IXYS IXKN75N60C

CoolMOS Power MOSFET
IXKN 75N60C
VDSS
ID25
RDS(on)
600 V
75 A
Ω
35 mΩ
N-Channel Enhancement Mode
Low RDSon, High VDSS MOSFET
Preliminary
miniBLOC, SOT-227 B
E72873
MOSFET
Symbol
Conditions
VDSS
TVJ = 25°C to 150°C
Maximum Ratings
S
VGS
ID25
ID90
dv/dt
V
±20
V
75
50
A
A
TC = 25°C
TC = 90°C
VDS < VDSS; IF ≤ 100A;diF/dt≤ 200A/µs
TVJ = 150°C
EAS
EAR
ID = 10 A; L = 36 mH; TC = 25°C
ID = 20 A; L = 5 µH; TC = 25°C
Symbol
Conditions
6
VGS = 10 V; ID = ID90
VGSth
VDS = 20 V; ID = 5 mA;
IDSS
VDS = VDSS; VGS = 0 V; TVJ = 25°C
TVJ = 125°C
S
D
G = Gate
S = Source
1.8
1
J
mJ
30
3.5
5.5
0.1
VGS = ±20 V; VDS = 0 V
miniBLOC package
- Electrically isolated copper base
- Low coupling capacitance to the heatsink for
reduced EMI
- High power dissipation due to AlN
ceramic substrate
- International standard package SOT-227
- Easy screw assembly
●
fast CoolMOS power MOSFET - 2nd generation
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped
inductive switching (UIS)
- Low thermal resistance
due to reduced chip thickness
●
Enhanced total power density
200 nA
nC
nC
nC
td(on)
tr
td(off)
tf
VGS= 10 V; VDS = 380 V;
ID = 50 A; RG = 1 Ω
30
95
100
10
ns
ns
ns
ns
RthJC
●
0.05 mA
mA
440
112
246
(reverse conduction) IF = 37.5 A; VGS = 0 V
Features
V
VGS= 10 V; VDS = 350 V; ID = 100 A
0.9
1.1
V
Applications
●
●
●
0.22 K/W
D = Drain
Either source terminal at miniBLOC can be used
as main or kelvin source
35 mΩ
Qg
Qgs
Qgd
VF
G
V/ns
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min.
typ. max.
RDSon
IGSS
600
●
●
Switched mode power supplies (SMPS)
Uninterruptible power supplies (UPS)
Power factor correction (PFC)
Welding
Inductive heating
CoolMOS is a trademark of
130
Infineon Technologies AG.
IXYS reserves the right to change limits, test conditions and dimensions.
© 2001 IXYS All rights reserved
1-3
IXKN 75N60C
Component
miniBLOC, SOT-227 B
Symbol
Conditions
VISOL
IISOL ≤ 1 mA; 50/60 Hz
TVJ
Tstg
Md
mounting torque
terminal connection torque (M4)
Symbol
Conditions
RthCH
with heatsink compound
Weight
Maximum Ratings
2500
V~
-40...+150
-40...+125
°C
°C
1.5
1.5
Nm
Nm
Characteristic Values
min.
typ. max.
0.1
K/W
30
g
M4 screws (4x) supplied
Dim.
© 2001 IXYS All rights reserved
Millimeter
Min.
Max.
Inches
Min.
Max.
A
B
31.50
7.80
31.88
8.20
1.240
0.307
1.255
0.323
C
D
4.09
4.09
4.29
4.29
0.161
0.161
0.169
0.169
E
F
4.09
14.91
4.29
15.11
0.161
0.587
0.169
0.595
G
H
30.12
37.80
30.30
38.20
1.186
1.489
1.193
1.505
J
K
11.68
8.92
12.22
9.60
0.460
0.351
0.481
0.378
L
M
0.76
12.60
0.84
12.85
0.030
0.496
0.033
0.506
N
O
25.15
1.98
25.42
2.13
0.990
0.078
1.001
0.084
P
Q
4.95
26.54
5.97
26.90
0.195
1.045
0.235
1.059
R
S
3.94
4.72
4.42
4.85
0.155
0.186
0.174
0.191
T
U
24.59
-0.05
25.07
0.1
0.968
-0.002
0.987
0.004
V
W
3.30
0.780
4.57
0.830
0.130
19.81
0.180
21.08
2-3
IXKN 75N60C
250
0.16
VGS = 18 - 12 V
A
10 V
VGS = 8 V
Ω
200
0.12
TVJ = 25°C
ID
TVJ = 25°C
RDSon
150
0.08
8V
10 V
100
0.04
50
0
12-18 V
0.00
0
4
8
12
16
V 20
0
50
100
200 A 250
150
ID
VDS
Fig. 1: typ. Output Characteristics
Fig. 2: typ. RDSon vs. Drain Current
0.10
250
Ω
TVJ = 25°C
A
0.08
ID 200
RDSon
0.06
TVJ = 125°C
150
ID = 50 A
0.04
100
0.02
50
0.00
0
-40
0
40
120 °C 160
80
0
2
4
6
TVJ
Fig. 3: typ. RDSon vs. Junction Temperature
Fig. 4: typ. Input Admittance
16
1
V
14
VGS
10 V 12
8
VGS
K/W
0.1
12
10
ZthJC
0.01
8
6
single pulse
4
0.001
2
0
0
100
200
300
400
500
nC
600
700
QG
Fig. 5: typ. Gate Charge Characteristic Curve
© 2001 IXYS All rights reserved
0.0001
0.00001 0.0001 0.001
IXKN75N60C
0.01
0.1
1
s 10
t
Fig. 6: typ. Transient Thermal Impedance
3-3