ICS ICS9148-111

ICS9148-111
Integrated
Circuit
Systems, Inc.
Frequency Generator & Integrated Buffers for PENTIUM/ProTM
Recommended Application:
ALI (Aladdin V™ ) mobile.
Output Features:
•
3 - CPUs @ 2.5V/3.3V, up to 100MHz.
•
3 - AGPCLK @ 3.3V
•
13 - SDRAM @ 3.3V, up to 100MHz.
•
6 - PCI @ 3.3V, including one free running.
•
1 - 48MHz, @ 3.3V fixed.
•
1 - REF @ 3.3V, 14.318MHz.
Features:
•
Up to 100MHz frequency support
•
Support power management: CPU, PCI, AGP stop and,
Power down Mode from I2C programming.
•
Spread spectrum for EMI control (0 to -0.6%, ± 0.25%).
•
Uses external 14.318MHz crystal
•
FS pins for frequency select
Key Specifications:
•
CPU – CPU: <250ps
•
SDRAM - SDRAM: <250ps
•
AGP-AGP: <250ps
•
PCI – PCI: <500ps
•
CPU-SDRAM <500ps
•
CPU(early)-PCI: 1-4ns, Center 2-6ns
•
CPU-AGP <500ps
Pin Configuration
48-Pin 300mil SSOP
* Internal Pull-up Resistor of
240K to 3.3V on indicated inputs
Block Diagram
Functionality
CPU,
PCI
AGP
FS2 FS1 FS0 SDRAM (MHz) (MHz)
(MHz)
1
1
1
100
33.33 66.67
1
1
0
95.25
31.75 63.50
1
0
1
83.3
33.30 66.60
1
0
0
75
30.00 60.00
0
1
1
91.5
30.50 61.00
0
1
0
96.22
32.07 64.15
0
0
1
66.8
33.40 66.80
0
0
0
60
30.00 60.00
9148-111 Rev A 10/19/99
Third party brands and names are the property of their respective owners.
REF,
IOAPIC
(MHz)
14.318
14.318
14.318
14.318
14.318
14.318
14.318
14.318
ICS reserves the right to make changes in the device data identified in
this publication without further notice. ICS advises its customers to
obtain the latest version of all device data to verify that any
information being relied upon by the customer is current and accurate.
ICS9148-111
Pin Configuration
PIN NUMBER
1
2
3,9,16,22,27,
33,39,45
4
P I N NA M E
VDD1
REF0
TYPE
PWR
OUT
C P U 3 . 3 # _ 2 . 5 1,2
IN
GND
PWR
SDRAM 11
OUT
PCI_STOP#1
IN
SDRAM 10
OUT
SDRAM (0:9)
OUT
SDRAM clock outputs.
AGP_STOP#
IN
IN
5
X2
OUT
VDD2
PWR
PCICLK_F
OUT
7
FS11, 2
10, 11, 12, 13
14
15
17
18
28, 29, 31, 32, 34,
35,37,38
20
IN
PCICLK0
FS21, 2
PCICLK(1:4)
VDD5
BUFFERIN
OUT
IN
OUT
PWR
IN
CPU_STOP#1
IN
SDRAM9
21
PD#
OUT
IN
SDRAM8
OUT
19,30,36
VDD3
PWR
23
24
SDATA
SCLK
IN
IN
AGP0
OUT
25
MODE1, 2
26
41, 43, 44
40
42
46, 47
48
Ground
Crystal input, has internal load cap (33pF) and feedback
resistor from X2
Crystal output, nominally 14.318MHz. Has internal load
cap (33pF)
Supply for PCICLK_F and PCICLK (0:5), nominal 3.3V
Free running PCI clock output. Synchronous with CPUCLKs with 1-4ns skew
(CPU early) This is not affected by PCI_STOP#
Frequency select pin. Latched Input. Along with other FS pins determins the
CPU, SDRAM, PCI & AGP frewuencies.
PCI clock outputs. Synchrounous CPUCLKs with 1-4ns skew (CPU early)
Frequency select pin. Latched Input
PCI clock outputs. Synchrounous CPUCLKs with 1-4ns skew (CPU early)
Supply for fixed PLL, 48MHz, AGP0
Input pin for SDRAM buffers.
Halts CPUCLK (0:3) clocks at logic 0 level, when input low (in Mobile
Mode, MODE=0)
SDRAM clock output
Halts PCICLK(0:5) clocks at logic 0 level, when input low (In mobile mode,
MODE=0)
SDRAM clock output
X1
6
8
DESCRIPTION
Ref (0:2), XTAL power supply, nominal 3.3V
14.318 Mhz reference clock.
Indicates whether VDDL2 is 3.3V or 2.5V. High=2.5V CPU, LOW=3.3V
C P U 1. L a t c h e d i n p u t 2
IN
48MHz
OUT
FS01, 2
IN
CPUCLK(0:3)
SDRAM12
VDDL
AGP (1:2)
VDD4
OUT
OUT
PWR
OUT
PWR
This asynchronous input halts AGP(1:2) clocks at logic "0" level when input
low (in Mobile Mode, MODE=0) Does not affect AGP0
SDRAM clock output
This asyncheronous Power Down input Stops the VCO, crystal & internal
clocks when active, Low. (In Mobile Mode, MODE=0)
SDRAM clock output
Supply for SDRAM (0:11), CPU Core, 48MHz clocks,
nominal 3.3V.
Data input for I2C serial input.
Clock input of I2C input
Advanced Graphic Port output, powered by VDD4. Not affected by
AGP_STOP#
Pin 17, 18, 20 & 21 function select pin, 1=Desktop Mode, 0=Mobile Mode.
Latched Input.
48MHz output clock for USB timing.
Frequency select pin. Latched Input. Along with other FS pins determins the
CPU, SDRAM, PCI & AGP frewuencies.
CPU clock outputs, powered by VDDL2. Low if CPU_STOP#=Low
Feedback SDRAM clock output.
Supply for CPU (0:3), either 2.5V or 3.3V nominal
Advanced Graphic Port outputs, powered by VDD4.
Supply for AGP (0:2)
Notes:
1: Internal Pull-up Resistor of 240K to 3.3V on indicated inputs
2: Bidirectional input/output pins, input logic levels are latched at internal power-on-reset. Use 10Kohm resistor
to program logic Hi to VDD or GND for logic low.
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2
ICS9148-111
General Description
Power Groups
The ICS9148-111 is a single chip clock solution
for Desktop/
™
Notebook designs using the ALI (Aladdin V ) mobile style
chipset. It provides all necessary clock signals for such a
system.
VDD1 = REF (0:1), X1, X2
VDD2 = PCICLK_F, PCICLK(0:5)
VDD3 = SDRAM (0:12), supply for PLL core
VDD4 = AGP (1:2)
VDD5 = Fixed PLL, 48MHz , AGP0
VDDL = CPUCLK (0:2)
Spread spectrum may be enabled through I2C programming.
Spread spectrum typically reduces system EMI by 8dB to
10dB. This simplifies EMI qualification without resorting to
board design iterations or costly shielding. The ICS9148-111
employs a proprietary closed loop design, which tightly
controls the percentage of spreading over process and
temperature variations.
Serial programming I2C interface allows changing functions,
stop clock programming and frequency selection.
Mode Pin - Power Management Input Control
MODE, Pin 25
(Latched Input)
0
1
Pin 17
Pin 18
Pin 20
Pin 21
CPU_STOP#
(INPUT)
SDRAM 11
(OUTPUT)
PCI_STOP#
(INPUT)
SDRAM 10
(OUTPUT)
AGP_STOP#
(INPUT)
SDRAM 9
(OUTPUT)
PD#
(INPUT)
SDRAM 8
(OUTPUT)
Power Management Functionality
AGP_STOP# CPU_STOP# PCI_STOP#
AGP,
CPUCLK
Outputs
PCICLK
(0:5)
PCICLK_F,
REF, 48MHz
and SDRAM
Crystal
OSC
VCO
AGP(1:2)
1
0
1
Stopped Low
Running
Running
Running
Running
Running
1
1
1
Running
Running
Running
Running
Running
Running
1
1
0
Running
Stopped Low
Running
Running
Running
Running
0
1
1
Running
Running
Running
Running
Running
Stopped Low
CPU 3.3#_2.5V Buffer selector for CPUCLK drivers.
CPU3.3#_2.5
Input level
(Latched Data)
1
0
Buffer Selected for
operation at:
2.5V VDD
3.3V VDD
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3
ICS9148-111
General I2C serial interface information
The information in this section assumes familiarity with I2C programming.
For more information, contact ICS for an I2C programming application note.
How to Write:
How to Read:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Controller (host) sends a start bit.
Controller (host) sends the write address D2 (H)
ICS clock will acknowledge
Controller (host) sends a dummy command code
ICS clock will acknowledge
Controller (host) sends a dummy byte count
ICS clock will acknowledge
Controller (host) starts sending first byte (Byte 0)
through byte 5
• ICS clock will acknowledge each byte one at a time.
• Controller (host) sends a Stop bit
Controller (host) will send start bit.
Controller (host) sends the read address D3 (H)
ICS clock will acknowledge
ICS clock will send the byte count
Controller (host) acknowledges
ICS clock sends first byte (Byte 0) through byte 5
Controller (host) will need to acknowledge each byte
Controller (host) will send a stop bit
How to Write:
Controller (Host)
Start Bit
Address
D2(H)
ICS (Slave/Receiver)
How to Read:
Controller (Host)
Start Bit
Address
D3(H)
ACK
Dummy Command Code
ACK
ICS (Slave/Receiver)
ACK
Byte Count
Dummy Byte Count
ACK
ACK
ACK
ACK
ACK
ACK
ACK
ACK
ACK
ACK
ACK
ACK
ACK
ACK
Stop Bit
Byte 0
Byte 0
Byte 1
Byte 1
Byte 2
Byte 2
Byte 3
Byte 3
Byte 4
Byte 4
Byte 5
Byte 5
Stop Bit
Notes:
1.
2.
3.
4.
5.
6.
The ICS clock generator is a slave/receiver, I2C component. It can read back the data stored in the latches for
verification. Read-Back will support Intel PIIX4 "Block-Read" protocol.
The data transfer rate supported by this clock generator is 100K bits/sec or less (standard mode)
The input is operating at 3.3V logic levels.
The data byte format is 8 bit bytes.
To simplify the clock generator I2C interface, the protocol is set to use only "Block-Writes" from the controller. The
bytes must be accessed in sequential order from lowest to highest byte with the ability to stop after any complete byte
has been transferred. The Command code and Byte count shown above must be sent, but the data is ignored for those
two bytes. The data is loaded until a Stop sequence is issued.
At power-on, all registers are set to a default condition, as shown.
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4
ICS9148-111
Serial Configuration Command Bitmap
Byte0: Functionality and Frequency Select Register (default = 0)
Bit
Bit 7
Bit 6:4
Bit 3
Bit 2
Bit 1
Bit 0
Description
Must be 0 for normal operation
0 -- +/- 0.25% Spread Spectrum Modulation
1 -- +/- 0.6% Spread Spectrum Modulation
Bit6 Bit5 Bit4
CPU Clock
PCI
100
33.33
111
95.25
31.75
110
83.3
33.30
101
75
30.00
100
91.5
30.50
011
96.22
32.07
010
66.8
33.40
001
60
30.00
000
0 - Frequency is selected by hardware select, Latched inputs
1 - Frequency is selected by Bit 6:4 (above)
Must be 0 for normal operation
0 - Spread Spectrum center spread type.
1 - Spread Spectrum down spread type.
0 - Normal
1 - Spread Spectrum Enabled
0 - Running
1 - Tristate all outputs
PWD
0
AGP
66.67
63.50
66.60
60.00
61.00
64.15
66.80
60.00
Note 1
0
0
0
0
Note 1. Default at Power-up will be for latched logic inputs to define frequency. Bits 4, 5, 6 are default to 000, and if
bit 3 is written to a 1 to use Bits 6:4, then these should be defined to desired frequency at same write cycle.
Note: PWD = Power-Up Default
Byte 2: PCI Active/Inactive Register
(1 = enable, 0 = disable)
Byte 1: CPU, Active/Inactive Register
(1 = enable, 0 = disable)
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Pin #
40
41
43
44
PWD
1
1
1
1
1
1
1
1
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Description
(Reserved)
(Reserved)
(Reserved)
SDRAM12 (Act/Inact)
(Reserved)
CPUCLK2 (Act/Inact)
CPUCLK1 (Act/Inact)
CPUCLK0 (Act/Inact)
Notes:
1. Inactive means outputs are held LOW and are disabled
from switching.
Third party brands and names are the property of their respective owners.
Pin #
7
13
12
11
10
8
PWD
1
1
1
1
1
1
1
1
Description
(Reserved)
PCICLK_F (Act/Inact)
(Reserved)
PCICLK4 (Act/Inact)
PCICLK3 (Act/Inact)
PCICLK2 (Act/Inact)
PCICLK1 (Act/Inact)
PCICLK0(Act/Inact)
Notes:
1. Inactive means outputs are held LOW and are disabled
from switching.
5
ICS9148-111
Byte 4: SDRAM Active/Inactive Register
(1 = enable, 0 = disable)
Byte 3: SDRAM Active/Inactive Register
(1 = enable, 0 = disable)
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Pin #
28
29
31
32
34
35
37
38
PWD
1
1
1
1
1
1
1
1
Description
SDRAM7 (Act/Inact)
SDRAM6 (Act/Inact)
SDRAM5 (Act/Inact)
SDRAM4 (Act/Inact)
SDRAM3 (Act/Inact)
SDRAM2 (Act/Inact)
SDRAM1 (Act/Inact)
SDRAM0 (Act/Inact)
Notes:
1. Inactive means outputs are held LOW and are disabled
from switching.
Pin #
47
46
2
PWD
1
1
1
1
1
1
1
1
PWD
1
1
1
1
Bit 3
17
1
Bit 2
18
1
Bit 1
Bit 0
20
21
1
1
Description
AGP0 (Active/Inactive)
(Reserved)
(Reserved)
(Reserved)
SDRAM11 (Act/Inact)
(Desktop Mode Only)
SDRAM10 (Act/Inact)
(Desktop Mode Only)
SDRAM9 (Act/Inact)
SDRAM8 (Act/Inact)
Byte 6: Optional Register for Possible
Furture Requirements
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Description
(Reserved)
(Reserved)
(Reserved)
AGP1 (Act/Inact)
(Reserved)
(Reserved)
AGP2 (Act/Inact)
REF0 (Act/Inact)
Pin #
-
PWD
1
1
1
1
1
1
1
1
Description
(Reserved)
(Reserved)
(Reserved)
(Reserved)
(Reserved)
(Reserved)
(Reserved)
(Reserved)
Notes:
1. Byte 6 is reserved by Integrated Circuit Systems for
future applications.
Notes:
1. Inactive means outputs are held LOW and are disabled
from switching.
Third party brands and names are the property of their respective owners.
Pin #
25
-
Notes:
1. Inactive means outputs are held LOW and are disabled
from switching.
Byte 5: Peripheral Active/Inactive Register
(1 = enable, 0 = disable)
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit
Bit 7
Bit 6
Bit 5
Bit 4
6
ICS9148-111
Shared Pin Operation Input/Output Pins
These figures illustrate the optimal PCB physical layout
options. These configuration resistors are of such a large
ohmic value that they do not effect the low impedance clock
signals. The layouts have been optimized to provide as little
impedance transition to the clock signal as possible, as it
passes through the programming resistor pad(s).
Pins 2, 7, 8, 25 & 26 on the ICS9148-111 serve as dual signal
functions to the device. During initial power-up, they act as
input pins. The logic level (voltage) that is present on these
pins at this time is read and stored into a 4-bit internal data
latch. At the end of Power-On reset, (see AC characteristics
for timing values), the device changes the mode of operations
for these pins to an output function. In this mode the pins
produce the specified buffered clocks to external loads.
To program (load) the internal configuration register for these
pins, a resistor is connected to either the VDD (logic 1)
power supply or the GND (logic 0) voltage potential. A 10
Kilohm(10K) resistor is used to provide both the solid CMOS
programming voltage needed during the power-up
programming period and to provide an insignificant load on
the output clock during the subsequent operating period.
Figs. 1 and 2 show the recommended means of implementing
this function. In Fig. 1 either one of the resistors is loaded
onto the board (selective stuffing) to configure the device’s
internal logic. Figs. 2a and b provide a single resistor loading
option where either solder spot tabs or a physical jumper
header may be used.
Fig. 1
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7
ICS9148-111
Fig. 2a
Fig. 2b
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8
ICS9148-111
AGP_STOP# Timing Diagram
AGP_STOP# is an asychronous input to the clock synthesizer. It is used to turn off the AGP clocks. for low power operation.
AGP_STOP# is synchronized by the ICS9148-111. The AGPCLKs will always be stopped in a low state and start in such a
manner that guarantees the high pulse width is a full pulse. AGPCLK on latency is less than AGPCLK and AGPCLK off latency
is less than 4 AGPCLKs. This function is available only with MODE pin latched low.
Notes:
1. All timing is referenced to the internal CPUCLK.
2. AGP_STOP# is an asynchronous input and metastable conditions may exist.
This signal is synchronized to the CPUCLKs inside the ICS9148-111.
3. All other clocks continue to run undisturbed.
4. PD# and PCI_STOP# are shown in a high (true) state.
5. Only applies if MODE pin latched 0 at power up.
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9
ICS9148-111
CPU_STOP# Timing Diagram
CPU_STOP# is an asychronous input to the clock synthesizer. It is used to turn off the CPU clocks for low power operation.
CPU_STOP# is synchronized by the ICS9148-111. The minimum that the CPU clock is enabled (CPU_STOP# high pulse) is 100
CPU clocks. All other clocks will continue to run while the CPU clocks are disabled. The CPU clocks will always be stopped in
a low state and start in such a manner that guarantees the high pulse width is a full pulse. CPU clock on latency is less than 4
CPU clocks and CPU clock off latency is less than 4 CPU clocks.
Notes:
1. All timing is referenced to the internal CPU clock.
2. CPU_STOP# is an asynchronous input and metastable conditions may exist. This signal is synchronized
to the CPU clocks inside the ICS9148-111.
3. All other clocks continue to run undisturbed. (including SDRAM outputs).
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10
ICS9148-111
PCI_STOP# Timing Diagram
PCI_STOP# is an asynchronous input to the ICS9148-111. It is used to turn off the PCICLK (0:5) clocks for low power
operation. PCI_STOP# is synchronized by the ICS9148-111 internally. The minimum that the PCICLK (0:5) clocks are enabled
(PCI_STOP# high pulse) is at least 10 PCICLK (0:5) clocks. PCICLK (0:5) clocks are stopped in a low state and started with a full
high pulse width guaranteed. PCICLK (0:5) clock on latency cycles are only one rising PCICLK clock off latency is one PCICLK
clock.
Notes:
1. All timing is referenced to the Internal CPUCLK (defined as inside the ICS9148 device.)
2. PCI_STOP# is an asynchronous input, and metastable conditions may exist. This signal is required to be synchronized
inside the ICS9148.
3. All other clocks continue to run undisturbed.
4. CPU_STOP# is shown in a high (true) state.
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11
ICS9148-111
PD# Timing Diagram
The power down selection is used to put the part into a very low power state without turning off the power to the part. PD# is
an asynchronous active low input. This signal needs to be synchronized internal to the device prior to powering down the clock
synthesizer.
Internal clocks are not running after the device is put in power down. When PD# is active low all clocks need to be driven to a
low value and held prior to turning off the VCOs and crystal. The power up latency needs to be less than 3 mS. The power down
latency should be as short as possible but conforming to the sequence requirements shown below. PCI_STOP# and
CPU_STOP# are considered to be don't cares during the power down operations. The REF and 48MHz clocks are expected to
be stopped in the LOW state as soon as possible. Due to the state of the internal logic, stopping and holding the REF clock
outputs in the LOW state may require more than one clock cycle to complete.
Notes:
1. All timing is referenced to the Internal CPUCLK (defined as inside the ICS9148-111 device).
2. As shown, the outputs Stop Low on the next falling edge after PD# goes low.
3. PD# is an asynchronous input and metastable conditions may exist. This signal is synchronized inside this part.
4. The shaded sections on the VCO and the Crystal signals indicate an active clock.
5. Diagrams shown with respect to 133MHz. Similar operation when CPU is 100MHz.
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12
ICS9148-111
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND –0.5 V to V DD +0.5 V
Ambient Operating Temperature . . . . . . . . . . . . . 0°C to +70°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are
stress specifications only and functional operation of the device at these or any other conditions above those listed in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect product reliability.
Electrical Characteristics - Input/Supply/Common Output Parameters
TA = 0 - 70º C; Supply Voltage VDD=3.3 V +\- 5%, VDDL = 2.5 V +/- 5% (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
VIN = VDD
Input High Current
VIN = 0 V; Inputs with no pull-up resistors
IIL1
Input Low Current
VIN = 0 V; Inputs with pull-up resistors
IIL2
Input Low Current
I
Operating
DD3.3OP66 Select @ 66.8MHz; CL=0; all outputs running
IDD3.3OP100 Select @ 100MHz; CL=0; all outputs running
Supply Current
IDD3.3PD PD# = 0; Full capacitive loads
Power down Current
VDD = 3.3 V
Fi
Input frequency
1
C
Logic Inputs
Input Capacitance
IN
CINX
X1 & X2 pins
1
T
To first crossing of target Freq.
Transition Time
Trans
1
TS
From first crossing to 1% of target Freq.
Settling Time
1
T
From VDD = 3.3 V to 1% target Freq.
Clk Stabilization
STAB
TCPU-PCI VT=1.5 V; f=66/100 MHz; VDD=VDDL
1
T
VT=1.5 V; f=83/75 MHz; VDD=VDDL
Skew
CPU-PCI
TAGP-PCI VT = 1.5 V; AGP leads
1
Guaranteed by design, not 100% tested in production.
MIN
2
VSS-0.3
-5
-200
12
27
2
2
TYP
MAX UNITS
VDD+0.3
V
0.8
V
0.1
5
µA
2.0
µA
-100
µA
115
160
mA
140
190
mA
150
600
µA
14.318
16
MHz
5
pF
36
45
pF
0.65
2
ms
0.35
3
ms
<1.5
2
ms
2.5
4
ns
4.25
5
ns
400
700
ps
Electrical Characteristics - Input/Supply/Common Output Parameters
T A = 0 - 70º C; Supply Voltage VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5% (unless otherwise stated)
1
PARAM ETER
SYM BOL
Operating
Supply Current
IDD2.5 OP66
IDD2.5 OP10 0
CONDITIONS
Select @ 66.8M Hz; C L=0; all outputs running
Select @ 100M Hz; C L=0; all outputs running
Guaranteed by design, not 100% tested in production.
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13
M IN
TYP
M AX
UNITS
15
30
mA
18
35
mA
ICS9148-111
Electrical Characteristics - CPU3.3
TA = 0 - 70º C; VDD = VDDL = 3.3 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
IOH = -28 mA
VOH2B
Output High Voltage
VOL2B
IOL = 24 mA
Output Low Voltage
IOH2B
VOH =2.0 V
Output High Current
VOL = 0.8 V
IOL2B
Output Low Current
VOL = 0.4 V, VOH = 2.4 V
Rise Time
tr2B1
1
Fall Time
tf2B
VOH = 2.4 V, VOL = 0.4 V
Duty Cycle
dt2B1
VT = 1.5 V
1
Skew
tsk2B
VT = 1.5 V
Jitter, Single Edge
VT = 1.5 V; f=66/100 MHz
tjsrd2B1
VT = 1.5 V; f=75/83 MHz
Displacement2
1
Guaranteed by design, not 100% tested in production.
2
Edge displacement of a period relative to a 10-clock-cycle rolling average period.
MIN
2.5
33
45
TYP
2.6
0.34
-29
52
1
0.9
52
90
150
285
MAX UNITS
V
0.4
V
-23
mA
mA
2
ns
2
ns
55
%
175
ps
320
ps
550
ps
TYP
2.2
0.22
-20
39
1
0.9
51
110
170
MAX UNITS
V
0.4
V
-16
mA
mA
1.6
ns
1.6
ns
55
%
175
ps
340
ps
Electrical Characteristics - CPU2.5
TA = 0 - 70º C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
MIN
IOH = -8.0 mA
2
Output High Voltage
VOH2B
Output Low Voltage
VOL2B
IOL = 12 mA
Output High Current
IOH2B
VOH =1.7 V
Output Low Current
IOL2B
VOL = 0.7 V
19
1
Rise Time
tr2B
VOL = 0.4 V, VOH = 2.0 V
VOH = 2.0 V, VOL = 0.4 V
Fall Time
tf2B1
1
VT = 1.25 V
45
Duty Cycle
dt2B
1
VT = 1.25 V
Skew
tsk2B
Jitter, Single Edge
tjsrd2B1
VT = 1.25 V; f=66/100 MHz
2
Displacement
VT = 1.25 V; f=75/83 MHz
1
Guaranteed by design, not 100% tested in production.
Edge displacement of a period relative to a 10-clock-cycle rolling average period.
2
Third party brands and names are the property of their respective owners.
14
310
680
ps
ICS9148-111
Electrical Characteristics - PCICLK
TA = 0 - 70º C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 30 pF (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
MIN
VOH1
IOH = -28 mA
Output High Voltage
2.4
VOL1
IOL = 23 mA
Output Low Voltage
IOH1
VOH = 2.0 V
Output High Current
I
VOL = 0.8 V
Output Low Current
41
OL1
1
t
V
=
0.4
V,
V
=
2.4
V
Rise Time
r1
OL
OH
Fall Time1
1
Duty Cycle
tf1
VOH = 2.4 V, VOL = 0.4 V
dt1
VT = 1.5 V
45
1
tsk1
VT = 1.5 V
Skew
Jitter, Single Edge
VT = 1.5 V
tjsrd1
Displacement2
1
Guaranteed by design, not 100% tested in production.
2
Edge displacement of a period relative to a 10-clock-cycle rolling average period.
TYP
3
0.32
-60
54
1.6
MAX UNITS
V
0.4
V
-40
mA
mA
2
ns
1.3
2
ns
51
55
%
100
250
ps
220
500
ps
Electrical Characteristics - SDRAM
TA = 0 - 70º C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 30 pF (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
MIN
IOH = -24 mA
2.4
Output High Voltage
VOH3
Output Low Voltage
VOL3
IOL = 23 mA
Output High Current
IOH3
VOH = 2.0 V
Output Low Current
IOL3
VOL = 0.8 V
41
Rise Time
Tr31
VOL = 0.4 V, VOH = 2.4 V
VOH = 2.4 V, VOL = 0.4 V
Fall Time
Tf31
1
VT = 1.5 V
48
Duty Cycle
Dt3
VT = 1.5 V, Sdram 0,8,9,12 Window
Tsk1
VT = 1.5 V, Sdram 2,4,5,6 Window
Skew1
VT = 1.5 V, Sdram 1,3,7,10,11 Window
Tprop
VT = 1.5 V
Propagation Delay
1
Guarenteed by design, not 100% tested in production.
Third party brands and names are the property of their respective owners.
15
TYP
2.9
0.35
-68
53
1.4
1.4
54
140
120
140
3.5
MAX UNITS
V
0.4
V
-40
mA
mA
2
ns
2
ns
60
%
250
ps
4.5
ns
ICS9148-111
Electrical Characteristics - AGP
TA = 0 - 70º C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 30 pF (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
MIN
Output High Voltage
VOH1
IOH = -28 mA
2.4
IOL = 23 mA
Output Low Voltage
VOL1
VOH = 2.0 V
Output High Current
IOH1
VOL = 0.8 V
41
Output Low Current
IOL1
Rise Time1
Fall Time
1
tr1
VOL = 0.4 V, VOH = 2.4 V
tf1
VOH = 2.4 V, VOL = 0.4 V
VT = 1.5 V, AGP0
VT = 1.5 V, AGP1:2
Duty Cycle1
dt1
Skew1
Jitter, Single Edge
Displacement2
tsk1
tjsrd1
TYP
3
0.32
-60
54
MAX UNITS
V
0.4
V
-40
mA
mA
1.3
2
ns
1.2
51
53
2
55
58
ns
%
%
VT = 1.5 V
VT = 1.5 V, AGP0
110
660
250
1200
ps
ps
VT = 1.5 V, AGP1:2
310
650
ps
45
48
1
Guaranteed by design, not 100% tested in production.
Edge displacement of a period relative to a 10-clock-cycle rolling average period.
2
Electrical Characteristics - REF0, 48MHz
TA = 0 - 70º C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
MIN
IOH = -16 mA
2.4
Output High Voltage
VOH5
Output Low Voltage
VOL5
IOL = 9 mA
VOH = 2.0 V
Output High Current
IOH5
Output Low Current
IOL5
VOL = 0.8 V
16
TYP
2.6
0.24
-32
28
MAX UNITS
V
0.4
V
-22
mA
mA
Rise Time1
tr5
VOL = 0.4 V, VOH = 2.4 V
1.5
4
ns
Fall Time1
tf5
VOH = 2.4 V, VOL = 0.4 V
2.1
4
ns
Duty Cycle1
dt5
VT = 1.5 V, REF0
VT = 1.5 V, 48M
VT = 1.5 V, REF0
55
55
430
60
56
750
%
%
ps
790
350
520
1200
550
700
ps
ps
ps
Jitter, Single Edge
tjsrd5
2
Displacement
Jitter, Absolute1
tjabs5
50
46
VT = 1.5 V, 48M
VT = 1.5 V, REF0
VT = 1.5 V, 48M
-550
-700
1
Guaranteed by design, not 100% tested in production.
Edge displacement of a period relative to a 10-clock-cycle rolling average period.
2
Third party brands and names are the property of their respective owners.
16
ICS9148-111
General Layout Precautions:
1) Use a ground plane on the top routing
layer of the PCB in all areas not used
by traces.
Ferrite
Bead
VDD
2) Make all power traces and ground
traces as wide as the via pad for lower
inductance.
Notes:
1 All clock outputs should have
provisions for a 15pf capacitor
between the clock output and series
terminating resistor. Not shown in all
places to improve readability of
diagram.
C2
22µF/20V
Tantalum
1
48
2
47
2
3
46
C1
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
C1
3.3V Power Route
2 Optional crystal load capacitors are
recommended. They should be
included in the layout but not
inserted unless needed.
Ferrite
Bead
C2
22µF/20V
Tantalum
VDD
2.5V Power Route
Ground
3.3V Power Route
1
Component Values:
C1 : Crystal load values determined by user
C2 : 22µF/20V/D case/Tantalum
AVX TAJD226M020R
C3 : 15pF capacitor
FB = Fair-Rite products 2512066017X1
All unmarked capacitors are 0.01µF ceramic
Clock Load
C3
= Routed Power
= Ground Connection Key (component side copper)
= Ground Plane Connection
Connections to VDD:
= Power Route Connection
= Solder Pads
= Clock Load
Third party brands and names are the property of their respective owners.
17
ICS9148-111
SYMBOL
A
A1
A2
B
C
D
E
e
H
h
L
N
µ
X
COMMON DIMENSIONS
MIN.
NOM.
MAX.
.095
.101
.110
.008
.012
.016
.088
.090
.092
.008
.010
.0135
.005
.010
See Variations
.292
.296
.299
0.025 BSC
.400
.406
.410
.010
.013
.016
.024
.032
.040
See Variations
0°
5°
8°
.085
.093
.100
VARIATIONS
MIN.
.620
AC
D
NOM.
.625
N
MAX.
.630
48
SSOP Package
Ordering Information
ICS9148yF-111
Example:
ICS XXXX y F - PPP
Pattern Number (2 or 3 digit number for parts with ROM code patterns)
Package Type
F=SSOP
Revision Designator (will not correlate with datasheet revision)
Device Type (consists of 3 or 4 digit numbers)
Prefix
ICS, AV = Standard Device
Third party brands and names are the property of their respective owners.
18
ICS reserves the right to make changes in the device data identified in
this publication without further notice. ICS advises its customers to
obtain the latest version of all device data to verify that any
information being relied upon by the customer is current and accurate.