TPS40304A www.ti.com SLUSA30 – FEBRUARY 2010 3-V TO 20-V INPUT SYNCHRONOUS BUCK CONTROLLER Check for Samples: TPS40304A CONTENTS FEATURES 1 • • • • • • • • • • • Input Voltage Range from 3 V to 20 V Fixed 600-kHz Switching Frequency High- and Low-Side FET RDS(on) Current Sensing Programmable Thermally Compensated OCP Levels Programmable Soft-Start 591-mV, 1% Reference Voltage Voltage Feed-Forward Compensation Supports Pre-Biased Output Frequency Spread Spectrum Thermal Shutdown Protection at 145°C 10-Pin 3 mm × 3 mm SON Package with Ground Connection to Thermal Pad Device Ratings 2 Electrical Characteristics 3 Device Information 8 Application Information 10 Additional References 13 X APPLICATIONS • • • • POL Modules Printer Digital TV Telecom DESCRIPTION The TPS40304A is a cost-optimized synchronous buck controller that operates from 3-V to 20-V input. The controller implements a voltage-mode control architecture with input-voltage feed-forward compensation that responds instantly to input voltage change. The switching frequency is fixed at 600 kHz. Frequency Spread Spectrum feature adds dither to the switching frequency, significantly reducing the peak EMI noise and making it much easier to comply with EMI standards. The TPS40304A offers design with a variety of user programmable functions, including soft-start, overcurrent protection (OCP) levels, and loop compensation. The OCP level is programmed by a single external resistor connected from LDRV pin to circuit ground. During initial power on, the TPS40304A enters a calibration cycle, measures the voltage at the LDRV pin, and sets an internal OCP voltage level. During operation, the programmed OCP voltage level is compared to the voltage drop across the low-side FET when it is on to determine whether there is an overcurrent condition. The TPS40304A then enters a shutdown and restart cycle until the fault is removed. SIMPLIFIED APPLICATION DIAGRAM VOUT VIN TPS40304A 5 FB BOOT 6 4 COMP HDRV 7 3 PGOOD SW 8 2 EN/SS LDRV/OC 9 1 VDD VOUT SD VIN BP 10 GND PAD UDG-10008 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TPS40304A SLUSA30 – FEBRUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION OPERATING FREQUENCY 600 kHz PACKAGE TAPE AND REEL QUANTITY PART NUMBER 250 TPS40304ADRCT 3000 TPS40304ADRCR Plastic 10-Pin SON (DRC) ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VDD –0.3 to 22 V SW –3 to 27 V –5 V BOOT –0.3 to 30 V HDRV –5 to 30 V BOOT-SW, HDRV-SW (differential from BOOT or HDRV to SW) –0.3 to 7 V COMP, PGOOD, FB, BP, LDRV, EN/SS –0.3 to 7 V SW (< 100 ns pulse width, 10 µJ) TJ Operating junction temperature range –40 to 145 °C Tstg Storage temperature –55 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those included under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability. DISSIPATION RATINGS AIRFLOW (LFM) RqJA HIGH-K BOARD (1) (°C/W) POWER RATING (W) TA = 25°C POWER RATING (W) TA = 85°C 0 (Natural Convection) 47.9 2.08 0.835 200 40.5 2.46 0.987 400 38.2 2.61 1.04 PACKAGE 10-Pin SON (DRC) (1) Ratings based on JEDEC High Thermal Conductivity (High K) Board. For more information on the test method, see TI technical brief (SZZA017). RECOMMENDED OPERATING CONDITIONS MIN VDD Input voltage TJ Operating junction temperature NOM MAX UNIT 3 20 V –40 125 °C MAX UNIT ELECTROSTATIC DISCHARGE (ESD) PROTECTION MIN TYP Human body model (HBM) 2000 V Charge device model (CDM) 1500 V 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A TPS40304A www.ti.com SLUSA30 – FEBRUARY 2010 ELECTRICAL CHARACTERISTICS TJ = –40°C to 125°C, VVDD = 12 V, all parameters at zero power dissipation (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX TJ = 25°C, 3 V < VVDD < 20 V 588 591 594 –40°C < TJ < 125°C, 3 V < VVDD < 20 V 585 591 597 UNIT VOLTAGE REFERENCE VFB FB input voltage mV INPUT SUPPLY VVDD Input supply voltage range 3 20 V IDDSD Shutdown supply current VEN/SS < 0.2 V 70 100 µA IDDQ Quiescent, non-switching Let EN/SS float, VFB = 1 V 2.5 3.5 mA V ENABLE/SOFT-START VIH High-level input voltage, EN/SS 0.55 0.70 1.00 VIL Low-level input voltage, EN/SS 0.27 0.30 0.33 V ISS Soft-start source current 8 10 12 µA VSS Soft-start voltage level 0.4 0.8 1.3 V 6.2 6.5 6.8 V 70 110 mV kHz BP REGULATOR VBP Output voltage IBP = 10 mA VDO Regulator dropout voltage, VVDD – VBP IBP = 25 mA, VVDD = 3 V fSW PWM frequency 3 V < VVDD < 20 V VRAMP (1) Ramp amplitude fSWFSS Frequency spread spectrum frequency deviation fMOD Modulation frequency OSCILLATOR 540 600 660 VVDD/6.6 VVDD/6 VVDD/5.4 12% V fSW 25 KHz PWM DMAX (1) tON(min) (1) tDEAD Maximum duty cycle VFB = 0 V, 3 V < VVDD < 20 V 90% Minimum controllable pulse width 45 75 HDRV off to LDRV on 5 25 35 LDRV off to HDRV on 5 25 30 Gain bandwidth product 10 24 Open loop gain 60 Output driver dead time ns ns ERROR AMPLIFIER GBWP AOL (1) (1) IIB Input bias current (current out of FB pin) VFB = 0.6 V IEAOP Output source current VFB = 0 V 2 IEAOM Output sink current VFB = 1 V 2 (1) MHz dB 75 nA mA Ensured by design. Not production tested. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A 3 TPS40304A SLUSA30 – FEBRUARY 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) TJ = –40°C to 125°C, VVDD = 12 V, all parameters at zero power dissipation (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PGOOD VOV Feedback upper voltage limit for PGOOD 646 666 691 VUV Feedback lower voltage limit for PGOOD 491 516 541 VPGD-HYST PGOOD hysteresis voltage at FB 25 40 RPGD PGOOD pull down resistance VFB = 0 V, IFB = 5 mA 30 70 Ω IPGDLK PGOOD leakage current 541 mV < VFB < 646 mV, VPGOOD = 5 V 10 20 µA mV OUTPUT DRIVERS RHDHI High-side driver pull-up resistance VBOOT – VSW = 5 V, IHDRV = –100 mA 0.8 1.5 2.5 Ω RHDLO High-side driver pull-down resistance VBOOT – VSW = 5 V, IHDRV = 100 mA 0.5 1.0 2.2 Ω RLDHI Low-side driver pull-up resistance ILDRV = -100 mA 0.8 1.5 2.5 Ω RLDLO Low-side driver pull-down resistance ILDRV = 100 mA 0.35 0.60 1.20 Ω tHRISE (2) High-side driver rise time CLOAD = 5 nF 15 ns tHFALL (2) High-side driver fall time 12 ns tLRISE (2) Low-side driver rise time 15 ns tLFALL (2) Low-side driver fall time 10 ns Minimum pulse time during short circuit 250 ns Switch leading-edge blanking pulse time 150 ns OVERCURRENT PROTECTION tPSSC(min) (2) tBLNKH (2) VOCH OC threshold for high-side FET TJ = 25°C 360 450 580 IOCSET OCSET current source TJ = 25°C 9.5 10.0 10.5 mV µA VLD-CLAMP Maximum clamp voltage at LDRV 260 340 400 mV VOCLOS OC comparator offset voltage for low-side FET TJ = 25°C –8 8 mV VOCLPRO (2) Programmable OC range for low-side FET TJ = 25°C 12 300 mV VTHTC (2) OC threshold temperature coefficient (both high-side and low-side) tOFF OC retry cycles on EN/SS pin 3000 ppm 4 Cycle BOOT DIODE VDFWD Bootstrap diode forward voltage IBOOT = 5 mA 0.8 V 145 °C 20 °C THERMAL SHUTDOWN TJSD (2) TJSDH (2) 4 Junction shutdown temperature (2) Hysteresis Ensured by design. Not production tested. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A TPS40304A www.ti.com SLUSA30 – FEBRUARY 2010 TYPICAL CHARACTERISTICS SWITCHING FREQUENCY vs JUNCTION TEMPERATURE QUIESCENT CURRENT vs JUNCTION TEMPERATURE 2.24 625 620 VVDD = 20 V IDDQ – Quiescent Current – mA fSW – Switching Frequency – kHz 2.22 615 610 605 VVDD = 12 V 600 VVDD = 3V 595 590 2.20 2.18 2.16 2.14 585 580 –40 –25 –10 5 20 35 50 65 80 2.12 –40 –25 –10 95 110 125 5 20 35 50 65 Figure 1. Figure 2. SHUTDOWN CURRENT vs JUNCTION TEMPERATURE OCSET CURRENT SOURCE vs JUNCTION TEMPERATURE 14 70 13 IOCSET – OCSET Current Source– mA 72 68 66 64 62 60 80 95 110 125 TJ – Junction Temperature – °C TJ – Junction Temperature – °C IDD(SD)– Shutdown Current – mA VVDD = 12 V 12 11 10 9 8 7 58 –40 –25 –10 VVDD = 12 V 5 20 35 50 65 80 95 110 125 6 –40 –25 –10 TJ – Junction Temperature – °C Figure 3. 5 20 35 50 65 80 95 110 125 TJ – Junction Temperature – °C Figure 4. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A 5 TPS40304A SLUSA30 – FEBRUARY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) FEEDBACK REFERENCE VOLTAGE vs JUNCTION TEMPERATURE ENABLE HIGH-LEVEL THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE 740 VIH – Enable High-Level Threshold Voltage – mV 592.0 VFB – Feedback Reference Voltage – mV 591.5 591.0 590.5 590.0 589.5 589.0 588.5 588.0 –40 –25 –10 5 20 35 50 65 80 720 700 680 660 640 620 –40 –25 –10 95 110 125 TJ – Junction Temperature – °C 20 35 50 65 80 95 110 125 TJ – Junction Temperature – °C Figure 5. Figure 6. ENABLE LOW-LEVEL THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE HIGH-SIDE OVERCURRENT THRESHOLD vs JUNCTION TEMPERATURE 303.0 VIL – Enable Low-Level Threshold Voltage – mV VOCH – High-Side Overcurrent Threshold – mV 600 302.5 302.0 301.5 301.0 300.5 300.0 –40 –25 –10 5 20 35 50 65 80 95 110 125 550 500 450 400 350 –40 –25 –10 TJ – Junction Temperature – °C Figure 7. 6 5 5 20 35 50 65 80 95 110 125 TJ – Junction Temperature – °C Figure 8. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A TPS40304A www.ti.com SLUSA30 – FEBRUARY 2010 TYPICAL CHARACTERISTICS (continued) POWER GOOD THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE SOFT-START VOLTAGE vs JUNCTION TEMPERATURE 1000 975 750 Overvoltage VSS – Soft-Start Voltage – mV VOV/VUV – Power Good Threshold Voltage – mV 800 700 650 600 550 500 950 925 900 875 850 825 800 450 Undervoltage 400 –40 –25 –10 5 20 35 50 65 775 80 95 110 125 750 –40 –25 –10 TJ – Junction Temperature – °C Figure 9. 5 20 35 50 65 80 95 110 125 TJ – Junction Temperature – °C Figure 10. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A 7 TPS40304A SLUSA30 – FEBRUARY 2010 www.ti.com DEVICE INFORMATION TERMINAL CONFIGURATION The package is an 10-Pin SON (DRC) package. Note: The thermal pad is an electrical ground connection. FB COMP PGOOD EN/SS VDD 5 4 3 2 1 8 9 10 SW LDRV/ OC BP Thermal Pad 6 7 BOOT HDRV PIN FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. BOOT 6 I Gate drive voltage for the high-side N-channel MOSFET. A 100 nF capacitor (typical) must be connected between this pin and SW. For low input voltage operation, an external schottky diode from BP to BOOT is recommended to maximize the gate drive voltage for the high-side. BP 10 O Output bypass for the internal regulator. Connect a low ESR bypass ceramic capacitor of 1 µF or greater from this pin to GND. COMP 4 O Output of the error amplifier and connection node for loop feedback components. EN/SS 2 I Logic level input which starts or stops the controller via an external user command. Letting this pin float turns the controller on. Pulling this pin low disables the controller. This is also the soft-start programming pin. A capacitor connected from this pin to GND programs the soft-start time. The capacitor is charged with an internal current source of 10 µA. The resulting voltage ramp of this pin is also used as a second non-inverting input to the error amplifier after a 0.8 V (typical) level shift downwards. Output regulation is controlled by the internal level shifted voltage ramp until that voltage reaches the internal reference voltage of 591 mV – the voltage ramp of this pin reaches 1.4 V (typical). Optionally, a 267 kΩ resistor from this pin to BP enables frequency spread spectrum feature. FB 5 I Inverting input to the error amplifier. In normal operation, the voltage on this pin is equal to the internal reference voltage. PGOOD 3 O Open drain power good output. HDRV 7 O Bootstrapped gate drive output for the high-side N-channel MOSFET. LDRV/OC 9 O Gate drive output for the low-side synchronous rectifier N-channel MOSFET. A resistor from this pin to GND is also used to determine the voltage level for OCP. An internal current source of 10 µA flows through the resistor during initial calibration and that sets up the voltage trip point used for OCP. VDD 1 I Power input to the controller. Bypass VDD to GND with a low ESR ceramic capacitor of at least 1.0-µF close to the device. SW 8 O Sense line for the adaptive anti-cross conduction circuitry. Serves as common connection for the flying high-side FET driver. GND 8 Thermal Pad Ground connection to the controller. This is also the thermal pad used to conduct heat from the device. This connection serves a twofold purpose. The first is to provide an electrical ground connection for the device. The second is to provide a low thermal impedance path from the device die to the PCB. This pad should be tied externally to a ground plane. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A TPS40304A www.ti.com SLUSA30 – FEBRUARY 2010 TPS40304A BLOCK DIAGRAM + 10 mA Soft Start 0.591 VREF + 12.5% SS SS EN/SS FB BP + 2 SD VDD 6-V Regulator 1 + References 6 BOOT 7 HDRV 8 SW 9 LDRV/OC OC 0.591 VREF SD BP 10 COMP 4 FB 0.591 VREF – 12.5% Fault Controller Clock BP Calibration Circuit Spread Spectrum Oscillator Clock PWM Logic 5 BP Anti-Cross Conduction and Pre-Bias Circuit PWM + + 10 mA 0.591 VREF SS PGOOD Thermal Shutdown 750 kW 3 OC Threshold Setting Fault Controller OC PAD UDG-01009 GND Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A 9 TPS40304A SLUSA30 – FEBRUARY 2010 www.ti.com APPLICATION INFORMATION Introduction The TPS40304A is a cost-optimized synchronous buck controller providing high-end features to construct high-performance DC/DC converters. Pre-bias capability eliminates concerns about damaging sensitive loads during startup. Programmable overcurrent protection levels and hiccup overcurrent fault recovery maximize design flexibility and minimize power dissipation in the event of a prolonged output short. Frequency Spread Spectrum (FSS) feature reduces peak EMI noise by spreading the initial energy of each harmonic along a frequency band, thus giving a wider spectrum with lower amplitudes. Voltage Reference The 591-mV band gap cell is internally connected to the non-inverting input of the error amplifier. The reference voltage is trimmed with the error amplifier in a unity gain configuration to remove amplifier offset from the final regulation voltage. The 1% tolerance on the reference voltage allows the user to design a very accurate power supply. Enable Functionality, Startup Sequence and Timing After input power is applied, an internal current source of 40 µA starts to charge up the soft-start capacitor connected from EN/SS to GND. When the voltage across that capacitor increases to 0.7 V, it enables the internal BP regulator followed by a calibration. The total calibration time is about 1.9 ms. See Figure 11. During the calibration, the device performs in the following way. It disables the LDRV drive and injects an internal 10 µA current source to the resistor connected from LDRV to GND. The voltage developed across that resistor is then sampled and latched internally as the OCP trip level until one cycles the input or toggles the EN/SS. 2.0 VIN – Input Voltage – V VEN/SS 1.6 Calibration Time 1.9 ms 1.3 V 1.2 0.8 0.7 V 0.4 VSS_INT 0 t – Time – ms UDG-09159 Figure 11. Startup Sequence and Timing The voltage at EN/SS is internally clamped to 1.3 V before and/or during calibration to minimize the discharging time once calibration is complete. The discharging current is from an internal current source of 140 µA and it pulls the voltage down to 0.4 V. It then initiates the soft-start by charging up the capacitor using an internal current source of 10 µA. The resulting voltage ramp on this pin is used as a second non-inverting input to the error amplifier after an 800 mV (typical) downward level-shift; therefore, actual soft-start will not take place until the voltage at this pin reaches 800 mV. If EN/SS is left floating, the controller starts automatically. EN/SS must be pulled down to less than 270 mV to guarantee that the chip is in shutdown mode. 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A TPS40304A www.ti.com SLUSA30 – FEBRUARY 2010 Soft-Start Time The soft-start time of the TPS40304A is user programmable by selecting a single capacitor. The EN/SS pin sources 10 µA to charge this capacitor. The actual output ramp-up time is the amount of time that it takes for the 10 µA to charge the capacitor through a 591-mV range. There is some initial lag due to calibration and an offset (800 mV) from the actual EN/SS pin voltage to the voltage applied to the error amplifier. The soft-start is done in a closed loop fashion, meaning that the error amplifier controls the output voltage at all times during the soft start period and the feedback loop is never open as occurs in duty cycle limit soft-start schemes. The error amplifier has two non-inverting inputs, one connected to the 591-mV reference voltage, and the other connected to the offset EN/SS pin voltage. The lower of these two voltages is what the error amplifier controls the FB pin to. As the voltage on the EN/SS pin ramps up past approximately 1.4 V (800 mV offset voltage plus the 591-mV reference voltage), the 591-mV reference voltage becomes the dominant input and the converter has reached its final regulation voltage. The capacitor required for a given soft-start ramp time for the output voltage is given by Equation 1. æI ö CSS = ç SS ÷ ´ t SS V è FB ø where • • • • CSS is the required capacitance on the EN/SS pin (F) ISS is the soft-start source current (10 µA) VFB is the feedback reference voltage (591 mV) tSS is the desired soft-start ramp time (s) (1) Oscillator and Frequency Spread Spectrum (FSS) The oscillator frequency is internally fixed at 600 kHz. Connecting a resistor with a value of 267 kΩ ± 10% from BP to EN/SS enables the FSS feature. When enabled, it spreads the internal oscillator frequency over a minimum 12% window using a 25-kHz modulation frequency with triangular profile. By modulating the switching frequency, side-bands are created. The emission power of the fundamental switching frequency and its harmonics is distributed into smaller pieces scattered around many side-band frequencies. The effect significantly reduces the peak EMI noise and makes it much easier for the resultant emission spectrum to pass EMI regulations. Overcurrent Protection Programmable OCP level at LDRV is from 6 mV to 150 mV at room temperature with 3000 ppm temperature coefficient to help compensate for changes in the low-side FET channel resistance as temperature increases. With a scale factor of 2, the actual trip point across the low-side FET is in the range of 12 mV to 300 mV. The accuracy of the internal current source is ±5%. Overall offset voltage, including the offset voltage of the internal comparator and the amplifier for scale factor of 2, is limited to ±8 mV. Maximum clamp voltage at LDRV is 340 mV to avoid turning on the low-side FET during calibration and in a pre-biased condition. The maximum clamp voltage is fixed and it does not change with temperature. If the voltage drop across ROCSET reaches the 340 mV maximum clamp voltage during calibration (No ROCSET resistor included), it disables OCP. Once disabled, there is no low-side or high-side current sensing. OCP level at HDRV is fixed at 450 mV with 3000 ppm temperature coefficient to help compensate for changes in the high-side FET channel resistance as temperature increases. OCP at HDRV provides pulse-by-pulse current limiting. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A 11 TPS40304A SLUSA30 – FEBRUARY 2010 www.ti.com OCP sensing at LDRV is a true inductor valley current detection, using sample and hold. Equation 2 can be used to calculate ROCSET: ææ ö æI öö ç ç IOUT(max ) - ç P-P ÷ ÷ ´ RDS(on ) - VOCLOS ÷ è 2 øø ç ÷ ROCSET = ç è ÷ 2 ´ IOCSET ç ÷ ç ÷ è ø where • • • • • • IOCSET is the internal current source VOCLOS is the overall offset voltage IP-P is the peak-to-peak inductor current RDS(on) is the drain to source on-resistance of the low-side FET IOUT(max) is the trip point for OCP ROCSET is the resistor used for setting the OCP level (2) To avoid overcurrent tripping in normal operating load range, calculate ROCSET using the equation above with: • The maximum RDS(ON) at room temperature • The lower limit of VOCLOS (–8 mV) and the lower limit of IOCSET (9.5 µA) from the Electrical Characteristics table. • The peak-to-peak inductor current IP-P at minimum input voltage Overcurrent is sensed across both the low-side FET and the high-side FET. If the voltage drop across either FET exceeds the OC threshold, a count increments one count. If no OC is detected on either FET, the fault counter decrements by one count. If three OC pulses are summed, a fault condition is declared which cycles the soft-start function in a hiccup mode. Hiccup mode consists of four dummy soft-start timeouts followed by a real one if overcurrent condition is encountered during normal operation, or five dummy soft-start timeouts followed by a real one if overcurrent condition occurs from the beginning during start. This cycle continues indefinitely until the fault condition is removed. Drivers The drivers for the external high-side and low-side MOSFETs are capable of driving a gate-to-source voltage of VBP. The LDRV driver for the low-side MOSFET switches between BP and GND, while HDRV driver for the high-side MOSFET is referenced to SW and switches between BOOT and SW. The drivers have non-overlapping timing that is governed by an adaptive delay circuit to minimize body diode conduction in the synchronous rectifier. Pre-Bias Startup The TPS40304A contains a circuit to prevent current from being pulled from the output during startup in the condition the output is pre-biased. There are no PWM pulses until the internal soft-start voltage rises above the error amplifier input (FB pin), if the output is pre-biased. Once the soft-start voltage exceeds the error amplifier input, the controller slowly initiates synchronous rectification by starting the synchronous rectifier with a narrow on time. It then increments that on time on a cycle-by-cycle basis until it coincides with the time dictated by (1-D), where D is the duty cycle of the converter. This approach prevents the sinking of current from a pre-biased output, and ensures the output voltage startup and ramp to regulation is smooth and controlled. 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A TPS40304A www.ti.com SLUSA30 – FEBRUARY 2010 Power Good The TPS40304A provides an indication that output is good for the converter. This is an open drain signal and pulls low when any condition exists that would indicate that the output of the supply might be out of regulation. These conditions include the following: • VFB is more than ±12.5% from nominal • Soft-start is active • A short circuit condition has been detected NOTE When there is no power to the device, PGOOD is not able to pull close to GND if an auxiliary supply is used for the power good indication. In this case, a built in resistor connected from drain to gate on the PGOOD pull down device makes the PGOOD pin look approximately like a diode to GND. Thermal Shutdown If the junction temperature of the device reaches the thermal shutdown limit of 145°C, the PWM and the oscillator are turned off and HDRV and LDRV are driven low. When the junction cools to the required level (125°C typical), the PWM initiates soft start as during a normal power-up cycle. ADDITIONAL REFERENCES Related Devices The devices listed in have characteristics similar to the TPS40304A and may be of interest. Table 1. Related Devices DEVICE TPS40303/4/5 DESCRIPTION 3-V to 20-V Input Synchronous Buck Controller References These references, design tools and links to additional references, including design software, may be found at http://power.ti.com 1. Additional PowerPAD™ information may be found in Applications Briefs (SLMA002A) and (SLMA004). 2. Under The Hood Of Low Voltage DC/DC Converters – SEM1500 Topic 5 – 2002 Seminar Series 3. Understanding Buck Power Stages in Switchmode Power Supplies, (SLVA057), March 1999 4. Designing Stable Control Loops – SEM 1400 – 2001 Seminar Series Package Outline and Recommended PCB Footprint The following pages outline the mechanical dimensions of the 10-pin DRC package and provide recommendations for PCB layout. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :TPS40304A 13 PACKAGE OPTION ADDENDUM www.ti.com 17-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS40304ADRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS40304ADRCT ACTIVE SON DRC 10 250 CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS40304ADRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS40304ADRCT SON DRC 10 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS40304ADRCR SON DRC 10 3000 346.0 346.0 29.0 TPS40304ADRCT SON DRC 10 250 190.5 212.7 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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