ICS ICSSSTVF16859YK

ICSSSTVF16859
Integrated
Circuit
Systems, Inc.
Advance Information
DDR 13-Bit to 26-Bit Registered Buffer
Q13A
Q12A
Q11A
Q10A
Q9A
VDDQ
GND
Q8A
Q7A
Q6A
Q5A
Q4A
Q3A
Q2A
GND
Q1A
Q13B
VDDQ
Q12B
Q11B
Q10B
Q9B
Q8B
Q7B
Q6B
GND
VDDQ
Q5B
Q4B
Q3B
Q2B
Q1B
Product Features:
• Differential clock signals
• Meets SSTL_2 signal data
• Supports SSTL_2 class I specifications on outputs
• Low-voltage operation
- VDD = 2.3V to 2.7V
• Available in 64 pin TSSOP and 56 pin MLF packages
Truth Table1
Inputs
Q Outputs
RESET#
CLK
CLK#
D
Q
L
X or
Floating
X or
Floating
X or
Floating
L
H
↑
↓
H
H
H
↑
↓
L
L
H
L or H
L or H
X
Q0(2)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
ICSSSTVF16859
Pin Configurations
Recommended Applications:
• DDR Memory Modules:
- DDRI (PC1600, PC2100)
- DDR333 (PC2700)
- DDRI-400 (PC3200)
• Provides complete DDR DIMM logic solution with
ICS93V857 or ICS95V857
• SSTL_2 compatible data registers
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VDDQ
GND
D13
D12
VDD
VDDQ
GND
D11
D10
D9
GND
D8
D7
RESET#
GND
CLK#
CLK
VDDQ
VDD
VREF
D6
GND
D5
D4
D3
GND
VDDQ
VDD
D2
D1
GND
VDDQ
64-Pin TSSOP
6.10 mm. Body, 0.50 mm. pitch
1.
2.
Q8A
VDDQ
Q9A
Q10A
Q11A
Q12A
Q13A
VDDQ
GND
D13
D12
VDD
VDDQ
D11
Notes:
H = "High" Signal Level
L = "Low" Signal Level
↑ = Transition "Low"-to-"High"
↓ = Transition "High"-to-"Low"
X = Don't Care
Output level before the indicated steady state
input conditions were established.
Block Diagram
CLK
CLK#
RESET#
D1
VREF
43
56
R
Q1A
CLK
D1
Q1B
Q7A 1
Q6A
Q5A
Q4A
Q3A
Q2A
Q1A
Q13B
VDDQ
Q12B
Q11B
Q10B
Q9B
Q8B 14
42 D10
ICSSSTVF16859
28
Q7B
Q6B
VDDQ
Q5B
Q4B
Q3B
Q2B
Q1B
VDDQ
D1
D2
VDD
VDDQ
D3
15
To 12 Other Channels
D9
D8
D7
RESET#
GND
CLK#
CLK
VDDQ
VDD
VREF
D6
D5
29 D4
56-Pin VFQFN (MLF2)
0776—03/18/03
ADVANCE INFORMATION documents contain information on products in the formative or design phase development. Characteristic data and other specifications are design goals.
ICS reserves the right to change or discontinue these products without notice. Third party brands and names are the property of their respective owners.
ICSSSTVF16859
Advance Information
General Description
The 13-bit-to-26-bit ICSSSTVF16859 is a universal bus driver designed for 2.3V to 2.7V VDD operation and SSTL_2
I/O levels, except for the LVCMOS RESET# input.
Data flow from D to Q is controlled by the differential clock (CLK/CLK#) and a control signal (RESET#). The positive
edge of CLK is used to trigger the data flow and CLK# is used to maintain sufficient noise margins where as RESET#,
an LVCMOS asynchronous signal, is intended for use at the time of power-up only. ICSSSTVF16859 supports lowpower standby operation. A logic level “Low” at RESET# assures that all internal registers and outputs (Q) are reset
to the logic “Low” state, and all input receivers, data (D) and clock (CLK/CLK#) are switched off. Please note that
RESET# must always be supported with LVCMOS levels at a valid logic state because VREF may not be stable during
power-up.
To ensure that outputs are at a defined logic state before a stable clock has been supplied, RESET# must be held
at a logic “Low” level during power up.
In the DDR DIMM application, RESET# is specified to be completely asynchronous with respect to CLK and CLK#.
Therefore, no timing relationship can be guaranteed between the two signals. When entering a low-power standby state,
the register will be cleared and the outputs will be driven to a logic “Low” level quickly relative to the time to disable
the differential input receivers. This ensures there are no glitches on the output. However, when coming out of low-power
standby state, the register will become active quickly relative to the time to enable the differential input receivers. When
the data inputs are at a logic level “Low” and the clock is stable during the “Low”-to-”High” transition of RESET# until
the input receivers are fully enabled, the design ensures that the outputs will remain at a logic “Low” level.
Pin Configuration (64-Pin TSSOP)
PIN NUMBER
PIN NAME
TYPE
1-5, 8-14, 16, 17, 19-25, 28-32
Q (13:1)
OUTPUT
DESCRIPTION
7, 15, 26, 34, 39, 43, 50, 54,
58, 63
GND
PWR
Ground
6, 18, 27, 33, 38, 47, 59, 64
VDDQ
PWR
Output supply voltage, 2.5V nominal
35, 36, 40-42, 44, 52, 53, 5557, 61, 62
D (13:1)
INPUT
Data input
Data output
48
CLK
INPUT
Positive master clock input
49
CLK#
INPUT
Negative master clock input
37, 46, 60
VDD
PWR
51
RESET#
INPUT
Reset (active low)
Core supply voltage, 2.5V nominal
45
VREF
INPUT
Input reference voltage, 2.5V nominal
Pin Configuration (56-Pin MLF2)
PIN NUMBER
PIN NAME
TYPE
1-8, 10-16, 18-22, 50-54, 56
Q (13:1)
OUTPUT
DESCRIPTION
Data output
37, 48
GND
PWR
9, 17, 23, 27, 34, 44, 49, 55
VDDQ
PWR
Ground
24, 25, 28-31, 39-43, 46, 47
D (13:1)
INPUT
Data input
Output supply voltage, 2.5V nominal
35
CLK
INPUT
Positive master clock input
36
CLK#
INPUT
Negative master clock input
26, 33, 45
VDD
PWR
38
RESET#
INPUT
Reset (active low)
Core supply voltage, 2.5V nominal
32
VREF
INPUT
Input reference voltage, 2.5V nominal
-
Center PAD
PWR
Ground (MLF2 package only)
0776—03/18/03
2
ICSSSTVF16859
Advance Information
Absolute Maximum Ratings
Storage Temperature . . . . . . . . . . . . . . . . . . . .
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Voltage1,2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Clamp Current . . . . . . . . . . . . . . . . . . . .
Output Clamp Current . . . . . . . . . . . . . . . . . . .
Continuous Output Current . . . . . . . . . . . . . . .
VDD, VDDQ or GND Current/Pin . . . . . . . . . . .
–65°C to +150°C
-0.5 to 3.6V
-0.5 to VDD +0.5
-0.5 to VDDQ +0.5
±50 mA
±50 mA
±50 mA
±100 mA
Package Thermal Impedance 3
55°C/W
...............
Notes:
1. The input and output negative voltage
ratings may be excluded if the input
and output clamp ratings are observed.
2. This current will flow only when the
output is in the high state level
V0 >VDDQ.
3. The package thermal impedance is
calculated in accordance with
JESD 51.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These
ratings are stress specifications only and functional operation of the device at these or any other conditions above those
listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect product reliability.
Recommended Operating Conditions - DDRI/DDR333 (PC1600, PC2100, PC2700)
PARAMETER
V DD
V DDQ
VREF
VTT
VI
VIH (DC)
VIH (AC)
VIL (DC)
VIL (DC)
VIH
VIL
VICR
VID
VIX
IOH
IOL
TA
DESCRIPTION
Supply Voltage
I/O Supply Voltage
Reference Voltage
Termination Voltage
Input Voltage
DC Input High Voltage
AC Input High Voltage
Data Inputs
DC Input Low Voltage
AC Input Low Voltage
Input High Voltage Level
RESET#
Input Low Voltage Level
Common mode Input Range
CLK, CLK#
Differential Input Voltage
Cross Point Voltage of Differential Clock
Pair
High-Level Output Current
Low-Level Output Current
Operating Free-Air Temperature
1
Guaranteed by design, not 100% tested in production.
0776—03/18/03
3
MIN
2.3
2.3
1.15
VREF - 0.04
0
VREF + 0.15
VREF + 0.31
TYP
2.5
2.5
1.25
V REF
MAX
2.7
2.7
1.35
V REF + 0.04
V DDQ
UNITS
VREF - 0.15
VREF - 0.31
V
1.7
0.97
0.36
0.7
1.53
(V DDQ/2) - 0.2
(VDDQ/2) + 0.2
0
-16
16
70
mA
°C
ICSSSTVF16859
Advance Information
Recommended Operating Conditions - DDRI-400 (PC3200)
PARAMETER
V DD
V DDQ
VREF
VTT
VI
VIH (DC)
VIH (AC)
VIL (DC)
VIL (DC)
VIH
VIL
VICR
VID
VIX
IOH
IOL
TA
DESCRIPTION
Supply Voltage
I/O Supply Voltage
Reference Voltage
Termination Voltage
Input Voltage
DC Input High Voltage
AC Input High Voltage
Data Inputs
DC Input Low Voltage
AC Input Low Voltage
Input High Voltage Level
RESET#
Input Low Voltage Level
Common mode Input Range
CLK, CLK#
Differential Input Voltage
Cross Point Voltage of Differential Clock
Pair
High-Level Output Current
Low-Level Output Current
Operating Free-Air Temperature
1
Guaranteed by design, not 100% tested in production.
0776—03/18/03
4
MIN
2.5
2.5
1.25
VREF - 0.04
0
VREF + 0.15
VREF + 0.31
TYP
2.6
2.6
1.3
V REF
MAX
2.7
2.7
1.35
V REF + 0.04
V DDQ
UNITS
VREF - 0.15
VREF - 0.31
V
1.7
0.97
0.36
0.7
1.53
(V DDQ/2) - 0.2
(VDDQ/2) + 0.2
0
-16
16
70
mA
°C
ICSSSTVF16859
Advance Information
DC Electrical Characteristics - DDRI/DDR333 (PC1600, PC2100, PC2700)
TA = 0 - 70°C; VDD = 2.5 +/-0.2V, V DDQ=2.5 +/-0.2V; (unless otherwise stated)
SYMBOL
VIK
VOH
VOL
II
I DD
I DDD
rOH
rOL
rO(D)
Ci
CONDITIONS
PARAMETERS
VDDQ
I I = -18mA
MIN
TYP
2.3V
I OH = -100µA
2.3V-2.7V
I OH = -8mA
I OL = 100µA
I OL = 8mA
All Inputs
V I = VDD or GND
Standby (Static)
RESET# = GND
V I = VIH(AC) or V IL(AC),
Operating (Static)
RESET# = VDD
RESET# = VDD,
Dynamic operating
V I = VIH(AC) or V IL(AC),
(clock only)
CLK and CLK# switching
50% duty cycle.
IO = 0
RESET# = VDD,
V I = VIH(AC) or V IL (AC),
Dynamic Operating CLK and CLK# switching
(per each data input) 50% duty cycle. One data
input switching at half
clock frequency, 50%
duty cycle
I OH = -16mA
Output High
Output Low
I OL = 16mA
[rOH - rOL] each
I O = 20mA, TA = 25° C
separate bit
Data Inputs
V I = VREF ±350mV
V ICR = 1.25V, V I(PP) = 360mV
CLK and CLK#
2.3V
2.3V-2.7V
2.3V
2.7V
Notes:
1 - Guaranteed by design, not 100% tested in production.
0776—03/18/03
5
MAX
UNITS
-1.2
V DDQ 0.2
1.95
V
0.2
0.35
±5
0.01
µA
µA
25
mA
30
µ/clock
MHz
10
µA/ clock
MHz/data
2.7V
2.3V-2.7V
2.3V-2.7V
7
7
2.5V
2.5V
2.5
2.5
13.5
13
20
20
Ω
Ω
4
Ω
3.5
3.5
pF
ICSSSTVF16859
Advance Information
DC Electrical Characteristics - DDRI-400 (PC3200)
TA = 0 - 70°C; VDD = 2.5 +/-0.2V, V DDQ=2.5 +/-0.2V; (unless otherwise stated)
SYMBOL
VIK
VOH
VOL
II
I DD
I DDD
rOH
rOL
rO(D)
Ci
CONDITIONS
PARAMETERS
VDDQ
I I = -18mA
MIN
TYP
2.5V
I OH = -100µA
2.5V-2.7V
I OH = -8mA
I OL = 100µA
I OL = 8mA
All Inputs
V I = VDD or GND
Standby (Static)
RESET# = GND
V I = VIH(AC) or V IL(AC),
Operating (Static)
RESET# = VDD
RESET# = VDD,
Dynamic operating
V I = VIH(AC) or V IL(AC),
(clock only)
CLK and CLK# switching
50% duty cycle.
IO = 0
RESET# = VDD,
V I = VIH(AC) or V IL (AC),
Dynamic Operating CLK and CLK# switching
(per each data input) 50% duty cycle. One data
input switching at half
clock frequency, 50%
duty cycle
I OH = -16mA
Output High
Output Low
I OL = 16mA
[rOH - rOL] each
I O = 20mA, TA = 25° C
separate bit
Data Inputs
V I = VREF ±350mV
V ICR = 1.25V, V I(PP) = 360mV
CLK and CLK#
2.7V
2.5V-2.7V
2.5V
2.7V
Notes:
1 - Guaranteed by design, not 100% tested in production.
0776—03/18/03
6
MAX
UNITS
-1.2
V DDQ 0.2
1.95
V
0.2
0.35
±5
0.01
µA
µA
25
mA
30
µ/clock
MHz
10
µA/ clock
MHz/data
2.7V
2.5V-2.7V
2.5V-2.7V
7
7
2.6V
2.6V
2.5
2.5
13.5
13
20
20
Ω
Ω
4
Ω
3.5
3.5
pF
ICSSSTVF16859
Advance Information
Timing Requirements1
(over recommended operating free-air temperature range, unless otherwise noted)
VDDQ = 2.5V ± 0.2V
PARAMETERS
SYMBOL
MIN
MAX
Clock frequency
270
fclock
Output slew rate
1
4
tSL
0.4
Setup time, fast slew rate 2 & 4
Data before CLK↑ , CLK#↓
tS
0.6
Setup time, slow slew rate 3 & 4
2&4
0.4
Hold time, fast slew rate
Th
Data after CLK↑ , CLK#↓
0.5
Hold time, slow slew rate 3 & 4
1 - Guaranteed by design, not 100% tested in production.
Notes:
2 - For data signal input slew rate of ≥ 1V/ns.
3 - For data signal input slew rate of ≥ 0.5V/ns and < 1V/ns.
4 - CLK, CLK# signals input slew rate of ≥ 1V/ns.
UNITS
Switching Characteristics - DDRI/DDR333 (PC1600, PC2100, PC2700)
(over recommended operating free-air temperature range, unless otherwise noted) (see Figure 1)
V DD = 2.5V ±0.2V
From
To
SYMBOL
UNITS
(Input)
(Output)
MIN
TYP
MAX
210
MHz
fmax
CLK, CLK# (TSSOP)
Q
1.6
2.1
2.6
ns
tPD
CLK, CLK# (VFQFN[MLF2])
Q
1.6
2.1
2.6
ns
RESET#
Q
3.5
ns
tphl
Switching Characteristics - DDRI-400 (PC3200)
(over recommended operating free-air temperature range, unless otherwise noted) (see Figure 1)
V DD = 2.6V ±0.1V
From
To
SYMBOL
UNITS
(Input)
(Output)
MIN
TYP
MAX
210
MHz
fmax
Q
1.1
2.2
ns
tPD
(VFQFN[MLF2])
tPDSS
Q
2.48
ns
RESET#
Q
3.5
ns
tphl
0776—03/18/03
7
MHz
V/ns
ns
ns
ns
ns
ICSSSTVF16859
Advance Information
Test Point
From Output
Under Test
CL = 30 pF
(see Note 1)
500Ω
Load Circuit
LVCMOS
RESET#
Input
VDDQ
VDDQ/2
VDDQ/2
tinact
VI(pp)
0V
Timing
Input
tact
IDD
(see note 2)
tPHL
90% IDDH
10%
VICR
VICR
IDDL
tPHL
VTT
Voltage and Current Waveforms
Inputs Active and Inactive Times
VTT
VOH
VOL
Output
Voltage Waveforms - Propagation Delay Times
tw
VIH
VREF
Input
VREF
VIL
Voltage Waveforms - Pulse Duration
LVCMOS
RESET#
Input
VI(pp)
Timing
Input
VDD/2
VIL
VICR
tPHL
tS
Input
VIH
VREF
VOH
Output
th
VTT
VOL
VIH
VREF
Voltage Waveforms - Propagation Delay Times
VIL
Voltage Waveforms - Setup and Hold Times
Figure 1 - Parameter Measurement Information (VDDQ = 2.5V ±0.2V)
Notes:
1. CL incluces probe and jig capacitance.
2. IDD tested with clock and data inputs held at VDDQ or GND, and IO = 0 mA.
3. All input pulses are supplied by generators having the following characteristics: PRR @10 MHz,
Zo=50Ω, input slew rate = 1 V/ns ±20% (unless otherwise specified).
4. The outputs are measured one at a time with one transition per measurement.
5. VTT = VREF = VDDQ/2
6. VIH = VREF + 310mV (AC voltage levels) for differential inputs. VIH = VDDQ for LVCMOS input.
7. VIL = VREF - 310mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS input.
8. tPLH and tPHL are the same as tpd
0776—03/18/03
8
ICSSSTVF16859
Advance Information
c
N
In Millimeters
In Inches
SYMBOL COMMON DIMENSIONS COMMON DIMENSIONS
MIN
MAX
MIN
MAX
A
-1.20
-.047
A1
0.05
0.15
.002
.006
A2
0.80
1.05
.032
.041
b
0.17
0.27
.007
.011
c
0.09
0.20
.0035
.008
SEE VARIATIONS
SEE VARIATIONS
D
8.10 BASIC
0.319 BASIC
E
E1
6.00
6.20
.236
.244
0.50 BASIC
0.020 BASIC
e
L
0.45
0.75
.018
.030
SEE VARIATIONS
SEE VARIATIONS
N
0°
8°
0°
8°
α
aaa
-0.10
-.004
L
E1
INDEX
AREA
E
1 2
D
A
A2
A1
VARIATIONS
-Ce
N
SEATING
PLANE
b
64
aaa C
D mm.
MIN
MAX
16.90
17.10
D (inch)
MIN
.665
Ref erence Doc.: JEDEC Publication 95, M O-153
10-0039
6.10 mm. Body, 0.50 mm. pitch TSSOP
(0.020 mil)
(240 mil)
Ordering Information
ICSSSTVF16859yG-T
Example:
ICS XXXX y G - PPP - T
Designation for tape and reel packaging
Pattern Number (2 or 3 digit number for parts with ROM code patterns)
Package Type
G = TSSOP
Revision Designator (will not correlate with datasheet revision)
Device Type (consists of 3 or 4 digit numbers)
Prefix
ICS, AV = Standard Device
0776—03/18/03
9
MAX
.673
ICSSSTVF16859
Advance Information
Symbol
Common Dime ns ions
A
-
0.85
1.00
A1
0.00
0.01
0.05
A2
-
0.65
0.80
A3
56 pin MLF2
0.20 BSC
D
8.00 BSC
D1
7.75 BSC
E
8.00 BSC
E1
7.75 BSC
Θ
12
P
0.24
0.42
0.60
R
0 . 13
0.17
0.23
Pitch Varation D
e
0.50 BSC
N
56
Nd
14
Ne
Ordering Information
ICSSSTVF16859yK
Example:
14
L
0.30
0.40
0.50
b
0.18
0.23
0.30
Q
0.00
0.20
0.45
D2
4.35
4.50
4.65
E2
5.05
5.20
5.35
ICS XXXX y K - PPP - T
Designation for tape and reel packaging
Pattern Number (2 or 3 digit number for parts with ROM code patterns)
Package Type
K = MLF
Revision Designator (will not correlate with datasheet revision)
Device Type (consists of 3 or 4 digit numbers)
Prefix
ICS, AV = Standard Device
0776—03/18/03
10