TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 1080p - Deep Color 2-to-1 HDMI/DVI Switch With Adaptive Equalization FEATURES 1 • 2:1 Switch Supporting DVI Above 1920 × 1200 and HDMI HDTV Resolutions up to 1080p With 16-bit Color Depth • Designed for Signaling Rates up to 3 Gbps • HDMI1.3a Spec Compliant • Adaptive Equalization to Support up to 20-m HDMI Cable • TMDS Input Clock-Detect Circuit • DDC Repeater Function • <2 mW Low-Power Mode • Local I2C or GPIO Configurable • Enhanced ESD. HBM: 10 kV on All Input TMDS, DDC I2C, HPD Pins • 3.3-Volt Power Supply 2 • • • Temperature Range: 0°C to 70°C 64-Pin TQFP Package: Pin-Compatible With TMDS251 Robust TMDS Receive Stage That Can Work With Non-Compliant Input Common-Mode HDMI Signal APPLICATIONS • High-Definition Digital TV – LCD – Plasma – DLP® DESCRIPTION The TMDS261 is a two-port digital video interface (DVI) or high-definition multimedia interface (HDMI) switch that allows up to two DVI or HDMI ports to be switched to a single display terminal. Four TMDS channels, one hot-plug detector, and a digital display control (DDC) interface are supported on each port. Each TMDS channel supports signaling rates up to 3 Gbps to allow 1080p resolution in 16-bit color depth. The TMDS261 provides an adaptive equalizer for different ranges of cable lengths. The equalizer automatically compensates for intersymbol interference [ISI] loss of an HDMI/DVI cable for up to 20 dB at 3 Gbps (see Figure 15). TYPICAL APPLICATION Digital TV BRTN TV1 Game Machine TM D S2 6 1 169 PALplus DVD Player or DVR M0124-02 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DLP is a registered trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) When any of the input ports are selected, the integrated terminations (50-Ω termination resistors pulled up to VCC) are switched on for the TMDS clock channel, the TMDS clock-detection circuit is enabled, and the DDC repeater is enabled. After a valid TMDS clock is detected, the integrated termination resistors for the data lines are enabled, and the output TMDS lines are enabled. When an input port is not selected, the integrated terminations are switched off, the TMDS receivers are disabled, and the DDC repeater is disabled. Clock-detection circuitry provides an automatic power-management feature, because if no valid TMDS clock is detected, the terminations on the input TMDS data lines are disconnected and the TMDS outputs are placed in a high-impedance state. The TMDS261 is designed to be controlled via a local I2C interface or GPIO interface based on the status of the I2C_SEL pin. The local I2C interface in TMDS261 is a slave-only I2C interface. (See the I2C INTERFACE NOTES section.) I2C Mode: When the I2C_SEL pin is set low, the device is in I2C mode. With local I2C, the interface port status can be read and the advanced configurations of the device such as TMDS output edge rate control, DDC I2C buffer output-voltage-select (OVS) settings (See the DDC I2C Function Description for detailed description on DDC I2C buffer description and OVS description), device power management, TMDS clock-detect feature and TMDS input-port selection can be set. See Table 8 through Table 11. GPIO mode: When the I2C_SEL pin is set high, the device is in GPIO control mode. The port selection is controlled with source selectors, S1 and S2. The power-saving mode is controlled through the LP pin. In GPIO mode, the default TMDS output edge rate that is the fastest setting of rise and fall time is set, and the default DDC I2C buffer OVS setting (OVS3) is set. See Table 8 and the DDC I2C Function Description for detailed description of the DDC I2C buffer. Following are some of the key features (advantages) that TMDS261 provides to the overall sink-side system (HDTV). • • • • • • • • • 2 2×1 switch that supports TMDS data rates up to 3 Gbps on all two input ports. ESD: Built-in support for high ESD protection (up to 10 kV on the HDMI source side). The HDMI source-side pins on the TMDS261 are connected via the HDMI/DVI exterior connectors and cable to the HDMI/DVI sources (e.g., DVD player). In TV applications, it can be expected that the source side may be subjected to higher ESD stresses compared to the sink side that is connected internally to the HDMI receiver. Adaptive equalization: The built-in adaptive equalization support compensates for intersymbol interference [ISI] loss of up to 20 dB, which represents a typical 20-m HDMI/DVI cable at 3 Gbps. Adaptive equalization adjusts the equalization gain automatically, based on the cable length and the incoming TMDS data rate. TMDS clock-detect circuitry: This feature provides an automatic power-management feature and also ensures that the TMDS output port is turned on only if there is a valid TMDS input signal. TMDS clock-detect feature can be by-passed in I2C Mode, See Table 10 and Table 11. It is recommended to enable TMDS clock-detect circuitry during normal operation. However, for HDMI compliance testing (TMDS Termination Voltage Test), the clock detect feature should be disabled by using the I2C Mode control. If the customer requires to pass TMDS Termination Voltage Test in GPIO mode with default TMDS clock-detect circuitry enabled, then a valid TMDS clock should be provided for this complaince test, so that the terminations on the TMDS data pair can be connected and thus customer can pass the TMDS Termination Voltage Test. DDC I2C buffer: This feature provides isolation on the source side and sink side DDC I2C capacitance, thus helping the sink system to pass system-level compliance. Robust TMDS receive stage: This feature ensures that the TMDS261 can work with TMDS input signals having common-mode voltage levels that can be either compliant or non-compliant with HDMI/DVI specifications. VSadj: This feature adjusts the TMDS output swing and can help the sink system to tune the output TMDS swing of the TMDS261 (if needed) based on the system requirements. GPIO or local I2C interface to control the device features TMDS output edge-rate control: This feature adjusts the TMDS261 TMDS output rise and fall times. There are four settings of the rise and fall times that can be chosen. The default setting is the fastest rise and fall Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 time; the other three settings are slower. Slower edge transitions can potentially help the sink system (HDTV) in passing regulatory EMI compliance. FUNCTIONAL BLOCK DIAGRAM o VCC RINT RINT Dx+_1 TMDS Rx w/ AEQ Dx–_1 VCC RINT RINT CLK+_1 TMDS Rx CLK–_1 Clock Detect VSadj Tx SCL1 Rx Dx+_SINK TMDS Tx Tx Dx–_SINK SDA1 Rx 2:1 MUX VCC CLK+_SINK TMDS Tx CLK–_SINK RINT RINT Dx+_2 Rx TMDS Rx w/ AEQ Dx–_2 SCL_SINK Tx VCC Rx RINT RINT SDA_SINK CLK+_2 Tx TMDS Rx CLK–_2 Clock Detect Clock Detect Tx SCL2 Rx Tx SDA2 Rx HPD_SINK HPD1 HPD2 I2C_SEL 1 kW 2 1 kW Local I C and Control Logic LP S1/SCL S2/SDA B0330-02 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 3 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com PAG PACKAGE 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 NC D2+_2 D2–_2 VCC D1+_2 D1–_2 GND D0+_2 D0–_2 VCC CLK+_2 CLK–_2 SCL2 SDA2 HPD2 LP PAG-64 (Top View) TMDS261 64-pin TQFP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 D2+_1 D2–_1 VCC D1+_1 D1–_1 GND D0+_1 D0–_1 VCC CLK+_1 CLK–_1 SCL1 SDA1 HPD1 I2C_SEL S2/SDA 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 D2+_SINK D2–_SINK VCC D1+_SINK D1–_SINK GND D0+_SINK D0–_SINK VCC CLK+_SINK CLK–_SINK GND SCL_SINK SDA_SINK HPD_SINK S1/SCL NC NC GND NC NC VCC NC NC GND NC NC VCC NC NC GND Vsadj P0010-04 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 TERMINAL FUNCTIONS TERMINAL SIGNAL NO. I/O DESCRIPTION TMDS INPUT PINS CLK+_1 CLK–_1 D[0:2]+_1 D[0:2]–_1 CLK+_2 CLK–_2 D[0:2]+_2 D[0:2]–_2 39 38 I Port-1 TMDS differential clock 42, 45, 48 41, 44, 47 I Port-1 TMDS differential data inputs 54 53 I Port-2 TMDS differential clock 57, 60, 63 56, 59, 62 I Port-2 TMDS differential data inputs 26 27 O TMDS sink differential clock 23, 20, 17 24, 21, 18 O TMDS sink differential data outputs 35, 50 O Source port hot-plug-detect output 31 I Sink hot-plug-detect input TMDS OUTPUT PINS CLK+_SINK CLK–_SINK D[0:2]+_SINK D[0:2]–_SINK HOT-PLUG-DETECT STATUS PINS HPD[1:2] HPD_SINK DDC PINS SCL[1:2] 37, 52 I/O TMDS port bidirectional DDC clock SDA[1:2] 36, 51 I/O TMDS port bidirectional DDC data SCL_SINK 29 I/O TMDS sink-side bidirectional DDC clock SDA_SINK 30 I/O TMDS sink-side bidirectional DDC data LP 49 I Low-power select bar I2C_SEL 34 I GPIO/local I2C control select S1/SCL 32 I Source select 1(GPIO) / local I2C clock (I2C) S2/SDA 33 I/O Source select 2 (GPIO) / local I2C data (I2C) VSadj 16 I VCC 6, 12, 19, 25, 40, 46, 55, 61 GND 3, 9, 15, 22, 28, 43, 58 CONTROL PINS TMDS-compliant voltage swing control SUPPLY AND GROUND PINS NC 1,2,4,5,7,8,10,11, 13,14,64 3.3-V supply Ground No Connect Pins Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 5 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com Table 1. Source Selection Lookup (1) CONTROL PINS (1) 6 I/O SELECTED HOT-PLUG DETECT STATUS Power Mode S2 S1 Port Selected SCL_SINK SDA_SINK HPD1 HPD2 H H Port 1 Terminations of port 2 are disconnected. SCL1 SDA1 HPD_SINK L Normal mode H L Port 2 Terminations of port 1 are disconnected. SCL2 SDA2 L HPD_SINK Normal mode L L L L Normal Mode L H HPD_SINK HPD_SINK Standby mode Disallowed (Indeterminate state, all None (Z) terminations are Are pulled HIGH by disconnected) external pullup None (Z) termination All terminations are disconnected. H: Logic high; L: Logic low; X: Don't care; Z: High impedance Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS TMDS Input Stage TMDS Output Stage VCC VCC 50 W 50 W Y B A Z 10 mA HPD Output Stage Status and Source Selector VCC VCC HPD_SINK S1 S2 HPD1 HPD2 DDC Buffer VCC Buffer S0386-02 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 7 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com Table 2. Control-Pin Lookup Table (1) SIGNAL LEVEL STATE H Normal mode L Low-power mode LP S[2:1] GPIO mode VSadj (1) Normal operational mode for device. If LP is left floating, then a weak internal pullup to VCC pulls it to VCC. Device is forced into a low-power state, causing the inputs and outputs to go to a high-impedance state. All other inputs are ignored. S2 S1 H H Port 1 Port 1 is selected as the active port; all other ports are low. H L Port 2 Port 2 is selected as the active port; all other ports are low. L L Disallowed H HPD[1:2] follow HPD_SINK L I2C_SEL DESCRIPTION Disallowed (Indeterminate state, all terminations are disconnected) Standby mode: HPD[1:2] follow HPD_sink. L I2C Device is configured by I2C logic. H GPIO Device is configured by GPIO. If the I2C_SEL pin is left floating, then a weak internal pullup to VCC pulls the I2C_SEL pin high. 4.02 kΩ Compliant voltage Driver output voltage swing precision control to aid with system compliance. The VSadj resistor value can be selected to be 4.02 kΩ ±10% based on the system requirement to pass HDMI compliance. (H) Logic high; (L) Logic low ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE TMDS261PAGR TMDS261 64-pin TQFP reel (large) TMDS261PAGT TMDS261 64-pin TQFP reel (small) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) Supply voltage range (2) VCC Voltage range TMDS I/O Electrostatic discharge –0.3 to 5.5 Control and status I/O –0.3 to 5.5 Human body model (3) on SCL[1:2], SDA[1:2], HPD[1:2], D[0:2]+_[1:2], D[0:2]–_[1:2], CLK+_[1:2], CLK–_[1:2] pins ±10,000 Human body model (3) on all other pins ±9,000 Charged-device model (4) ±1500 Machine model (5) ±200 (6) , contact discharge Continuous power dissipation 8 V –0.3 to 4 IEC 61000-4-2 (6), air discharge (2) (3) (4) (5) (6) UNIT HPD and DDC I/O IEC 61000-4-2 (1) VALUE –0.3 to 3.6 V V ±8,000 ±15,000 See Dissipation Ratings table Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground terminal. Tested in accordance with JEDEC Standard 22, Test Method A114-B Tested in accordance with JEDEC Standard 22, Test Method C101-A Tested in accordance with JEDEC Standard 22, Test Method A115-A Tested in accordance with IEC EN 61000-4-2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 DISSIPATION RATINGS PACKAGE PCB JEDEC STANDARD TA ≤ 25°C DERATING FACTOR (1) ABOVE TA = 25°C TA = 70°C POWER RATING Low-K 1066 mW 10.66 mW/°C 586 mW High-K 1481 mW 14.8 mW/°C 814 mW 64-pin TQFP (PAG) (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX (1) UNIT RθJB Junction-to-board thermal resistance 37.13 °C/W RθJC Junction-to-case thermal resistance 15.3 °C/W PD(1) Device power dissipation in normal mode LP = HIGH TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1/S2 = LOW/HIGH, HIGH/HIGH 560 780 mW 10 20 mW 1 2 mW 40 65 mW PD(2) Device power dissipation in standby mode PSD Device power dissipation in low-power mode PNCLK Device power dissipation in normal mode LP = HIGH, No TMDS input clock, HPD_SINK = with no active TMDS input clock HIGH, S1/S2 = LOW/HIGH, HIGH/HIGH (1) LP = HIGH, TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1 = HIGH, S2 = LOW LP = LOW The maximum rating is simulated under 3.6-V VCC across worse-case temperature and process variation. Typical conditions are simulated at 3.3-V VCC, 25°C with nominal process material. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX VCC Supply voltage 3 3.3 3.6 UNIT V TA Operating free-air temperature 0 70 °C 0.15 1.56 V VCC – 0.4 VCC + 0.01 V TMDS DIFFERENTIAL OUTPUT PINS VID(pp) Peak-to-peak input differential voltage VIC Input common-mode voltage AVCC TMDS output termination voltage dR Data rate RVSadj Resistor for TMDS-compliant voltage output swing RT Termination resistance 3 3.3 3.6 3 V Gbps 3.66 4.02 4.47 kΩ 45 50 55 Ω DDC PINS VI Input voltage dR(I2C) I2C data rate 0 5.5 V 100 Kbps HPD AND CONTROL PINS VIH High-level input voltage 2 5.5 V VIL Low-level input voltage 0 0.8 V Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 9 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com DEVICE POWER The TMDS261 is designed to operate from a single 3.3-V supply voltage. The TMDS261 has three power modes of operation. These three modes are referred to as normal mode, standby mode, and low-power mode. Normal mode is designed to be used during typical operating conditions. In normal mode, the device is fully functional and consumes the greatest amount of power. Standby mode is designed to be used when reduced power is desired, but DDC and HPD communication must be maintained. Standby mode can be enabled via the I2C interface (See Table 8 through Table 11). or GPIO interface (See Table 1). In standby mode, the high-speed TMDS data and clock channels are disabled to reduce power consumption. The internal I2C logic and DDC function normally. HPD[1:3] follow HPD_SINK. Low-power mode is designed to consume the least possible amount of power while still applying 3.3 V to the device. Low-power mode can be enabled by either the LP pin or by local I2C (See Table 8 through Table 11). In low-power mode, all of the inputs and outputs are disabled with the exception of the internal I2C logic and LP pin. The clock-detect feature in the TMDS261 provides an automatic power-management feature in normal mode. if no valid TMDS clock is detected, the terminations on the input TMDS data lines are disconnected, and the TMDS outputs are high-Z. As soon as a valid TMDS clock is detected, the terminations on the TMDS data lines are connected, the TMDS outputs come out of high-Z, and the device is fully functional and consumes the greatest amount of power. ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN ICC Normal-mode supply current LP = HIGH TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1/S2 = LOW/HIGH, HIGH/HIGH ISTBY Standby supply current LP = HIGH, TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1 = HIGH, S2 = LOW ISD Shutdown current LP = LOW INCLK Normal-mode supply current, LP = HIGH, No TMDS input clock, HPD_SINK = HIGH, S1/S2 with no active TMDS input cloc = LOW/HIGH, HIGH/HIGH TYP MAX UNIT 170 216 mA 3 5.5 mA 300 555 µA 12 18 mA HOT-PLUG DETECT The TMDS261 is designed to support the hot-plug indication to the input ports (HDMI/DVI sources connected to TMDS261) via the HPD[1:2] output pins. The state of the hot-plug output of the selected source follows the state of the hot-plug input (HPD_SINK input pin) from the sink side. The state of the hot-plug output for the non-selected source goes low (See Table 1). The maximum VOH of the HPD depends on VCC. It is recommended that if VOH greater than 3.6 V is needed on HPD, then an external circuit can be used to drive the VOH off of the +5 V from the HDMI source connected (as shown in Figure 33). ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V VOH(HPD) High-level output voltage IOH = 100 µA 2 VCC VOL(HPD) Low-level output voltage IOL = 100 µA 0 0.4 V IH High-level input current VIH = 2 V, VCC = 3.6 V –10 10 µA IL Low-level input current VIL = 0.8 V, VCC = 3.6 V –10 10 µA RL Output source impedance 1200 Ω 10 800 1000 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) TYP MAX tPD1(HPD) HPD_SINK propagation delay PARAMETER HPD_SINK to HPD[1:2] TEST CONDITIONS MIN 12 20 ns tS1 Selecting port HPD switch time S[1:2] to HPD[1:2] 17 30 ns tS2 Deselecting port HPD switch time S[1:2] to HPD[1:2] 14 22 ns tZ Low-power to high-level propagation delay LP to HPD[1:2] 13 20 ns 5V HPD BUFFER HPD Input HPD_SINK HPD Output 2.5 V 5 pF 5 pF UNIT 0V tPD1(HPD) 3.3 V HPD[1:2] S0367-01 1.65 V 0V T0387-02 Figure 1. HPD Test Circuit Figure 2. HPD Timing Diagram #1 5V HPD_SINK 0V 5V 2.5 V 0V S1 5V S2 0V VCC VCC/2 0V HPD2 ts2 VCC VCC/2 0V HPD1 ts1 5V 2.5 V 0V LP tz T0423-01 Figure 3. HPD Timing Diagram #2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 11 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com TMDS DDC and Local I2C Pins DDC I2C Buffer or Repeater: The TMDS261 provides buffering on the DDC I2C interface for each of the input ports connected. This feature isolates the capacitance on the source side from the sink side and thus helps in passing system-level compliance. See the DDC I2C Function Description section for a detailed description on how the DDC I2C buffer operates. Note that a key requirement on the sink side is that the VIL(Sink) (input to TMDS261) should be less than 0.4 V. This requirement should be met for the DDC I2C buffer to function properly. There are three settings of VIL(Sink) and VOL(Sink) that can be chosen based on OVS settings (See Table 8 through Table 11). Local I2C Interface: The TMDS261 includes a slave I2C interface to control device features like TMDS input port selection, TMDS output edge-rate control, power management, DDC buffer OVS settings, etc. See Table 8 through Table 11. The TMDS261 is designed to be controlled via a local I2C interface or GPIO interface, based on the status of the I2C_SEL pin. The local I2C interface in the TMDS261 is only a slave I2C interface. See the I2C INTERFACE NOTES section for a detailed description of I2C functionality. ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER IL Low-level input current Ilkg(Sink) Input leakage current TEST CONDITIONS TYP MAX UNIT VCC = 3.6 V, VI = 0 V –10 10 µA Sink pins VCC = 3.6 V, VI = 4.95 V –10 10 µA DC bias = 2.5 V, AC = 3.5 Vp-p, f = 100 kHz 15 pF CIO(Sink) Input/output capacitance Sink pins VIH(Sink) High-level input voltage Sink pins VIL1(Sink) Low-level input voltage Sink pins OVS 1 VOL1(Sink) Low-level output voltage Sink pins IO = 3 mA, OVS = HIGH VIL2(Sink) Low-level input voltage Sink pins OVS 2 VOL2(Sink) Low-level output voltage Sink pins IO = 3 mA, OVS = LOW VIL3(Sink) Low-level input voltage Sink pins OVS 3 VOL3(Sink) Low-level output voltage Sink pins Ilkg(I2C) Input leakage current Port[1:2] pins CIO(I2C) Input/output capacitance Port[1:2] pins DC bias = 2.5 V, AC = 3.5 Vp-p, f = 100 kHz VIH(I2C) High-level input voltage Port[1:2] pins VIL(I2C) Low-level input voltage Port[1:2] pins VOL(I2C) Low-level output voltage Port[1:2] pins 12 MIN 2.1 5.5 V –0.2 0.4 V 0.6 0.7 V –0.2 0.4 V 0.5 0.6 V –0.2 0.3 V IO = 3 mA, OVS = high-Z 0.4 0.5 V VCC = 3.6 V, VI = 4.95 V –10 10 µA 15 pF 2.1 5.5 V –0.2 1.5 V 0.2 V IO = 3 mA Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) MAX UNIT tPLH1 Propagation delay time, low to high PARAMETER Source to sink TEST CONDITIONS MIN 80 TYP 251 ns tPHL1 Propagation delay time, high to low Source to sink 35 200 ns tPLH2 Propagation delay time, low to high Sink to source 204 459 ns tPHL2 Propagation delay time, high to low Sink to source 35 200 ns tf1 Output signal fall time Sink side 20 72 ns tf2 Output-signal fall time Source side 20 fSCL SCL clock frequency for internal register Local I2C tW(L) Clock LOW period for I2C register Local I2C 72 ns 100 kHz 4.7 µs tW(H) Clock HIGH period for internal register Local I C 4 µs tSU1 Internal register setup time, SDA to SCL Local I2C 250 ns th(1) Internal register hold time, SCL to SDA Local I2C 0 µs t(buf) Internal register bus free time between STOP and START Local I2C 4.7 µs 2 tsu(2) Internal register setup time, SCL to START Local I C 4.7 µs th(2) Internal register hold time, START to SCL Local I2C 4 µs tsu(3) Internal register hold time, SCL to STOP Local I2C 4 µs 2 5V VCC RL = 2 kW PULSE GENRATOR D.U.T. RT CL = 100 pF VOUT VIN S0369-02 Figure 4. Sink-Side Test Circuit 5V VCC RL = 2 kW PULSE GENRATOR D.U.T. RT CL = 400 pF VIN VOUT S0370-02 Figure 5. Source-Side Test Circuit Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 13 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com 5V SCL[x] SDA[x] Input 1.6 V 0.1 V tPHL2 tPLH2 5V 80% SCL_SINK SDA_SINK Output 1.6 V 20% VOL tf2 T0388-01 Figure 6. Source-Side Output AC Measurements 5V SCL_SINK SDA_SINK Input 1.6 V 0.1 V tPHL1 5V 80% SCL[x] SDA[x] Output 1.6 V 20% VOL tf1 T0389-01 Figure 7. Sink-Side Output AC Measurements 5V SCL_SINK SDA_SINK Input VOL tPLH1 5V SCL[x] SDA[x] Output 1.6 V T0390-01 Figure 8. Source-Side Output AC Measurements (Continued) TMDS Main Link Pins The TMDS port of the TMDS261 is designed to be compliant with the Digital Video Interface (DVI) 1.0 and High Definition Multimedia Interface (HDMI) 1.3 specifications. The differential output voltage swing can be fine-tuned with the VSadj resistor. 14 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN AVCC = 3.3 V, RT = 50 Ω VOH Single-ended HIGH-level output voltage VOL Single-ended LOW-level output voltage VSWING Single-ended output voltage swing VOC(SS) Change in steady-state common-mode output voltage between logic states VOD(pp) Peak-to-peak output differential voltage V(O)SBY Single-ended standby output voltage I(O)OFF 0 V ≤ VCC ≤ 1.5 V, AVCC = 3.3 V, Single-ended power-down output current RT = 50 Ω IOS Short-circuit output current See Figure 16 -15 VCD(pp) Minimum valid clock differential voltage (peak-to-peak) Input TMDS clock frequency = 300 MHz 100 TYP MAX UNIT AVCC – 10 AVCC + 10 mV AVCC – 600 AVCC – 400 mV 400 600 mV 5 mV 800 1200 mV AVCC – 10 AVCC + 10 mV –10 10 µA 15 mA 12 mV SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT 800 ps 800 ps 140 ps 110 140 ps 142 160 190 ps 142 160 190 ps Rise time, fastest mode + 100 ps (approximately) 187 210 230 ps tF3 Fall time, fastest mode + 100 ps (approximately) 187 210 230 ps tR4 Rise time, fastest mode + 120 ps (approximately): Slowest Setting 216 230 260 ps tF4 Fall time, fastest mode + 120 ps (approximately): Slowest Setting 216 230 260 ps tSK(P) Pulse skew (see 8 15 ps tSK(D) Intra-pair skew tSK(O) Inter-pair skew (see tJITD(PP) Peak-to-peak output residual data jitter tPLH Propagation delay time 250 tPHL Propagation delay time 250 tR1 Rise time, fastest mode (default setting): Fastest Setting 84 110 tF1 Fall time, fastest mode (default setting): Fastest Setting 84 tR2 Rise time, fastest mode + 50 ps (approximately) tF2 Fall time, fastest mode + 50 ps (approximately) tR3 (1) (2) (3) AVCC = 3.3 V, RT = 50 Ω. See Figure 9 and Figure 10. (2) ) AVCC = 3.3 V, RT = 50 Ω. See Figure 11. 10 (3) ) AVCC = 3.3 V, RT = 50 Ω, dR = 2.25 Gbps. See Figure 14 for measurement setup; residual jitter is the total jitter measured at TTP4 minus the jitter measured at TTP1. See Figure 15 for the loss profile of the cable used for tJITD(PP) measurement. Also see Typical Curves for tJITD(PP) across cable length and input TMDS data rate. 40 30 ps 100 ps 88 ps All typical values are at 25°C and with a 3.3-V supply. tsk(p) is the magnitude of the time difference between tPLH and tPHL of a specified terminal. tsk(o) is the magnitude of the difference in propagation delay times between any specified terminals of a sink-port bank when inputs of the active source port are tied together. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 15 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com SWITCHING CHARACTERISTICS (continued) over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT tJITC(PP) Peak-to-peak output residual clock jitter AVCC = 3.3 V, RT = 50 Ω, input TMDS clock frequency = 225 MHz. See Figure 14for measurement setup; residual jitter is the total jitter measured at TTP4 minus the jitter measured at TTP1. See Figure 15 for the loss profile of the cable used for tJITC(PP) measurement. 10 35 ps tCLK1 Valid clock-detect enable time AVCC = 3.3 V, RT = 50 Ω, input TMDS clock frequency = 300 MHz. See Figure 13. 300 500 ns tCLK2 Invalid clock-detect disable time AVCC = 3.3 V, RT = 50 Ω, input TMDS clock frequency = 1 MHz. See Figure 13. 500 800 ns tSEL1 Port selection time (see AVCC = 3.3 V, RT = 50 Ω 300 500 ns tSEL2 Port deselection time (see AVCC = 3.3 V, RT = 50 Ω 40 50 ns fCD Clock-detect frequency 300 MHz (4) (5) (4) (5) ) AVCC = 3.3 V, RT = 50 Ω. See Figure 13. 25 tSEL1 includes the time for the valid clock detect enable time and tS1(HPD), because the tS1(HPD) event happens in parallel with tSEL1; thus, the tSEL1 time is primarily the tCLK1 time. tSEL2 is primarily the tS2(HPD) time. AVCC VCC 50 W 50 W 50 W D+ VD+ Receiver VID D– VD– 50 W 0.5 pF VID = VD+ – VD– V = (VD+ + VD–) ICM 2 Y Driver VY Z VOD = VY – VZ V = (VY + VZ) VZ OC 2 S0371-02 Figure 9. TMDS Main-Link Test Circuit 16 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 3.3 V VID 2.8 V VID+ VID(pp) 0V VID– tPLH tPHL 80% 20% tf 80% VOD(pp) VOD 20% tr T0391-01 Figure 10. TMDS Main-Link Timing Measurements VOH VY 50% VZ VOL tsk(D) Figure 11. Definition of Intra-Pair Differential Skew VOC DVOC(SS) T0392-01 Figure 12. TMDS Main-Link Common-Mode Measurements VCD(PP) Valid Input TMDS clock that meets the min Frequency Threshold and Amplitude tclk1 tclk2 TMDS outputs HiZ during this duration VOD(PP) TMDS outputs HiZ TMDS output clock with peak to peak swing compliant to the HDMI spec and same frequency as the Input TMDS clock frequency T0424-01 Figure 13. Clock-Detect Timing Diagram Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 17 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com (4) AVCC RT Data+ Video Data– Patterm Generator 1000-mVpp Differential Coax Coax SMA HDMI Cable SMA (6) SMA <2-inch 50-W Transmission Line RX +EQ SMA (6) OUT <2-inch 50-W Transmission Line Clk+ Clk– Coax Coax Jitter Test AVCC Instrument(2, 3) (1) TM261 SMA (6) RX +EQ SMA (5) Coax RT Coax RT SMA <2-inch 50-W Transmission Line OUT (6) SMA <2-inch 50-W Transmission Line RT Coax Coax Jitter Test (2, 3) Instrument TTP1 TTP2 TTP4 TTP3 B0331-02 (1) The HDMI cable between TTP1 and TTP2 is 20 m. See Figure 15 for the loss profile of the cable. (2) All jitter is measured at a BER of 10–12. (3) Residual jitter is the total jitter measured at TTP4 minus the jitter measured at TTP1. (4) AVCC = 3.3 V. (5) RT = 50 Ω. (6) 2 inches = 5.08 cm. Figure 14. TMDS Jitter Measurements 0 HDMI Cable 20 m −5 Amplitude − dB −10 −15 −20 −25 −30 −35 0.0 0.5 1.0 1.5 2.0 2.5 3.0 f − Frequency − GHz G001 Figure 15. Loss Profile of 20-m HDMI Cable 18 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 50 W OS Driver 50 W + – 0 V or 3.6 V S0372-01 Figure 16. TMDS Main Link Short-Circuit Output Circuit TYPICAL CHARACTERISTICS AVCC = 3.3 V, RT = 50 Ω POWER vs AMBIENT TEMPERATURE POWER vs INPUT TMDS DATA RATE 590 590 VCC = 3.3 V, Input TMDS Data Rate = 2.25 Gbps 580 580 TA = 25°C, VCC = 3.3 V, VSadj = 4.02 KΩ VSadj = 4.02 KΩ 570 570 Fastest (Default) TMDS Output Edge Rate 560 550 Power − mW Power − mW 560 Fastest (Default) TMDS Output Edge Rate 540 530 520 550 540 530 520 Slowest TMDS Output Edge Rate 510 510 500 500 490 0 10 20 30 40 50 TA − Ambient Temperature − °C 60 70 490 0.0 Slowest TMDS Output Edge Rate 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Input TMDS Data Rate − Gbps G002 Figure 17. G003 Figure 18. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 19 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω PEAK-PEAK RESIDUAL DATA JITTER vs INPUT TMDS DATA RATE PEAK-PEAK RESIDUAL DATA JITTER vs HDMI CABLE LENGTH 100 140 VSadj = 4.02 kΩ, TA =25°C, VCC = 3.3 V TA = 25°C VCC = 3.3 V VSadj = 4.02 kΩ 80 Peak-to-Peak Residual Data Jitter − ps Peak-to-Peak Residual Data Jitter − ps 90 20 m, 24 AWG HDMI Cable 70 15 m, 26 AWG HDMI Cable 60 50 40 10 m, 28 AWG HDMI Cable 30 20 10 0 0.0 120 100 80 60 40 20 3 m, 28 AWG HDMI Cable 0.5 1.0 1.5 2.0 2.5 0 3.0 20 m 28 AWG 3.5 20 m 24 AWG 15 m 10 m 26 AWG 28 AWG Input TMDS Data Rate − Gbps 5m 3m 3m 1m 1m 28 AWG 28 AWG 30 AWG 28 AWG 30 AWG HDMI Cable Length G005 Figure 19. G007 Figure 20. VOD(pp) vs VSadj VOD(pp) − Differential Output Voltage − mV 1600 TA = 25°C 1400 VCC = 3.6 V 1200 VCC = 3.3 V 1000 VCC = 3 V 800 600 400 200 0 3 4 5 6 7 VSadj Resistance − kΩ G008 Figure 21. 20 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω TP1 TP2 TP3 TMDS261 Test Board HDMI Cable Video Format Generator TMDS 261 Figure 22. HDMI Cable Test-Point Configuration Figure 23. Eye at TP3 (Output of TMDS261) With 20-m, 24-AWG HDMI Cable, 2.25-Gbps Input TMDS data Rate, Fastest Rise- and Fall-Time Setting on TMDS Outputs Figure 24. Eye at TP3 (Output of TMDS261) With 20-m, 24-AWG HDMI Cable, 3-Gbps Input TMDS Data Rate, Fastest Rise- and Fall-Time Setting on TMDS Outputs Figure 25. Eye at TP3 (Output of TMDS261) With 3-m, 28-AWG HDMI Cable, 3-Gbps Input TMDS Data Rate, Fastest Rise- and Fall-Time Setting on TMDS Outputs Figure 26. Eye at TP3 (Output of TMDS261) With 3-m, 28-AWG HDMI Cable, 3-Gbps Input TMDS Data Rate, Slowest Rise- and Fall-Time Setting on TMDS Outputs Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 21 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω Figure 27. Eye at TP3 (Output of TMDS261) With 20-m, 24-AWG HDMI Cable, 2.25-Gbps Input TMDS Data Rate, Slowest Rise- and Fall-Time Setting on TMDS outputs 22 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 APPLICATION INFORMATION Table 3. TMDS261 vs TMDS251 Pinout PIN NUMBER I/O Pins 32 and 33 I TMDS251 TMDS261 GPIO mode: S1 and S2 configured as source selector pins GPIO mode: S1 and S2 configured as source selector pins (same as TMDS251) I2C mode: S1 and S2 configured as SCL and SDA for local slave I2C communication Pin 34 Pin 49 I — EQ: TMDS input equalization control select I2C_SEL: GPIO / local I2C control select EQ = Low – HDMI 1.3 compliant cable I2C_SEL = High – Device is configured by GPIO logic. EQ = High – 10-m 28 AWG HDMI cable I2C_SEL= Low – Device is configured by I2C logic. VDD: HPD/DDC power supply LP: Low-power mode select bar LP = High – Normal operational mode LP = Low – Device goes into low-power state. Based on the differences listed in Table 3, attention must be given to pin 34, which determines whether the device uses I2C or GPIO control. Supply Voltage The TMDS261 is powered up with a single power source that is 3.3-V VCC for the TMDS circuitry for HPD, DDC, and most of the control logic. TMDS Input Fail-Safe The TMDS261 incorporates clock-detect circuitry. If there is no valid TMDS clock from the connected HDMI/DVI source, the TMDS261 does not switch on the terminations on the source-side data channels. Additionally, the TMDS outputs are placed in the high-impedance state. This prevents the TMDS261 from turning on its outputs if there is no valid incoming HDMI/DVI data. TMDS Outputs A 10% precision resistor, 4.02-kΩ, is recommended to control the output swing to the HDMI-compliant 800-mV to 1200-mV range VOD(pp) (1000 mV typical). The TMDS outputs are high-impedance under standby mode operation, S1 = H and S2 = L. DDC I2C Function Description The TMDS261 provides buffers on the DDC I2C lines on all two input ports. This section explains the operation of the buffer. For representation, the source side of the TMDS261 is represented by RSCL/RSDA, and the sink side is represented by TSCL/TSDA. The buffers on the RSCL/RSDA and TSCL/TSDA pins are 5-V tolerant when the device is powered off and high-impedance under low supply voltage, 1.5 V or below. If the device is powered up, the driver T (see Figure 28) is turned on or off depending on the corresponding R-side voltage level. When the R side is pulled low below 1.5 V, the corresponding T-side driver turns on and pulls the T side down to a low level output voltage, VOL. The value of VOL and VIL on the T side or the sink side of the TMDS261 switch depends on the output-voltage select (OVS) control settings. OVS control can be changed by the slave I2C, see Table 8. When the OVS1 setting is selected, VOL is typically 0.7 V and VIL is typically 0.4 V. When the OVS2 setting is selected, VOL is typically 0.6 V and VIL is typically 0.4 V. When OVS3 setting (default) is selected, VOL is typically 0.5 V and VIL is typically 0.3 V. VOL is always higher than the driver-R input threshold, VIL on the T side or the sink side, preventing lockup of the repeater loop. The TMDS261 is targeted primarily as a switch in the HDTV market and is expected to be a companion chip to an HDMI receiver; thus, the OVS control has been provided on the sink side, so that the requirement of VIL to be less than 0.4 V can be met. The VOL value can be selected to improve or optimize noise margins between VOL and VIL of the repeater itself or VIL of some external device connected on the T side. When the R side is pulled up, above 1.5 V, the T-side driver turns off and the T-side pin is high-impedance. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 23 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com OVS T RSCL RSDA TSCL TSDA R B0344-01 2 Figure 28. I C Drivers in the TMDS261 (R Side Is the HDMI Source Side, T Side Is the HDMI Sink Side) When the T side is pulled below 0.4 V by an external I2C driver, both drivers R and T are turned on. Driver R pulls the R side to near 0 V, and driver T is on, but is overridden by the external I2C driver. If driver T is already on, due to a low on the R side, driver R just turns on. When the T side is released by the external I2C driver, driver T is still on, so the T side is only able to rise to the VOL of driver T. Driver R turns off, because VOL is above its 0.4-V VIL threshold, releasing the R side. If no external I2C driver is keeping the R side low, the R side rises, and driver T turns off once the R side rises above 1.5 V, see Figure 29. VCC TSCL/TSDA 0.5 V tPLH 5 V ±10% RSCL/RSDA VCC/2 Figure 29. Waveform of Driver T Turning Off It is important that any external I2C driver on the T side is able to pull the bus below 0.4 V to achieve full operation. If the T side cannot be pulled below 0.4 V, driver R may not recognize and transmit the low value to the R side. DDC I2C Behavior The typical application of the TMDS261 is as a 2×1 switch in a TV connecting up to two HDMI input sources to an HDMI receiver. The I2C repeater is 5-V tolerant, and no additional circuitry is required to translate between 3.3-V and 5-V bus voltages. In the following example, the system master is running on an R-side I2C-bus while the slave is connected to a T-side bus. Both buses run at 100 kHz, supporting standard-mode I2C operation. Master devices can be placed on either bus. 24 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 VRdd V Tdd Driver T RRup RTup Master Slave CSOURCE CI CO Cslave Driver R Cmedium CCABLE Figure 30. Typical Application Figure 31 illustrates the waveforms seen on the R-side I2C-bus when the master writes to the slave through the I2C repeater circuit of the TMDS261. This looks like a normal I2C transmission, and the turnon and turnoff of the acknowledge signals are slightly delayed. 9th Clock Pulse - Acknowledge From Slave RSCL RSDA Figure 31. Bus-R Waveform Figure 32 illustrates the waveforms seen on the T-side I2C-bus under the same operation as in Figure 31. On the T-side of the I2C repeater, the clock and data lines would have a positive offset from ground equal to the VOL of the driver T. After the 8th clock pulse, the data line is pulled to the VOL of the slave device, which is very close to ground in this example. At the end of the acknowledge, the slave device releases and the bus level rises back to the VOL set by the driver until the R-side rises above VCC/2, after which it continues to be high. It is important to note that any arbitration or clock-stretching events require that the low level on the T-side bus at the input of the TMDS261 I2C repeater is below 0.4 V to be recognized by the device and then transmitted to the R-side I2C bus. 9th Clock Pulse - Acknowledge From Slave TSCL TSDA VOL Of Driver T V OL Of Slave Figure 32. Bus T Waveform I2C Pullup Resistors The pullup resistor value is determined by two requirements: 1. The maximum sink current of the I2C buffer: The maximum sink current is 3 mA or slightly higher for an I2C driver supporting standard-mode I2C operation. Rup(min) = VDD/Isink (1) 2. The maximum transition time on the bus: Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 25 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com The maximum transition time, T, of an I2C bus is set by an RC time constant, where R is the pullup resistor value and C is the total load capacitance. The parameter, k, can be calculated from Equation 3 by solving for t, the times at which certain voltage thresholds are reached. Different input threshold combinations introduce different values of t. Table 4 summarizes the possible values of k under different threshold combinations. T = k × RC (2) V(t) = VDD(1 – e–t/RC) (3) Table 4. Value of k for Different Input Threshold Voltages Vth–\Vth+ 0.7 VDD 0.65 VDD 0.6 VDD 0.55 VDD 0.5 VDD 0.45 VDD 0.4 VDD 0.35 VDD 0.3 VDD 0.1 VDD 1.0986 0.9445 0.8109 0.6931 0.5878 0.4925 0.4055 0.3254 0.2513 0.15 VDD 1.0415 0.8873 0.7538 0.6360 0.5306 0.4353 0.3483 0.2683 0.1942 0.2 VDD 0.9808 0.8267 0.6931 0.5754 0.4700 0.3747 0.2877 0.2076 0.1335 0.25 VDD 0.9163 0.7621 0.6286 0.5108 0.4055 0.3102 0.2231 0.1431 0.0690 0.3 VDD 0.8473 0.6931 0.5596 0.4418 0.3365 0.2412 0.1542 0.0741 — From Equation 1, Rup(min) = 5.5 V/3 mA = 1.83 kΩ to operate the bus under a 5-V pullup voltage and provide less than 3 mA when the I2C device is driving the bus to a low state. If a higher sink current, for example 4 mA, is allowed, Rup(min) can be as low as 1.375 kΩ. Given a 5-V I2C device with input low and high threshold voltages at 0.3 Vdd and 0.7 Vdd, respectively, the value of k is 0.8473 from Table 4. Taking into account the 1.83-kΩ pullup resistor, the maximum total load capacitance is C(total-5V) = 645 pF. Ccable(max) should be restricted to be less than 545 pF if Csource and Ci can be as high as 50 pF. Here the Ci is treated as Csink, the load capacitance of a sink device. Fixing the maximum transition time from Table 4, T = 1 µs, and using the k values from Table 4, the recommended maximum total resistance of the pullup resistors on an I2C bus can be calculated for different system setups. To support the maximum load capacitance specified in the HDMI spec, Ccable(max) = 700 pF/Csource = 50 pF/Ci = 50 pF, R(max) can be calculated as shown in Table 5. Table 5. Pullup Resistor for Different Threshold Voltages and 800-pF Load Vth–\Vth+ 0.7 VDD 0.65 VDD 0.6 VDD 0.55 VDD 0.5 VDD 0.45 VDD 0.4 VDD 0.35 VDD 0.3 VDD UNIT 0.1 VDD 1.14 1.32 1.54 1.80 2.13 2.54 3.08 3.84 4.97 kΩ 0.15 VDD 1.20 1.41 1.66 1.97 2.36 2.87 3.59 4.66 6.44 kΩ 0.2 VDD 1.27 1.51 1.80 2.17 2.66 3.34 4.35 6.02 9.36 kΩ 0.25 VDD 1.36 1.64 1.99 2.45 3.08 4.03 5.60 8.74 18.12 kΩ 0.3 VDD 1.48 1.80 2.23 2.83 3.72 5.18 8.11 16.87 — kΩ Or, limiting the maximum load capacitance of each cable to 400 pF to accommodate with I2C spec version 2.1. Ccable(max) = 400 pF/Csource = 50 pF/Ci = 50 pF, the maximum values of R(max) are calculated as shown in Table 6. Table 6. Pullup Resistor Upon Different Threshold Voltages and 500-pF Loads 26 Vth–\Vth+ 0.7 VDD 0.65 VDD 0.6 VDD 0.55 VDD 0.5 VDD 0.45 VDD 0.4 VDD 0.35 VDD 0.3 VDD UNIT 0.1 VDD 1.82 2.12 2.47 2.89 3.40 4.06 4.93 6.15 7.96 kΩ 0.15 VDD 1.92 2.25 2.65 3.14 3.77 4.59 5.74 7.46 10.30 kΩ 0.2 VDD 2.04 2.42 2.89 3.48 4.26 5.34 6.95 9.63 14.98 kΩ 0.25 VDD 2.18 2.62 3.18 3.92 4.93 6.45 8.96 13.98 28.99 kΩ 0.3 VDD 2.36 2.89 3.57 4.53 5.94 8.29 12.97 26.99 — kΩ Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 Obviously, to accommodate the 3-mA drive current specification, a narrower threshold voltage range is required to support a maximum 800-pF load capacitance for a standard-mode I2C bus. When the input low- and high-level threshold voltages, Vth– and Vth+, are 0.7 V and 1.9 V, respectively, which is 0.15 VDD and 0.4 VDD, approximately. With VDD = 5 V from Table 5, the maximum pullup resistor is 3.59 kΩ. The allowable pullup resistor is in the range of 1.83 kΩ and 3.59 kΩ. HPD Pins The HPD circuits are powered by the 3.3-V VCC supply. This provides maximum VOH = VCC and maximum VOL= 0.4-V output signals to the SOURCE with a typical 1-kΩ output resistance. An external 1-kΩ resistor is not needed here. The HPD output of the selected source port follows the logic level of the HPD_SINK input. Unselected HPD outputs are kept low. When the device is in standby mode, all HPD outputs follow HPD_SINK. If VOH greater than VCC is desired, then an external circuit as shown in Figure 33 can be used. In this case, the max VOH can be equal to the 5 V coming from the HDMI source. 5V_Source (5 V coming from HDMI source) VCC/5V_source VCC 1 kW 1 kW HPD_SOURCE 1 kW (internal series resistor) HPD_SINK HPD[1:2] 10 kW TMDS261 VCC HPD_SINK HPD[1:2] ON L H HPD_SOURCE L ON H L H OFF X Z H S0387-02 Figure 33. External Circuit to Drive 5-V VOH on HPD[1:2] Layout Considerations The high-speed differential TMDS inputs are the most critical paths for the TMDS261. There are several considerations to minimize discontinuities on these transmission lines between the connectors and the device: • Maintain 100-Ω differential transmission line impedance into and out of the TMDS261. • Keep an uninterrupted ground plane beneath the high-speed I/Os. • Keep the ground-path vias to the device as close as possible to allow the shortest return current path. • Keep the trace lengths of the TMDS signals between connector and device as short as possible. Using the TMDS261 in Systems with Different CEC Link Requirements The TMDS261 supports a DTV with up to two HDMI inputs when used in conjunction with a signal-port HDMI receiver. Figure 34 and Figure 35 through Figure 37 show simplified application block diagrams for the TMDS261 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 27 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com in different DTVs with different consumer electronic control (CEC) requirements. The CEC is an optional feature of the HDMI interface for centralizing and simplifying user control instructions from multiple audio/video products in an interconnected system, even when all the audio/video products are from different manufacturers. This feature minimizes the number of remote controls in a system, as well as reducing the number of times buttons must be pressed. A DTV Supporting a Passive CEC Link In Figure 34, the DTV does not have the capability of handling CEC signals, but allows CEC signals to pass over the CEC bus. The source selection is done by the control command of the DTV. The user cannot force the command from any audio/video product on the CEC bus. The selected source reads the E-EDID data after receiving an asserted HPD signal. The microcontroller loads different CEC physical addresses while changing the source by means of the S1 and S2 pins. E-EDID Reading Configurations in Standby Mode When the DTV system is in standby mode, the sources do not read the E-EDID memory because the 1-kΩ pulldown resistor keeping the HPD_SINK input at logic low forces all HPD pins to output logic-low to all sources. The source does not read the E-EDID data with a low on HPD signal. However, if reading the E-EDID data in the system standby mode is preferred, then TMDS261 can still support this need. The recommended configuration sequences are: 1. Apply the same 3.3-V power to the VCC of TMDS261 and the TMDS line termination at the HDMI receiver 2. Because the TMDS261 has clock-detect circuitry and there is no valid input TMDS clock in the standby mode, TMDS261 draws significanty less current. 3. Set S1 and S2 to select the source port which is allowed to read the E-EDID memory. Note that if the source has a time-out limitation between the 5-V and the HPD signals, the foregoing configuration is not applicable. Uses individual EEPROMs assigned for each input port, see Figure 35 through Figure 37. The solution uses E-EDID data to be readable during system power-off or standby-mode operations. SINK HPD 5V HPD 5V HPD1 5V SOURCE 1 SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 HPD 5V HPD 5V SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 VCC (3.3V) EQ 47kW SDA SCL CEC VDD (5V) SDA1 SCL1 mController S1 S2 CEC A21/B11 A22/B12 A23/B13 A24/B14 HPD_SINK 1kW 3.3V 4.7kW HPD2 5V 47kW SOURCE 2 4.7kW DDC_SDA DDC_SCL SDA_SINK SCL_SINK E-EDID SDA2 SCL2 HDMI RX CEC Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 A21/B21 A22/B22 A23/B23 A24/B24 GND VSadj 4.02kW 10% Figure 34. Two-Port HDMI-Enabled DTV With TMDS261 – CEC Commands Passing Through 28 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 A DTV Supporting an Active CEC Link In Figure 35, the CEC PHY and CEC LOGIC functions are added. The DTV can initiate and/or react to CEC signals from its remote control or other audio/video products on the same CEC bus. All sources must have their own CEC physical address to support the full functionality of the CEC link. A source reads its CEC physical address stored its E-EDID memory after receiving a logic-high from the HPD feedback. When HPD is high, the sink-assigned CEC physical address should be maintained. Otherwise, when HPD is low, the source sets CEC physical address value to (F.F.F.F). Case 1 – AC-Coupled Source (See Figure 35, Port 1) When the source TMDS lines are ac-coupled or when the source cannot detect the TMDS termination provided in the connected sink, the indication of the source selection can only come from the HPD signal. The TMDS261 HPD1 pin should be applied directly as the HPD signal back to the source. Case 2 – DC-Coupled Source (See Figure 36, Port 2) When the source TMDS lines are dc-coupled, there are two methods to inform the source that it is the active source to the sink. One is checking the HPD signal from the sink, and the other is checking the termination condition in the sink. In a full-CEC operation mode, the HPD signal is set high whether the port is selected or not. The source loads and maintains the CEC physical address when HPD is high. As soon as HPD goes low, the source loses the CEC physical address. To keep the CEC physical address to the source, the HPD signal is looping back from the source-provided 5-V signal through a 1-kΩ pullup resistor in the sink. This method is acceptable in applications where the HDMI transmitter can detect the receiver termination by current sensing and the receiver has switchable termination on the TMDS inputs. The internal termination resistors are connected to the termination voltage when the port is selected, or they are disconnected when the port is not selected. The TMDS261 features switchable termination on the TMDS inputs. Case 3 – External Logic Control for HPD (See Figure 37, Port 3) When the HDMI transmitter does not have the capability of detecting the receiver termination, using the HPD signal as a reference for sensing port selections is the only possible method. External control logic for switching the connections of the HPD signals between the HPD pins of the TMDS261 and the 5-V signal from the source provides a good solution. E-EDID Reading Configurations in Standby Mode When the TMDS261 is in standby mode operation, S1 = H and S2 = L, all sources can read their E-EDID memories simultaneously with all HPD pins following HPD_SINK in logic-high. HPD_SINK input low prevents E-EDID reading in standby-mode operation. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 29 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com SINK HPD 5V SOURCE with AC coupled HDMI output HPD 5V SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 HPDx VDD (5V) VCC (3.3V) SDA SCL EQ 5V 47kW mController S1 S2 SDAx SCLx CEC LOGIC CEC E-EDID Ax1/Bx1 Ax2/Bx2 Ax3/Bx3 Ax4/Bx4 HPD_SINK 1kW CEC PHY 3.3V 4.7kW 4.7kW DDC_SDA DDC_SCL SDA_SINK SCL_SINK HDMI RX Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 VSadj GND 4.02kW 10% Figure 35. Two-Port HDMI Enabled DTV With TMDS261 – AC Coupled Source – CEC Commands Active SINK HPD 5V HPD 5V 1kW 5V 47kW SOURCE with DC coupled HDMI output SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 HPDx VDD (5V) VCC (3.3V) SDA SCL EQ mController S1 S2 SDAx SCLx CEC LOGIC CEC E-EDID Ax1/Bx1 Ax2/Bx2 Ax3/Bx3 Ax4/Bx4 HPD_SINK 1kW CEC PHY 3.3V 4.7kW SDA_SINK SCL_SINK 4.7kW DDC_SDA DDC_SCL HDMI RX Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 GND Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 VSadj 4.02kW 10% Figure 36. Two-Port HDMI Enabled DTV With TMDS261 – DC Coupled Source – CEC Commands Active 30 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 SINK SOURCE in general HDMI output HPD 5V HPD 5V SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 1kW 5V 47kW HPDx VDD (5V) VCC (3.3V) SDA SCL EQ mController S1 S2 SDAx SCLx CEC LOGIC CEC E-EDID Ax1/Bx1 Ax2/Bx2 Ax3/Bx3 Ax4/Bx4 HPD_SINK 1kW CEC PHY 3.3V 4.7kW 4.7kW DDC_SDA DDC_SCL SDA_SINK SCL_SINK HDMI RX Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 VSadj GND 4.02kW 10% Figure 37. Two-Port HDMI Enabled DTV With TMDS261 – External Logic – CEC Commands Active I2C INTERFACE NOTES The I2C interface is used to access the internal registers of the TMDS261. I2C is a two-wire serial interface developed by Philips Semiconductor (see I2C-Bus Specification, Version 2.1, January 2000). The bus consists of a data line (SDA) and a clock line (SCL) with pullup structures. When the bus is idle, both SDA and SCL lines are pulled high. All the I2C-compatible devices connect to the I2C bus through open-drain I/O pins, SDA and SCL. A master device, usually a microcontroller or a digital signal processor, controls the bus. The master is responsible for generating the SCL signal and device addresses. The master also generates specific conditions that indicate the START and STOP of data transfer. A slave device receives and/or transmits data on the bus under control of the master device. The TMDS261 works as a slave and supports standard-mode transfer (100 kbps). The basic I2C start and stop access cycles are shown in Figure 38. The basic access cycle consists of the following: • A start condition • A slave address cycle • Any number of data cycles • A stop condition SDA SDA SCL SCL S P Start Condition Stop Condition T0393-01 2 Figure 38. I C Start and Stop Conditions GENERAL I2C PROTOCOL • The master initiates data transfer by generating a start condition. The start condition is when a high-to-low Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 31 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com • • • transition occurs on the SDA line while SCL is high, as shown in Figure 38. All I2C-compatible devices should recognize a start condition. The master then generates the SCL pulses and transmits the 7-bit address and the read/write direction bit R/W on the SDA line. During all transmissions, the master ensures that data is valid. A valid data condition requires the SDA line to be stable during the entire high period of the clock pulse (see Figure 39). All devices recognize the address sent by the master and compare it to their internal fixed addresses. Only the slave device with a matching address generates an acknowledge (see Figure 40) by pulling the SDA line low during the entire high period of the ninth SCL cycle. On detecting this acknowledge, the master knows that a communication link with a slave has been established. The master generates further SCL cycles to either transmit data to the slave (R/W bit 0) or receive data from the slave (R/W bit 1). In either case, the receiver must acknowledge the data sent by the transmitter. So an acknowledge signal can be generated either by the master or by the slave, depending on which one is the receiver. The 9-bit valid data sequences consisting of 8-bit data and 1-bit acknowledge can continue as long as necessary (See Figure 42 through Figure 45). To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line from low to high while the SCL line is high (see Figure 38). This releases the bus and stops the communication link with the addressed slave. All I2C compatible devices must recognize the stop condition. Upon the receipt of a stop condition, all devices know that the bus is released, and they wait for a start condition followed by a matching address. SDA SCL Data Line Stable; Data Valid Change of Data Allowed T0394-01 2 Figure 39. I C Bit Transfer Data Output by Transmitter Not Acknowledge Data Output by Receiver Acknowledge SCL From Master 1 2 8 9 S Clock Pulse for Acknowledgement START Condition T0395-01 2 Figure 40. I C Acknowledge 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SCL SDA MSB Acknowledge Slave Address Stop Acknowledge Data T0396-01 2 Figure 41. I C Address, Data Cycle(s), and Stop 32 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 During a write cycle, the transmitting device must not drive the SDA signal line during the acknowledge cycle so that the receiving device may drive the SDA signal low. After each byte transfer following the address byte, the receiving device pulls the SDA line low for one SCL clock cycle. A stop condition is initiated by the transmitting device after the last byte is transferred. An example of a write cycle can be found in Figure 42 and Figure 43. Note that the TMDS261 allows multiple write transfers to occur. See the Example – Writing to the TMDS261 section for more information. During a read cycle, the slave receiver acknowledges the initial address byte if it decodes the address as its address. Following this initial acknowledge by the slave, the master device becomes a receiver and acknowledges data bytes sent by the slave. When the master has received all of the requested data bytes from the slave, the not-acknowledge (A) condition is initiated by the master by keeping the SDA signal high just before it asserts the stop (P) condition. This sequence terminates a read cycle as shown in Figure 44 and Figure 45. See the Example – Reading from the TMDS261 section for more information. From Receiver S Slave Address W Data A Data A A A = No Acknowledge (SDA High) A = Acknowledge S = Start Condition P = Stop Condition W = Write P From Transmitter R0007-01 2 Figure 42. I C Write Cycle Acknowledge (From Receiver) Start Condition A5 A6 SDA A1 A0 R/W ACK D7 2 I C Device Address and Read/Write Bit Acknowledge (Receiver) D6 D1 Acknowledge (Receiver) D0 ACK First Data Byte D7 D6 D1 D0 ACK Stop Condition Other Last Data Byte Data Bytes T0397-01 Figure 43. Multiple-Byte Write Transfer S Slave Address W A Data Data A A A = No Acknowledge (SDA High) A = Acknowledge S = Start Condition P = Stop Condition W = Write R = Read P Transmitter Receiver R0008-01 2 Figure 44. I C Read Cycle Acknowledge Acknowledge (From Receiver) (From Transmitter) Start Condition A6 SDA 2 A0 R/W ACK I C Device Address and Read/Write Bit D7 D0 ACK D7 Not Acknowledge (Transmitter) D6 D1 D0 First Data Other Last Data Byte Byte Data Bytes ACK Stop Condition T0398-01 Figure 45. Multiple-Byte Read Transfer Slave Address Both SDA and SCL must be connected to a positive supply voltage via a pullup resistor. These resistors should comply with the I2C specification that ranges from 2 kΩ to 19 kΩ. When the bus is free, both lines are high. The address byte is the first byte received following the START condition from the master device. The 7-bit address is factory preset to 0101 100. Table 7 lists the calls that the TMDS261 responds to. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 33 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com Table 7. TMDS261 Slave Address FIXED ADDRESS READ/WRITE BIT Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (R/W) 0 1 0 1 1 0 0 1/0 EXAMPLE – WRITING TO THE TMDS261 The proper way to write to the TMDS261 is illustrated as follows: An I2C master initiates a write operation to the TMDS261 by generating a start condition (S) followed by the TMDS261 I2C address (as shown following, in MSB-first bit order, followed by a 0 to indicate a write cycle. After receiving an acknowledge from the TMDS261, the master presents the subaddress (sink port) to be written, consisting of one byte of data, MSB-first. The TMDS261 acknowledges the byte after completion of the transfer. Finally, the master presents the data to be written to the register (sink port), and the TMDS261 acknowledges the byte. The master can continue presenting data to be written after TMDS261 acknowledges the previous byte (steps 6, 7). After the last byte to be written has been acknowledged by TMDS261, the I2C master then terminates the write operation by generating a stop condition (P). Step 1 0 I2C start (master) S Step 2 2 I C general address (master) 7 6 5 4 3 2 1 0 0 1 0 1 1 0 0 0 7 6 5 4 3 2 1 0 0 0 0 0 Addr Addr Addr Addr Step 3 8 2 I C acknowledge (slave) A Step 4 2 I C write sink logic address (master) Step 5 8 I2C acknowledge (slave) A Step 6 I2C write data (master) 7 6 5 4 3 2 1 0 Data Data Data Data Data Data Data Data Data is the register address or register data to be written Step 7 8 I2C acknowledge (slave) A Step 8 0 I2C stop (master) P An example of the proper bit control for selecting port 2 is: Step 4: 0000 0001 Step 6: 1001 0000 EXAMPLE – READING FROM THE TMDS261 The read operation consists of two phases. The first phase is the address phase. In this phase, an I2C master initiates a write operation to the TMDS261 by generating a start condition (S) followed by the TMDS261 I2C address, in MSB-first bit order, followed by a 0 to indicate a write cycle. After receiving acknowledges from the TMDS261, the master presents the subaddress of the register to be read. After the cycle is acknowledged (A), the master may optionally terminate the cycle by generating a stop condition (P). The second phase is the data phase. In this phase, an I2C master initiates a read operation to the TMDS261 by 34 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 generating a start condition followed by the TMDS261 I2C address (as shown following for a read operation), in MSB first bit order, followed by a 1 to indicate a read cycle. After an acknowledge from the TMDS261, the I2C master receives one byte of data from the TMDS261. The master can continue receiving data byes by issuing an acknowledge after each byte read (steps 10, 11). After the last data byte has been transferred from the TMDS261 to the master, the master generates a not-acknowledge followed by a stop. TMDS261 Read Phase 1 Step 1 0 I2C start (master) S Step 2 7 6 5 4 3 2 1 0 I2C general address (master) 0 1 0 1 1 0 0 0 7 6 5 4 3 2 1 0 0 0 0 0 Addr Addr Addr Addr Step 3 8 I2C acknowledge (slave) A Step 4 2 I C write sink logic address (master) Where Addr is determined by the values shown in Table 7. Step 5 8 I2C acknowledge (slave) A Step 6 0 I2C stop (master) P Step 6 is optional. TMDS261 Read Phase 2 Step 7 0 I2C start (master) S Step 8 7 6 5 4 3 2 1 0 I2C general address (master) 0 1 0 1 1 0 0 1 Step 9 8 I2C acknowledge (slave) A Step 10 I2C read data (slave) 7 6 5 4 3 2 1 0 Data Data Data Data Data Data Data Data Where data is determined by the logic values contained in the internal registers. Step 11A 2 I C acknowledge (master) 8 A If Step 11A is executed, go to step 10. If Step 11B is executed, go to Step 12. Step 11B 8 I2C not acknowledge (master) A Step 12 0 I2C stop (master) P Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 35 TMDS261 SLLS953 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com Table 8. I2C Register 0x01 Lookup Table BIT 7:6 5:4 3:2 1:0 VALUE STATE DEFAULT DESCRIPTION 2 Bit 7 Bit 6 1 1 Port Select I C Mode 1 0 Port 2 is selected as the active port; HPD on non-selected ports is low. HPD2 can go low, high or high-Z. 0 0 Disallowed (indeterminate sate, all terminations are disconnected) 0 1 Standby mode: HPD[1:2] follows HPD_SINK. Bit 4 Bit 3 0 0 0 1 1 1 Bit 3 Bit 2 1 1 Fastest TMDS output rise and fall time setting + 120 ps approximately (slowest rise and fall time setting) 1 0 Fastest TMDS output rise and fall time setting + 100 ps approximately 0 1 0 0 Bit 1 Bit 0 1 0 Device enters low-power mode. 1 1 Device enters low-power mode. 0 1 Reserved 0 0 X Port 1 is selected as the active port; HPD on non-selected ports is low. HPD1 can go low, high or high-Z. OVS Control X OVS2: DDC sink-side VOL and VIL offset range 2: VIL2 (max): 0.4 V, VOL2 (max): OVS3: DDC sink-side VOL and VIL offset range 3: VIL3 (max): 0.3 V, VOL3 (max): 0.5 V 0.6 V OVS1: DDC sink-side VOL and VIL offset range 1: VIL1 (max): 0.4 V, VOL1 (max): 0.7 V Output Edge Rate Control Fastest TMDS output rise and fall time setting + 50 ps approximately X Fastest TMDS output rise and fall time setting Power Mode X Device is in normal-power mode. Register 0x01 is read/write. Table 9. I2C Register 0x02 Lookup Table BIT VALUE STATE 7:6 Bit 7 Bit 6 1 1 1 0 Indicates port 2 is selected as the active port, all other ports are low. 0 0 Disallowed (indeterminate sate, all terminations are disconnected) Indicates standby mode: HPD[1:2] follows HPD_SINK. 5:4 3:2 1:0 36 DEFAULT DESCRIPTION Port Select Status Indicator X Indicates port 1 is selected as the active port, all other ports are low. 0 1 Bit 4 Bit 3 0 0 0 1 1 1 Bit 3 Bit 2 1 1 Indicates fastest TMDS output rise and fall time setting + 120 ps approximately (slowest rise and fall time setting) 1 0 Indicates fastest TMDS output rise and fall time setting + 100 ps approximately 0 1 Indicates fastest TMDS output rise and fall time setting + 50 ps approximately OVS Control Status Indicator X Indicates DDC sink side VOL and VIL offset range 2: VIL2 (max): 0.4 V, VOL2 (max): 0.6 V Indicates DDC sink side VOL and VIL offset range 3: VIL3 (max): 0.3 V, VOL3 (max): 0.5 V Indicates DDC sink side VOL and VIL offset range 1: VIL1 (max): 0.4 V, VOL1 (max): 0.7 V Output edge rate status control 0 0 Bit 1 Bit 0 X Indicates fastest TMDS output rise and fall time setting 1 0 Indicates device enters low-power mode 1 1 Indicates device enters low-power mode 0 1 0 0 Power Mode Status Indicator Reserved X Indicates device is in normal-power mode Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 TMDS261 www.ti.com............................................................................................................................................................................................ SLLS953 – DECEMBER 2008 Register 0x02 is read-only. Table 10. I2C Register 0x03 Lookup Table BIT VALUE STATE 7 1 Clock detect disabled DEFAULT DESCRIPTION 0 Clock detect enabled 6:5 X RSVD 4 0 RSVD X Note: Do not write a 1 to this bit 3:0 0 RSVD X Reserved Clock Detect Circuit Disabled. For HDMI compliance testing (TMDS Termination Voltage Test) clock-detect feature should be disabled. In this mode the terminations on the TMDS input data lines are always connected when the port is selected. X Clock Detect Circuit Enabled. It is recommended that TMDS261 is used in this default mode during normal operation where clock detect circuit is enabled . The terminations on the TMDS input data lines are connected only when valid TMDS clock is detected on the selected port. Reserved Register 0x03 is read/write, For disabling clock detect, value of 80h or 1000 0000b can be written to register 0x03. Table 11. I2C Register 0x04 Lookup Table BIT VALUE STATE 7 1 Clock detected DEFAULT DESCRIPTION 0 No clock detect 6:5 X RSVD 4 0 RSVD X This bit should always read 0 3:0 0 RSVD X Reserved A valid clock signal is detected on the selected port. If clock detect is disabled in register 0x03, then bit 7 of register 0x04 will always be 1. X The selected port does not have a valid clock signal. Reserved Register 0x04 is read-only. Table 12. I2C Register 0x05 Lookup Table BIT VALUE STATE DEFAULT 7:0 — RSVD X DESCRIPTION Reserved. Read-only, value is indeterministic. Register 0x05 is TI internal use only. Table 13. I2C Register 0x06 Lookup Table BIT VALUE STATE DEFAULT 7:0 — RSVD X DESCRIPTION Reserved. Read-only, value is indeterministic. Register 0x06 is TI internal use only. Table 14. I2C Register 0x07 Lookup Table BIT VALUE STATE DEFAULT 7:0 — RSVD X DESCRIPTION Reserved. Read-only, value is indeterministic. Register 0x07 is TI internal use only. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TMDS261 37 PACKAGE OPTION ADDENDUM www.ti.com 15-Dec-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TMDS261PAG ACTIVE TQFP PAG 64 160 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TMDS261PAGR ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TMDS261PAGR Package Package Pins Type Drawing TQFP PAG 64 SPQ Reel Reel Diameter Width (mm) W1 (mm) 1500 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.0 13.0 1.5 16.0 24.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMDS261PAGR TQFP PAG 64 1500 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996 PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 48 0,08 M 33 49 32 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,05 MIN 1,05 0,95 0°– 7° 0,75 0,45 Seating Plane 0,08 1,20 MAX 4040282 / C 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. 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