SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 D D D D Member of the Texas Instruments Widebus Family Compatible With IEEE Std 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture Includes D-Type Flip-Flops and Control Circuitry to Provide Multiplexed Transmission of Stored and Real-Time Data Two Boundary-Scan Cells Per I/O for Greater Flexibility D SCOPE Instruction Set – IEEE Std 1149.1-1990 Required Instructions, Optional INTEST, and P1149.1A CLAMP and HIGHZ – Parallel Signature Analysis at Inputs With Masking Option – Pseudorandom Pattern Generation From Outputs – Sample Inputs/Toggle Outputs – Binary Count From Outputs – Device Identification – Even-Parity Opcodes 1A2 1A1 1OE GND 1SAB 1CLKAB TDO V CC TMS 1CLKBA 1SBA 1DIR GND 1B1 1B2 1B3 PM PACKAGE (TOP VIEW) 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1A3 1A4 1A5 GND 1A6 1A7 1A8 1A9 VCC 2A1 2A2 2A3 GND 2A4 2A5 2A6 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 1B4 1B5 1B6 GND 1B7 1B8 1B9 VCC 2B1 2B2 2B3 2B4 GND 2B5 2B6 2B7 2A7 2A8 2A9 GND 2OE 2SAB 2CLKAB TDI VCC TCK 2CLKBA 2SBA GND 2DIR 2B9 2B8 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 description This scan test device with a 18-bit bus transceiver and register is a member of the Texas Instruments SCOPE testability IC family. This device supports IEEE Std 1149.1-1990 boundary scan to facilitate testing of complex circuit board assemblies. Scan access to the test circuitry is accomplished via the four-wire test access port (TAP) interface. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SCOPE and Widebus are trademarks of Texas Instruments. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 description (continued) In the normal mode, this device is an 18-bit bus transceiver and register that allows for multiplexed transmission of data directly from the input bus or from the internal registers. It can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self-test on the boundary test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPE bus transceivers and registers. Transceiver function is controlled by output-enable (OE) and direction (DIR) inputs. When OE is low, the transceiver is active and operates in the A-to-B direction when DIR is high or in the B-to-A direction when DIR is low. When OE is high, both the A and B outputs are in the high-impedance state, effectively isolating both buses. Data flow is controlled by clock (CLKAB and CLKBA) and select (SAB and SBA) inputs. Data on the A bus is clocked into the associated registers on the low-to-high transition of CLKAB. When SAB is low, real-time A data is selected for presentation to the B bus (transparent mode). When SAB is high, stored A data is selected for presentation to the B bus (registered mode). The function of the CLKBA and SBA inputs mirrors that of CLKAB and SAB, respectively. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the SN74ABT18646. In the test mode, the normal operation of the SCOPE bus transceivers and registers is inhibited, and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry can perform boundary scan test operations according to the protocol described in IEEE Std 1149.1-1990. Four dedicated test pins are used to observe and control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry can perform other testing functions, such as parallel signature analysis on data inputs and pseudorandom pattern generation from data outputs. All testing and scan operations are synchronized to the TAP interface. Additional flexibility is provided in the test mode through the use of two boundary scan cells (BSCs) for each I/O pin. This allows independent test data to be captured and forced at either bus (A or B). A PSA/COUNT instruction is also included to ease the testing of memories and other circuits where a binary count addressing scheme is useful. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°C LQFP – PM Tray SN74ABT18646PM ABT18646 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 FUNCTION TABLE (normal mode, each 9-bit section) INPUTS DATA I/O OPERATION OR FUNCTION OE DIR CLKAB CLKBA SAB SBA A1–A9 B1–B9 X X ↑ X X X Input Unspecified† X X X ↑ X X Unspecified† Input H X ↑ ↑ X X Input Input Store A and B data H X L L X X Input disabled Input disabled Isolation, hold storage L L X X X L Output Input Real-time B data to A bus Store A, B unspecified† Store B, A unspecified† L L X X X H Output Input disabled Stored B data to A bus L H X X L X Input Output Real-time A data to B bus L H L X H X Input disabled Output Stored A data to B bus † The data output functions can be enabled or disabled by various signals at the OE and DIR inputs. Data input functions are always enabled; i.e., data at the bus terminals is stored on every low-to-high transition of the clock inputs. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER OE L DIR L CLKAB CLKBA X X SAB X BUS B BUS A BUS A BUS B SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 SBA L OE L DIR H REAL-TIME TRANSFER BUS B TO BUS A DIR X X X CLKAB CLKBA X ↑ X ↑ ↑ ↑ SAB X X X SAB L SBA X BUS B BUS A SBA X X X STORAGE FROM A, B, OR A AND B OE L L DIR L H CLKAB X L CLKBA X X SAB X H TRANSFER STORED DATA TO A AND/OR B Figure 1. Bus-Management Functions 4 CLKBA X REAL-TIME TRANSFER BUS A TO BUS B BUS B BUS A OE X X H CLKAB X POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SBA H X SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 functional block diagram 1OE 1DIR 1CLKBA Boundary-Scan Register 62 53 55 1SBA 54 59 1CLKAB 60 1SAB C1 1D 1A1 51 63 C1 1D 1B1 1 of 9 Channels 2OE 2DIR 2CLKBA 2SBA 2CLKAB 2SAB 21 30 27 28 23 22 C1 1D 2A1 40 10 C1 1D 2B1 1 of 9 Channels Bypass Register Boundary-Control Register VCC TDI 24 VCC TMS TCK Identification Register 58 Instruction Register TDO 56 26 TAP Controller POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI: Except I/O ports (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V I/O ports (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Voltage range applied to any output in the high state or power-off state, VO . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX 4.5 5.5 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC –32 mA Low-level output current 64 mA ∆t/∆v Input transition rise or fall rate 10 ns/V High-level input voltage 2 V 0.8 Input voltage 0 V V V TA Operating free-air temperature –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Note 4) PARAMETER VIK TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –3 mA VOL VCC = 4.5 V, VCC = 4.5 V, IOH = –32 mA IOL = 64 mA II 5V VCC = 5 5.5 V, VI = VCC or GND IIH IIL VCC = 5.5 V, VCC = 5.5 V, VI = VCC, VI = GND, IOZH‡ IOZL‡ VCC = 5.5 V, VCC = 5.5 V, VO = 2.7 V VO = 0.5 V Ioff ICEX IO§ VCC = 0, VCC = 5.5 V, VI or VO ≤ 5.5 V VO = 5.5 V, VCC = 5.5 V, VO = 2.5 V VOH ICC ∆ICC# Ci Cio MIN TYP† A or B ports VCC = 5.5 V, One input at 3.4 V, VI = 2.5 V or 0.5 V, VO = 2.5 V or 0.5 V, UNIT –1.2 V 2.5 V 2 0.55 ±1 CLK, DIR, OE, S, TCK ±100 A or B ports V µA TDI, TMS 10 µA TDI, TMS –150 µA 50 µA Outputs high –50 Outputs high VCC = 5.5 V, IO = 0, VI = VCC or GND MAX Outputs low –50 µA ±100 µA 50 µA –200 mA 5.5 38¶ mA Outputs disabled 5 Other inputs at VCC or GND 2 Control inputs A or B ports Co VO = 2.5 V or 0.5 V, TDO NOTE 4: Preliminary specifications based on SPICE analysis † All typical values are at VCC = 5 V, TA = 25°C. ‡ The parameters IOZH and IOZL include the input leakage current. § Not more than one output should be tested at a time, and the duration of the test should not exceed one second. ¶ If both A and B ports are low, ICCL is 76 mA. # This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. mA 3 pF 10 pF 8 pF timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (normal mode) (see Note 4 and Figure 2) MIN fclock tw Clock frequency CLKAB or CLKBA Pulse duration CLKAB or CLKBA high or low tsu th Setup time A before CLKAB↑ or B before CLKBA↑ Hold time A after CLKAB↑ or B after CLKBA↑ MAX UNIT 100 MHz 4 ns 4.5 ns 0 ns NOTE 4: Preliminary specifications based on SPICE analysis POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (test mode) (see Note 4 and Figure 2)123 MIN fclock tw tsu th td tr Clock frequency TCK Pulse duration TCK high or low Setup time UNIT 50 MHz 8 A, B, CLK, DIR, OE, or S before TCK↑ 4.5 TDI before TCK↑ 7.5 TMS before TCK↑ 3 A or B after TCK↑ 0.5 CLK, DIR, OE, or S after TCK↑ Hold time MAX ns ns 0 ns TDI after TCK↑ 0.5 TMS after TCK↑ 0.5 Delay time Power up to TCK↑ 50 ns Rise time VCC power up 1 µs NOTE 4: Preliminary specifications based on SPICE analysis switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (normal mode) (see Note 4 and Figure 2) PARAMETER fmax tPLH tPHL tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ FROM (INPUT) TO (OUTPUT) CLKAB or CLKBA A or B B or A CLKAB or CLKBA B or A SAB or SBA B or A DIR B or A OE B or A DIR B or A POST OFFICE BOX 655303 MAX 100 B or A OE tPLZ NOTE 4: Preliminary specifications based on SPICE analysis 8 MIN • DALLAS, TEXAS 75265 UNIT MHz 2 5.4 2 6.6 2.5 8 2.5 7.4 2 7.5 2 8 2 8 3 9.1 2.5 8.6 3 9.3 3.5 11.1 3 8.8 3.5 10.5 2 8.5 ns ns ns ns ns ns ns SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (test mode) (see Note 4 and Figure 2)123 PARAMETER fmax tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ FROM (INPUT) TO (OUTPUT) TCK MAX 50 TCK↓ A or B TCK↓ TDO TCK↓ A or B TCK↓ TDO TCK↓ A or B TCK↓ tPLZ NOTE 4: Preliminary specifications based on SPICE analysis POST OFFICE BOX 655303 MIN TDO • DALLAS, TEXAS 75265 UNIT MHz 2.5 13.5 2.5 12.5 2 6.5 2 6.5 4.5 13.8 5 14.5 2 7 3 7.5 4 17 3 16 3 9 3 7.5 ns ns ns ns ns ns 9 SN74ABT18646 SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER AND REGISTER SCBS131A – AUGUST 1992 – REVISED JANUARY 2002 PARAMETER MEASUREMENT INFORMATION 7V 500 Ω From Output Under Test Open S1 GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V 1.5 V Input 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL Output 3V Output Control tPHL tPLH 1.5 V Output Waveform 2 S1 at Open (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 2. Load Circuit and Voltage Waveforms 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 1-May-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ABT18646PM ACTIVE LQFP PM 64 160 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ABT18646PMG4 ACTIVE LQFP PM 64 160 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996 PM (S-PQFP-G64) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 0,08 M 33 48 49 32 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,05 MIN 0°– 7° 0,75 0,45 1,45 1,35 Seating Plane 0,08 1,60 MAX 4040152 / C 11/96 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Falls within JEDEC MS-026 May also be thermally enhanced plastic with leads connected to the die pads. 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