TI SN74AUC244RGYR

SN74AUC244
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES432 – MARCH 2003
D
VCC
1
20
19 2OE
18 1Y1
2
3
17 2A4
16 1Y2
4
5
15 2A3
14 1Y3
6
7
13 2A2
12 1Y4
8
9
10
11
2A1
D
D
D
D
D
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
1OE
D
RGY PACKAGE
(TOP VIEW)
Optimized for 1.8-V Operation and is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub 1-V Operable
Max tpd of 1.9 ns at 1.8 V
Low Power Consumption, 20-µA Max ICC
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
GND
D
description/ordering information
This octal buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC244 is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is
low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
ORDERABLE
PART NUMBER
PACKAGE†
TOP-SIDE
MARKING
–40°C to 85°C QFN – RGY
Tape and reel
SN74AUC244RGYR
MS244
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
(each 4-bit buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74AUC244
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES432 – MARCH 2003
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.6 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.6 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 2): . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-5.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74AUC244
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES432 – MARCH 2003
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VCC = 0.8 V
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
MIN
MAX
0.8
2.7
VCC
0.65 × VCC
Output voltage
High-level output current
0
0.35 × VCC
∆t/∆v
Low-level output current
V
0.7
3.6
V
Active state
0
3-state
0
VCC
3.6
V
VCC = 1.4 V
VCC = 1.65 V
VCC = 2.3 V
VCC = 0.8 V
IOL
V
0
VCC = 0.8 V
VCC = 1.1 V
IOH
V
1.7
VCC = 0.8 V
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
VO
UNIT
–0.7
–3
–5
–9
0.7
VCC = 1.1 V
VCC = 1.4 V
3
VCC = 1.65 V
VCC = 2.3 V
8
Input transition rise or fall rate
mA
–8
5
mA
9
20
ns/V
TA
Operating free-air temperature
–40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74AUC244
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES432 – MARCH 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
0.8 V to 2.7 V
IOH = –100 µA
IOH = –0.7 mA
VOH
VOL
II
Ioff
A and OE inputs
MIN
TYP†
MAX
0.8 V
0.55
IOH = –3 mA
IOH = –5 mA
1.1 V
0.8
1.4 V
1
IOH = –8 mA
IOH = –9 mA
1.65 V
1.2
2.3 V
1.8
IOL = 100 µA
IOL = 0.7 mA
0.8 V to 2.7 V
V
0.2
0.8 V
0.25
IOL = 3 mA
IOL = 5 mA
1.1 V
0.3
1.4 V
0.4
IOL = 8 mA
IOL = 9 mA
1.65 V
0.45
2.3 V
0.6
VI = VCC or GND
VI or VO = 2.7 V
IOZ
ICC
VO = VCC or GND
VI = VCC or GND,
Ci
VI = VCC or GND
0 to 2.7 V
0
2.7 V
IO = 0
0.8 V to 2.7 V
Co
VO = VCC or GND
† All typical values are at TA = 25°C.
UNIT
VCC–0.1
V
±5
µA
±10
µA
±10
µA
20
µA
2.5 V
2
3
pF
2.5 V
5.5
6
pF
switching characteristics over recommended operating free-air temperature range, CL = 15 pF
(unless otherwise noted) (see Figure 1)
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
TYP
MIN
MAX
MIN
MAX
MIN
TYP
MAX
MIN
MAX
tpd
A
Y
6.5
1.1
3.7
0.6
2.3
0.5
1.1
1.9
0.4
1.5
ns
ten
OE
Y
8
1.2
4.5
0.7
2.8
0.6
1.2
2.3
0.5
1.7
ns
tdis
OE
Y
10.4
1.7
6
1.1
4
1.7
2.4
4.2
0.6
3.8
ns
PARAMETER
UNIT
switching characteristics over recommended operating free-air temperature range, CL = 30 pF
(unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
ten
tdis
PARAMETER
4
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
UNIT
MIN
TYP
MAX
MIN
MAX
Y
0.8
1.5
2.5
0.7
1.9
ns
OE
Y
0.8
1.7
3.1
0.7
2.3
ns
OE
Y
1.7
2.4
4.2
0.5
2.3
ns
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74AUC244
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES432 – MARCH 2003
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power
dissipation
capacitance
Outputs
enabled
Outputs
disabled
TEST
CONDITIONS
VCC = 0.8 V
TYP
VCC = 1.2 V
TYP
VCC = 1.5 V
TYP
VCC = 1.8 V
TYP
VCC = 2.5 V
TYP
21
21
22
23
30
3
3
3
3.5
4.5
f = 10 MHz
UNIT
pF
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN74AUC244
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES432 – MARCH 2003
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
VCC
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
LOAD CIRCUIT
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
CL
RL
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
V∆
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
0.15 V
0.15 V
VCC
Timing Input
VCC/2
0V
tw
tsu
VCC
VCC/2
Input
VCC/2
th
VCC
VCC/2
Data Input
VCC/2
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
VCC/2
Input
VCC/2
0V
tPHL
tPLH
VOH
VCC/2
Output
VCC/2
VOL
tPHL
VCC/2
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VCC/2
0V
tPLZ
tPZL
VCC
VCC/2
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
tPZH
VOH
Output
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
VCC/2
VCC
Output
Control
VCC/2
VOH – V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AUC244RGYR
ACTIVE
VQFN
RGY
20
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74AUC244RGYRG4
ACTIVE
VQFN
RGY
20
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Dec-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74AUC244RGYR
Package Package Pins
Type Drawing
VQFN
RGY
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
12.4
Pack Materials-Page 1
3.8
B0
(mm)
K0
(mm)
P1
(mm)
4.8
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Dec-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUC244RGYR
VQFN
RGY
20
3000
190.5
212.7
31.8
Pack Materials-Page 2
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