decrement fr (fr = fr - 1)
1
1
DECSZ fr
Decrement fr and Skip if Zero (fr = fr - 1 and skip
next instruction if result is zero)
INC fr
Increment fr (fr = fr + 1)
INCSZ fr
Increment fr and Skip if Zero (fr = fr + 1 and skip
next instruction if result is zero)
RL fr
Rotate fr Left through Carry (fr = << fr)
1
1
0011 011f ffff
C
RR fr
Rotate fr Right through Carry (fr = >> fr)
1
1
0011 001f ffff
C
SUB fr,W
Subtract W from fr (fr = fr - W); complement of
the carry bit is subtracted if CF bit in FUSEX
register is cleared to 0
1
1
Swap High/Low Nibbles of fr (fr = <> fr)
1
1
SWAP fr
© 2000 Scenix Semiconductor, Inc. All rights reserved.
1 or
2 (skip)
1
- 35 -
1 or
2 (skip)
0001 111f ffff
0001 110f ffff
0000 0000 0100
0000 111f ffff
1 or 0010 111f ffff
2 (skip)
1
0010 101f ffff
1 or 0011 111f ffff
2 (skip)
C, DC, Z
C, DC, Z
TO, PD
Z
none
Z
none
0000 101f ffff
C, DC, Z
0011 101f ffff
none
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Table 16-1. The SX Instruction Set (Continued)
Mnemonic,
Operands
Cycles
Cycles
(Compatible) (Turbo)
Description
Opcode
Bits
Affected
Bitwise Operations
CLRB fr.bit
Clear Bit in fr (fr.bit = 0)
SB fr.bit
Test Bit in fr and Skip if Set (test fr.bit and skip
next instruction if bit is 1)
SETB fr.bit
Set Bit in fr (fr.bit = 1)
SNB fr.bit
Test Bit in fr and Skip if Clear (test fr.bit and skip
next instruction if bit is 0)
1
1
0100 bbbf ffff
none
1 or
2 (skip)
1 or
2 (skip)
0111 bbbf ffff
none
1
1
0101 bbbf ffff
none
1 or
2 (skip)
1 or
2 (skip)
0110 bbbf ffff
none
Data Movement Instructions
MOV fr,W
Move W to fr (fr = W)
1
1
0000 001f ffff
none
MOV W,fr
Move fr to W (W = fr)
1
1
0010 000f ffff
Z
MOV W,fr-W
Move (fr-W) to W (W = fr - W); complement of
carry bit is subtracted if CF bit in FUSEX register
is cleared to 0
1
1
MOV W,#lit
Move Literal to W (W = lit)
1
1
1100 kkkk kkkk
none
MOV W,/fr
Move Complement of fr to W (W = fr ^ FFh)
1
1
0010 010f ffff
Z
MOV W,--fr
Move (fr-1) to W (W = fr - 1)
1
1
0000 110f ffff
Z
MOV W,++fr
Move (fr+1) to W (W = fr + 1)
1
1
0010 100f ffff
Z
MOV W,<<fr
Rotate fr Left through Carry and Move to W
(W = << fr)
1
1
MOV W,>>fr
Rotate fr Right through Carry and Move to W
(W = >> fr)
1
1
MOV W,<>fr
Swap High/Low Nibbles of fr and move to W
(W = <> fr)
1
1
MOV W,M
Move MODE Register to W (W = MODE), high
nibble is cleared
1
1
MOVSZ W,--fr
Move (fr-1) to W and Skip if Zero (W = fr -1 and
skip next instruction if result is zero)
1 or
2 (skip)
0010 110f ffff
1
2 (skip)
none
MOVSZ W,++fr
Move (fr+1) to W and Skip if Zero (W = fr + 1 and
skip next instruction if result is zero)
1 or
2 (skip)
0011 110f ffff
1
2 (skip)
none
MOV M,W
Move W to MODE Register (MODE = W)
1
1
0000 0100 0011
none
MOV M,#lit
Move Literal to MODE Register (MODE = lit)
1
1
0000 0101 kkkk
none
MOV !rx,W
Move W to Port Rx Control Register:rx <=> W
(exchange W and WKPND_B or CMP_B) or rx
= W (move W to rx for all other port control registers)
0000 100f ffff
C, DC, Z
0011 010f ffff
0011 000f ffff
0011 100f ffff
0000 0100 0010
C
C
none
none
0000 0000 0fff
1
1
MOV !OPTION, W Move W to OPTION Register (OPTION = W)
1
1
0000 0000 0010
none
TEST fr
1
1
0010 001f ffff
Z
Test fr for Zero (fr = fr to set or clear Z bit)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
- 36 -
none
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
Table 16-1. The SX Instruction Set (Continued)
Mnemonic,
Operands
Cycles
Cycles
(Compatible) (Turbo)
Description
Opcode
Bits
Affected
Program Control instruction
CALL addr8
JMP addr9
Call Subroutine:
top-of-stack = program counter + 1
PC(7:0) = addr8
program counter (8) = 0
program counter (10:9) = PA1:PA0
1001 kkkk kkkk
2
3
Jump to Address:
PC(7:0) = addr9(7:0)
program counter (8) = addr9(8)
program counter (10:9) = PA1:PA0
2
3
NOP
No Operation
1
1
RET
Return from Subroutine
(program counter = top-of-stack)
2
3
RETP
Return from Subroutine Across Page Boundary
(PA1:PA0 = top-of-stack (10:9) and
program counter = top-of-stack)
2
3
Return from Interrupt (restore W, STATUS,
FSR, and program counter from shadow registers)
2
3
Return from Interrupt and add W to RTCC (restore W, STATUS, FSR, and program counter
from shadow registers; and add W to RTCC)
2
3
Return from Subroutine with Literal in W
(W = lit and program counter = top-of-stack)
2
3
RETI
RETIW
RETW lit
none
101k kkkk kkkk
none
0000 0000 0000
0000 0000 1100
none
none
0000 0000 1101
PA1, PA0
0000 0000 1110 all STA-
TUS, except TO,
PD
0000 0000 1111 all STA-
TUS, except TO,
PD
1000 kkkk kkkk
none
System Control Instructions
BANK addr8
Load Bank Number into FSR(7:5)
FSR(7:5) = addr8(7:5)
1
1
IREAD
Read Word from Instruction Memory
MODE:W = data at (MODE:W)
1
4
PAGE addr12
Load Page Number into STATUS(7:5)
STATUS(7:5) = addr12(11:9)
1
1
SLEEP
Power Down Mode
0000 0001 1nnn
0000 0100 0001
0000 0001 0nnn
none
none
PA1, PA0
0000 0000 0011
WDT = 00h, TO = 1, stop oscillator
1
1
TO, PD
(PD = 0, clears prescaler if assigned)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
16.1 Equivalent Assembler Mnemonics
Some assemblers support additional instruction mnemonics that are special cases of existing instructions or
alternative mnemonics for standard ones. For example,
an assembler might support the mnemonic “CLC” (clear
carry), which is interpreted the same as the instruction
“clrb $03.0” (clear bit 0 in the STATUS register). Some of
the commonly supported equivalent assembler mnemonics are described in Table 16-2.
Table 16-2. Equivalent Assembler Mnemonics
Syntax
Description
Equivalent
Cycles
CLC
Clear Carry bit
CLRB $03.0
1
CLZ
Clear Zero bit
CLRB $03.2
1
JMP W
Jump Indirect W
MOV $02,W
4 or 3 (note 1)
JMP PC+W
Jump Indirect W Relative
ADD $02,W
4 or 3 (note 1)
MODE imm4
Move Immediate to MODE
Register
MOV M,#lit
NOT W
Complement W
XOR W,#$FF
SC
Skip if Carry bit Set
SB $03.0
1 or 2 (note 2)
SKIP
Skip Next Instruction
SNB $02.0 or SB $02.0
4 or 2 (note 3)
1
1
Note 1: The JMP W or JMP PC+W instruction takes 4 cycles in the “compatible” clocking mode or 3 cycles in the
“turbo” clocking mode.
Note 2: The SC instruction takes 1 cycle if the tested condition is false or 2 cycles if the tested condition is true.
Note 3: The assembler converts the SKIP instruction into a SNB or SB instruction that tests the least significant bit
of the program counter, choosing SNB or SB so that the tested condition is always true. The instruction takes 4 cycles
in the “compatible” clocking mode or 2 cycles in the “turbo” clocking mode.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.0 ELECTRICAL CHARACTERISTICS
17.1 Absolute Maximum Ratings
-40°C to +85°C
Ambient temperature under bias
-65°C to +150°C
Storage temperature
Voltage on Vdd with respect to Vss
0 V to +7.0V
Voltage on OSC1 with respect to Vss
0 V to +13.5V
Voltage on MCLR with respect to Vss
0 V to +13.5V
Voltage on all other pins with respect to V ss
-0.6 V to (Vdd + 0.6V)V
Total power dissipation
700 mW
Max. current out of V ss pin
130 mA
Max. current into Vdd pin
130 mA
Max. DC current into an input pin (with internal protection diode forward
biased)
+500 µA
Max. allowable sink current per I/O pin
45 mA
Max. allowable source current per I/O pin
45 mA
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.2 DC Characteristics
SX18/20/28AC (Temp Range: 0°C <= Ta <= +70°C) and SX18/20/28AC-I (Temp Range: -40 °C <= Ta <= +85°C)
Symbol
Parameter
Supply Voltage (Note 1)
Vdd
SVdd
Conditions
Min
Typ
Max
Units
Fosc= 32 MHz
2.7
-
5.5
V
Fosc= 50 MHz
3.0
-
5.5
V
0.05
-
-
V/ms
-
77
82
mA
Vdd = 5.0V, Fosc = 4 MHz (Crystal)
7.5
8
mA
Vdd = 2.7V, Fosc = 20 MHz (Crystal)
17
18
mA
10
20
µA
1.0
9.0
µA
Vdd rise rate
Supply Current, active
Idd
Supply Current, power down
Ipd
Vdd = 5.0V, Fosc = 50 MHz (Crystal)
Vdd = 3.0V, WDT enabled
-
Vdd = 3.0V, WDT disabled
Input Levels
MCLR, OSC1, RTCC
Logic High
0.8Vdd
Vdd
V
Logic Low
Vss
0.2Vdd
V
0.7Vdd
Vdd
V
Vss
0.3Vdd
All Other Inputs
Vih, Vil
CMOS
Logic High
Logic Low
TTL
Logic High
Logic Low
Iil
2.0
Vdd
Vss
0.8
V
V
V
Input Leakage Current
Vin = Vdd or Vss
-1.0
+1.0
µA
Weak Pullup Current
Vdd = 5.5V, Vin = 0V
100
190
µA
Vdd = 3.0V, Vin = 0V
25
50
µA
Iip
Output High Voltage
OSC2, Ports B, C
Voh
Port A
Vol
Ioh = 20mA, Vdd = 4.5V
Vdd-0.7
V
Ioh = 12mA, Vdd = 3.0V
Vdd-0.7
V
Ioh = 30mA, Vdd = 4.5
Vdd-0.7
V
Ioh = 20mA, Vdd = 3.0V
Vdd-0.7
V
Output Low Voltage
Iol = 30mA, Vdd = 4.5V
0.6
V
All Ports, OSC2
Iol = 20mA, Vdd = 3.0V
0.6
V
Note 1: Vdd must start rising from Vss to ensure proper Power-On-Reset when relying on the internal Power-On-Reset
circuitry.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.3 AC Characteristics
SX18/20/28AC (Temp Range: 0°C <= Ta <= +70°C) and SX18/20/28AC-I (Temp Range: -40 °C <= Ta <= +85°C)
Symbol
Parameter
Min
Typ
Max
Units
Conditions
DC
-
4.0
10
24
50
32
1.0
MHz
MHz
MHz
MHz
KHz
MHz
RC
XT1
XT2
HS1/HS2/HS3
LP1
LP2
Oscillator Frequency
DC
0.032
1.0
1.0
DC
0.032
-
4.0
10.0
24.0
50
32
1.0
MHz
MHz
MHz
MHz
KHz
MHz
RC
XT1
XT2
HS1/HS2/HS3
LP1
LP2
External CLKIN Period
250
100
41.7
20
31.25
1.0
-
-
ns
ns
ns
ns
µs
µs
RC
XT1
XT2
HS1/HS2/HS3
LP1
LP2
Oscillator Period
250
0.1
41.7
20
31.25
1.0
-
31.25
1000.0
1000.0
31.25
ns
µs
ns
ns
µs
µs
RC
XT1
XT2
HS1/HS2/HS3
LP1
LP2
Clock in (OSC1) Low or High Time
50
8.0
2.0
-
-
ns
ns
µs
XT1/XT2
HS1/HS2/HS3
LP1/LP2
Clock in (OSC1) Rise or Fall Time
-
-
25
25
50
ns
ns
µs
XT1/XT2
HS1/HS2/HS3
LP1/LP2
External CLKIN Frequency
Fosc
Tosc
TosL, TosH
TosR, TosF
Note:Data in the Typical (“TYP”) column is at 5V, 25 °C unless otherwise stated.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.4 DC Characteristics
SX18/20/28AC75 (Temp Range: 0°C <= Ta <= +70°C)
Symbol
Parameter
Vdd
Supply Voltage (Note 1)
SVdd
Vdd rise rate
Idd
Ipd
Conditions
Min
Typ
Max
Units
Fosc= 75 MHz
4.5
-
5.5
V
0.05
-
-
V/ms
-
100
105
mA
110
µA
100
µA
Supply Current, active
Vdd = 5.0V, Fosc = 75 MHz (Ext.)
Supply Current, power down
Vdd = 4.5V, WDT enabled
Vdd = 4.5V, WDT disabled
-
Input Levels
MCLR, OSC1, RTCC
Logic High
0.8Vdd
Vdd
V
Logic Low
Vss
0.2Vdd
V
0.7Vdd
Vdd
Vss
0.3Vdd
2.0
Vdd
V
Vss
0.8
V
All Other Inputs
Vih, Vil
CMOS
Logic High
Logic Low
TTL
V
V
Logic High
Logic Low
Iil
Input Leakage Current
Vin = Vdd or Vss
-1.0
+1.0
µA
Iip
Weak Pullup Current
Vdd = 5.5V, Vin = 0V
100
160
µA
Output High Voltage
Voh
Vol
OSC2, Ports B, C
Ioh = 20mA, Vdd = 4.5V
Vdd-0.7
V
Port A
Ioh = 30mA, Vdd = 4.5
Vdd-0.7
V
Output Low Voltage
Iol = 30mA, Vdd = 4.5V
All Ports, OSC2
0.6
V
Note:Data in the Typical (“TYP”) column is at 5V, 25 °C unless otherwise stated.
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.5 AC Characteristics
SX18/20/28AC75 (Temp Range: 0°C <= Ta <= +70°C)
Symbol
Parameter
Min
Typ
Max
Units
Conditions
75
MHz
HS1/HS2/HS3
External CLKIN Frequency
DC
Oscillator Frequency
DC
-
75
MHz
HS1/HS2/HS3
External CLKIN Period
13.3
-
-
ns
HS1/HS2/HS3
Oscillator Period
13.3
-
-
ns
HS1/HS2/HS3
TosL, TosH
Clock in (OSC1) Low or High Time
8.0
-
-
ns
HS1/HS2/HS3
TosR, TosF
Clock in (OSC1) Rise or Fall Time
-
-
25
ns
HS1/HS2/HS3
Fosc
Tosc
Note:Data in the Typical (“TYP”) column is at 5V, 25 °C unless otherwise stated.
17.6 Comparator DC and AC Specifications
Parameter
Input Offset Voltage
Conditions
0.4V < Vin < Vdd – 1.5V
Input Common Mode Voltage Range
Typ
Max
Units
+/- 10
+/- 25
mV
Vcc – 1.3
V
0.4
Voltage Gain
300k
DC Supply Current (enabled)
Response Time
Min
V/V
Vdd = 5.5V
120
µA
Voverdrive = 25mV
250
ns
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.7 Typical Performance Characteristics (Room Temp)
Active Supply Current Vs Operating Frequency
(Crystal Clock)
Active Supply Current Vs Operating Frequency
(External Clock)
90 _
90 _
80 _
60
50
40
_
V
_
dd
=
5.
70
Idd (mA)
Idd (mA)
70
80 _
5V
_
_
60
50
40
30 _
V dd =
_
_
20 _
10 _
10 _
20
30
40
50
© 2000 Scenix Semiconductor, Inc. All rights reserved.
V dd =
10
Operating Frequency (MHz)
=
_
30 _
3 .0 V
d
5V
_
20 _
10
Vd
5.
20
30
3 .0 V
40
50
Operating Frequency (MHz)
- 44 -
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.7
Typical Performance Characteristics (continued)
Active Supply Current Vs Operating Frequency
(External Clock)
Active Supply Current Vs Vdd
(Crystal Clock)
SX18AC75/SX20AC75/SX28AC75
90 _
80 _
Idd (mA)
Idd (mA)
100 _
90 _
60
50
40
_
50
70
M
H
z
110 _
_
_
40
_
M
32
30 _
20 _
80 _
20 M
M
Hz
Hz
8 MH
10 _
4.5
5.5
5.0
Hz
z
4 MHz
2.5
3.5
4.5
5.5
Vdd (V)
Vdd (V)
Active Supply Current Vs Vdd
(32 kHz Crystal Clock)
Active Supply Current Vs Vdd
(External Clock)
90 _
80 _
60
50
40
z
H
_
50
M
600
_
40
_
_
3
30 _
20 _
Hz
M
500
Idd (µ A)
Idd (mA)
70
700
Hz
2M
20 M
_
_
_
300 _
200 _
Hz
8 MH
10 _
100 _
z
3
4 MHz
2.5
400
_
3.5
4.5
5.5
3.5
4
4.5
5
5.5
6
Vdd (V)
Vdd (V)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
17.7
Typical Performance Characteristics (continued)
Active Supply Current Vs Vdd
(32 kHz External Clock)
600
Port A/B/C Weak Pull-Up Source Current
160
_
V
dd
_
Ipup (µA)
Idd (µA)
500 _
400
_
300 _
120
_
80
_
40
_
=5
.5V
200 _
100
_
2
2.5
3
3.5
4
4.5
5
5.5
Vd
1
d
=3
.0V
2
3
Vdd (V)
2
5V
4.
=
dd
3.
0V
V
=
20 _
V
=3
3 .0 V
.0V
Iol (mA)
V dd =
V dd =
V dd
.5V
V dd = 4
4 .5 V
30 _
dd
A
B
Ioh (mA)
Po
rt
Po
rt
Po
rt A
Po
B
rt
40 _
10 _
10 _
1
6
Port A/B/C Sink Current
40 _
20 _
5
Voh (V)
Port A/B/C Source Current
30 _
4
3
4
5
6
0.5
Vol (V)
Voh (V)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
1.0
- 46 -
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
18.0 PACKAGE DIMENSIONS (DIMENSIONS ARE IN INCHES/(MILLIMETERS)
0.035 - 0.045
(0.890 - 1.143)
SX18AC/SO
SX18AC75/SO
1
9
0.400 - 0.410
(10.16 - 10.41)
0.045 - 0.055
(1.143 - 1.397)
0.292 - 0.299
7.42 - 7.59)
0.090 - 0.094
(2.29 - 2.39)
10
0.292 - 0.299
(7.42 - 7.59)
28
0.014 - 0.019
(0.35 - 0.48)
0.050 BSC
(1.27 BSC)
0.090 - 0.094
(2.29 - 2.39)
0.451 - 0.461
(11.46 - 11.71)
SX18AC/DP
SX18AC75/DP
0.0050 - 0.0115
(0.127 - 0.292)
0.895 - 0.905
(22.73 - 22.99)
9
1
0.240 - 0.260
(6.10 -6.60)
10
18
0.008 - 0.012
(0.20 - 0.31)
0.015 min.
(0.38 min.)
0.130 nom.
(3.3 nom.)
0.430 max.
(10.92 max.)
0.170 max.
(4.32 max.)
0.125 - 0.135
(3.17 - 3.43)
o
0.300 BSC at 90
[ (7.62
BSC at 90 ) ]
o
0.100 BSC
(2.54 BSC)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
0.055 -0.065
(1.39 - 1.65)
- 47 -
0.015 - 0.022
(0.38 - 0.56)
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
0.039
(1.00)
SX20AC/SS
SX20AC75/SS
1
10
0.301 - 0.311
(7.65 - 7.90)
0.039
(1.00)
o
0.205 - 0.212
(5.20 - 5.38)
o
12 - 16
11
20
0.066 - 0.070
(1.68 - 1.78)
0.205 - 0.212
(5.20 - 5.38)
0.0256 BSC
(0.65 BSC)
0.010 - 0.015
(0.25 - 0.38)
0.066 - 0.070
(1.68 - 1.78)
0.278 - 0.289
(7.07 - 7.33)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
- 48 -
0.002 - 0.008
(0.05 - 0.21)
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
0.035 - 0.045
(0.890 - 1.143)
SX28AC/SO
14
1
SX28AC75/SO
0.40 - 0.41
(10.16 - 10.41)
0.045 - 0.055
(1.143 - 1.397)
0.292 - 0.299
7.42 - 7.59)
0.090 - 0.094
(2.29 - 2.39)
15
28
0.292 - 0.299
(7.42 - 7.59)
0.014 - 0.019
(0.35 - 0.48)
0.050 BSC
(1.27 BSC)
0.090 - 0.094
(2.29 - 2.39)
0.701 - 0.710
(17.81 - 18.06)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
- 49 -
0.0050 - 0.0115
(0.127 - 0.292)
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
SX28AC/DP
SX28AC75/DP
1.360 - 1.370
(34.54 - 34.80)
1
14
0.280 - 0.295
(7.11 - 7.49)
28
15
0.009 - 0.014
(0.23 - 0.36)
0.020 min.
(0.51 min.)
0.430 max.
(10.92 max.)
0.130 nom.
(3.3 nom.)
o
0.300 BSC at 90
[ (7.62
BSC at 90 ) ]
0.180 max.
(4.57 max.)
o
0.120 - 0.135
(3.05 - 3.43)
0.100 BSC
(2.54 BSC)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
0.045 - 0.055
(1.14 - 1.40)
- 50 -
0.015 - 0.021
(0.38 - 0.53)
www.scenix.com
SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
SX28AC/SS
SX28AC75/SS
0.039
(1.00)
14
o
1
0.039
(1.00)
o
12 - 16
15
0.301 - 0.311
(7.65 - 7.90)
0.205 - 0.212
(5.20 - 5.38)
28
0.066 - 0.070
(1.68 - 1.78)
0.205 - 0.212
(5.20 - 5.38)
0.010 - 0.015
(0.25 - 0.38)
0.0256 BSC
(0.65 BSC)
0.002 - 0.008
(0.05 - 0.21)
0.066 - 0.070
(1.68 - 1.78)
0.397 - 0.407
(10.07 - 10.33)
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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SX18AC/SX20AC/SX28AC/SX18AC75/SX20AC75/SX28AC75
Lit #: SXL-DS01-04
Sales and Tech Support Contact Information
For the latest contact and support information on SX devices, please visit the Scenix Semiconductor website at
www.scenix.com. The site contains technical literature, local sales contacts, tech support and many other features.
1330 Charleston Road
Mountain View, CA 94043
E-Mail: [email protected]
Web site: www.scenix.com
Tel.: (650) 210-1500
Fax: (650) 210-8715
© 2000 Scenix Semiconductor, Inc. All rights reserved.
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www.scenix.com