DSEP 30-12CR Advanced Technical Information HiPerDynFREDTM IFAV = 30 A VRRM = 1200 V trr = 20 ns with soft recovery (Electrically Isolated Back Surface) VRSM VRRM V V 1200 1200 Type A C ISOPLUS 247TM C A Isolated back surface * DSEP 30-12CR A = Anode, C = Cathode * Patent pending Conditions Maximum Ratings IFRMS IFAVM IFRM TC = 85°C; rectangular, d = 0.5 tP < 10 µs; rep. rating, pulse width limited by TVJM IFSM TVJ = 45°C; tp = 10 ms (50 Hz), sine EAS 70 30 tbd A A A 250 A TVJ = 25°C; non-repetitive IAS = 1.3 A; L = 180 µH 0.2 mJ VA = 1.25·VR typ.; f = 10 kHz; repetitive 0.1 A -55...+175 175 -55...+150 °C °C °C Features ● ● ● ● IAR TVJ TVJM Tstg Ptot TC = 25°C 165 W VISOL 50/60 Hz RMS; IISOL ≤ 1 mA 2.5 kV 10...50/2...10 N/lb. 6 g Mounting force with clip Weight typical ● ● ● ● ● ● Applications ● ● ● Symbol IR ① Conditions Characteristic Values typ. max. TVJ = 25°C VR = VRRM TVJ = 150°C VR = VRRM 250 2 µA mA VF ② IF = 30 A; 3.1 5.0 V V RthJC RthCH 0.9 with heatsink compound 0.25 K/W K/W IF = 1 A; -di/dt = 200 A/µs; VR = 30 V; TVJ = 25°C 20 VR = 100 V; IF = 50 A; -diF/dt = 100 A/µs TVJ = 100°C 4.0 t rr IRM TVJ = 150°C TVJ = 25°C ● ● ● ● ● Antiparallel diode for high frequency switching devices Antisaturation diode Snubber diode Free wheeling diode in converters and motor control circuits Rectifiers in switch mode power supplies (SMPS) Inductive heating Uninterruptible power supplies (UPS) Ultrasonic cleaners and welders Advantages ● ns ● A Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation Low cathode to tab capacitance (<25pF) International standard package Planar passivated chips Very short recovery time Extremely low switching losses Low IRM-values Soft recovery behaviour Epoxy meets UL 94V-0 Isolated and UL registered E153432 ● Avalanche voltage rated for reliable operation Soft reverse recovery for low EMI/RFI Low IRM reduces: - Power dissipation within the diode - Turn-on loss in the commutating switch ISOPLUS 247TM package for clip or spring mounting Pulse test: ① Pulse Width = 5 ms, Duty Cycle < 2.0 % ② Pulse Width = 300 µs, Duty Cycle < 2.0 % ● Data according to IEC 60747 and per diode unless otherwise specified Dimensions see IXYS CD 2000 IXYS reserves the right to change limits, test conditions and dimensions. © 2000 IXYS All rights reserved 008 Symbol 1-1