TI SN65HVD1781DRG4

SN65HVD1781
www.ti.com
SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
70-V Fault-Protected RS-485 Transceiver
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
1
•
•
•
Bus-Pin Fault Protection to > ±70 V
Operation With 3.3-V to 5-V Supply Range
±16 kV HBM Protection on Bus Pins
Reduced Unit Load for up to 320 Nodes
Failsafe Receiver for Open-Circuit,
Short-Circuit and Idle-Bus Conditions
Low Power Consumption
– Low Standby Supply Current, 1 µA Max
– ICC 4 mA Quiescent During Operation
Designed for RS-485 and RS-422 Networks
Pin-Compatible With Industry-Standard
SN75176
HVAC Networks
Security Electronics
Building Automation
Telecomm Equipment
Motion Control
Industrial Networks
A
A
A
A
DESCRIPTION
This device is designed to survive overvoltage faults such as direct shorts to power supplies, mis-wiring faults,
connector failures, cable crushes, and tool mis-applications. The internal current-limit circuits allow fault
survivability without causing the high bus currents that otherwise might damage external components or power
supplies. It is also robust to ESD events, with high levels of protection to the JEDEC or IEC human-body-model
specification.
This device combines a differential driver and a differential receiver, which operate from a single power supply.
The driver differential outputs and the receiver differential inputs are connected internally to form a bus port
suitable for half-duplex (two-wire bus) communication. This port features a wide common-mode voltage range,
making the devices suitable for multipoint applications over long cable runs. This device is characterized from
–40°C to 125°C. The SN65HVD1781 is pin-compatible with the industry-standard SN75176 transceiver, making it
a drop-in upgrade for most devices.
The HVD1781 is fully compliant with ANSI TIA/EIA 485-A with a 5-V supply and can operate with a 3.3-V supply
with reduced driver output voltage for low-power applications.
VFAULT up to 70 V
M0092-02
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
SN65HVD1781
www.ti.com
SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
LOGIC DIAGRAM (POSITIVE LOGIC)
SN65HVD1781
D Package
(Top View)
3
DE
R
1
8
VCC
RE
2
7
B
DE
3
6
A
D
4
5
GND
4
D
2
RE
6
A
1
P0066-05
R
Bus
7
B
S0299-02
DEVICE INFORMATION
DRIVER FUNCTION TABLE
(1)
Input
Enable
Outputs
Driver State
D
DE
A
H
H
H
L
Actively drive bus High
L
H
L
H
Actively drive bus Low
X
L
Z
Z
Driver disabled
X
OPEN
Z
Z
Driver disabled by default
OPEN
H
H
L
Actively drive bus High by default
B
(1)
(1)
When both the driver and receiver are disabled, the device enters a low-power standby mode.
RECEIVER FUNCTION TABLE
(1)
2
Differential Input
Enable
Output
Receiver State
VID = VA – VB
RE
R
VIT+ < VID
L
H
Receive valid bus High
VIT– < VID < VIT+
L
?
Indeterminate bus state
VID < VIT–
L
L
Receive valid bus Low
X
H
Z
Receiver disabled
X
OPEN
Z
Receiver disabled by default
Open-circuit bus
L
H
Fail-safe high output
Short-circuit bus
L
H
Fail-safe high output
Idle (terminated) bus
L
H
Fail-safe high output
(1)
(1)
When both the driver and receiver are disabled, the device enters a low-power standby mode.
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
ABSOLUTE MAXIMUM RATINGS (1)
VCC
VALUE
UNIT
Supply voltage
–0.5 to 7
V
Voltage range at A and B inputs
–70 to 70
V
–0.3 to VCC + 0.3
V
Input voltage range at any logic pin
TJ
Voltage input range, transient pulse, A and B, through 100 Ω
–70 to 70
V
Receiver output current
–24 to 24
mA
170
°C
Junction temperature
Continuous total power dissipation
See Dissipation Rating Table
IEC 60749-26 ESD (human-body model), bus terminals and GND
±16
kV
JEDEC Standard 22, Test Method A114 (human-body model), bus terminals and GND
±16
kV
JEDEC Standard 22, Test Method A114 (human-body model), all pins
±4
kV
±2
kV
±400
V
JEDEC Standard 22, Test Method C101 (charged-device model), all pins
JEDEC Standard 22, Test Method A115 (machine model), all pins
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE DISSIPATION RATINGS
PACKAGE (1)
JEDEC
THERMAL
MODEL
TA < 25°C
RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 85°C
RATING
TA = 105°C
RATING
TA = 125°C
RATING
(3.3 V ONLY)
High-K
905 mW
7.25 mW/°C
470 mW
325 mW
180 mW
Low-K
516 mW
4.1 mW/°C
268 mW
186 mW
103 mW
SOIC (D) 8-pin
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
RECOMMENDED OPERATING CONDITIONS
VCC
Supply voltage
(1)
MIN
NOM
MAX
3.15
5
5.5
UNIT
V
VI
Input voltage at any bus terminal (separately or common mode)
–7
12
V
VIH
High-level input voltage (driver, driver enable, and receiver enable inputs)
2
VCC
V
VIL
Low-level input voltage (driver, driver enable, and receiver enable inputs)
0
0.8
V
VID
Differential input voltage
–12
12
V
Output current, driver
–60
60
mA
Output current, receiver
–8
8
mA
RL
Differential load resistance
54
CL
Differential load capacitance
1/tUI
Signaling rate
IO
Ω
50
pF
1
TA
Operating free-air temperature (See
application section for thermal information)
TJ
Junction temperature
(1)
60
5-V supply
–40
105
3.3-V supply
–40
125
–40
150
Mbps
°C
°C
By convention, the least positive (most negative) limit is designated as minimum in this data sheet.
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
|VOD|
TEST CONDITIONS
Driver differential output voltage magnitude
1.5
RL = 60 Ω, 4.75 V ≤ VCC 375 Ω on each
output to –7 V to 12 V, TA < 125°C, See
Figure 1
1.4
TYP
RL = 54 Ω, 4.75 V ≤ VCC ≤ 5.25 V, TA <
85°C
1.7
RL = 54 Ω, 4.75 V ≤ VCC ≤ 5.25 V, TA <
125°C
1.5
RL = 54 Ω, 3.15 V ≤ VCC ≤ 3.45 V
0.8
1
RL = 100 Ω, 4.75 V ≤ VCC ≤ 5.25 V, TA <
85°C
2.2
2.5
RL = 100 Ω, 4.75 V ≤ VCC ≤ 5.25 V, TA <
125°C
2
Δ|VOD|
Change in magnitude of driver differential output
RL = 54 Ω
voltage
VOC(SS)
Steady-state common-mode output voltage
ΔVOC
Change in differential driver output
common-mode voltage
VOC(PP)
Peak-to-peak driver common-mode output
voltage
COD
Differential output capacitance
VIT+
Positive-going receiver differential input voltage
threshold
VIT–
Negative-going receiver differential input
voltage threshold
VHYS
Receiver differential input voltage threshold
hysteresis (VIT+ – VIT–)
VOH
Receiver high-level output voltage
VOL
Receiver low-level output voltage
II(LOGIC)
Driver input, driver enable, and receiver enable
input current
IOZ
Receiver output high-impedance current
IOS
Driver short-circuit output current
II(BUS)
Bus input current (disabled driver)
4
MIN
RL = 60 Ω, 4.75 V ≤ VCC 375 Ω on each
output to –7 V to 12 V, TA < 85°C, See
Figure 1
2
–50
0
50
mV
1
VCC/2
3
V
–50
0
50
mV
500
mV
23
pF
–100
–180
–150
30
50
2.4
VCC
– 0.3
IOL = 8 mA, TA < 85°C
0.2
IOL = 8 mA, TA < 125°C
–50
VCC = 3.15 to 5.5 V
or
VCC = 0 V, DE at 0 V
–35
mV
V
0.4
0.5
VO = 0 V or VCC, RE at VCC
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50
V
µA
–1
1
µA
–150
150
mA
VI = 12 V
VI = –7 V
UNIT
V
Center of two 27-Ω load resistors, See
Figure 2
IOH = –8 mA
MAX
75
–60
–40
100
µA
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): SN65HVD1781
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating conditions (unless otherwise noted)
PARAMETER
ICC
Supply current (quiescent)
TEST CONDITIONS
TYP
MAX
Driver and receiver
enabled
DE = VCC, RE =
GND,
no load
4
6
Driver enabled,
receiver disabled
DE = VCC, RE =
VCC,
no load
3
5
Driver disabled,
receiver enabled
DE = GND, RE =
GND,
no load
2
4
0.15
1
Driver and receiver
disabled, standby
mode
Supply current (dynamic)
MIN
DE = GND, D =
open
RE = VCC, no load,
TA < 85°C
DE = GND, D =
open
RE = VCC, no load,
TA < 125°C
UNIT
mA
µA
12
See Typical Characteristics section
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
300
ns
170
ns
20
ns
0.1
µs
DRIVER
tr, tf
Driver differential output rise/fall time
tPHL, tPLH
Driver propagation delay
tSK(P)
Driver differential output pulse skew,
|tPHL – tPLH|
tPHZ, tPLZ
Driver disable time
tPZH, tPZL
Driver enable time
70
RL = 54 Ω, CL = 50 pF, See Figure 3
Receiver enabled
See Figure 4 and
Figure 5
Receiver disabled
260
ns
5
µs
RECEIVER
tr, tf
Receiver output rise/fall time
tPHL, tPLH
Receiver propagation delay time
tSK(P)
Receiver output pulse skew,
|tPHL – tPLH|
tPLZ, tPHZ
Receiver disable time
tPZL(1), tPZH(1)
tPZL(2), tPZH(2)
6
Receiver enable time
CL = 15 pF,
See Figure 6
4
10
ns
100
150
ns
6
10
ns
Driver enabled, See Figure 7
15
50
ns
Driver enabled, See Figure 7
80
200
ns
Driver disabled, See Figure 8
3
5
µs
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
THERMAL INFORMATION
PARAMETER
TEST CONDITIONS
SOIC-8
RθJA Junction-to-ambient thermal resistance (no airflow)
DIP-8
SOIC-14
RθJB Junction-to-board thermal resistance
RθJC Junction-to-case thermal resistamce
PD
TSD
(1)
VALUE
JEDEC high-K model
138
JEDIC low-K model
242
JEDEC high-K model
59
JEDIC low-K model
128
JEDEC high-K model
95
JEDIC low-K model
168
SOIC-8
62
DIP-8
39
SOIC-14
40
SOIC-8
61
DIP-8
61
SOIC-14
44
Power dissipation
VCC = 3.6V, TJ = 150°C, RL = 300 Ω,
CL = 50 pF (driver), CL = 15 pF (receiver)
3.3-V supply, unterminated (1)
75
VCC = 3.6V, TJ = 150°C, RL = 100 Ω,
CL = 50 pF (driver), CL = 15 pF (receiver)
3.3-V supply, RS-422 load (1)
95
VCC = 3.6V, TJ = 150°C, RL = 54 Ω,
CL = 50 pF (driver), CL = 15 pF (receiver)
3.3-V supply, RS-485 load (1)
115
VCC = 5.5V, TJ = 150°C, RL = 300 Ω,
CL = 50 pF (driver), CL = 15 pF (receiver)
5-V supply, unterminated (1)
290
VCC = 5.5V, TJ = 150°C, RL = 100 Ω,
CL = 50 pF (driver), CL = 15 pF (receiver)
5-V supply, RS-422 load (1)
320
VCC = 5.5V, TJ = 150°C, RL = 54 Ω,
CL = 50 pF (driver), CL = 15 pF (receiver)
5-V supply, RS-485 load (1)
400
Thermal-shutdown junction temperature
UNIT
°C/W
°C/W
°C/W
mW
170
°C
Driver and receiver enabled, 50% duty cycle square-wave signal at signaling rate: 1 Mbps.
PARAMETER MEASUREMENT INFORMATION
Input generator rate is 100 kbps, 50% duty cycle, rise and fall times less than 6 nsec, output impedance 50 Ω.
375 W ±1%
VCC
DE
0 V or 3 V
D
A
VOD
60 W ±1%
B
+
_
–7 V < V(test) < 12 V
375 W ±1%
S0301-02
Figure 1. Measurement of Driver Differential Output Voltage With Common-Mode Load
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
27 W ±1%
DE
Input
A
D
A
VA
B
VB
VOC(PP)
VOC
B
DVOC(SS)
CL = 50 pF ±20%
27 W ±1%
VOC
CL Includes Fixture and
Instrumentation Capacitance
S0302-01
Figure 2. Measurement of Driver Differential and Common-Mode Output With RS-485 Load
3V
VCC
DE
D
Input
Generator
VI
CL = 50 pF ±20%
A
VOD
50 W
B
VI
RL = 54 W
±1%
CL Includes Fixture
and Instrumentation
Capacitance
50%
50%
tPLH
VOD
tPHL
»2V
90% 90%
0V
10%
0V
10%
tr
» –2 V
tf
S0303-01
Figure 3. Measurement of Driver Differential Output Rise and Fall Times and Propagation Delays
3V
D
DE
Input
Generator
VI
50 W
A
3V
S1
VO
B
CL = 50 pF ±20%
VI
50%
RL = 110 W
± 1%
CL Includes Fixture
and Instrumentation
Capacitance
50%
tPZH
VO
0V
0.5 V
VOH
90%
50%
»0V
tPHZ
S0304-01
NOTE: D at 3 V to test non-inverting output, D at 0 V to test inverting output.
Figure 4. Measurement of Driver Enable and Disable Times With Active High Output and Pulldown Load
3V
A
3V
D
DE
Input
Generator
S1
RL = 110 W
±1%
VO
»3V
VI
50%
50%
0V
B
tPZL
tPLZ
CL = 50 pF ±20%
VI
50 W
CL Includes Fixture
and Instrumentation
Capacitance
»3V
VO
50%
10%
VOL
S0305-01
NOTE: D at 0 V to test non-inverting output, D at 3 V to test inverting output.
Figure 5. Measurement of Driver Enable and Disable Times With Active-Low Output and Pullup Load
8
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
A
Input
Generator
VO
R
50 W
VI
B
1.5 V
CL = 15 pF ±20%
RE
0V
CL Includes Fixture
and Instrumentation
Capacitance
3V
VI
50%
50%
0V
tPLH
tPHL
90% 90%
VO
50%
10%
50%
10%
tr
VOH
VOL
tf
S0306-01
Figure 6. Measurement of Receiver Output Rise and Fall Times and Propagation Delays
3V
VCC
DE
A
0 V or 3 V D
B
RE
Input
Generator
VI
1 kW ± 1%
R VO
S1
CL = 15 pF ±20%
CL Includes Fixture
and Instrumentation
Capacitance
50 W
3V
VI
50%
50%
0V
tPZH(1)
tPHZ
VOH
90%
VO
50%
D at 3 V
S1 to GND
»0V
tPZL(1)
tPLZ
VCC
VO
50%
D at 0 V
S1 to VCC
10%
VOL
S0307-01
Figure 7. Measurement of Receiver Enable/Disable Times With Driver Enabled
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
A
0 V or 1.5 V
R VO
1.5 V or 0 V
RE
Input
Generator
VI
1 kW ± 1%
S1
B
CL = 15 pF ±20%
CL Includes Fixture
and Instrumentation
Capacitance
50 W
3V
VI
50%
0V
tPZH(2)
VOH
VO
A at 1.5 V
B at 0 V
S1 to GND
50%
GND
tPZL(2)
VCC
VO
50%
VOL
A at 0 V
B at 1.5 V
S1 to VCC
S0308-01
Figure 8. Measurement of Receiver Enable Times With Driver Disabled
10
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SLLS877A – DECEMBER 2007 – REVISED JANUARY 2008
TYPICAL CHARACTERISTICS
DRIVER OUTPUT CURRENT
vs
SUPPLY VOLTAGE
RMS SUPPLY CURRENT
vs
SIGNALING RATE
80
10
70
ICC − RMS Supply Current − mA
0
IO − Driver Output Current − mA
TA = 25°C
RE at VCC
DE at VCC
RL = 54 Ω
CL = 50 pF
−10
−20
−30
TA = 25°C
DE at VCC
D at VCC
RL = 54 Ω
−40
VCC = 5 V
60
50
40
VCC = 3.3 V
30
20
−50
0
1
2
3
4
5
0
6
100 200 300 400 500 600 700 800 900 1000
Signaling Rate − kbps
VCC − Supply Voltage − V
G002
G001
Figure 9.
Figure 10.
DIFFERENTIAL OUTPUT VOLTAGE
vs
DIFFERENTIAL LOAD CURRENT
4.4
VOD − Differential Output Voltage − V
4.0
VCC = 5.5 V
3.6
3.2
Load = 300 Ω
2.8
2.4
Load = 100 Ω
2.0
Load = 60 Ω
1.6
1.2
VCC = 3.3 V
0.8
0.4
VCC = 3.15 V
0.0
0
5
10
15
20
25
30
35
40
I(diff) − Differential Load Current − mA
45
50
G003
Figure 11.
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PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65HVD1781D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD1781DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD1781DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD1781DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN65HVD1781DR
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.4
5.2
2.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65HVD1781DR
SOIC
D
8
2500
346.0
346.0
29.0
Pack Materials-Page 2
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