ICS ICS8521

ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS8521 is a low skew, 1-to-9 3.3V Differential-to-LVHSTL Fanout Buffer and a member of
HiPerClockS™
the HiPerClockS™ family of High Performance
Clock Solutions from ICS. The ICS8521 has two
selectable clock inputs. The CLK, nCLK pair can
accept most standard differential input levels. The PCLK,
nPCLK pair can accept LVPECL, CML, or SSTL input levels.
The clock enable is internally synchronized to eliminate runt
pulseson the outputs during asynchronous assertion/
deassertion of the clock enable pin.
• 9 LVHSTL outputs
Guaranteed output skew, part-to-part skew and crossover
voltage characteristics make the ICS8521 ideal for today’s
most advanced applications, such as IA64 and static RAMs.
• Part-to-part skew: 250ps (maximum)
,&6
• Selectable CLK, nCLK or LVPECL clock inputs
• CLK, nCLK pair can accept the following differential input
levels: LVDS, LVPECL, LVHSTL, SSTL, HCSL
• PCLK, nPCLK supports the following input types:
LVPECL, CML, SSTL
• Maximum output frequency up to 500MHz
• Output skew: 50ps (maximum)
• Propagation delay: 1.8ns (maximum)
• VOH = 1.2V (maximum)
• 3.3V core, 1.8V output operating supply voltages
• 0°C to 70°C ambient operating temperature
• Industrial temperature information available upon request
BLOCK DIAGRAM
PIN ASSIGNMENT
CLK
nCLK
PCLK
nPCLK
CLK_SEL
VDDO
nQ2
Q2
Q
nQ1
Q1
nQ0
Q0
VDDO
D
CLK_EN
LE
0
1
32 31 30 29 28 27 26 25
Q0
nQ0
VDD
CLK
nCLK
CLK_SEL
PCLK
nPCLK
GND
CLK_EN
Q1
nQ1
Q2
nQ2
Q3
nQ3
Q4
nQ4
1
2
3
4
5
6
7
8
ICS8521
24
23
22
21
20
19
18
17
VDDO
Q3
nQ3
Q4
nQ4
Q5
nQ5
VDDO
9 1 0 1 1 1 2 1 3 1 4 1 5 16
VDDO
Q6
nQ6
Q7
nQ7
Q6
nQ6
Q8
nQ8
VDDO
Q5
nQ5
32-Lead LQFP
7mm x 7mm x 1.4mm Package Body
Y Package
Top View
Q7
nQ7
Q8
nQ8
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REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1
VDD
Type
Description
Power
Positive supply pin. Connect to 3.3V.
2
CLK
Input
Pulldown
3
nCLK
Input
Pullup
4
CLK_SEL
Input
Pulldown
5
PCLK
Input
Pulldown
Pullup
6
nPCLK
Input
7
GND
Power
8
CLK_EN
Input
Pullup
Non-inver ting differential clock input.
Inver ting differential clock input.
Clock select input. When HIGH, selects PCLK, nPCLK inputs.
When LOW, selects CLK, nCLK.
LVTTL / LVCMOS interface levels.
Non-inver ting differential LVPECL clock input.
Inver ting differential LVPECL clock input.
Power supply ground. Connect to ground.
Synchronizing clock enable. When HIGH, clock outputs follow
clock input. When LOW, Q outputs are forced low, nQ outputs
are forced high. LVCMOS /LVTTL interface levels.
9, 16, 17,
24, 25, 32
10, 11
VDDO
Power
Output supply pins. Connect to 1.8V.
nQ8, Q8
Output
Differential output pair. LVHSTL interface level.
12, 13
nQ7, Q7
Output
Differential output pair. LVHSTL interface level.
14, 15
nQ6, Q6
Output
Differential output pair. LVHSTL interface level.
18, 19
nQ5, Q5
Output
Differential output pair. LVHSTL interface level.
20, 21
nQ4, Q4
Output
Differential output pair. LVHSTL interface level.
22, 23
nQ3 Q3
Output
Differential output pair. LVHSTL interface level.
26, 27
nQ2, Q2
Output
Differential output pair. LVHSTL interface level.
28, 29
nQ1, Q1
Output
Differential output pair. LVHSTL interface level.
30, 31
nQ0, Q0
Output
Differential output pair. LVHSTL interface level.
NOTE: Pullup and Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
Test Conditions
Minimum Typical
CLK, nCLK,
PCLK, nPLCK
CLK_EN, CLK_SEL
Maximum
Units
4
pF
CIN
Input Capacitance
RPULLUP
Input Pullup Resistor
51
KΩ
RPULLDOWN
Input Pulldown Resistor
51
KΩ
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2
pF
REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 3A. CONTROL INPUT FUNCTION TABLE
Inputs
Outputs
CLK_EN
CLK_SEL
Selected Sourced
Q0 thru Q8
nQ0 thru nQ8
0
0
CLK, nCLK
Disabled; LOW
Disabled; HIGH
0
1
PCLK, nPCLK
Disabled; LOW
Disabled; HIGH
1
0
CLK, nCLK
Enabled
Enabled
1
1
PCLK, nPCLK
Enabled
Enabled
After CLK_EN switches, the clock outputs are disabled or enabled following a rising and falling input clock edge
as shown in Figure 1.
In the active mode, the state of the outputs are a function of the CLK, nCLK and PCLK, nPCLK inputs as described
in Table 3B.
Enabled
Disabled
nCLK, nPCLK
CLK, PCLK
CLK_EN
nQ0 - nQ8
Q0 - Q8
FIGURE 1: CLK_EN TIMING DIAGRAM
TABLE 3B. CLOCK INPUT FUNCTION TABLE
Inputs
Outputs
CLK or PCLK
nCLK or nPCLK
Q0 thru Q8
nQ0 thru nQ8
0
1
LOW
HIGH
Input to Output Mode
Polarity
Differential to Differential
Non Inver ting
1
0
HIGH
LOW
Differential to Differential
Non Inver ting
0
Biased; NOTE 1
LOW
HIGH
Single Ended to Differential
Non Inver ting
1
Biased; NOTE 1
HIGH
LOW
Single Ended to Differential
Non Inver ting
Biased; NOTE 1
0
HIGH
LOW
Single Ended to Differential
Inver ting
Biased; NOTE 1
1
LOW
HIGH
Single Ended to Differential
Inver ting
NOTE 1: Please refer to the Application Information section on page 8, Figure 9, which discusses wiring the differential
input to accept single ended levels.
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REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDDx
Inputs, VI
Outputs, VO
Package Thermal Impedance, θ JA
Storage Temperature, TSTG
4.6V
-0.5V to VDD + 0.5V
-0.5V to VDDO + 0.5V
47.9°C/W
-65°C to 150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings
are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the
DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 70°C
Symbol
Parameter
VDD
Test Conditions
Minimum
Typical
Maximum
Units
Positive Supply Voltage
3.135
3.3
3.465
V
VDDO
Output Supply Voltage
1.6
1.8
2.0
V
IDD
Power Supply Current
60
80
mA
Typical
TABLE 4B. LVCMOS DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 70°C
Symbol
Parameter
VIH
CLK_EN, CLK_SEL
VIL
CLK_EN, CLK_SEL
IIH
Input High Current
IIL
Input Low Current
Test Conditions
Minimum
Maximum
Units
2
3.765
V
-0.3
0.8
V
CLK_EN
VIN = VDD = 3.465V
5
µA
CLK_SEL
VIN = VDD = 3.465V
150
µA
CLK_EN
VIN = 0V, VDD = 3.465V
-150
µA
CLK_SEL
VIN = 0V, VDD = 3.465V
-5
µA
TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 70°C
Symbol
Parameter
IIH
Input High Current
IIL
Input Low Current
Test Conditions
CLK
Minimum
Typical
VIN = VDD = 3.465V
Units
150
µA
nCLK
VIN = VDD = 3.465V
CLK
VIN = 0V, VDD = 3.465V
-5
5
µA
nCLK
VIN = 0V, VDD = 3.465V
-150
µA
VPP
Peak-to-Peak Input Voltage
0.15
Common Mode Input Voltage;
VCMR
0.5
NOTE 1, 2
NOTE 1: For single ended applications, the maximum input voltage for CLK and nCLK is VDD + 0.3V.
NOTE 2: Common mode voltage is defined as VIH.
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4
µA
1.3
V
VDD - 0.85
V
REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 4D. LVPECL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 70°C
Symbol
Parameter
IIH
Input High Current
IIL
Input Low Current
Test Conditions
Minimum
Typical
Maximum
Units
150
µA
5
µA
VDD = VIN = 3.465V
PCLK
nPCLK
VDD = VIN = 3.465V
PCLK
VDD = 3.465V, VIN = 0V
-5
µA
nPCLK
VDD = 3.465V, VIN = 0V
-150
µA
Peak-to-Peak Input Voltage
0.3
Common Mode Input Voltage;
VCMR
1.5
NOTE 1, 2
NOTE 1: Common mode voltage is defined as VIH.
NOTE 2: For single ended applications, the maximum input voltage for PCLK and nPCLK is VDD + 0.3V.
1
V
VDD
V
VPP
TABLE 4E. LVHSTL DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 70°C
Symbol Parameter
Output High Voltage;
VOH
NOTE 1
Output Low Voltage;
VOL
NOTE 1
VOX
Test Conditions
Output Crossover Voltage
Minimum
Maximum
Units
1.0
1.2
V
0
0.4
V
40% x (VOH - VOL) + VOL
60% x (VOH - VOL) + VOL
V
0.6
1.1
V
Peak-to-Peak
Output Voltage Swing
NOTE 1: Outputs terminated with 50Ω to ground.
VSWING
Typical
TABLE 5. AC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = 0°C TO 70°C
Symbol
Parameter
fMAX
Maximum Output Frequency
Test Conditions
Minimum
IJ 250MHz
Typical
1
Maximum
Units
500
MHz
tPD
Propagation Delay; NOTE 1
t sk(o)
Output Skew; NOTE 2, 4
t sk(pp)
Par t-to-Par t Skew; NOTE 3, 4
250
ps
tR
Output Rise Time
20% to 80% @ 50MHz
300
700
ps
tF
Output Fall Time
20% to 80% @ 50MHz
300
700
ps
52
%
odc
Output Duty Cycle
48
All parameters measured at 250MHz unless noted otherwise.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
Measured from VDD/2 to the output differential crossing point for single ended input levels.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differntial cross points.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the output are measurd
at the differential cross points.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
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5
1.8
ns
50
ps
REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
VDDO
VDD
SCOPE
Qx
LVHSTL
VDD = 3.3V ± 5%
VDDO = 1.8V ± 0.2V
nQx
GND = 0V
FIGURE 2 - OUTPUT LOAD TEST CIRCUIT
V DD
CLK, PCLK
V
Cross Points
PP
V
CMR
nCLK, nPCLK
GND
FIGURE 3 - DIFFERENTIAL INPUT LEVEL
Qx
nQx
Qy
nQy
tsk(o)
FIGURE 4 - OUTPUT SKEW
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REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
Qx
PART 1
nQx
Qy
PART 2
nQy
tsk(pp)
FIGURE 5 - PART-TO-PART SKEW
80%
80%
V
20%
SWING
20%
Clock Inputs
and Outputs
t
t
R
FIGURE 6 - INPUT
AND
OUTPUT RISE
AND
F
FALL TIME
CLK, PCLK
nCLK, nPCLK
Q0, Q8
nQ0, nQ8
t
PD
FIGURE 7 - PROPAGATION DELAY
CLK, PCLK
nCLK, nPCLK
Pulse Width
t
t
odc =
t
PERIOD
PW
PERIOD
FIGURE 8 - odc & tPERIOD
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ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
Figure 9 shows how the differential input can be wired to accept single ended levels. The reference voltage V_REF ~ VDD/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit should be located as close as possible to the input pin. The ratio of
R1 and R2 might need to be adjusted to position the V_REF in the center of the input voltage swing. For example, if the input clock
swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V and R2/R1 = 0.609.
VDD
R1
1K
CLK_IN
+
V_REF
C1
0.1uF
R2
1K
FIGURE 9 - SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
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REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8521.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8521 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 80mA = 277.2mW
Power (outputs)MAX = 32mW/Loaded Output pair
If all outputs are loaded, the total power is 9 * 32mW = 288mW
Total Power_MAX (3.465V, with all outputs switching) = 277.2mW + 288mW = 565.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = junction-to-ambient thermal resistance
Pd_total = Total device power dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used . Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.565W * 42.1°C/W = 93.8°C. This is well below the limit of 125°C
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
Table 6. Thermal Resistance qJA for 32-pin LQFP, Forced Convection
qJA by Velocity (Linear Feet per Minute)
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
47.9°C/W
200
55.9°C/W
42.1°C/W
500
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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Integrated
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LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVHSTL output driver circuit and termination are shown in Figure 10.
VDD
Q1
VOUT
RL
50Ω
FIGURE 10 - LVHSTL DRIVER CIRCUIT
AND
TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
DD
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = (V
/R ) * (V
OH_MAX
Pd_L = (V
OL_MAX
•
L
-V
DD_MAX
/R ) * (V
L
-V
DD_MAX
For logic high, V
For logic low, V
OUT
)
OL_MAX
=V
OUT
•
)
OH_MAX
=V
OH_MAX
=V
OL_MAX
– 1.2V
DD_MAX
=V
– 0.4V
DD_MAX
Pd_H = (1.2V/50Ω) * (2V - 1.2V) = 19.2mW
Pd_L = (0.4V/50Ω) * (2V - 0.4V) = 12.8mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 32mW
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REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
RELIABILITY INFORMATION
TABLE 6. θJAVS. AIR FLOW TABLE
qJA by Velocity (Linear Feet per Minute)
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
47.9°C/W
200
55.9°C/W
42.1°C/W
500
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS8521 is: 944
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REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
PACKAGE OUTLINE - Y SUFFIX
TABLE 6. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
BBA
SYMBOL
MINIMUM
NOMINAL
MAXIMUM
32
N
A
--
--
1.60
A1
0.05
--
0.15
A2
1.35
1.40
1.45
b
0.30
0.37
0.45
c
0.09
--
0.20
D
9.00 BASIC
D1
7.00 BASIC
D2
5.60 Ref.
E
9.00 BASIC
E1
7.00 BASIC
E2
5.60 Ref.
e
0.80 BASIC
L
0.45
0.60
0.75
q
0°
--
7°
ccc
--
--
0.10
Reference Document: JEDEC Publication 95, MS-026
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REV. B JULY 31, 2001
ICS8521
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER
TABLE 7. ORDERING INFORMATION
Part/Order Number
ICS8521BY
ICS8521BYT
Marking
ICS8521BY
ICS8521BY
Package
32 Lead LQFP
32 Lead LQFP on Tape and Reel
Count
250 per tray
1000
Temperature
0°C to 70°C
0°C to 70°C
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no
responsibility for either its use or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or
licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature
range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to
change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical
instruments.
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REV. B JULY 31, 2001